1. Field of the Invention
The present invention relates to an ink jet print head that ejects ink onto a surface of a print medium to form an image and more particularly to an ink jet print head having a flexible film substrate mounted on a substrate formed with print elements to generate energy for ejecting ink.
2. Description of the Related Art
An ink jet printing system generally comprises an ink jet print head having nozzles or ejection openings to eject ink and a supply system to supply ink to the print head.
An ink jet print head H1000 generally comprises a print element unit H1002, an ink supply unit H1003 and a tank holder H2000. As shown in
Here, the construction of the print element unit H1002 will be explained.
The print element unit H1002 is generally manufactured in the following processes.
Process 1: Forming a plate assembly by joining the first plate H1200 and the second plate H1400.
Process 2: Mounting two print element substrates H1100 and H1101 on the plate assembly.
Process 3: Positioning electrode terminals H1302 of the electric wiring tape H1300 and electrode portions of the print element substrates, and joining the electric wiring tape to the plate assembly.
Process 4: Connecting the electrode terminals H1302 of the electric wiring tape H1300 and the electrode portions of the print element substrates.
Process 5: Sealing the electrical connections.
Each of the above processes will be detailed in the following.
Process 1
The first plate H1200 is formed with ink supply ports H1201 to supply a black ink to the first print element substrate H1100 and cyan, magenta and yellow inks to the second print element substrate H1101. The second plate H1400 is joined to the first plate H1200 in a way that exposes the ink supply ports H1201. Where the ink supply ports H1201 are exposed, the second plate H1400 joined to the first plate H1200 is formed with device holes H1401 to accommodate the two print element substrates H1100, H1101.
Process 2
The first print element substrate H1100 and the second print element substrate H1101 are securely bonded with high precision to the exposed portions of the first plate H1200 through the device holes H1401. The positioning of the first and second print element substrates is made with respect to an X-direction positional reference surface H1204 and a Y-direction positional reference surface H1205 both formed in the first plate H1200. The print element substrates each having a plurality of ink ejection openings have a known construction employed in an ink jet print head.
Process 3
The electric wiring tape H1300 is a laminate of a base film, copper foil wires and a wire protecting cover film or solder resist. The base film may, for example, be formed of a polyimide resin to a thickness of about 25–125 μm. The copper foil wires have a thickness of 35 μm and are formed in a predetermined shape to connect the two print element substrates to the electric contact substrate H2200. Portions of the electric wiring tape H1300 that the print element substrates are built into, are formed with device holes H1304 of almost the same shape as the device holes H1401. At two sides of each of the device holes H1304 which correspond to the electrode portions of the print element substrates, electrode terminals H1302 plated with gold on their surface are arrayed as connection terminals. The electric wiring tape H1300 is secured on its cover film side to the surface of the second plate H1400 through a thermosetting epoxy resin bonding layer. The base film of the electric wiring tape H1300 is made smooth on its surface as it is engaged with a capping member of the print element unit.
Process 4
Electric connection between the electric wiring tape H1300 and the two print element substrates is made by performing an inner lead bonding (abbreviated ILB) on the electrode terminals H1302 of the electric wiring tape H1300 and bumps provided in advance on the electrode portions of the print element substrates, for example.
Process 5
When the electric connections are exposed after ILB, the electrode portions are covered and sealed with a sealant H1308 (
The sealant (first sealant) H1307 applied to the surroundings of the print element substrates is chosen to have a high fluidity and a high elasticity so that the sealant when hardened will not cause stresses such as hardening shrinkage to the print element substrate. The other sealant (second sealant) H1308 applied to the electric connections is chosen to have a high hardness to provide such properties as wear resistance against rubbing motions of a rubber wiper blade to wipe off ink drops adhering to an ejection opening forming face and durability against being flaked off should a print medium contact it.
Then, the electric terminal contact member H1303 on an electric input side of the electric wiring tape H1300 and the electric contact substrate H2200 to transfer electric signals from the printing apparatus body are connected together by, for instance, an ACF (Anisotropic Conductive Film) and the terminal connection portions are also covered with a sealant.
The print element unit H1002 assembled in the above processes and the ink supply unit H1003 are joined together through the joint seal member H2300. Screws H2400 are fastened into screw fixing bosses H1517 in the ink supply unit H1003 through screw setting positions H1207 provided in two screw setting portions H1206 of the first plate. At this time, the positional reference surfaces H1204, H1205 of the first plate and its back surface engage abutment portions H1509, H1510, H1511 of the ink supply unit H1003. This positions the print element unit H1002 in the X direction (main scan direction), Y direction (sub-scan direction) and Z direction (ink ejection direction). The electric contact substrate H2200 is positioned and fixed by a terminal positioning pins H1515 and terminal connecting pins H1516 of a terminal fixing portion H1512 of the ink supply unit H1003 coming into terminal positioning holes H1309 and terminal connecting holes H1310 of the electric contact substrate.
Then, the tank holder H2000 is mounted on the assembly of the print element unit H1002 and the ink supply unit H1003 to provide an ink jet print head H1000 of
Although the ink jet print head described above has a black ink ejection portion and a color ink ejection portion formed integral as one piece, the similar manufacturing process can also be applied to an ink jet print head with separate print element substrates for individual colors.
The ink jet print head, however, has the following problems that may degrade reliability.
As described above, the second sealant H1308 that covers the electric connections between the electric wiring tape H1300 and the print element substrates is hard and highly durable. Thus, where the second sealant H1308 is placed over the soft first sealant H1307, which seals the outer periphery of the print element substrates, may be cracked when applied a local external force as the first sealant H1307 deforms. From these cracks ink may seep in, leading to corrosion of electric connections.
To solve this problem, a method has been proposed (see Japanese Patent Application Laid-open No. 2002-187273) which involves extending the base film of the electric wiring tape H1300 at both ends of the arrays of the electrode terminals H1302 slightly into the device holes and applying the second sealant H1308 over the extension portions H1305 so as to cover the electric connections. This document also discloses that the extension portions H1305 may have a conductive layer to particularly enhance stiffness.
As the ink jet printing apparatus have come into widespread use, there is a growing demand for a reduction in cost of the print head used in the apparatus. To meet this demand, it is essential to lower the cost of elements making up the print head. When the base film and the copper foil layer making up the electric wiring tape H1300, which are relatively expensive parts, are reduced in thickness as part of the cost reduction effort, it is highly unlikely that the above-mentioned problem cannot be avoided completely with the above construction left unchanged.
This problem will be explained by referring to
As shown in
However, when the first sealant H1307 deforms (e.g., due to hardening shrinkage) as shown in
In light of the problem described above, the present invention has been accomplished to provide a highly reliable ink jet print head that clears the above problem.
The print head of this invention therefore comprises:
a print element substrate disposed on a base and having print elements for ejecting ink and electrode portions to receive a power supply for driving the print elements;
an accommodating unit to accommodate the print element substrate by enclosing a side peripheral part of the print element substrate, the accommodating unit being mounted on the base;
a resilient wiring member disposed on the accommodating unit and having wiring portions formed thereon to be connected to the electrode portions of the print element substrate;
a first sealant filling a space surrounding the print element substrate enclosed by the accommodating unit;
a second sealant covering the electrode portions of the print element substrate and a part of the wiring portions of,the wiring member corresponding to the electrode portions; and
a support member situated in the space to support the second sealant on the base.
With this invention stress concentrations in the electric connections which are feared to occur as a result of reducing the thickness of the base film and copper foil layer making up a wiring member such as an electric wiring tape, which are the relatively expensive wiring member, can be alleviated thereby enhancing the reliability. The provision of the support member that supports the second sealant can improve the reliability and manufacturing stability of the connecting portions between the print element substrate and the wiring member even if the wiring member is reduced in thickness to lower the cost. Particularly if protrusions are provided inside the device hole, which defines the print element substrate accommodating space in the accommodating unit (second plate) that can be formed of a relatively inexpensive material, the number of parts does not increase nor does the part cost rise. Therefore it is possible to provide a highly reliable ink jet print head at low cost.
The above and other objects, effects, features and advantages of the present invention will become more apparent from the following description of embodiments thereof taken in conjunction with the accompanying drawings.
Now, the present invention will be described in detail by referring to the accompanying drawings.
This embodiment differs from the construction of
Using the second plate H1400′ formed in this manner, the print element unit H1002 is assembled in the process described above, so that the device hole extension portions H1305 of the electric wiring tape are supported by the protrusions H1402 of the second plate, as shown in
In this embodiment, the extension portions H1305 are provided on the electric wiring tape side to support the second sealant H1308. In this construction the extension portions H1305 are formed to positively protrude toward the electric connections to ensure that a step at the end of the electric wiring tape is not situated near the periphery of the sealant H1308, thereby making the step coverage of the sealant H1308 stable and satisfactory. If the peeling of the sealant H1308 due to such a step does not become an issue, the extension portions H1305 may not be provided on the electric wiring tape side and instead the protrusions H1402 of the second plate can be directly covered with the sealant H1308, i.e., the protrusions H1402 of the second plate can directly support the sealant H1308. This can also be said of second and third embodiment.
While this embodiment has almost square protrusions H1402 at corners of the device hole H1401′ of the second plate H1400′, the shape of the protrusions is not limited to this one as long as they can effectively support the device hole extension portions H1305 of the electric wiring tape or the second sealant H1308. For example, their square edge portions may be chamfered in an inclined surface or in a curved surface. The protrusions of such shapes can still be molded easily and as one piece with the second plate and produce the similar effect.
The second plate H1400′ does not affect the construction of other parts of the print element unit and thus does not require significant changes in the basic design and manufacturing process of the print element unit. Therefore, for the print element substrates H1100 and H1101 the known construction of the ink jet print head can be employed. The construction of the print element substrates will be briefly explained referring
Further, along two sides of the print element substrate in a direction (X direction in the figure) perpendicular to the direction of array of the electrothermal transducers H1103 (Y direction in the figure) are formed electrode portions H1104 for connecting the electrothermal transducers formed on the first print element substrate and a drive circuit built into the first print element substrate with external circuits. In the electrode portions H1104 ball bumps (stud bumps) H1105 of Au, for example, are formed as by a wire bonding device for connection with the electrode terminals H1302 of the electric wiring tape H1300.
Means for generating ink ejection energy are not limited to the electrothermal transducers, which, when energized, generate thermal energy to heat and create a bubble in ink, and other forms of energy generation means may be employed.
The print head H1100 assembled by using the print element unit H1002 constructed as shown in
This apparatus has a linear encoder 506 to detect a position of the carriage in the main scan direction. The linear encoder 506 has as one constitutional element a linear scale 507 provided along the direction of travel of the carriage 500 which is formed with slits at a predetermined density and at equal intervals. The linear encoder 506 has as the other constitutional element a slit detection system 508 having a light emitting portion and a light sensor and a signal processing circuit. Thus, as the carriage 500 moves, the linear encoder 506 outputs an ejection timing signal for determining an ink ejection timing and carriage position information.
Paper P as a print medium is intermittently fed in a direction B perpendicular to the scan direction of the carriage 500. The paper P is supported by a pair of roller units 509, 510 situated upstream in the direction of paper transport and by a pair of roller units 511, 512 situated downstream and is given a predetermined tension by these rollers to secure a flatness or planarity with respect to an ejection opening forming face of the print element unit H1002 as it is transported. A driving force to each roller unit is transmitted from a paper feed motor not shown.
In the above construction, the printing over the same width as the length of the ejection opening arrays of the ink jet print head while the carriage 500 moves and the feeding of paper P are repetitively alternated until the whole paper P is printed.
The carriage 500 stops at a home position as required at a print start time or during a printing operation. At this home position is provided a cap member 513 that caps the ejection opening forming face of each ink jet head (in which ejection openings are formed). The cap member 513 has a suction-based recovery means (not shown) to forcibly suck out ink from ejection openings to prevent possible clogging of the ejection openings. At the home position a wiping member 550 to wipe clean the ejection opening forming face of the print element unit H1002 is arranged vertically movable.
This embodiment differs from the construction of
In other steps, the print element unit H1002 is assembled in the similar manner to have the device hole extension portions H1305 of the electric wiring tape supported on the support members H1403. Thus, if the first sealant H1307 undergoes hardening shrinkage, the downward deflection of the extension portions H1305 can be blocked, preventing local stress concentrations in the electric connections between the print element substrate and the electric wiring tape, thereby maintaining the connection stability. It is therefore possible to provide a highly reliable ink jet print head.
In other steps the print element unit H1002 is assembled in the similar manner to have the device hole extension portions H1305 of the electric wiring tape supported on the support members H1403. Thus, if the first sealant H1307 undergoes hardening shrinkage, the downward deflection of the extension portions H1305 can be blocked, preventing local stress concentrations in the electric connections between the print element substrate and the electric wiring tape, thereby maintaining the connection stability. It is therefore possible to provide a highly reliable ink jet print head.
It is noted that the shape of the support members is not limited to the cube or the like as long as they can effectively support the device hole extension portions H1305 of the electric wiring tape or the second sealant H1308. The material of the support members is also not limited to acrylics but may use inexpensive and easily formed materials, such as metal, ceramics and easily molded resin.
The size of the folded portions may be set otherwise. That is, the front ends of the folded portions H1306 need not completely contact the upper surface of the first plate H1200. The folded portions H1306 can be sized to allow deformation of the electric wiring tape to such a degree that no undesirable local stress concentrations occur in the electric connections between the electric wiring tape and the print element substrate.
The present invention has been described in detail with respect to preferred embodiments, and it will now be apparent from the foregoing to those skilled in the art that changes and modifications may be made without departing from the invention in its broader aspect, and it is the intention, therefore, in the apparent claims to cover all such changes and modifications as fall within the true spirit of the invention.
This application claims priority from Japanese Patent Application No. 2003-415727 filed Dec. 12, 2003, which is hereby incorporated by reference herein.
Number | Date | Country | Kind |
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2003-415727 | Dec 2003 | JP | national |
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Number | Date | Country |
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2002-187273 | Jul 2002 | JP |
Number | Date | Country | |
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20050128548 A1 | Jun 2005 | US |