Claims
- 1. Method for producing a filter element for an injection valve comprising:
selecting monocrystalline semiconductor material for the filter element; and forming ducts in the semiconductor.
- 2. Method according to claim 1, wherein the ducts are etched anisotropically.
- 3. Method according to claim 1, wherein the semiconductor selected is silicon.
- 4. Method according to claim 1, wherein the step of forming ducts in the semiconductor includes forming longitudinal ducts extending between upstream and downstream surfaces of the filter element.
- 5. Method of producing a filter element arranged inside an injection valve of an internal combustion engine, comprising:
forming longitudinal ducts extending between upstream and downstream surfaces of the filter element; and installing a heating element for heating regions of walls of the ducts along longitudinal extent of the walls.
- 6. Method according to claim 5, further comprising making the filter element at least partially from a semiconducting material at least in a vicinity of fuel flow.
- 7. Method according to claim 6, wherein the semiconducting material includes silicon.
- 8. Method according to claim 6, wherein the semiconducting material includes conductive aluminum metal.
- 9. Method according to claim 5, further comprising installing a perforated stabilizing plate, through which fuel can flow and which is made from a metal and is arranged on an outflow side of the filter element.
- 10. Method according to claim 5, further comprising installing a plurality of semiconductor boards, arranging semiconductor boards one behind the other, and providing semiconductor boards with ducts.
- 11. Method according to claim 5, further comprising thermally insulating the filter element in relation to a housing of the injection valve.
Priority Claims (2)
Number |
Date |
Country |
Kind |
100 03 935.9 |
Jan 2000 |
DE |
|
100 53 583.6 |
Oct 2000 |
DE |
|
BACKGROUND AND SUMMARY OF THE INVENTION
[0001] The present application is a division of patent application Ser. No. 09/770,293, filed Jan. 29, 2001, the entire disclosure of which is incorporated herein by reference. Priority is claimed based on Federal Republic of Germany Patent Document Nos. 100 03 935.9, filed Jan. 29, 2000, and 100 53 583.6, filed Oct. 28, 2000, the disclosures of which are expressly incorporated by reference herein.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09770293 |
Jan 2001 |
US |
Child |
10405483 |
Apr 2003 |
US |