Ink Jet Printable Compositions

Abstract
In jet printable compositions that include nano metal powders in a liquid carrier.
Description
BACKGROUND

Ink jet printing is a widely used printing technique. Specific examples include continuous ink j et printing and drop on demand ink jet printing.


SUMMARY

We have developed compositions that can be ink jetted to form conductive patterns on a variety of substrates. Dispersions hereby are nano metal powders dispersed in a liquid carrier. Inks are dispersions with additional additives to impart additional properties to the dispersion in order to fulfill requirements of the printing process and the final product properties. The final printed product is in the form of a conductive pattern that may have additional properties depending on its specific application. The nano metal powders, which are produced by the Metallurgic Chemical Process (MCP) process described herein, have special properties, enabling the dispersion and de-agglomeration of the powder in a liquid carrier (organic solvent, water, or any combination thereof), with or without additives. Taking advantage of these attributes we have been able, with the MCP-produced nano metal powders, to design compositions with very low viscosities, as required for ink jet printing at high metal concentrations, by selecting appropriate combinations of the nano metal powder, liquid carrier, and, optionally, additives. The ability to combine high metal concentrations with very low viscosities makes the compositions particularly useful for ink jet printing.


Dispersions comprising nano metal particles dispersed substantially homogeneously in a liquid carrier that includes (a) water, a water-miscible organic solvent, or combination thereof or (b) an organic solvent, or combination of organic solvents and (c) surfactants, wetting agents, stabilizers, humectants, rheological agents, and combinations thereof, are described.


Inks based upon these dispersions, and further including property-modifiying additives (e.g. adhesion promoters, rheology adjusting additives, and the like) are also described.


The compositions have properties that enable their jettability (printing through ink jet print heads which posses small nozzles, usually in the micron range). These properties include the following: low viscosities between 1 and 200 cP (at room temperature or at jetting temperature), surface tension between 20-37 dyne/cm for solvent based dispersions and 30-60 dyne/cm for water based dispersions, metal loadings of nano particles between 1% and 70% (weight by weight), low particle size distribution of the nano metal particle material having a particle size distribution (PSD) D90 below 150 nm, preferably below 80 nm. The compositions have stabilities sufficient to enable jetting with minimum settling, and without clogging the print head or changing the properties of the compositions. The compositions can be printed by different technologies including continuous ink jet technologies, drop on demand ink jet technologies (such as piezo and thermal) and also additional techniques like air brush, flexo, electrostatic deposition, wax hot melt, etc.


The details of one or more embodiments of the invention are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the invention will be apparent from the description and drawings, and from the claims.





DESCRIPTION OF DRAWINGS


FIG. 1 is a representative ink jet printed pattern.



FIGS. 2-6 are Scanning Electron Microscopy (SEM) photographs of nano metal particles used to prepare the ink jettable compositions.



FIGS. 7-8 are Transmission Electron Microscopy (TEM) photographs of ink jettable compositions.



FIG. 9 is an x-ray diffraction scan of nano metal particles used to prepare ink jettable compositions.





Like reference symbols in the various drawings indicate like elements.


DETAILED DESCRIPTION

The ink jettable compositions feature nano metal particles in a liquid carrier. Suitable nano metal particles include silver, silver-copper alloys, silver-palladium alloys, and other metals and metal alloys produced by the process described in U.S. Pat. No. 5,476,535 (“Method of producing high purity ultra-fine metal powder”) and PCT application WO 2004/000491 A2 (“A Method for the Production of Highly Pure Metallic Nano-Powders and Nano-Powders Produced Thereof”), both of which are hereby incorporated by reference in their entirety. The nano metal particles have a “non uniform spherical” shape and their chemical compositions include aluminum up to 0.4% (weight by weight), both of which are unique to this production method. SEM photographs of representative nano metal particles are shown in FIGS. 2-6. TEM photographs of a representative composition prepared by dispersing nano metal particles in a liquid carrier are shown in FIGS. 7-8. The non-uniform (deformed ellipsoidal) shape of the particles is evident from the XRD data shown in FIG. 9 and from particle size distribution measurements.


Useful liquid carriers include water, organic solvents, and combinations thereof. Useful additives include surfactants, wetting agents, stabilizers, humectants, rheology adjusting agents, adhesion promoters, and the like. Specific examples, many of which are commercially available, include the following:

    • Organic solvents: DPM (di(propyleneglycol)methyl ether), PMA (1,2-propanediol monomethyl ether acetate), Dowanol DB (diethylene glycol monobutyl ether), BEA (butoxyethyl acetate).
    • Dispersing agents and stabilizers for solvent-based dispersions: BYK-9077, Disperbyk-163, PVP K-15.
    • Dispersing/wetting agents and stabilizers for water-based dispersions: BYK-154, BYK-162, BYK-180, BYK-181, BYK-190, BYK-192, BYK-333, BYK-348, Tamol T1124, SDS, AOT, Tween 20, Tween 80, L-77, Betaine, Sodium Laureth Sulfosuccianate and Sulfate, Tego 735W, Tego 740W, Tego 750W, Disperbyk, PDAC (poly(diallyldimethylammonium chloride)), Nonidet, CTAC, Daxad 17 and 19 (sodium salt of naphthalene sulfonate formaldehyde condensate), BASF 104, Solspers 43000, Solspers 44000, Atlox 4913, PVP K-30, PVP K-15, Joncryl 537, Joncryl 8003, Ufoxan, STPP, CMC, Morwet, LABS W-100A, Tamol 1124.
    • Humectants for water-based dispersions: PMA, DPM, glycerol, Sulfolam, diethylene glycol, triethanolamine, Dowanol DB, ethanol, DMF (dimethyl formamide), isopropanol, n-propanol, PM (1-methoxy-2-propanol), Diglyme (di(ethylene glycol)diethyl ether), NMP (1-methyl pyrrolidinone).


The printed patterns produced hereby can be treated post printing in any suitable way to increase their conductivity. The treatments may be any of the following methods or combinations thereof: methods described in PCT applications WO 2004/005413 A1 (“Low Sintering Temperatures Conductive Inks—a Nano Technology Method for Producing Same”) and WO03/106573 (“A Method for the Production of Conductive and Transparent Nano-Coatings and Nano-Inks and Nano-Powder Coatings and Inks Produced Thereby”), application of radiation, microwave, light, flash light, laser sintering, applying pressure, rubbing, friction sintering, thermal heat (applied in any form, e.g. forced air oven, hot plate, etc), continuous radiation, scanned beam, pulsed beam, etc. Preferably the treatment is a “chemical sintering method” (CSM) described in a provisional patent application No. ______ entitled “Low Temperature Sintering Process for Preparing Conductive Printed Patterns on Substrates, and Articles Based Thereon” filed concurrently with the present application, and in WO 03/106573.


The dispersions and inks may be printed onto a wide range of surfaces, including flexible, rigid, elastic, and ceramic surfaces. Specific examples include paper, polymer films, textiles, plastics, glass, fabrics, printed circuit boards, epoxy resins, and the like.


The invention will now be described further by way of the following examples.


EXAMPLES
EXAMPLE 1

A dispersion of 30% by weight of silver nano powder (#471-G51) (prepared as described in U.S. Pat. No. 5,476,535 and PCT application WO 2004/000491 A2), 0.7% Disperbyl® 348 (available from BYK-Chemie, Wesel Germany), 5.3% BYK® 190 (also available from BYK-Chemie), 0.35% PVP K-30 (available from Alfa Aesar—Johnson Matthey), 3.15% DPM (Dipropylene glycol methyl ether), 25.5% iso-propanol (IPA), and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing with a high speed homogenizer Dispermat (VMA-GETZMANN GMBH) at 4000 rpm with a 47 mm diameter dissolver shaft, until the minimum particle size distribution (PSD) was achieved. Typically, homogenization was performed for 10 min at 6000 rpm. The dispersion was printed in a Hewlett-Packard Deskjet 690 printer.


EXAMPLE 2

A dispersion of 40% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 0.6% Disperbyk® 348 (available from BYK-Chemie, Wesel Germany), 4.6% BYK® 190 (also available from BYK-Chemie), 0.1% PVP K-30 (available from Alfa Aesar—Johnson Matthey), 11% NMP, 0.5% AMP, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing with a high speed homogenizer Dispermat (VMA-GETZMANN GMBH) at 4000 rpm with a 47 mm diameter dissolver shaft, until the minimum PSD was achieved. Typically, homogenization was performed for 10 min at 6000 rpm. The dispersion was printed in a Hewlett-Packard Deskjet 690 printer.


EXAMPLE 3

A dispersion of 50% by weight of silver nano powder (#471-G51) (prepared as described in U.S. Pat. No. 5,476,535 and PCT application WO 2004/000491 A2), 0.5% Disperbyk® 348 (available from BYK-Chemie, Wesel Germany), 3.8% BYK® 190 (also available from BYK-Chemie), 0.25% PVP K-30 (available from Alfa Aesar—Johnson Matthey), 0.25% Tween 20 (available from Aldrich), 9.1% NMP, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing with a high speed homogenizer Dispermat (VMA-GETZMANN GMBH) at 4000 rpm with a 47 mm diameter dissolver shaft, until the minimum PSD was achieved. Typically, homogenization was performed for 10 min at 6000 rpm. The dispersion was printed in a Hewlett-Packard Deskjet 690 printer.


EXAMPLE 4

A dispersion of 60% by weight of silver nano powder (#471-G51) (prepared as described in U.S. Pat. No. 5,476,535 and PCT application WO 2004/000491 A2), 0.4% Disperbyk® 348 (available from BYK-Chemie, Wesel Germany), 3% BYK® 190 (also available from BYK-Chemie), 0.1% PVP K-30 (available from Alfa Aesar—Johnson Matthey), 7.3% NMP, 0.4% AMP, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing with a high speed homogenizer Dispermat (VMA-GETZMANN GMBH) at 4000 rpm with a 47 mm diameter dissolver shaft, until the minimum PSD was achieved. The dispersion was printed in a Hewlett-Packard Deskjet 690 printer.


EXAMPLE 5

A dispersion of 60% by weight of silver nano powder (#473-G51) (prepared as described in Example 26), 0.4% Disperbyk® 348 (available from BYK-Chemie, Wesel Germany), 3% BYK® 190 (also available from BYK-Chemie), 0.1% PVP K-30 (available from Alfa Aesar—Johnson Matthe), 0.4% AMP, 7.3% iso-propanol (IPA), and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing with a high speed homogenizer Dispermat (VMA-GETZMANN GMBH) at 4000 with a 47 mm diameter dissolver shaft, until the minimum PSD was achieved. Typically, homogenization was performed for 10 min. The dispersion was printed in a Hewlett-Packard Deskjet 690 printer.


EXAMPLE 6

A dispersion of 60% by weight of silver nano powder (#473-W51) (prepared as described in patent U.S. Pat. No. 5,476,535 and PCT application WO 2004/000491 A2), 0.4% Disperbyk® 348 (available from BYK-Chemie, Wesel Germany), 3% BYK® 190 (also available from BYK-Chemie), 0.1% PVP K-30 (available from Alfa Aesar—Johnson Matthey), 0.4% AMP, 11% NMP, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver powder in portions while mixing with a high speed homogenizer Dispermat (VMA-GETZMANN GMBH) with a 47 mm diameter dissolver shaft, until the minimum PSD was achieved. Typically, homogenization was performed for 10 min at 6000 rpm. The dispersion was printed in a Hewkett-Packard Deskjet 690 printer.


EXAMPLE 7

A dispersion of 10% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 0.5% Disperbyk® 163 (available fiom BYK-Chemie, Wesel Germany), 0.007% BYK® 333 (also available from BYK-Chemie), and the balance BEA (Buthoxy ethylacetate) was prepared by mixing the additives with the solvents, then adding the silver nanopowder in portions while mixing with a high speed homogenizer Dispermat (VMA-GETZMANN GMBH) at 4000 rpm with a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 76 nm). Typically, homogenization was performed for 10 min at 6000 rpm. A surface tension of 26 mN/m was measured according to the Dunoy ring method.


EXAMPLE 8

A dispersion of 60% by weight of silver nano powder (#473-G51) (prepared as described in Example 26), 3% Disperbyk 163 (available from BYK-Chemie, Wesel Germany), 0.04% BYK® 333 (also available from BYK-Chemie), and the balance BEA (Buthoxy ethylacetate) was prepared by mixing the additives with the solvents, then adding the silver nano powder in portions while mixing with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 17 cP using a Brookfield Viscometer. A surface tension of 26.5 mN/m was measured using the Dunoy ring method. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which the resistivity was measured and determined to be 5 μΩcm.


EXAMPLE 9

A dispersion of 10% by weight of silver nano powder (#473-G51) (prepared as described in Example 26), 0.6% Disperbyk® 190 (available from BYK-Chemie, Wesel Germany), 0.015% BYK® 348 (also available from BYK-Chemie), 0.015% PVP K-30 (available from Alfa Aesar—Johnson Matthey), 0.93% NH3 water solution, 18.66% NMP, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 76 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 4 cP using a Brookfield Viscometer. A surface tension of 47.5 mN/m was measured using the Dunoy ring method.


EXAMPLE 10

A dispersion of 40% by weight of silver nano powder (#473-G51) (prepared as described in Example 26), 2.4% Disperbyk® 190 (available from BYK-Chemie, Wesel Germany), 0.06% BYK® 348 (also available from BYK-Chemie), 0.06% PVP K-30 (available from Alfa Aesar—Johnson Matthey), 0.6% NH3 water solution, 12% NMP, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 17 cP using a Brookfield Viscometer. A surface tension of 47.5 mN/m was measured using the Dunoy ring method.


EXAMPLE 11

A dispersion of 60% by weight of silver nano powder (#473-G51) (prepared as described in Example 26), 3% Disperbyk® 190 (available from BYK-Chemie, Wesel Germany), 0.08% BYK® 348 (also available from BYK-Chemie), 0.2% PVP K-15 (available from Fluka), 0.147% AMP (2-amino-2-methyl-propanol), 7.343% NMP (1-methyl pyrrolidinone), and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 15 cP using a Brookfield Viscometer. A surface tension of 47.5 mN/m was measured using the Dunoy ring method.


EXAMPLE 12

A dispersion of 10% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 1.14% Disperbyk® 190 (available from BYK-Chemie, Wesel Germany), 0.15% Tween 20 (available from Aldrich), 0.15% NH3 water solution, 1.5% PMA, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D50 50 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 3 cP using a Brookfield Viscometer. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 11 μΩcm.


EXAMPLE 13

A dispersion of 60% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 3% Disperbyl(® 190 (available from BYK-Chemie, Wesel Germany), 0.08% BYK® 348 (also available from BYK-Chemie), 0.2% PVP K-30 (available from Alfa Aesar—Johnson Matthey), 0.147% AMP, 7.343% NMP, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D50 50 nm). Typically, homogenization was performed for 10 min. The viscosity of the composition was determined to be 18 cP using a Brookfield Viscometer. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 11 μΩcm.


EXAMPLE 14

A dispersion of 50% by weight of silver nano powder (#471-W51) (prepared as described in Example 28, 0.3% Disperbyk® 348 (available from BYK-Chemie, Wesel Germany), 0.5% NH3 water solution, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved. Typically, homogenization was performed for 10 min at 6000 rpm. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 19 μΩcm.


EXAMPLE 15

A dispersion of 20% by weight of silver nano powder (#473-G51) (prepared as described in Example 26), 1% Disperbyl(® 190 (available from BYK-Chemie, Wesel Germany), 0.027% BYK® 348 (also available from BYK-Chemie), 0.067% PVP K-15 (available from Fluka), 0.313% AMP (2-amino-2-methyl-propanol), 15.76% NMP (1-methyl pyrrolidinone), and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min. The viscosity of the composition was determined to bet 15 cP using a Brookfield Viscometer. A surface tension of 47.5 mN/m was measured using the Dunoy ring method. A conductive pattern was printed with this dispersion using a Lexmark printer Z602, cartridge Lexmark Black 17 and 16 in which the black ink had been replaced with this dispersion. The dispersion was printed on HP photoquality paper semi-glossy (C6984A). Two passes were performed. The conductive pattern was sintered at 150° C. for 90 minutes, after which its resistivity was measured and determined to be 70 μΩcm.


EXAMPLE 16

The procedure of Example 15 was followed except that the dispersion was printed on Epson premium Glossy Photo paper (S0412870). The conductive pattern was sintered at 80° C. for 30 minutes, after which its resistivity was measured and determined to be 70 μΩcm.


EXAMPLE 17

The procedure of Example 15 was followed except that the composition was printed on an HP Premium Inkjet Transparency Film (C3835A). The conductive pattern was sintered at 150° C. for 30 minutes, after which its resistivity was measured and determined to be 70 μΩcm.


EXAMPLE 18

A dispersion of 20% by weight of silver palladium nano powder (#455) (prepared as described in patent U.S. Pat. No. 5,476,535 and PCT application WO 2004/000491 A2), 4% Disperbyk® 163 (available from BYK-Chemie, Wesel Germany), and the balance BEA was prepared by mixing the additives with the solvent, then adding the silver palladium nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D50 50 nm). Typically, homogenization was performed for 10 min. The viscosity of the composition was determined to be 3 cP using a Brookfield Viscometer. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 113 μΩcm.


EXAMPLE 19

A dispersion of 40% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 0.3% BYK® 348 (available from BYK-Chemie, Wesel Germany), 0.6% NH3 water solution, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 20 cP using a Brookfield Viscometer with a constant shear cone spindle #4 at 200 rpm. A surface tension of 47.5 mN/m was measured using the Dunoy ring method. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 17 μΩcm.


EXAMPLE 20

A dispersion of 60% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 0.3% BYK® 348 (available from BYK-Chemie, Wesel Germany), 0.4% NH3 water solution, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 78 cP using a Brookfield Viscometer with a constant shear cone, spindle #4 at 200 rpm. A surface tension of 47.5 mN/m was measured using the Dunoy ring method. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 24 μΩcm.


EXAMPLE 21

A dispersion of 40% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 0.3% BYK® 348 (available from BYK-Chemie, Wesel Germany), 0.6% NH3 water solution, and the balance water was prepared by mixing the additives with the solvents and water, then adding the silver powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 20 cP using a Brookfield Viscometer with a constant shear cone spindle #4 at 200 rpm. A surface tension of 47.5 mN/m was measured using the Dunoy ring method. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 17 μΩcm.


EXAMPLE 22

A dispersion of 40% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 2% BYK(® 9077 (available from BYK-Chemie, Wesel Germany), and the balance PMA was prepared by mixing the additive with the solvent, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 20 cP using a Brookfield Viscometer with a constant shear cone spindle #4 at 200 rpm. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 17 μΩcm.


EXAMPLE 23

A dispersion of 50% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 2.5% BYK® 9077 (available from BYK-Chemie, Wesel Germany), and the balance PMA was prepared by mixing the additive with the solvent, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 24 cP using a Brookfield Viscometerwith a constant shear cone spindle #4 at 200 rpm. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 14 μΩcm.


EXAMPLE 24

A dispersion of 60% by weight of silver nano powder (#471-W51) (prepared as described in Example 28), 3% BYK® 9077 (available from BYK-Chemie, Wesel Germany), and the balance PMA was prepared by mixing the additive with the solvent, then adding the silver nano powder in portions while mixing at 4000 rpm with a high speed Premier Mill Laboratory Dispersator Series 2000 Model 90 (Premier Mill Corp. USA) having a 47 mm diameter dissolver shaft, until the minimum PSD was achieved (D100 77 nm). Typically, homogenization was performed for 10 min at 6000 rpm. The viscosity of the composition was determined to be 40 cP using a Brookfield Viscometer with a constant shear cone spindle #4 at 200 rpm. A conductive pattern prepared using the composition was sintered at 300° C. for 30 minutes, after which its resistivity was measured and determined to be 14 μΩcm.


Examples 25-28 describe the preparation of various nano metal powders.


EXAMPLE 25
Nano Powder production through MCP Process #440

Silver nano powder was prepared by making a melt of 30% by weight of silver and 70% aluminum (e.g., 300 grams silver and 700 grams aluminum) in a stirred graphite crucible in an induction melting furnace under air at a temperature of at least 661° C. The melt was poured into a 14 mm thick mold made from steel. The molded ingot was left to cool at room temperature, and then annealed in an electrical furnace at 400° C. for 2 hours. The annealed ingot was left to cool at room temperature, then rolled at room temperature in a rolling machine (from 13 mm thickness to 1 mm thickness in 22 passes). The sheets were cut and heat treated in an electrical furnace at 560° C. for 4 hours. The heated sheets were quenched in water at room temperature. The sheets were then leached in an excess of a NaOH solution (25% by weight in deionized water—density 1.28 grams/ml at room temperature, 1.92 kg NaOH solution per 0.1 kg alloy) at a starting temperature of 28° C. and while cooling to keep temperature below 70° C. for 12 hours (leaching reactor without external agitation).


Next, the NaOH solution was decanted and a new portion of 25% NaOH solution was added (40 gram per 0.1 kg starting alloy), after which the sample was left for 2 hours. The slurry was filtered and washed with deionized water to a pH of 7. The powder was then dried in an air convection oven at a temperature below 45° C. The powder produced at this stage had a prime particle size below 80 nm, as measured by XRD and SEM, and a typical chemical composition of 99.7% silver, 0.3% aluminum, and traces of sodium, iron, copper and other impurities.


An ethanol solution was prepared by dissolving 15.66 grams Span 20 and 2.35 grams hexadecanol in 750 ml ethanol. 500 grams of leached dry powder was added to the ethanolic solution and stirred for 2 hours. The slurry was poured into a tray and the ethanol evaporated at temperature below 45° C. The coated powder was then passed through a jet mill to get a de-agglomerated silver nano powder with particle size (D90) below 80 nm, as measured by laser diffraction.


EXAMPLE 26
Nano Powder Production through MCP Process #473-G51

Silver nano powder was prepared by making a melt of 24.4% by weight of silver, 0.6% by weight copper and 75% aluminum (e.g., 243.8 grams silver, 6.3 gram copper and 750 grams aluminum) in a stirred graphite crucible under air at a temperature of at least 661° C. The melt was poured into a 14 mm thick mold made from steel. The molded ingot was left to cool at room temperature, and then annealed in an electrical furnace at 400° C. for 2 hours. The annealed ingot was left to cool at room temperature, and then rolled at room temperature in a rolling machine (from 13 mm thickness to 1 mm thickness in 24 passes). The sheets were cut and heat treated in in an electrical furnace at 440° C. for 4 hours. The heated sheets were quenched in water at room temperature. The sheets were then leached in an excess of a NaOH solution (25% by weight in deionized water—density 1.28 grams/ml at room temperature, 1.92 kg NaOH solution per 0.1 kg alloy) at a starting temperature of 28° C. and while cooling to keep the temperature below 70° C. for 12 hours (leaching reactor without external agitation).


The NaOH solution was then decanted and a new portion of 25% NaOH solution was added (40 gram per 0.1 kg starting alloy) and left for 2 hours. The powder produced at this stage had a prime particle size below 80 nm, as measured by XRD and SEM, and a surface area greater than 5 mt2/gram. An ethanol solution was prepared by dissolving 15.66 grams Span 20 and 2.35 grams hexadecanol in 750 ml ethanol. 500 grams of leached dry powder was added to the ethanolic solution and stirred for 2 hours. The slurry was poured into a tray and the ethanol evaporated at a temperature below 45° C. The coated powder was then passed through a jet mill to get a de-agglomerated silver nano powder with particle size (D90) below 80 nm, as measured by laser diffraction.


The powder produced in the previous steps was further washed with hot ethanol several times (between 3 and 5 times), and then dried in tray until all the ethanol evaporated at a temperature below 45° C. A de-agglomerated silver nano powder with particle size (D90) below 80 nm, as measured by laser diffraction, and organic coating of less than 1.2% by weight, as measured by TGA, was obtained.


EXAMPLE 27
Nano Powder Production through MCP Process #473-SH

Silver nano powder was prepared by making a melt of 24.4% by weight of silver, 0.6% by weight copper and 75% aluminum (e.g., 243.8 grams silver, 6.3 gram copper and 750 grams aluminum) in a stirred graphite crucible under air at a temperature of at least 661° C. The melt was poured into a 14 mm thick mold made from steel. The molded ingot was left to cool at room temperature, and then annealed in an electrical furnace at 400° C. for 2 hours. The annealed ingot was left to cool at room temperature, ands then rolled at room temperature in a rolling machine (from 13 mm thickness to 1 mm thickness in 24 passes). The sheets were cut and heat treated in in an electrical furnace at 440° C. for 4 hours. The heated sheets were quenched in water at room temperature. The sheets were then leached in an excess of a NaOH solution (25% by weight in deionized water—density 1.28 grams/ml at room temperature, 1.92 kg NaOH solution per 0.1 kg alloy) at a starting temperature of 28° C., while cooling to keep temperature below 70° C., for 12 hours (leaching reactor without external agitation).


The NaOH solution was then decanted and a new portion of 25% NaOH solution was added (40gram per 0.1 kg starting alloy) and left for 2 hours. The powder produced at this stage had a prime particle size below 80 nm, as measured by XRD and SEM, and surface area greater than 5 mt2/gram. An ethanol solution was prepared by dissolving 15.66 grams Span 20 and 2.35 grams hexadecanol in 750 ml ethanol. 500 grams of leached dry powder was added to the ethanolic solution and stirred for 2 hours. The slurry was poured into a tray and the ethanol evaporated at temperature below 45° C. The coated powder was passed through a jet mill to get a de-agglomerated silver nano powder with particle size (D90) below 80 nm, as measured by laser diffraction.


EXAMPLE 28
Nano Powder Production through MCP Process #471-W51

Silver nano powder was prepared by making a melt of 10% by weight of silver, 0.1% by weight copper and 89.9% aluminum (e.g., 99 grams silver, 1 gram copper and 899 grams aluminum) in a stirred graphite crucible under air at a temperature of at least 661° C. The melt was poured into a 14 mm thick mold made from steel. The molded ingot was left to cool at room temperature, and then annealed in an electrical furnace at 400° C. for 2 hours. The annealed ingot was left to cool at room temperature, and then rolled at room temperature in a rolling machine (from 13 mm thickness to 1 mm thickness in 24 passes). The sheets were cut and heat treated in in an electrical furnace at 440° C. for 4 hours. The heated sheets were quenched in water at room temperature. The sheets were leached in a NaOH solution (25% by weight in deionized water—density 1.28 grams/ml at room temperature, 1.92 kg NaOH solution per 0.1 kg alloy) at a starting temperature of 28° C. while cooling to keep temperature below 95° C. When the temperature reached 95° C., the solution was allowed to sit for 10 minutes, after which the NaOH solution was decanted (leaching reactor without external agitation). The powder produced at this stage had a prime particle size below 80 nm, as measured by XRD and SEM, and a surface area greater than 11 mt2/gram.


A water solution was prepared by dissolving 13.5 grams Tamol T1124 (available from Rohm & Hass) in 170 ml water. 300 grams of leached dry powder was added to the water solution and stirred for 100 minutes. The slurry was then poured into a tray and the water evaporated at temperature below 45° C. The coated powder was passed through a jet mill to get a de-agglomerated silver nano powder with particle size (D90) below 70 nm, as measured by laser diffraction.


EXAMPLE 29
Stability

The composition prepared in Example 15 was filtered after 14 days through a 5 μm filter. The metal load before and after filtration was 19.7% and 19.6%, respectively, measured by weight using the TGA method. The PSD was also measured and no change found. This indicates that the composition exhibited good stability and dispersability.


EXAMPLES 30-34

Examples 30-34 describe various solvent-based compositions. The constituents and properties of the individual compositions are listed in Table 1. The compositions, each of which included 60% by weight of silver nano powder No. 471-W51 (prepared as described in Example 28), were prepared as follows: 6 g of liquid carrier having the composition set forth in Table 1 was homogenized using a Dispermat (VMA-GETZMANN GMBH) at 4000 rpm. 9 g of silver/copper alloy nano powder was added gradually and then homogenization was performed for 10 min at 6000 rpm. The particle size measurements were measured with the use of HPPS (Malvern Instruments) for dispersions diluted in a liquid similar to that of the dispersion. The measurements were carried out only for liquid-phase dispersions. Some dispersions formed pastes after homogenization; these pastes were not further studied.









TABLE 1







Solvent-based formulations
















Viscosity
Viscosity

Surface tension of

Surface tension


Example
Formulations
25° C.
45° C.
Size
dispersion
Solution
of solution





30
60% 471-W51 in (7.6% Byk
  14 cp
  11 cp
35 nm (9%)
25.45 (mN/m)
(0.1% Byk 333 +
24.4 (mN/m)



9077 in PMA) + 0.1% Byk 333


235 nm (63%)

7.6% Byk 9077) in






450 nm (27%)

PMA


31
60% 471-W51 in (7.6% Byk
  18 cp
11.3 cp
15 nm (20%)
25.21 (mN/m)
(0.1% Byk 333 +
24.5 (mN/m)



163 + 0.1% Byk 333) in


230 nm (80%)

7.6% Byk 163) in



(Dowanol DB +




(Dowanol DB + 30%



30% PMA)




PMA)


32
60% 471-W51 in (7.6% Byk 163
 7.5 cp
 5.1 cp
25 nm (75%)
+0.1% Byk 333
(0.1% Byk 333 +
25.3 (mN/m)



in BEA)


230 nm (24%)
26.2 mN/m
7.6% Byk 163) in








BEA


33
60% Ag (Sp.ol) in (7.6% Byk
12.4 cp
 8.8 cp
550 nm (55%) and
26.9 mN/m
7.6% Byk 163 in
27.1 (mN/m)



163 in BEA)


1μ(44%).

BEA






Pecipitation in






cuvette during size






measurement


34
60% 471-W51 in (7.6% Byk
16.8 cp
11.3 cp
70 nm (8%)



163 + 0.1% Byk 333 + 0.5%


230 nm (90%)



PVP K-15) in (Dowanol DB +


Sometimes small



30% MPA)


peaks at 1μ and 2.7μ






are observed









As shown in Table 1, formulations composed of Ag/Cu alloy nano powder dispersed in PMA, Dowanol DB plus PMA, or BEA, and containing BYK 9077 or Disperbyk 163 as dispersing agents, and BYK-333 as a wetting agent, are good candidates to be used as ink-jet inks. These formulations are characterized by 2-3 peaks in size distribution graphs (15-35 nm, 230-235 nm, and 450 nm). Viscosity was found to be in the range 14-18 cP at 25° C. and 11 cP at 45° C., surface tension is about 24-25 mN/m. After about 10 days, there was some sedimentation (easily redispersed by shaking), but there was no clear visible separation, which indicates that there were many small particles still dispersed in the liquid.


EXAMPLES 35-43

Examples 35-43 describe various water-based compositions. The constituents and properties of the individual compositions are listed in Table 2. The compositions, each of which included 60% by weight of silver nano powder No. 473-G51 (prepared as described in Example 26), were prepared as follows: 6 g of liquid carrier having the composition set forth in Table 2 was homogenized using a Dispermat (VMA-GETZMANN GMBH) at 4000 rpm. 9 g of silver nano powder was added gradually and then homogenization was performed for 10 min at 6000 rpm. The particle size measurements were measured with the use of HPPS (Malvern Instruments) for dispersions diluted in a liquid similar to that of the dispersion. The measurements were carried out only for liquid-phase dispersions. Some of the dispersions formed pastes after homogenization; these pastes were not further studied.









TABLE 2







Water-based formulations with NanoPowder product 473-G51










Rheological
Viscosity













Example
Sample
Dispersants, wetting agents and solvents
Size by volume distribution
properties
25° C.
45° C.





35
473-G51
(0.2% Byk 348 + 7.6% Byk 190 +
20 nm (90%); 230 nm (8%); sometimes
Liquid with a small






0.5% PVP K-30) in [1% AMP in H2O
small peak at 2.7μ is observed
amount of precipitate




(pH = 11.5) + 20% NMP]


36
473-G51
(0.2% Byk 348 + 7.6% Byk 190 +
16 nm (80%); 230 nm (11%); small
Liquid with




0.5% PVP K-30) in [1% AMP in H2O
peaks at 1μ and 2.7μ are observed
precipitate




(pH = 11.5) + 10% PMA]


37
473-G51
(0.2% Tween 20 + 7.6% Byk 190 +
19 nm (30%); 230 nm (7%); Sometimes
Liquid with




0.5% PVP K-30) in [1% AMP in H2O
small peaks at 1μ and are 2.7μ
precipitate




(pH = 11.5) + 10% Dowanol DB]


38
473-G51
(0.2% Byk 348 + 7.6% Daxad 19)

Paste




in [1% AMP in H2O (pH = 11.5) +




20% NMP]


39
473-G51
(0.2% Byk 348 + 7.6% Byk 190 +
20 nm (80%); 230 nm (9%); small
Liquid with soft
27.3 cp 
 26 cp




0.5% PVP K-30) in [1% AMP
peaks at 1μ; 2.7μ
precipitate




(pH = 11.5) + 20% n-propanol]


40
473-G51
(0.2% Byk 348 + 7.6% Byk 190 +
24 nm (86%); 230 nm (13%)
Liquid with a small




0.5% PVP K-30) in [1% AMP in H2O

amount of precipitate




(pH = 11.5) + 30% NMP]


41
473-G51
(0.2% Byk 348 + 7.6% Byk 190 +
20 nm (70%); 230 nm (29%)
Liquid with a small
8.2 cp
6.5 cp




0.5% PVP K-15) in [0.5% AMP in H2O

amount of precipitate




(pH = 10.9) + 20% NMP]


42
473-G51
(0.2% Byk 348 + 7.6% Byk 190 +
25 nm (82%); 230 nm (17%)
Liquid with a a small
7.2 cp
5.0 cp




1.0% PVP K-15) in [0.5% AMP in H2O

amount of precipitate




(pH = 10.9) + 20% NMP]


43
473-G51
(0.1% Byk 333 + 7.6% Byk 163) in
There are big peaks at 1μ and 2.7μ
Liquid with




(Dowanol DB + 30% PMA)

precipitate









The results shown in Table 2 demonstrate that useful water-based ink formulations could be prepared using silver nano powder 473-G51. This powder was obtained in the presence of Span in hexadecanol followed by washing by ethanol up to practically exhaustive elimination of organic substances. BYK 190 (in combination with wetting agent BYK 348) was found to be a useful dispersing agent for this nano powder in combination with PVP K-15 and K-30. In addition, NMP, PMA, Dowanol DB and n-propanol, were used as co-solvents and humectants.


The pH of the compositions was adjusted by AMP (2-amino-2-methyl-propanol). Several experiments were carried out with 1% AMP in water (pH 11.5). Dispersions were characterized by size distribution containing usually 4 peaks (about 20 nm, 230 nm, and 2 weak peaks at 1 μm and 2.7 μm). A decrease in AMP concentration to 0.5% resulted in a decrease in pH value to 10.9. Such a correction of pH resulted in an improvement of the dispersion characteristics.


As seen from Table 2, Examples 41 and 42 are characterized by only two peaks in the size distribution graph: 20-25 nm (70-86%) and 230 nm (13-29%). These formulations exhibited particularly useful viscosities for ink jet printing.


EXAMPLES 44-145

Examples 44-145 describe additional water-based compositions. The constituents and properties of the individual compositions are listed in Table 3. The compositions, each of which, except as noted, included 60% by weight of silver nano powder No. 471-W51 (prepared as described in Example 28), were prepared as follows: 6 g of liquid carrier having the composition set forth in Table 3 was homogenized using a Dispermat (VMA-GETZMANN GMBH) at 4000 rpm. 9 g of silver nano powder was added gradually and then homogenization was performed for 10 min at 6000 rpm. The particle size measurements were measured with the use of HPPS (Malvern Instruments) for dispersions diluted in a liquid similar to that of the dispersion. The measurements were carried out only for liquid-phase dispersions. Some of the dispersions formed pastes after homogenization; these pastes were not further studied.









TABLE 3





Water-based formulations with NanoPowder product 471-W51

















Example
Sample
Dispersants, wetting agents and solvents





44
471-W51-Ag/Cu
7.6% Byk 192 in (0.1%



alloy stabilized by
NH4OH + 10% DPM)



Tamol 1124


45
471-W51-Ag/Cu
7.0% T-1124 in (H2O + 10% DPM)



alloy stabilized by




Tamol 1124


46
471-W51-Ag/Cu
7.0% T 1124 in 1 M NaOH



alloy stabilized by




Tamol 1124


47
471-W51-Ag/Cu
7.6% Byk 192 in (0.1% NH4OH + 10%



alloy stabilized by
PMA)



Tamol 1124


48
471-W51-Ag/Cu
10.5% Byk 192 in (0.1% NH4OH + 10%



alloy stabilized by
PMA)



Tamol 1124


49
471-W51-Ag/Cu
4.5% Byk 192 in (0.1% NH4OH + 10%



alloy stabilized by
PMA)



Tamol 1124


50
471-W51-Ag/Cu
7.6% Byk 190 in (0.1% NH4OH + 10%



alloy stabilized by
PMA)



Tamol 1124


51
471-W51-Ag/Cu
7.6% Betaine in (0.1% NH4OH + 10%



alloy stabilized by
PMA)



Tamol 1124


52
471-W51-Ag/Cu
1.5% Betaine in (0.1% NH4OH + 10%



alloy stabilized by
PMA)



Tamol 1124


53
471-W51-Ag/Cu
1.5% Sodium Laureth Sulfosuccinate in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


54
471-W51-Ag/Cu
1.5% Sodium Laureth Sulfate in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


55
471-W51-Ag/Cu
7.6% Tego 740w in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


56
471-W51-Ag/Cu
4.5% Tego 740w in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


57
471-W51-Ag/Cu
12% Tego 740w in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


58
471-W51-Ag/Cu
7.6% Tego 740w in (H2O + 10% DPM)



alloy stabilized by




Tamol 1124


59
471-W51-Ag/Cu
3% AOT in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


60
471-W51-Ag/Cu
7.6% Tego 740w in (0.1%



alloy stabilized by
NH4OH + 10% PMA)



Tamol 1124


61
471-W51-Ag/Cu
7.6% Tego 735w in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


62
471-W51-Ag/Cu
45% Byk 190 in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


63
471-W51-Ag/Cu
15% (active) Tego 750w in (H2O + 10%



alloy stabilized by
PMA)



Tamol 1124


64
471-W51-Ag/Cu
7.6% Disperbyk in (H2O + 10% PMA)



alloy stabilized by



Tamol 1124


65
471-W51-Ag/Cu
0.5% PDAC (Med. M.W.) in (H2O + 5%



alloy stabilized by
Glycerol)



Tamol 1124


66
471-W51-Ag/Cu
7.6% Tego 740w in (H2O + 20% PMA)



alloy stabilized by




Tamol 1124


67
471-W51-Ag/Cu
(4.5% Tego 740w + 5% Na-citrate) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124



68
471-W51-Ag/Cu
7.6% Dispex A-40 in H2O



alloy stabilized by



Tamol 1124


69
471-W51-Ag/Cu
(1% Byk 333 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


70
471-W51-Ag/Cu
(1% Tween 20 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


71
471-W51-Ag/Cu
(1% Tween 20 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 15% IPA + 10% PMA)



Tamol 1124


72
471-W51-Ag/Cu
(1% Tween 20 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 5% IPA + 10% PMA)



Tamol 1124


73
471-W51-Ag/Cu
7.6% Tween 20 in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


74
471-W51-Ag/Cu
7.6% Tween 20 in (H2O + 10%



alloy stabilized by
Sulfolan)



Tamol 1124


75
471-W51-Ag/Cu
7.6% Tween 20 in (H2O + 10%



alloy stabilized by
Diethyleneglycol)



Tamol 1124


76
471-W51-Ag/Cu
(7.6% Tween 20 + 0.5% NMP) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


77
471-W51-Ag/Cu
(7.6% Tween 20 + 1% PVP K-40) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


78
471-W51-Ag/Cu
(7.6% Tween 20 + 1% Joncryl 537) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


79
471-W51-Ag/Cu
(7.6% Tween 20 + 1% Joncryl 8003) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


80
471-W51-Ag/Cu
(7.5% Nonidet in



alloy stabilized by
(Triethanolamine/H2O = 1:3)



Tamol 1124


81
471-W51-Ag/Cu
3% Nonidet in 10% Triethanolamine



alloy stabilized by




Tamol 1124


82
471-W51-Ag/Cu
(1% Tween 20 + 7.6% Byk 190) in H2O



alloy stabilized by




Tamol 1124


83
471-W51-Ag/Cu
(1% Tween 20 + 7.6% Byk 190) in H2O



alloy stabilized by




Tamol 1124


84
471-W51-Ag/Cu
(1% Tween 20 + 7.6% Byk 190 + 0.5%



alloy stabilized by
Byk 348) in (H2O + 10% PMA)



Tamol 1124


85
471-W51-Ag/Cu
(0.2% Tween 20 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


86
471-W51-Ag/Cu
7.6% Byk 190 in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


87
471-W51-Ag/Cu
15% Byk 190 in (H2O + 10% PMA)



alloy stabilized by




Tamol 1124


88
471-W51-Ag/Cu
(0.5% Tween 20 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 10% PMA)



Tamol 1124


89
471-W51-Ag/Cu
(1% Tween 20 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 10% Dowanol DB)



Tamol 1124


90
471-W51-Ag/Cu
(2.0% Byk 154 + 7.6% Byk 181) in



alloy stabilized by
(H2O + 10% Ethanol)



Tamol 1124


91
471-W51-Ag/Cu
(1.0% Byk 181 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 10% Ethanol)



Tamol 1124


92
471-W51-Ag/Cu
(1% Urea + 1% Byk 181 + 7.6% Byk



alloy stabilized by
190) in (H2O + 10% Ethanol)



Tamol 1124


93
471-W51-Ag/Cu
(1% Byk 181 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 10% PM)



Tamol 1124


94
471-W51-Ag/Cu
(1% Byk 181 + 7.6% Byk 154) in



alloy stabilized by
(H2O + 10% Ethanol)



Tamol 1124


95
471-W51-Ag/Cu
7.6% Tween 20 in (H2O + 10% DMF)



alloy stabilized by




Tamol 1124


96
471-W51-Ag/Cu
(1% Byk 181 + 10% Byk 154) in



alloy stabilized by
(H2O + 10% Ethanol)



Tamol 1124


97
471-W51-Ag/Cu
(1% Byk 181 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 20% Ethanol)



Tamol 1124


98
471-W51-Ag/Cu
(1% Byk 181 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 20% DMF)



Tamol 1124


99
471-W51-Ag/Cu
(1% Urea + 1% Tween 20 + 7.6% Byk



alloy stabilized by
190) in (H2O + 10% DMF + 10%



Tamol 1124
Ethanol)


100 
471-W51-Ag/Cu
(1% Urea + 7.6% Tween 20) in



alloy stabilized by
(H2O + 10% DMF)



Tamol 1124


101 
471-W51-Ag/Cu
(1% Urea + 7.6% Tween 20) in



alloy stabilized by
(H2O + 10% DMF + 10% PMA)



Tamol 1124



102 
471-W51-Ag/Cu
(1% Urea + 7.6% Tween 20) in



alloy stabilized by
(H2O + 10% DMF + 10% Dow.DB)



Tamol 1124



103 
471-W51-Ag/Cu
(1% Urea + 1% Byk 181 + 7.6% Byk



alloy stabilized by
190) in (H2O + 10%



Tamol 1124
DMF + 10% Dowanol DB)


104 
471-W51-Ag/Cu
(1% Urea + 1% Byk 181 + 7.6% Byk



alloy stabilized by
190) in (H2O + 10% DMF + 10% PMA)



Tamol 1124


105 
471-W51-Ag/Cu
7.6% Tween 20 in (H2O + 20% Ethanol + 10%



alloy stabilized by
PMA)



Tamol 1124


106 
471-W51-Ag/Cu
7.6% Tween 20 in (H2O + 20%



alloy stabilized by
Ethanol + 10% Dowanol DB)



Tamol 1124


107 
471-W51-Ag/Cu
(1% Byk 181 + 7.6% Byk 180) in



alloy stabilized by
(H2O + 10% IPA + 10% Dowanol DB)



Tamol 1124


108 
471-W51-Ag/Cu
7.6% Tween 20 in H2O + (1% Span 20



alloy stabilized by
in 10% IPA + 10% Dowanol DB)



Tamol 1124


109 
471-W51-Ag/Cu
7.6% Tween 20 in (H2O + 20%



alloy stabilized by
IPA + 10% Dowanol DB)



Tamol 1124


110 
471-W51-Ag/Cu
7.6% Tween 20 in (H2O + 20% IPA)



alloy stabilized by




Tamol 1124


111 
471-W51-Ag/Cu
7.6% Tween 80 in (H2O + 20% IPA)



alloy stabilized by




Tamol 1124


112 
471-W51-Ag/Cu
5% CTAC in (H2O + 20% IPA)



alloy stabilized by



Tamol 1124


113 
471-W51-Ag/Cu
10% CTAC in (H2O + 20% IPA)



alloy stabilized by



Tamol 1124


114 
471-W51-Ag/Cu
(2% Daxad 19 + 7.6% Byk 190) in



alloy stabilized by
(H2O + 20% IPA)



Tamol 1124


115 
471-W51-Ag/Cu alloy
(7.6% BasF 104 + 0.025% NH4OH) in (H2O + 20%



stabilized by Tamol 1124
IPA)


116 
471-W51-Ag/Cu alloy
(5% BasF 104 + 0.025% NH4OH) in (H2O + 20%



stabilized by Tamol 1124
IPA)


117 
471-W51-Ag/Cu alloy
(7.6% Tween 20 + 0.025% NH4OH) in (H2O + 20%



stabilized by Tamol 1124
IPA)


118 
471-W51-Ag/Cu alloy
(1% Tween 20 + 7.6% Bk 190 + 0.1% NH4OH) in



stabilized by Tamol 1124
(H2O + 20% IPA)


119 
471-W51-Ag/Cu alloy
(1% Tween 20 + 7.6% Bk 190 + 0.1% NH4OH) in



stabilized by Tamol 1124
(H2O + 20% Diglyme)


120 
471-W51-Ag/Cu alloy
(45% Byk 190 + 1% Tween 20 + 0.1% NH4OH) in



stabilized by Tamol 1124
(H2O + 20% Diglyme)


121 
471-W51-Ag/Cu alloy
(2% L-77 + 7.6% Byk 190 + 0.1% NH4OH) in



stabilized by Tamol 1124
(H2O + 20% IPA + 10% Dowanol DB)


122 
471-W51-Ag/Cu alloy
(1% Byk 181 + 7.6% Byk 180) in (H2O + 10%



stabilized by Tamol 1124
Diglyme + 10% Dowanol DB)


123 
471-W51-Ag/Cu alloy
(1% L-77 + 7.6% Byk 180) in (H2O + 20%



stabilized by Tamol 1124
Dowanol DB)


124 
471-W51-Ag/Cu alloy
(2% Tween 20 + 7.6% Byk 180 in (H2O + 20%



stabilized by Tamol 1124
Diglyme)


125 
471-W51-Ag/Cu alloy
(0.5% Tween 20 + 7.6% Byk 180) in (H2O + 20%



stabilized by Tamol 1124
Diglyme)


126 
471-W51-Ag/Cu alloy
(1% Byk 348 + 7.6% Byk 180) in (H2O + 20%



stabilized by Tamol 1124
Diglyme)


127 
471-W51-Ag/Cu alloy
(0.91% Byk 181 + 13.6% Byk 180) in (H2O + 9.1%



stabilized by Tamol 1124
Diglyme + 9.1% Dowanol DB)


128 
471-W51-Ag/Cu alloy
(1% Byk 181 + 5% Byk 180) in (H2O + 10%



stabilized by Tamol 1124
Diglyme + 10% Dowanol DB)


129 
471-W51-Ag/Cu alloy
(4% Urea + 1% Byk 181 + 7.6% Byk 180) in



stabilized by Tamol 1124
(H2O + 10% Diglyme + 10% Dowanol DB)


130 
471-W51-Ag/Cu alloy
(0.2% SDS + 1% Byk 181 + 7.6% Byk 180) in



stabilized by Tamol 1124
(H2O + 10% Diglyme + 10% Dowanol DB)


131 
471-W51-Ag/Cu alloy
(1% Byk 181 + 10% Byk 180) in (H2O + 10%



stabilized by Tamol 1124
Diglyme + 10% Dowanol DB)


132 
471-W51-Ag/Cu alloy
(0.8% PVP K-30 + 0.5% Byk 348 + 7.6% Byk



stabilized by Tamol 1124
190 in [0.04% AMP in H2O(pH = 10) + 40%




IPA + 5% DPM)


133 
471-W51-Ag/Cu alloy
(0.8% PVP K-30 + 0.5% Tween 20 + 0.5%



stabilized by Tamol 1124
Byk 348 + 15.2% Solsperse 44000) in (0.04%




AMP in H2O(pH = 10) + 40% IPA + 5% DPM)


134 
471-W51-Ag/Cu alloy
(0.5% Tween 20 + 0.5% Byk 348 + 7.6%



stabilized by Tamol 1124
Solsperse 43.000 + 0.8% PVP (K-30) in (40%




IPA + 5% DPM + 0.04% AMP in H2O




(pH = 10)]


135 
471-W51-Ag/Cu alloy
(0.5% Tween 20 + 0.5% Byk 348 + 7.6% Byk



stabilized by Tamol 1124
190 + 0.5% PVP K-30) in [0.04% AMP in




H2O (pH = 10) + 20% NMP]]


136 
40% 471-W51-Ag/Cu alloy
(0.5% Tween 20 + 0.5% Byk 348 + 7.6% Byk



stabilized by Tamol 1124
190 + 0.5% PVP K-30) in [0.04% AMP in




H2O (pH = 10) + 20% NMP]]


137 
40% 471-W51-Ag/Cu alloy
(0.2 Byk 348 + 7.6% Byk 190 + 0.5% PVP K-



stabilized by Tamol 1124
30) in [1% AMP in H2O (pH = 11.5) + 20%




NMP]


138 
40% 471-W51-Ag/Cu alloy
(0.2 Byk 348 + 7.6% Byk 190 + 0.5% PVP K-



stabilized by Tamol 1124
30) in [1% AMP in H2O (pH = 11.5) + 20%




NMP]


139 
60% 471-W51-Ag/Cu alloy
0.2% Byk 348 + 7.6% Atlox 4913) in [1%



stabilized by Tamol 1124
AMP in H2O (pH = 11.5) + 20% NMP]


140 
471-W51-Ag/Cu alloy
(0.2 Byk 348 + 7.6% Daxad 19) in [1% AMP



stabilized by Tamol 1124
in H2O (pH = 11.5) + 20% NMP]


141 
471-W51-Ag/Cu alloy
(0.2 Byk 348 + 5% Solsperse 44000) in [1%



stabilized by Tamol 1124
AMP in H2O (pH = 11.5) + 20% NMP]


142 
471-W51-Ag/Cu alloy
(0.2 Byk 348 + 7.6% Solsperse 44000) in [1%



stabilized by Tamol 1124
AMP in H2O (pH = 11.5) + 20% NMP]


143 
471-W51-Ag/Cu alloy
(0.2 Byk 348 + 7.6% Byk 190 + 0.5% PVP K-



stabilized by Tamol 1124
30) in [1% AMP in H2O (pH = 11.5) + 20% n-




propanol]


144 
471-W51-Ag/Cu alloy
(0.2 Byk 348 + 7.6% Byk 190 + 0.5% PVP K-



stabilized by Tamol 1124
30) in [1% AMP in H2O (pH = 11.5) + 30%




NMP]


145 
471-W51-Ag/Cu alloy
(0.2 Byk 348 + 7.6% Byk 190 + 0.5% PVP K-



stabilized by Tamol 1124
30) in [1% AMP in H2O (pH = 11.5) + 20% n-




propanol + 10% NMP]















Rheological



Example
Size by volume distribution
properties
Viscosity





44
Peaks until 1μ
Liquid with





precipitate


45
Peaks until 2.6μ
Liquid with




precipitate


46
Peaks until 2.6μ
Liquid with




precipitate


47
Peaks until 1μ
Liquid with




precipitate


48
Peaks until 2.7μ
Liquid with




precipitate


49
Peaks until 2.7μ
Liquid with




precipitate


50
Peaks until 2.7μ
Liquid with




precipitate


51
Peaks until 1μ
Liquid with




precipitate


52
2.5μ
Liquid with




precipitate


53
1.6μ; 2.5μ
Liquid with




precipitate


54
1μ; 1.5μ
Liquid with




precipitate


55
Peaks until 1μ
Liquid with
99.6 cp




precipitate
(25° C.)


56
Peaks until 1μ; small peak
Liquid with



at 2.7μ
precipitate


57
Peaks at 940 nm; 2.7μ
Liquid with




precipitate


58
Peaks at 940 nm; 2.7μ
Liquid with




precipitate


59
2.4μ
Liquid with




precipitate


60
Peaks at 940 nm; 2.7μ
Liquid with




precipitate


61
2.4μ
Liquid with




precipitate


62
Peaks until 600 nm; small
Liquid with



peak at 2μ
precipitate


63
Peaks at 940 nm and 2.7μ
Liquid with




precipitate


64

Paste


65

Paste


66

Liquid with
 185 cp




precipitate
(25° C.)


67
616 nm (26%); 933 nm
Liquid



(73%); 2.7μ (2%)
with




precipitate


68

Paste


69
Peak at 2.7μ
Liquid with




precipitate


70
Peaks until 600 nm
Liquid with




precipitate


71
Peaks until 600 nm
Liquid with




precipitate


72
Peaks until 600 nm
Liquid with




precipitate


73
Sometimes a peak at 2.7μ
Liquid with



appears
precipitate


74
Peaks until 600 nm, small
Liquid with



peak at 2.7μ
precipitate


75
Peaks until 600 nm, small
Liquid with



peak at 2.7μ
precipitate


76
Peaks until 600 nm, small
Liquid with



peak at 2.7μ
precipitate


77
Peaks until 600 nm, small
Liquid with



peak at 2.7μ
precipitate


78
Sometimes a small peak at
Liquid with



2.7μ appears
precipitate


79
Sometimes there is a small
Liquid with



peak at 2.7μ
precipitate


80
There are peaks at 940 nm;
Paste



2.7μ


81
There are peaks at 940 nm;
Paste



2.7μ


82
20 nm (37%) 236.2 (2%)
Liquid with
33.2 cp




precipitate
(25° C.)


83
20 nm (37%) 236.2 (2%)
Liquid with
33.2 cp




precipitate
(25° C.)


84
There is a peak at 2.7μ
Liquid with




precipitate


85
There is a peak at 2.7μ
Liquid with




precipitate


86
There are peaks at 940 nm
Liquid with



and 2.7μ
precipitate


87
Sometimes a peak at 2.7μ
Liquid with



appears
precipitate


88
Sometimes peaks at 940 nm
Liquid with



and 2.7μ appear
precipitate


89
Sometimes peaks at 940 nm
Liquid with



and 2.7μ appear
precipitate


90
940 nm; 2.7μ
Almost




paste


91
18 nm; 220 nm
Liquid with




precipitate


92
18 nm; 220 nm
Liquid with




precipitate


93
Peaks until 230 nm
Liquid with




precipitate


94
Peaks at 385, 583.1 nm
Almost




paste


95
10-18 nm; 240 nm; 400 nm;
Liquid with



small peak 2.7μ
precipitate


96
500-600 nm
Almost




paste


97
24 nm; 230 nm; sometimes
Liquid with



small peak at 2.7μ appears
precipitate


98
20 nm; 230 nm; small peak
Liquid with



at 2.7μ
precipitate


99
20-30 nm; 230 nm
Liquid with




precipitate


100 
17-18 nm; 200 nm; small
Liquid with



peak at 2.7μ
precipitate


101 
25 nm; 230 nm; sometimes
Liquid with
36.2 cp



a small peak at 2.7μ
precipitate
(25° C.)



appears

 21. cp





(45° C.)


102 
20 nm; 230 nm; sometimes
Liquid with
56.4 cp



a small peak at 2.7μ
precipitate
(25° C.)



appears

 50. cp





(45° C.)


103 
20 nm; 230 nm; sometimes
Liquid with
34.7 cp



a small peak at 2.7μ
precipitate
(25° C.)



appears

19.1 cp





(45° C.)


104 
20 nm; 230 nm; sometimes
Liquid with
56.4 cp



a small peak at 2.7μ
precipitate
(25° C.)



appears

25.0 cp





(45° C.)


105 
20 nm; 230 nm; sometimes
Liquid with



a small peak at 2.7μ
precipitate



appears


106 
20 nm; 230 nm; sometimes
Liquid with



a small peak at 2.7μ
precipitate



appears


107 
500 nm
Almost




paste


108 
20-30 nm; 230 nm; small
Liquid with



peak at 2.7μ appears
precipitate


109 
230 nm and sometimes a
Liquid with



small peak at 2.7μ appears
precipitate


110 
20 nm; 230 nm
Liquid with




precipitate


111 
20 nm; 230 nm
Liquid with




precipitate


112 
20 nm; 230 nm
Paste


113 
1μ; 2μ
Paste


114 
600 nm; 700 nm
Liquid with




precipitate


115 
20 nm (80%); 230 nm (14%); sometimes a
Liquid with



small peak at 2.7μ appears
precipitate


116 
10-12 nm (50%); 230 nm (7%); sometimes
Liquid with



a small peak at 2.7μ appears
precipitate


117 
10-12 nm (50%); 230 nm (7%); sometimes
Liquid with



a small peak at 2.7μ appears
precipitate


118 
10-12 nm (50%); 230 nm (7%); sometimes
Liquid with



a small peak at 2.7μ appears
precipitate


119 
10-12 nm (50%); 230 nm (7%); sometimes
Liquid with



a small peak at 2.7μ appears
precipitate


120 
420 nm; 600 nm; 1μ; 2μ
Liquid with




precipitate


121 
49 nm (26%); 230 nm (25%); sometimes
Liquid with



small peaks at 1μ and 2.7μ appear
precipitate


122 
450 nm; 600 nm
Liquid with




precipitate


123 
Peaks until 1μ
Paste


124 
8 nm (90%); 200 nm; 400 nm; 600 nm (2-3%)
Liquid with




precipitate


125 
15 nm (60%); 1μ (33%); 2.7μ
Liquid with




precipitate


126 
20 nm (24%); 240 nm (4%); 400 nm (9%);
Liquid with



1μ (30%)
precipitate


127 
400 nm
Liquid with




precipitate


128 
Big peaks at 1μ and 2.7μ
Liquid with




precipitate


129 
Big peaks at 1μ and 2.7μ
Liquid with




precipitate


130 
Big peaks at 1μ
Liquid with




precipitate


131 
Peaks at 1μ and 2.7μ
Liquid with




precipitate


132 
20 nm; 230 nm; sometimes a peak at 2.7μ
Liquid with



appears
precipitate


133 

Paste


134 

Paste


135 
20 nm; 230 nm; sometimes a small peak at
Liquid with



2.7μ appears
precipitate


136 
20 nm; 230 nm; sometimes a small peak at
Liquid with small



2.7μ appears
and soft precipitate


137 
20 nm; 230 nm; sometimes a small peak at
Liquid with small
10.9 cp



2.7μ appears
and soft precipitate
(25° C.)





6.54


138 
20 nm; 230 nm; sometimes a small peak at
Liquid with small



2.7μ appears
and soft precipitate


139 
20 nm; 230 nm
Liquid with




precipitate


140 

Paste


141 
20 nm; 230 nm; sometimes a small peat at
Liquid with



2.7μ appears
precipitate


142 
20 nm; 230 nm; sometimes a small peat at
Liquid with



2.7μ appears
precipitate


143 
20 nm; 230 nm (15%); 1μ; 2.7μ
Liquid with




precipitate


144 
20 nm (70%); 230 nm (14%); sometimes a
Liquid with



small peat at 2.7μ appears
precipitate


145 
20 nm (70%); 230 nm (14%); sometimes a
Liquid with



small peat at 2.7μ appears
precipitate









The results shown in Table 3 demonstrate that the best dispersions could be obtained at high pH values, e.g., about 10. Therefore, experiments were carried out with the addition of ammonia solution, and then with an organic amine (AMP) to avoid NH3 evaporation. Low concentrations of AMP were used (e.g., 0.04% AMP in water gives pH=10). Because the preparation of silver nano powder dispersions results in a decrease in pH to 9, the AMP concentration in all experiments was 1%. The best dispersions (very diluted, without a dispersant or wetting agent) were obtained with the use of isopropanol and ethanol as humectants; the optimal concentrations were found to be 40% for both additives. Several formulations also contained DPM as an additive in order to suppress evaporation.


As seen in Table 3, most of the formulations contained compact precipitates and had relatively high viscosities. A decrease in silver nano powder concentration from 60% to 40% resulted in a decrease in the amount of precipitate, which also became less compact. Viscosities of formulations containing 40% of silver nano powder (e.g., Examples 137 and 138) were 10.9 cP at 25° C. and 6.9 cP at 45° C.


EXAMPLES 146-167

Examples 146-167 describe additional water-based compositions. The constituents and properties of the individual compositions are listed in Table 4. The compositions, each of which included 60% by weight of silver nano powder No. 1440 (prepared in the presence of Daxad 19 stabilizer following the procedures generally described in U.S. Pat. No. 5,476,535 and PCT application WO 2004/000491 A2), were prepared as follows: 6 g of liquid carrier having the composition set forth in Table 4 was homogenized using a Dispermat (VMA-GETZMANN GMBH) at 4000 rpm. 9 g of silver nano powder was added gradually and then homogenization was performed for 10 min at 6000 rpm. The particle size measurements were measured with the use of HPPS (Malvern Instruments) for dispersions diluted in a liquid similar to that of the dispersion. The measurements were carried out only for liquid-phase dispersions. Some of the dispersions formed pastes after homogenization; these pastes were not further studied.









TABLE 4







Water-based formulations with NanoPowder product 1440 stabilized by Daxad 19














Dispersants, wetting agents and





Example
Sample
solvents
Size by volume distributions
Rheological properties
Viscosity





146
1440 (Lot AS 1015)
2% SDS in (H2O + 10% PMA)
2.7μ
Paste




Stabilized by Daxad 19


147
1440 (Lot AS 1015)
15% Byk 190 in (0.1% NH4OH + 10%
935 nm; 2μ
Liquid with precipitate



Stabilized by Daxad 19
PMA)


148
1440 (Lot AS 1015)
7.6% Tego 740 W in H2O
2.7μ
Pastse



Stabilized by Daxad 19


149
1440 (Lot AS 1015)
7.6% Byk 190 in (H2O + 10% PMA)
248.7 nm (18%); 425.5 nm
Liquid with precipitate
11.3 cp



Stabilized by Daxad 19

(56%); 595.1 nm (15%); and

(25° C.)





small peaks at 940 nm and 2.7μ

10.6 cp







(45° C.)


150
1440 (Lot AS 1015)
15% Byk 190 in H2O
Peaks until 600μ and a small
Liquid with precipitate



Stabilized by Daxad 19

peak at 2.7μ


151
1440 (Lot AS 1015)
7.5% Byk 190 in H2O
There are peaks at 940 nm and
Liquid with precipitate



Stabilized by Daxad 19

2.7μ


152
1440 (Lot AS 1015)
15% Byk 190 in (H2O + 10% DPM)
There are peaks at 940 nm and
Liquid with precipitate



Stabilized by Daxad 19

2.7μ


153
1440 (Lot AS 1015)
7.5% Byk 190 in (H2O + 10% DPM)
There are peaks at 940 nm and
Liquid with precipitate



Stabilized by Daxad 19

2.7μ


154
1440 (Lot AS 1015)
15% Byk 190 in (H2O + 10% PMA)
There are peaks at 940 nm and
Liquid with precipitate



Stabilized by Daxad 19

2.7μ


155
1440 (Lot AS 1015)
7.6% Dispex A40 in H2O
There are peaks at 940 nm and
Liquid with precipitate



Stabilized by Daxad 19

2.7μ


156
1440 (Lot AS 1015)
7.6% Na-polyacrylic acid 2100 in H2O
There are peaks at 940 nm and
Liquid with precipitate



Stabilized by Daxad 19

2.7μ


157
1440 (Lot AS 1015)
(1% Tween 20 + 7.6% Byk 190) in
There are peaks at 940 nm and
Liquid with precipitate



Stabilized by Daxad 19
(H2O + 10% PMA)
2.7μ


158
1440 (Lot AS 1015)
7.6% Tween 20 in (H2O + 10% Sultolan)

Paste



Stabilized by Daxad 19


159
1440 (Lot AS 1015)
7.6% Tween 20 in (H2O + 10% PMA)

Paste



Stabilized by Daxad 19


160
1440 (Lot AS 1015)
(1% Byk 333 + 7.6% Byk 190) in
940 nm; 2.7μ
Liquid with precipitate



Stabilized by Daxad 19
(H2O + 10% PMA)


161
1440 (Lot AS 1015)
(7.6% Byk 190 + 1% PVP K-30) in
940 nm; 2.7μ
Liquid with precipitate



Stabilized by Daxad 19
(H2O + 10% PMA)


162
1440 (Lot AS 1015)
3% Nonidet in 10% Triethanolamine
940 nm; 2.7μ
Liquid with precipitate



Stabilized by Daxad 19


163
1440 (Lot AS 1037)
7.6% Byk 9077 in PMA
Peaks until 1μ
Liquid with precipitate



Stabilized by Daxad 19


164
1440 (Lot AS 1037)
7.6% Byk 9076 in PMA
Peaks until 1μ
Liquid with precipitate



Stabilized by Daxad 19


165
1440 (Lot AS 1037)
(1% Byk 181 + 7.6% Byk 154) in

Paste



Stabilized by Daxad 19
(H2O + 10% Ethanol)


166
1440 (Lot AS 1037)
7.6% Tween 20 in (H2O + 20% DPA)
200 nm; 400 nm; 2.7μ
Liquid with precipitate



Stabilized by Daxad 19


167
1440 (Lot AS 1037)
(7.6% Dasad 19 + 0.2% Byk 348) in (1%

Paste



Stabilized by Daxad 19
AMP in H2O (pH = 11.5) + 20% NMP)









As shown in Table 4, most of the formulations contained particles with a size of about 1 and 2.7 μm. In addition, each formulation resulted in the formation of a paste or bulky precipitate.


EXAMPLES 168-172

Examples 168-172 describe additional water and solvent-based compositions. The constituents and properties of the individual compositions are listed in Table 5. The compositions, each of which included 60% by weight of silver nano powder No. 473-SH or 44-052 (prepared following the procedures generally described in U.S. Pat. No. 5,476,535 and PCT application WO 2004/000491 A2), were prepared as follows: 6 g of liquid carrier having the composition set forth in Table 5 was homogenized using a Dispermat (VMA-GETZMANN GMBH) at 4000 rpm. 9 g of silver nano powder was added gradually and then homogenization was performed for 10 min at 6000 rpm. As shown in Table 5, each formulation formed a paste.









TABLE 5







Solvent and water-based formulations with NanoPowder


products 473-SH and 440-052













Rheological


Example
Sample
Dispersants, wetting agents and solvents
properties





168
473-SH
(0.1% Byk 333 + 7.6% Byk 163) in (Dowanol
Paste



(Lot AS 1060)
DB + 30% PMA)


169
473-SH
(0.2% Byk 348 + 7.6% Byk 190 + 0.5% PVP
Paste



(Lot AS 1060)
K-30) in [1% AMP in H2O (pH = 11.5) + 20%




n-propanol]


170
473-SH
(0.2% Byk 348 + 7.6% Byk 190 + 0.5% PVP
Paste



(Lot AS 1060)
K-30) in (H2O + 20% n-propanol)


171
440-052
(0.1% Byk 333 + 7.6% Byk 163) in (Dowanol
Paste



(Lot AS 1055)
DB + 30% PMA)


172
440-052
(0.2% Byk 348 + 7.6% Byk 190 + 0.5% PVP
Paste



(Lot AS 1055)
K-30) in (H2O + 20% n-propanol)









EXAMPLES 173-178

The formulations described in Examples 173-178 are listed in Table 6, and were prepared following the procedure generally described in Examples 168-172 using either silver nano powder 471-W51 (prepared as described in Example 28) or 473-G51 (prepared as described in Example 26).









TABLE 6







Formulations for printing with the use of HP Deskjet 690












Ag
Ag
Solution













Example
sample
Concentrate
Additives
Solvent
Comments





173
471-W51
30%
0.5% PVP K-30
  40% IPA
Initial formulation contained





  1% Byk-348
  5% DPM
60% of Ag and was diluted





7.6% Byk-190
  55% water,
twice before printing






pH = 10


174
471-W51
50%
0.5% PVP K-30
  20% NMP
Initial formulation contained





0.5% Byk-348
0.04% AMP-95
60% of Ag and was diluted 1.2





0.5% Tween 20
in water,
times before printing





7.6% Byk-190
pH = 10


175
471-W51
40%
0.2% PVP K-30
  20% NMP
Initial formulation contained





  1% Byk-348
  1% AMP-95
40% of Ag





7.6% byk-190
in water,






pH = 11.5


176
473-G51
60%
0.2% PVP K-30
  20% NMP





  1% Byk-348
  1% AMP-95





7.6% Byk-190
in water,






pH = 11.5


177
473-G51
60%
0.2% PVP K-30
  20% n-propanol





  1% Byk-348
  1% AMP-95





7.6% Byk-190
in water,






pH = 11.5


178
473-G51
60%
0.2% PVP K-30
  30% NMP





  1% Byk-348
  1% AMP-95





7.6% Byk-190
in water,






pH = 11.5









Preliminary printing experiments were conducted using a Hewlett-Packard Deskjet 690 printer. Cartridge #29 was washed out with water/isopropanol/propyleneglycol (60:30:10) and then rinsed with appropriate sample solution. One milliliter of ink was placed into the internal filter zone of the cartridge and vacuumed via nozzles. Next, the printhead was refilled with 1-2 ml of ink, and printing on paper or polyimide (“Capton”) was carried out (standard table 5×50, line thickness 0.5 mm). Printed patterns were air-dried.


In general, printed patterns were obtained with several formulations, although after printing about 5-10 pages, a malfunction was observed (either clogging, flow, or wetting problem). The inks described in Examples 176 and 178 yielded the best printed patterns. The inks described in Examples 173 and 174 were printed for several pages, then it was possible to partially restore the print head by a short sonication.


EXAMPLES 179-182

Additional compositions were prepared and tested as described above. The formulations and their properties are listed in Table 7.

















TABLE 7







Powder










size





Surface




(D90)
Metal

Resistivity
Sintering
Viscosity
Tension


Example
Metal
(μm)
Wt. %
Solvent
(μΩ cm)
Conditions
(cPs)
(dyne/cm)























179
Ag/Cu
60
30
Butanol
20
300° C., 30 min.
8



180
Ag/Cu
60
51
Propyl
23
300° C., 30 min.
3.5






acetate


181
Ag/Cu
60
60
BEA
10
300° C., 30 min.
10
25-28


182
Ag/Cu
60
60
Water/NMP
10
300° C., 30 min.
12
45-50









A number of embodiments of the invention have been described. Nevertheless, it will be understood that various modifications may be made without departing from the spirit and scope of the invention. Accordingly, other embodiments are within the scope of the following claims.

Claims
  • 1. A composition comprising 1-70% by weight of a nano metal powder dispersed in a liquid carrier, wherein the composition has a viscosity no greater than about 200 cP at ink jet printing temperatures and is ink jet printable.
  • 2. A composition acccording to claim 1 comprising 10-60% by weight of the nano metal powder.
  • 3. A composition according to claim 1 comprising 20-60% by weight of the nano metal powder.
  • 4. A composition according to claim 1 wherein the composition has a viscosity of 1-200 cP at ink jet printing temperatures.
  • 5. A composition according to claim 1 wherein the composition has a viscosity of 1-100 cP at ink jet printing temperatures.
  • 6. A composition according to claim 1 wherein the composition has a viscosity of 2-20 cP at ink jet printing temperatures.
  • 7. A composition according to claim 1 comprising about 60% by weight nano metal powder and having a viscosity of about 18 cP at ink jet printing temperatures.
  • 8. A composition according to claim 1 wherein the composition has a viscosity no greater than about 200 cP at room temperature.
  • 9. A composition according to claim 1 wherein the composition has a viscosity of 1-200 cP at room temperature.
  • 10. A composition according to claim 1 wherein the composition has a viscosity of 1-100 cP at room temperature.
  • 11. A composition according to claim 1 wherein the composition has a viscosity of 2-20 cP at room temperature.
  • 12. A composition according to claim 1 comprising about 60% by weight nano metal powder and having a viscosity of about 18 cP at room temperature.
  • 13. A composition according to claim 1 wherein the liquid carrier comprises water and the composition has a surface tension of about 30-60 dynes/cm.
  • 14. A composition according to claim 1 wherein the liquid carrier comprises an organic solvent and the composition has a surface tension of about 20-37 dynes/cm.
  • 15. A composition according to claim 1 wherein the nano metal powder has an average particle size no greater than about 150 nm.
  • 16. A composition according to claim 1 wherein the nano metal powder has an average particle size no greater than about 100 nm.
  • 17. A composition according to claim 1 wherein the nano metal powder has an average particle size no greater than about 80 nm.
  • 18. A composition according to claim 1 wherein the nano metal powder is prepared according to the MCP process.
  • 19. A composition according to claim 1 or 18 wherein the nano metal powder comprises silver.
  • 20. A composition according to claim 1 or 18 wherein the nano metal powder comprises a silver-copper alloy.
  • 21. A composition according to claim 18 wherein the nano metal powder comprises non-uniform spherical particles and includes up to about 0.4% by weight aluminum.
  • 22. A composition according to claim 1 wherein the compositions is stable against particle settling.
  • 23. A composition according to claim 1 wherein the liquid carrier comprises (a) at least one organic solvent and (b) at least one agent selected from the group consisting of surfactants, wetting agents, rheology modifying agents, adhesion promoters, humectants, binders, and combinations thereof.
  • 24. A composition according to claim 1 wherein the liquid carrier comprises (a) water, a water-miscible organic solvent, or combination thereof and (b) at least one agent selected from the group consisting of surfactants, wetting agents, rheology modifying agents, adhesion promoters, humectants, binders, and combinations thereof.
  • 25. A composition according to claim 1 wherein the liquid carrier comprises (a) at least one organic solvent, (b) a curable monomer, and (c) at least one agent selected from the group consisting of surfactants, wetting agents, rheology modifying agents, adhesion promoters, humectants, binders, and combinations thereof.
  • 26. A method comprising printing the composition of claim 1 onto a substrate using an ink jet printer.
  • 27. A method according to claim 26 wherein the ink jet printer is a continuous ink jet printer.
  • 28. A method according to claim 26 wherein the ink jet printer is a drop on demand ink jet printer.
  • 29. A method according to claim 26 wherein the substrate is selected from the group consisting of paper, polymer films, textiles, plastics, glass, printed circuit boards, epoxy resins, and combinations thereof.
  • 30. A method according to claim 26 comprising sintering the composition after applying it to the substrate.
  • 31. A method according to claim 26 comprising treating the composition after applying it to the substrate by applying electromagnetic radiation, pressure, thermal radiation, or a combination thereof.
PCT Information
Filing Document Filing Date Country Kind 371c Date
PCT/IB2005/002721 9/14/2004 WO 00 10/31/2007
Provisional Applications (1)
Number Date Country
60603750 Aug 2004 US