This application claims priority to Taiwan Application Serial Number 102126301, filed Jul. 23, 2013, which is incorporated by reference herein in its entirety.
1. Technical Field
The present disclosure relates to a filter. More particularly, the present disclosure relates to a filter for filtering infrared light.
2. Description of Related Art
Conventional optical systems constitute a set of lens elements and an image sensor, wherein the set of lens elements is disposed at an object side of the optical system and the image sensor is disposed at an image side of the optical system. Since the image sensor has high sensitivity to the infrared light, the infrared light thus may washout the color response in the visible spectrum and thus may distort the image color reproduction. Conventional infrared filters are mostly recognized as interference type filters and absorption type filters. The interference type filter filters out the infrared light by applying alternate film layers of high refractive index (for example, TiO2, Ta2O5 or Nb2O5) and low refractive index materials (for example, SiO2 or MgF2). The absorption type filter typically uses a blue glass to block the infrared light since the materials inside the blue glass absorb the infrared light.
In recent years, as the optical systems of the electronic products have gradually evolved toward compact size and wide viewing angle, the total track length of the optical systems has to be reduced and the chief ray angle also has to be large. However, as the absorption type of infrared filter is relatively expensive and it has issues with environment stability. It is also not favorable for being applied to compact optical systems as it is relatively thick. Moreover, the interference type of infrared filter tends to produce color shift in a peripheral region of an image as the chief ray angle becomes larger. Since it generally requires certain layers to be coated; therefore, it is not favorable for being applied to compact optical systems. Especially, when it is deposited a multilayer with a high layer count, it tends to produce warpage due to uneven internal stress. It also tends to produce obvious image defects due to particle pollution by depositing high-layer-count coatings.
According to one aspect of the present disclosure, an infrared filter includes a transparent substrate, and an infrared-filtering multilayer film. The infrared-filtering multilayer film is coated on the transparent substrate, and the infrared-filtering multilayer film includes a plurality of first dielectric layers and a plurality of silver layers. The first dielectric layers and the silver layers are alternately stacked, wherein the first dielectric layers are made of nitride. When a total number of layers in the infrared-filtering multilayer film is TL, a total thickness of the infrared-filtering multilayer film is TT, and a total number of the silver layers is AgL, the following conditions are satisfied:
6≦TL≦42;
100 nm≦TT≦4000 nm; and
3≦AgL≦21.
The disclosure can be more fully understood by reading the following detailed description of the embodiment, with reference made to the accompanying drawings as follows:
An infrared filter includes a transparent substrate, and an infrared-filtering multilayer film. The infrared-filtering multilayer film is coated on the transparent substrate, and the infrared-filtering multilayer film includes a plurality of first dielectric layers and a plurality of silver layers. The first dielectric layers and the silver layers are alternately stacked, wherein the first dielectric layers are made of nitride, such as, but are not limited to, SiN, AlN, or GaN. When a total number of layers in the infrared-filtering multilayer film is TL, a total thickness of the infrared-filtering multilayer film is TT, and a total number of the silver layers is AgL, the following conditions are satisfied:
6≦TL≦42;
100 nm≦TT≦4000 nm; and
3≦AgL≦21.
The first dielectric layers and the silver layers are alternately stacked, wherein the first dielectric layers are made of nitride. Accordingly, it is favorable for preventing the silver layers from reducing reflectivity due to oxidation. Moreover, the infrared filter is favorable for effectively reducing the red light loss so as to reduce the color shift.
When the total number of layers in the infrared-filtering multilayer film is TL, the following condition is satisfied: 6≦TL≦42. Since the total number of layers in the infrared-filtering multilayer film is less, it is favorable for reducing the particle pollution so as to improve the image defect.
When the total thickness of the infrared-filtering multilayer film is TT, the following condition is satisfied: 100 nm≦TT≦4000 nm. Since the total thickness of the infrared-filtering multilayer film is relatively thin, it is favorable for balancing the internal stress of the infrared filter as to avoid warpage. Preferably, the following condition is satisfied: 100 nm≦TT≦2000 nm.
When the total number of the silver layers is AgL, the following condition is satisfied: 3≦AgL≦21. It is favorable for controlling the cost for coating layers and further correcting the color shift.
When the first dielectric layers are made of silicon nitride (SixNy), aluminum nitride (AlN), or gallium nitride (GaN); the total number of the first dielectric layers is DLA, the following condition is satisfied: 3≦DLA. Therefore, it is favorable for preventing the silver layers from reducing reflectivity due to oxidation.
When the infrared-filtering multilayer film can further include at least one second dielectric layer, wherein at least one of the first dielectric layers is coated between the second dielectric layer and one of the silver layers, and the second dielectric layer can be made of metal oxide, the total number of the first dielectric layers is DLA, a total number of the second dielectric layer is DLB, the following conditions are satisfied: 5≦DLA; and 1≦DLB. Therefore, it is favorable for reducing the coating cost and enhancing the abrasion resistance and hardness.
According to the infrared filter of the present disclosure, the transparent substrate can be made of plastic or glass material. When the transparent substrate is made of plastic material, the manufacturing cost thereof can be reduced. Moreover, the infrared-filtering multilayer film can be coated on the plastic lens elements with refractive power so as to further filter out infrared light and correct color shift.
When a decay rate of the transmittance responsivity value through the infrared filter between 554 nm and 700 nm is D, the following condition is satisfied: 1%≦D≦30%, Therefore, it is favorable for effectively correcting the color shift. Preferably, the following condition is satisfied: 1%≦D≦20%.
According to the infrared filter of the present disclosure, the transmittance responsivity value (TR) is defined as the sum of transmittance (X) multiplied by relative responsivity of the image sensor (Y) under a reference wavelength (between m and n) with an interval of 1 nm, and the decay rate (D) is defined as the decrease in TR at two different chief ray angles through the infrared filter under a reference wavelength, the equations are expressed as follows:
where,
m is the starting wavelength;
n is the ending wavelength;
both of m and n are integer;
X is transmittance; and
Y is relative responsivity of the image sensor.
where,
D is the decay rate;
TR1 is the transmittance responsivity when the chief ray angle is at 0 degrees;
TR2 is the transmittance responsivity when the chief ray angle is at 40 degrees;
It will be apparent to those skilled in the art that the aforementioned decay rate is the decay rate of the infrared filter of the present disclosure.
According to the infrared filter of the present disclosure, at least one of the first dielectric layers is coated between the second dielectric layer and one of the silver layers, that is, the second dielectric layer is not adjacent to the silver layers. More specifically, the second dielectric layer can be coated between two first dielectric layers, the transparent substrate and the first dielectric layer, or air and the first dielectric layer.
On the other hand, when the total number of the second dielectric layer is greater than 1, each of the second dielectric layers may be made of different materials. Each of the second dielectric layers may be stacked together as long as the second dielectric layer is not adjacent to the silver layers. Furthermore, each layer of the infrared-filtering multilayer film coated on the transparent substrate may be coated using different techniques such as evaporation or sputtering.
According to the above description of the present disclosure, the following 1st-7th specific embodiments are provided for further explanation.
In the 1st embodiment, the first dielectric layers 121 are made of SiN (silicon mononitride), but are not limited thereto. The first dielectric layers 121 may also be made of AlN, GaN, or other silicon nitrides with varying silicon oxidation states (SixNy).
In
In Table 1, a total thickness of the infrared-filtering multilayer film 120 of the infrared filter 100 is 220.2 nm.
In the 2nd embodiment, the first dielectric layers 221 are made of SiN (silicon mononitride), but are not limited thereto. The first dielectric layers 221 may also be made of AIN, GaN, or other silicon nitrides with varying silicon oxidation states (SixNy).
In
In Table 3, a total thickness of the infrared-filtering multilayer film 220 of the infrared filter 200 is 268 nm.
In the 3rd embodiment, the first dielectric layers 321 are made of metallic or metalloid nitrides, such as, SiN, AlN or GaN. The first dielectric layers 321 may also be made of AlN, GaN, or other silicon nitrides with varying silicon oxidation states (SixNy). The second dielectric layers 323 may be made of SiO2, but are not limited thereto. Furthermore, the first dielectric layers 321 may also be made of SiXNY, and the second dielectric layers 323 may also be made of Nb2O5, Ta2O5, ZrO2, Y2O3, CeO2, Al2O3, ZnO or titanium oxides (TixOy),
In
In Table 5, the total thickness of the infrared-filtering multilayer film 320 of the infrared filter 300 having the first dielectric layers made of SiN is 286.5 nm, the total thickness of the infrared-filtering multilayer film 320 of the infrared filter 300 having the first dielectric layers made of AlN is 277.9 nm, and the total thickness of the infrared-filtering multilayer film 320 of the infrared filter 300 having the first dielectric layers made of GaN is 257.3 nm.
In the 4th embodiment, the first dielectric layers 421 are made of SiN. The second dielectric layers 423 are made of Nb2O5, but are not limited thereto. Furthermore, the first dielectric layers 421 may also be made of AlN, GaN, or other silicon nitrides with varying silicon oxidation states (SixNy). The second dielectric layers 423 may also be made of Ta2O5, ZrO2, Y2O3, CeO2, Al2O3, ZnO, SiO2 or titanium oxides (Ti3Oy).
In
In Table 7, a total thickness of the infrared-filtering multilayer film 420 of the IR filter 400 is 207.1 nm.
In the 5th embodiment, the first dielectric layers 521 are made of SiN. The second dielectric layers 523 are made of Nb2O5, but are not limited thereto. Furthermore, the first dielectric layers 521 may also be made of AlN, GaN, or other silicon nitrides with varying silicon oxidation states (SixNy). The second dielectric layers 523 may also be made of Ta2O5, ZrO2, Y2O3CeO2, Al2O3, ZnO, SiO2 or titanium oxides (TixOy).
In
In Table 9, a total thickness of the infrared-filtering multilayer film 520 of the IR filter 500 is 254.9 nm.
6th Embodiment
More specifically, one of the second dielectric layers 623 is coated between air and one first dielectric layer 621, and the other two second dielectric layers 623 are coated between any two of the first dielectric layers 621 respectively. The material for making the second dielectric layer 623 coated between air and the first dielectric layer 621 is different from those for making the other two second dielectric layers 623 coated between any two of the first dielectric layers 621.
In the 6th embodiment, the first dielectric layers 621 are made of SiN. The second dielectric layer 623 coated between air and the first dielectric layer 621 is made of SiO2. However, the other second dielectric layers 623 coated between any two of the first dielectric layers 621 are both made of Nb2O5, but are not limited thereto. Furthermore, the first dielectric layers 621 may also be made of AlN, GaN, or other silicon nitrides with varying silicon oxidation states (SixNy). The second dielectric layers 623 may also be made of Ta2O5, ZrO2, Y2O3, CeO2, Al2O3, ZnO, SiO2 or titanium oxides (TixOy).
In
In Table 11, a total thickness of the infrared-filtering multilayer film 620 of the IR filter 600 is 281.7 nm.
More specifically, one of the second dielectric layers 723 is coated between the transparent substrate 710 and the first dielectric layer 721. Another two of the second dielectric layers 723 are stacked together and coated between air and the first dielectric layer 721 wherein these two second dielectric layers 723 are made of different materials. The other two of the second dielectric layers 723 are coated between any two of the first dielectric layers 721 respectively.
In the 7th embodiment, the first dielectric layers 721 are made of Sill. The second dielectric layer 723 coated closest to air and furthest from the transparent substrate 710 is made of SiO2. The other four second dielectric layers 723 are all made of Nb2O5, but are not limited thereto. Furthermore, the first dielectric layers 721 may also be made of AIN, GaN, or other silicon nitrides with varying silicon oxidation states (SixNy). The second dielectric layers 723 may also be made of Ta2O5, ZrO2, Y2O3, CeO2, Al2O3, ZnO, SiO2 or titanium oxides (TixOy).
In
In Table 13, a total thickness of the infrared-filtering multilayer film 720 of the IR filter 700 is 262 nm.
According to the embodiments of the present disclosure, the infrared-filtering multilayer film may be a stack of multiple repeating units, and the number of the repeating units can be adjusted. Taking the 1st embodiment as an example, the entire arrangement from the layer closest to the transparent substrate (No. 1) to the layer closest to air (No. 6) can be defined as one repeating unit using the aforementioned definition. When the infrared-filtering multilayer film is a stack of seven repeating units, the total number of layers in icy the infrared-filtering multilayer film is 42, and the total number of the silver layers is 21. Likewise the number of the repeating units of the infrared-filtering multilayer film in the aforementioned second to seventh embodiments also can be adjusted.
An exemplified infrared filter is a transparent substrate with two differ kinds of dielectric layers alternately stacked and coated on the transparent substrate, wherein the total number of layers of the stack is 44. Furthermore, the material and the thickness of each layer of the exemplified infrared filter, numbered 1 to 44 in ascending order, starting from the layer closest to the transparent substrate to the layer closest to air are shown in Table 15. The decay rate and the transmittance responsivity value of the exemplified infrared filter at two different chief ray angles (0 and 40°) are shown in Table 16.
In Table 15, a total thickness of the exemplified infrared filter is 5181.6 nm.
In Table 16 and
The foregoing description, for purpose of explanation, has been described with reference to specific embodiments. It is to be noted that TABLES 1-14 show different data of the different embodiments; however, the data of the different embodiments are obtained from experiments. The embodiments ere chosen and described in order to best explain the principles of the disclosure and its practical applications, to thereby enable others skilled in the art to best utilize the disclosure and various embodiments with various modifications as are suited to the particular use contemplated. The embodiments depicted above and the appended drawings are exemplary and are not intended to be exhaustive or to limit the scope of the present disclosure to the precise forms disclosed. Many modifications and variations are possible in view of the above teachings.
Number | Date | Country | Kind |
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102126301 | Jul 2013 | TW | national |