This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2016-017983, filed Feb. 2, 2016, the entire contents of which are incorporated herein by reference.
An embodiment described herein relates generally to an ink jet head.
In the related art, a so-called shear mode type ink jet head that discharges ink droplets from a nozzle using shear mode deformation of a piezoelectric member is known. As an example of a shear mode type ink jet head structure, there is a structure in which a piezoelectric ceramic plate, an ink chamber plate, and a nozzle plate are stacked. A plurality of grooves, and side walls between the grooves, are formed in the piezoelectric ceramic plate, and electrodes are formed on the side walls of an inner surface of the grooves. The ink chamber plate covers the grooves of the piezoelectric ceramic plate to form ink chambers.
In the shear mode type inkjet head structure, since ink and the electrode maybe in contact with each other, if liquid having electric conductivity or liquid having polarity (an electric di-pole) is to be used as the ink, an electrode protective film is first formed on the electrode. For example, an inorganic insulating film formed of an inorganic material and an organic insulating film formed of an organic material are sequentially formed on the groove inner surface so as to cover the electrode, and thus the protective layer includes two film layers comprising the inorganic insulating film and the organic insulating film. Accordingly, when manufacturing the head, after bonding a piezoelectric ceramic plate on which an electrode is formed to the ink chamber plate, the protective layer includes the two film layers comprising the inorganic insulating film and the organic insulating film, and the nozzle plate is bonded to an end surface of a bonding body thereof.
In the ink jet head structure of the related art, there is a problem that contact between an electrode and the ink cannot be prevented when there is a pinhole in the protective film formed of an organic material.
In general, according to an embodiment, an ink jet head includes a base, walls attached to the base and defining flow paths between the walls, the flow paths including first and second flow paths alternating with one another, a nozzle plate comprising openings, each of which communicates with one of the first flow paths, an ink supply unit fluidly coupled to the first flow paths, electrodes on side surfaces of the walls, first and second wirings, each extending along the base and each being individually connected to one of the electrodes, a plurality of first protective layers on the base, the first wiring extending between a first pair of the first protective layers and the second wiring extending between a second pair of the first protective layers, and a second protective layer comprising an electrically insulating layer covering the first protective layers and the first and second wirings.
Hereinafter, an embodiment will be described with reference to
As illustrated in
The head main body 11 forms a device for discharging ink. The head main body 11 is attached to the unit portion 12. The unit portion 12 includes a manifold that forms a portion of a path between the head main body 11 and an ink tank, and a member for attaching the ink jet head 10 to an inner portion of the inkjet printer. The pair of circuit substrates 13 are attached to the head main body 11.
As illustrated in
As illustrated in
A row of spaced apart supply holes 22 are provided in parallel with each other in a longitudinal direction of the base plate 15 at a center portion of the base plate 15 as illustrated in
As illustrated in
As illustrated in
The frame member 17 is formed in a rectangular frame shape from a nickel alloy material. The frame member 17 is interposed between the mounting surface 21 of the base plate 15 and the one side surface of the nozzle plate 16. The frame member 17 is bonded to the mounting surface 21 and to the nozzle plate 16. That is, the nozzle plate 16 is attached to the base plate 15 through the frame member 17. The ink chamber 19 is bounded by the base plate 15, the nozzle plate 16, and the frame member 17.
The drive element 18 includes two piezoelectric members having a plate shape formed of, for example, lead zirconate titanate (PZT). The two piezoelectric members are bonded together with their polarization directions opposite to each other in the thickness direction thereof (i.e., opposed in the direction between the nozzle plate 16 and the base plate 15.
The pair of drive elements 18 are bonded to the mounting surface 21 of the base plate 15. The pair of drive elements 18 are arranged in parallel in the ink chamber 19 with one of each of the rows of nozzles 25 located thereover. As illustrated in
A plurality of grooves 27 extend inwardly of the drive elements 18 from the nozzle plate 16 side thereof. The grooves 27 extend in the direction intersecting the longitudinal direction of the drive element 18, and are arranged in parallel with each other in the longitudinal direction of the drive element 18 as illustrated in
The grooves 27 forming the dummy flow paths 52 are sealed resin at both ends of the groove 27 by a sealing portion 53 formed of a sealing resin. As illustrated in
An electrode 28 is provided in each of the plurality of grooves 27. For example, the electrodes 28 are formed by etching a nickel thin film through a patterned photoresist. The electrode 28 covers the inner side surfaces of the grooves 27.
As illustrated in
The wiring patterns 35 extend from one side end portion 21a and the other, opposed, side end portion 21b of the mounting surface 21, respectively. The side end portions 21a and 21b include not only the opposed edges of the mounting surface 21, but also the periphery region inward of the edges thereof. Therefore, the wiring pattern 35 may also extend from a location inwardly of the sides of the mounting surface 21.
Hereinafter, the wiring pattern 35 extending from the one side end portion 21a will be described as representative. The basic configuration of the wiring pattern 35 extending from the other side end portion 21b is the same as that of the wiring pattern 35 of the one side end portion 21a.
The wiring pattern 35 includes first portions 35a and second portions 35b. As illustrated in
In addition, the wiring patterns 35 according to the embodiment include first wiring patterns 35p connected to the electrode 28 of the dummy flow path 52 and second wiring patterns 35m connected to the electrodes 28 of the driven pressure chambers 51. As illustrated in
The electrode 28 of the dummy flow path 52 is divided into two portions, and one portion is formed as a common electrode. The other portion of the electrode 28 of the dummy flow path 52 is operated as an individual electrode to which positive charge is applied. Accordingly, the first wiring pattern 35p is connected to the other portion of the electrode 28 that is operated as the individual electrode of the dummy flow path 52.
In the embodiment, as illustrated in
Furthermore, a second protective layer 56 formed of an electric insulating material having good electric insulation characteristics is stacked on the planarization layer 55 formed of the wiring pattern 35 and the first protective layer 54. The second protective layer 56 is formed of, for example, a parylene film formed of an organic insulating material. The parylene film of the second protective layer 56 is formed by vapor deposition polymerization. In addition, the second protective layer 56 may also include a silicon nitride film as the inorganic material layer. It is possible to use a chemical vapor deposition (CVD) method, an RF magnetron sputtering method, and an atomic layer deposition (ALD) method as a manufacturing method of the silicon nitride film layer.
As illustrated in
The substrate main body 44 is a printed wiring plate having rigidity formed in a rectangular shape. Various electronic components and connectors are mounted on the substrate main body 44. In addition, the pair of FCPs 45 is attached to the substrate main body 44.
Each of the pair of FCPs 45 includes a flexible resin film 46 on which a plurality of wirings are formed and an IC 47 connected to the plurality of wirings. The film 46 is a tape automated bonding (TAB) film. The IC 47 is a component for applying a voltage to the electrode 28. The IC 47 is fixed to the film 46 by resin.
As illustrated in
The FCP 45 is electrically connected to the wiring pattern 35 such that the IC 47 is electrically connected to the electrode 28 through the wiring of the FCP 45. The IC 47 applies a voltage to the electrode 28 through the wiring of the film 46.
When the IC 47 applies a non-zero voltage to the electrodes 28 of the adjacent dummy pressure chambers 52 which each share a common wall 18 with a selected driven pressure chamber 51, the volume of the selected driven pressure chamber 51 groove is increased or decreased as a result of shear mode deformation of the drive element 18. As a result, when a positive potential is applied to the electrodes 28 of the dummy pressure chambers on the drive elements 18 which form common walls with the selected driven pressure chamber, the volume of the selected driven pressure chamber 51 increases, and ink is drawn therein from the ink chamber 19. When the voltage on these same electrodes is reversed, i.e., a negative potential is applied thereto, the volume of the selected driven pressure chamber 51 contracts and the pressure of the ink in the selected driven pressure chamber 51 groove is increased such that the ink is discharged from the nozzle 25, i.e., the ink is squeezed out of the selected driven pressure chamber 51 at least in part through the nozzle associated therewith. Note, one, or both of the electrodes 28 of the dummy pressure chambers on the drive elements 18 which form common walls with the selected driven pressure chamber need be biased to cause a change in the volume of the selected driven pressure chamber 51.
According to a configuration of the ink jet head 10 according to the embodiment, as illustrated in
The dummy flow path 52 is sealed by the sealing portion 53 formed of sealing resin at both ends of the groove 27 such that flowing of the ink from the ink chamber 19 to the dummy flow path 52 is prevented. Accordingly, each nozzle 25 of the nozzle plate 16 is opposed to a position corresponding to a driven pressure chamber 51 of the groove 27. Therefore, for example, when a nozzle 25 of the nozzle plate 16 is formed by laser processing, the laser beam is not directed to a location overlying the dummy flow paths 52. Accordingly, when the nozzles 25 of the nozzle plate 16 are formed by the laser processing, since the laser beam is not directed to the locations of the nozzle plate overlying the electrode 28 of the dummy flow paths 52, the electric insulating layer of the electrode 28 of the dummy flow path 52 is not damaged.
In addition, for example, in the embodiment, the first protective layer 54 formed of the inorganic insulating material is formed on a surface on the wiring pattern 35 on the mounting surface 21 of the base plate 15, and the planarization stop layer 55 for planarizing a surface of the wiring pattern 35 includes the first protective layer 54. Furthermore, the second protective layer 56 formed of an electric insulating layer having good electric insulation characteristics is stacked on the planarization layer 55 formed by the wiring pattern 35 and the first protective layer 54. With this structure, the planarization stop layer 55 having planarization characteristics of the wiring pattern 35 and the second protective layer 56 having good ink resistance characteristics and coverage properties are sequentially formed. Therefore, even a when liquid having electric conductivity or liquid having polarity (a di-pole) is used as the ink, it is possible to ensure insulating properties with good reproducibility between the ink and the electrode 28 when the ink is supplied to the ink chamber 19 inside the head main body 11.
Furthermore, the wiring pattern 35 according to the embodiment includes the first wiring pattern 35p connected to the electrode 28 of the dummy flow path 52 and the second wiring pattern 35m connected to the electrode 28 of the driven pressure chamber 51. Accordingly, as illustrated in
According to the embodiment, even when the liquid having electric conductivity or the liquid having polarity is used as the ink, it is possible to provide an ink jet head which can maintain the insulating properties between the electrode and the ink.
While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Number | Date | Country | Kind |
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2016-017983 | Feb 2016 | JP | national |