This application claims priority to and the benefit of Taiwan Application Serial Number 110142832, filed on Nov. 17, 2021, the entire contents of which are incorporated herein by reference as if fully set forth below in its entirety and for all applicable purposes.
The present disclosure relates to an electronic device. More particularly, the present disclosure relates to an inductor device.
Radio frequency (RF) devices generate second harmonic, third harmonic, fourth harmonic, etc. during operation. The harmonics cause negative effect to other circuits. For example, second harmonic of 2.4 GHz circuit is near 5 GHz, and 5 GHz signal causes negative effect to system on chip (SoC).
Conventional way to solve negative effect caused by harmonics is that a filter will be disposed outside of a circuit for filtering the harmonics. However, the filter disposed outside of the circuit will affect function of the circuit and generate additional costs.
The foregoing presents a simplified summary of the disclosure in order to provide a basic understanding to the reader. This summary is not an extensive overview of the disclosure and it does not identify key/critical elements of the present disclosure or delineate the scope of the present disclosure. Its sole purpose is to present some concepts disclosed herein in a simplified form as a prelude to the more detailed description that is presented later.
One aspect of the present disclosure is to provide an inductor device. The inductor device comprises a first trace, a second trace, and a capacitor. The first trace includes at least two sub-traces and a first crossing connection portion. One terminal of the at least two sub-traces is coupled to a first node. The first crossing connection portion is coupled between the at least two sub-traces of the first trace in an interlaced manner. The second trace comprises at least two sub-traces. One terminal of the at least two sub-traces is coupled at a second node. The capacitor is coupled between the first node and the second node.
Therefore, based on the technical content of the present disclosure, the capacitor of the inductor device brings a function to filter low frequency, such that low frequency signal induced at the inductor device cannot pass but high frequency signal can pass the capacitor directly. Low frequency signal is, for example, a signal that uses 2.4 GHz as main operating frequency. Therefore, the folded inductor will not affect the characteristic of the operating frequency of the inductor. If an inductor which is located at the center of the inductor device has a high frequency signal, for example, a second harmonic (i.e., 5 GHz signal), the high frequency signal may pass the capacitor and form an inductive inductor which is a circle flows through the folded inductor and the capacitor. Therefore, a 5 GHz harmonic signal corresponding to 2.4 GHz signal is induced in the inductor device of the present disclosure. The 5 GHz signal can be used in the circuit. For example, the 5 GHz signal can be amplified and then the amplified 5 GHz signal is used to cancel the 5 GHz harmonic signal of the operating frequency. In addition, the amplifying circuit can be arranged by a designer who is familiar with circuit design. As a result, a negative effect to a 5 GHz circuit can be reduced.
Besides, since the filter is disposed inside the inductor device of the present disclosure, there is no need to dispose a filter outside of the inductor device, so as to prevent an outer filter from affecting the circuit or prevent additional costs. In addition, the crossing structure of the present disclosure with symmetrical disposition can make the induced signals in the inner wire and the outer wire flow of the traces in an interlaced manner, such that the induced signals in the inner wire and the outer wire can be cancelled.
It is to be understood that both the foregoing general description and the following detailed description are by examples, and are intended to provide further explanation of the invention as claimed.
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention. In the drawings,
According to the usual mode of operation, various features and elements in the figures have not been drawn to scale, which are drawn to the best way to present specific features and elements related to the disclosure. In addition, among the different figures, the same or similar element symbols refer to similar elements/components.
To make the contents of the present disclosure more thorough and complete, the following illustrative description is given with regard to the implementation aspects and embodiments of the present disclosure, which is not intended to limit the scope of the present disclosure. The features of the embodiments and the steps of the method and their sequences that constitute and implement the embodiments are described. However, other embodiments may be used to achieve the same or equivalent functions and step sequences.
Unless otherwise defined herein, scientific and technical terminologies employed in the present disclosure shall have the meanings that are commonly understood and used by one of ordinary skill in the art. Unless otherwise required by context, it will be understood that singular terms shall include plural forms of the same and plural terms shall include the singular. Specifically, as used herein and in the claims, the singular forms “a” and “an” include the plural reference unless the context clearly indicates otherwise.
With respect to structures, one terminal (e.g., the upper terminal) of the at least two sub-traces 1110, 1120 is coupled to a first node N1. The first crossing connection portion 1130 is coupled between at least two sub-traces 1110, 1120 of the first trace 1100 in an interlaced manner. In addition, one terminal (e.g., the upper terminal) of the at least two sub-traces 1210, 1220 is coupled to a second node N2. Besides, the capacitor C is coupled between the first node N1 and the second node N2.
In one embodiment, the second trace 1200 further includes a second crossing connection portion 1230. The second crossing connection portion 1230 is coupled between the at least two sub-traces 1210, 1220 of the second trace 1200 in an interlaced manner.
In one embodiment, the first trace 1100 includes a first sub-trace 1110 and a second sub-trace 1120. Besides, each of the first sub-trace 1110 and the second sub-trace 1120 includes a first terminal and a second terminal. As shown in the figure, the first terminal (e.g., the upper terminal) of the first sub-trace 1110 is coupled to the first node N1, and the first terminal (e.g., the upper terminal) of the second sub-trace 1120 and the first terminal (e.g., the upper terminal) of the first sub-trace 1110 are coupled to each other at the first node N1.
In one embodiment, each of the at least two sub-traces 1110, 1120 of the first trace 1100 includes a U-typed sub-trace. For example, the sub-traces 1110, 1120 are all U-typed sub-traces. In addition, each of the at least two sub-traces 1210, 1220 of the second trace 1200 includes a U-typed sub-trace. For example, the sub-traces 1210, 1220 are all U-typed sub-traces. However, the present disclosure is not limited to the structure as shown in
In one embodiment, the first sub-trace 1110 includes a first half-trace 1111 and a second half-trace 1113. The first half-trace 1111 is coupled to the first node N1. In another embodiment, the second sub-trace 1120 includes a third half-trace 1121 and a fourth half-trace 1123. The first half-trace 1111 and the third half-trace 1121 are coupled to each other at the first node N1.
In one embodiment, the first crossing connection portion 1130 includes a first crossing connection element 1131 and a second crossing connection element 1133. The first crossing connection element 1131 is coupled to the first half-trace 1111 and the fourth half-trace 1123. In addition, the second crossing connection element 1133 is coupled to the second half-trace 1113 and the third half-trace 1121. As shown in the figure, the first crossing connection element 1131 and the second crossing connection element 1133 are coupled to each other in an interlaced manner.
In one embodiment, the second trace 1200 includes a third sub-trace 1210 and a fourth sub-trace 1220. Besides, each of the third sub-trace 1210 and the fourth sub-trace 1220 includes a first terminal and a second terminal. As shown in the figure, the first terminal (e.g., the upper terminal) of the third sub-trace 1210 is coupled to the second node N2, and the first terminal (e.g., the upper terminal) of the fourth sub-trace 1220 and the first terminal of the third sub-trace 1210 are coupled to each other at the second node N2.
In one embodiment, the third sub-trace 1210 includes a fifth half-trace 1211 and a sixth half-trace 1213. The fifth half-trace 1211 is coupled to the second node N2. In another embodiment, the fourth sub-trace 1220 includes a seventh half-trace 1221 and an eighth half-trace 1223. The fifth half-trace 1211 and the seventh half-trace 1221 are coupled to each other at the second node N2.
In one embodiment, the second crossing connection portion 1230 includes a third crossing connection element 1231 and a fourth crossing connection element 1233. The third crossing connection element 1231 is coupled to the fifth half-trace 1211 and the eighth half-trace 1223. In addition, the fourth crossing connection element 1233 is coupled to the sixth half-trace 1213 and the seventh half-trace 1221. As shown in the figure, the third crossing connection element 1231 and the fourth crossing connection element 1233 are coupled to each other in an interlaced manner.
In one embodiment, the inductor device 1000 further includes a connection element 1300, and the connection element 1300 is coupled between the fourth half-trace 1123 and the eighth half-trace 1223.
In one embodiment, the capacitor C and the connection element 1300 are located at two sides of the inductor device 1000 respectively. For example, the capacitor C is located at the upper side of the inductor device 1000, and the connection element 1300 is located at the lower side of the inductor device 1000.
In one embodiment, the first crossing connection portion 1130 and the second crossing connection portion 1230 are located at two sides of the inductor device 1000 respectively. For example, the first crossing connection portion 1130 is located at the left side of the inductor device 1000, and the second crossing connection portion 1230 is located at the right side of the inductor device 1000.
In one embodiment, the capacitor C and the connection element 1300 are disposed in a first direction, the first crossing connection portion 1130 and the second crossing connection portion 1230 are disposed in a second direction, and the first direction is perpendicular to the second direction. For example, the capacitor C and the connection element 1300 are disposed in a vertical direction as shown in the figure, and the first crossing connection portion 1130 and the second crossing connection portion 1230 are disposed in a horizontal direction as shown in the figure. Therefore, the two directions are perpendicular to each other.
In one embodiment, the inductor device 1000 further includes a first input/output terminal 1410 and a second input/output terminal 1420. The first input/output terminal 1410 is coupled to the second half-trace 1113. The second input/output terminal 1420 is coupled to the sixth half-trace 1213. However, the present disclosure is not limited to the structure as shown in
As shown in the figure, the connection element 1300A of the inductor device 1000A in
It can be understood from the embodiments of the present disclosure that application of the present disclosure has the following advantages. The inductor device of the present disclosure may induce high frequency signal (e.g., second harmonic) of inductor (e.g., 5000, 5000A) inside the inductor device. After the high frequency signal is amplified by additional circuit, the amplified high frequency signal is able to cancel negative effect to the circuit caused by second harmonic. For example, the capacitor of the inductor device is used to let high frequency signal pass and block low frequency signal. Therefore, the inductor device is able to deal with signals in high frequency or low frequency by two kinds of inducing manner.
Besides, since the filter is disposed inside integrated circuit (IC), for example, the inductor device, of the present disclosure, there is no need to dispose a filter outside of the inductor device, so as to prevent an outer filter from affecting the circuit or prevent additional costs. In addition, the crossing structure of the present disclosure with symmetrical disposition can make the induced signals in the inner wire and the outer wire flow in an interlaced manner, such that the induced signals in the inner wire and the outer wire can be cancelled. The inductor device of the present disclosure can improve IMD3 about 2˜3 dBs.
Although the present invention has been described in considerable detail with reference to certain embodiments thereof, other embodiments are possible. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.
It will be apparent to those skilled in the art that various modifications and variations can be made to the structure of the present invention without departing from the scope or spirit of the invention. In view of the foregoing, it is intended that the present invention cover modifications and variations of this invention provided they fall within the scope of the following claims and their equivalents.
Number | Date | Country | Kind |
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110142832 | Nov 2021 | TW | national |