Ink printing cliché and fabrication method thereof

Information

  • Patent Grant
  • 6722760
  • Patent Number
    6,722,760
  • Date Filed
    Thursday, October 3, 2002
    22 years ago
  • Date Issued
    Tuesday, April 20, 2004
    20 years ago
Abstract
A cliché of a gravure offset printing device is fabricated such that an organic layer and a photoresist layer are formed on a substrate. The photoresist layer is developed to form a photoresist pattern, and in a state that the organic layer is blocked with the photoresist pattern, the organic layer is etched to form a groove. The organic layer allows a fine process, so that a gravure offset printing device adopting the cliché can form a fine ink pattern. This fine pattern produces a resolution that is applicable to the production of semiconductors and liquid crystal display devices.
Description




This nonprovisional application claims priority under 35 U.S.C. §119(a) on Patent Application No. 88553/2001 filed in Korea on Dec. 29, 2001, which is herein incorporated by reference.




BACKGROUND OF THE INVENTION




1. Field of the Invention




The invention relates to an ink printing device for pattern formation, and more particularly, to an ink printing cliché capable of forming a fine pattern and lengthening the life span of a printing device by forming a cliché with an organic material or an organic/metal.




2. Description of the Related Art




Display devices, especially a flat panel display such as a liquid crystal display (LCD) device, include an active device such as a thin film transistor (TFT) in each pixel to drive the display device. This display device driving method is called an active matrix driving method. In an active matrix method, the active driving device is disposed in each pixel. The pixels are arranged in a matrix.

FIG. 1

illustrates an active matrix liquid crystal display device, in which the liquid crystal display device is a TFT LCD using a thin film transistor as the active device.




As shown in

FIG. 1

, the TFT LCD has N×M pixels vertically and horizontally arranged. Each pixel has a gate line


4


to which a scan signal is applied from an external driving circuit, a data line


6


to which an image signal is applied, and a TFT formed at the intersection of the gate line


4


and the data line


6


.




The TFT includes a gate electrode


3


connected to the gate line


4


. A semiconductor layer


8


is formed on the gate electrode


3


, and the semiconductor layer


8


activates when a scan signal is applied to the gate electrode


3


. A source/drain electrode


5


is formed on the semiconductor layer


8


.




A pixel electrode


10


is formed at a display region of the pixel


1


, and the pixel electrode


10


connects to the source/drain electrode


5


. An image signal is applied through the source/drain electrode


5


as the semiconductor layer


8


is activated, to thereby activate a liquid crystal (not shown).




The source/drain electrode


5


of the TFT is electrically connected to the pixel electrode


10


formed in the pixel


1


, so that as a signal is applied to the pixel electrode


10


through the source/drain electrode


5


, the source/drain electrode


5


drives the liquid crystal and displays an image.




In the active matrix type display device such as the liquid crystal display device, each pixel has a size of scores of μm. Thus, the active device such as the TFT disposed in the pixel should have a fine size, i.e., a few μm.




In addition, high picture quality display devices such as the high definition (HD) TV have been in increasing demand. These devices require a greater concentration of pixels occupying a screen of the same area. As a result, the active device pattern (including gate line and data line patterns) disposed on the pixel also becomes more dense and requires a finer structure.




In the conventional art, fabrication of an active device, such as a TFT, utilizes a pattern or a line of the active device formed by a photolithography method using an exposure device.




However, this photolithography method uses a high-priced exposing device. The steps of photolithography can include vapor prime, spin coat, soft bake, alignment and exposure through a mask, post-exposure bake, development, hard bake and inspection. The result is increased fabrication cost and a complicated fabrication process.




Additionally, the exposure region of the exposing device is limited in the photolithographic production of a display device. In order to fabricate a large-scale display device, the screen is divided to accommodate the photolithographic process. This degrades productivity because it is difficult to accurately match the positions when processing the divided regions, and the photolithographic process has to be repeated several times.




In order to solve this problem, pattern forming by gravure offset printing has been recently proposed.




Gravure offset printing is a printing method in which ink is put on a concave plate. Redundant ink is removed by scraping or doctoring, and then printing is performed. This printing method has been adopted in various applications such as printing wrappings of cellophane, vinyl or polyethylene.




Recently, efforts have been made to adapt gravure printing to produce an active device used for the display device or to produce a circuit pattern.




Gravure offset printing transfers ink to a substrate by using a transfer roll, and a pattern can be formed by a single printing step. Even a large-scale display device can be produced by using a transfer roll corresponding to the area of the desired display device.




Gravure offset printing can be used to pattern various configurations and sub-assemblies of the display device. These can include, for example, a metal pattern for a capacitor, a pixel electrode, the gate line and the data line connected to the TFT, and the TFT, which are all structures necessary for a liquid crystal display device.





FIGS. 2A through 2C

illustrate pattern forming by a conventional gravure offset printing method.




As shown in

FIG. 2A

, the conventional gravure offset printing method forms a groove


22


at a specific position of a cliché


20


or a concave plate. The groove


22


corresponds to a pattern that is desired to form on a substrate. The groove


22


is filled with ink


24


.




The ink


24


in the groove


22


results in pattern forming ink


24


being coated at an upper portion of the cliché


20


, and then a doctor blade


28


proceeds while in contact with the cliché


20


. A doctor blade


28


proceeds to impress the ink


24


filled into the groove


22


. The doctor blade simultaneously removes the excess ink


24


remaining on the surface of the cliché


20


. Alternatively, a Meyer rod can be used instead of a doctor blade.




As shown in

FIG. 2B

, the ink


24


filling in the groove


22


of the cliché


20


contacts and transfers to the surface of the transfer role


30


.




The transfer roll


30


is formed with a circumference having the same length as that of the panel of a display device to be fabricated. That is, the transfer roll


30


has the circumferential length equal to the length of the desired panel. Accordingly, the ink


24


filled in the groove


22


of the cliché


20


can be wholly transferred on the surface of the circumference of the transfer roll


30


by a single rotation.




Thereafter, as shown in

FIG. 2C

, the transfer roll


30


contacts the surface of a process-object layer


41


formed on the substrate


40


, and the transfer roll


30


is rotated. Then, the ink


24


transferred on the transfer roll


30


is re-transferred on the process-object layer


41


. By applying heat to the re-transferred ink


24


and drying it, an ink pattern


42


is formed. At this time, the desired ink pattern


42


can be formed on the entire substrate


40


of the display device by a single rotation of the transfer roll


30


.




In the gravure offset printing method discussed above, since the ink pattern


42


is mechanically formed by using the cliché


20


, and the transfer roll


30


and the process-object layer


41


is etched by the ink pattern


42


to form a desired pattern, the pattern forming process is simplified compared to the conventional photolithographic exposure process.




However, the conventional art gravure offset method has shortcomings. Generally, since the cliché


20


is made of a metal such as ferrite and nickel, it is difficult to form a fine groove.




Usually, the groove


22


of the cliché


20


is formed by a mechanical process. In this respect, it is not substantially possible to mechanically process a groove of below a few μm. Thus, it is difficult to form a fine ink pattern, and this process can scarcely be adopted to fabricate a display device.




In addition, the surface of the metal cliché


20


becomes damaged due to abrasion by the doctor blade


28


, and particles are generated. These particles are a critical factor leading to pattern defects during formation of an ink pattern. Moreover, since the grain is large, a rough edge region of the groove is formed when the groove is processed, which makes it impossible to form a smooth ink pattern.




As has been shown, the conventional art gravure process using a cliché has serious drawbacks that hamper adaptation of this technology to the production of semiconductor devices such as liquid crystal displays.




SUMMARY OF THE INVENTION




The invention, in part, provides a cliché of a gravure offset printing device and its fabrication method that are capable of forming a fine ink pattern and a final fine pattern by forming the cliché with an organic material.




The invention, in part, provides a cliché of a gravure offset printing device and its fabrication method that are capable of forming a fine pattern having a lengthened life span by forming a cliché with an organic material/metal.




To achieve these and other advantages and in accordance with the invention, there is provided a gravure offset printing device including a cliché with a groove formed in which ink is filled and a transfer roll for re-transferring the ink transferred from the cliché to a process-object layer, wherein the cliché includes a substrate and an organic layer with a groove formed in a portion of the organic layer.




In the gravure offset printing device of the invention, the substrate is made of glass, plastic or semiconductor wafer, and the organic layer is made of a polymer, polyimide, photosensitive acrylate or methacrylate, or BCB (Benzocyclobutene). The organic layer is grain-free.




In the invention, a metal layer may be formed over the organic layer to lengthen the life span of the cliché, and an intermediate layer can be formed to improve the adhesion force between the organic layer and the metal layer.




The invention, in part, pertains to a cliché fabrication method including the steps of preparing a substrate, depositing an organic layer and a photoresist layer over the substrate, developing the photoresist layer to form a photoresist pattern, and etching the organic layer while the organic layer is blocked with the photoresist pattern, to form a groove.




The foregoing and other objects, features, aspects and advantages of the invention will become more apparent from the following detailed description of the invention when taken in conjunction with the accompanying drawings, which provide further explanation of the invention, as claimed.











BRIEF DESCRIPTION OF THE DRAWINGS




The accompanying drawings are included to provide a further understanding of the invention. The drawings illustrate embodiments of the invention and together with the description serve to explain the principles of the embodiments of the invention.





FIG. 1

is a plan view showing the structure of a general liquid crystal display device.





FIGS. 2A through 2C

show a sequential process of a method for forming a pattern such as a display device by using a conventional art gravure offset printing method.





FIGS. 3A through 3D

show a sequential process of a method for fabricating a cliché in accordance with an embodiment of the present invention.





FIGS. 4A through 4D

show a sequential process of a method for fabricating a cliché in accordance with another embodiment of the present invention.





FIG. 5

is a sectional view showing the structure of a cliché with a tapered metal layer.











DETAILED DESCRIPTION




Advantages of the present invention will become more apparent from the detailed description given herein after. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.




Reference will now be made in detail to the preferred embodiments of the invention, examples of which are illustrated in the accompanying drawings.




The invention provides a gravure offset printing device which is capable of forming a fine pattern. In order to use a gravure offset printing device to produce a fine pattern, a cliché is made of an organic material.




Generally, the organic material allows fine process detail by dry etching. If the cliché is made of the organic material, a fine groove can be formed.




In addition, since the organic material has no grain or a small grain, an edge region is smoothly formed when forming a groove.




Various types of organic materials can be used, preferably polymers, polyimide, BCB (benzocyclobutene) or a photosensitive acrylate or methacrylate. The cliché is formed by coating the organic material on a substrate. The substrate can be a glass substrate, a plastic substrate or a semiconductor wafer that can be an Si or GaAs wafer.




The cliché of the invention can be constructed as a double layer having an organic layer and a metal layer. The cliché with a double layer structure is advantageous in that it has a long life span due to the characteristics of the metal layer, and an ink pattern can be smoothly formed thanks to the grain-free organic layer.




A preferred embodiment of the invention will now be described in detail with reference to the accompanying drawings.





FIGS. 3A through 3D

show a sequential process of a method for fabricating a cliché in accordance with one embodiment of the invention.




First, as shown in

FIG. 3A

, an organic material such as polymer, polyimide, BCB or photosensitive acrylate or methacrylate is deposited on a substrate


101


made of a material such as glass, plastic or a wafer to from an organic layer


103


. Over the organic layer


103


, a photoresist layer


110


made of photosensitive resin is formed.




Thereafter, a mask with an opening is positioned at region corresponding to a pattern desired to form on the photoresist layer


110


. Light such as an ultraviolet ray is irradiated, and a developer patterns the photoresist layer


110


, as is shown in FIG.


3


B.




At this point, the organic layer


103


is blocked by the patterned photoresist layer


110


. Then, the organic layer


103


is etched to form a groove


105


, as shown in FIG.


3


C. The photoresist layer


110


on the organic layer


103


is then removed to complete a cliché


100


with a groove


105


, as shown in FIG.


3


D.




Ink is filled in the groove


105


of the cliché


100


, and the ink is transferred onto a process-object layer of the substrate by using a transfer roll. Then, an etching process is performed to thereby obtain the desired pattern (corresponding to the groove of the cliché).




As stated above, the cliché


100


in accordance with one embodiment of the present invention has a substrate


101


and an organic layer


103


, and the ink-filling groove


105


is formed in the cliché


100


.




Usually, it is difficult to form a fine pattern with a gravure offset printing device (for example, a metal pattern such as an electrode), compared to a pattern formed by a general exposure process. However, in the above-described embodiment of the invention, if the cliché


100


is formed on the substrate


101


and the organic layer


103


and the groove


105


is formed by the exposure process, a fine pattern can be formed with the same or better resolution compared to the resolution formed by the conventional exposure process.




By adopting the thus fabricated cliché, the gravure offset printing device can form a fine pattern with a very simple process compared to the conventional pattern forming method. That is, a fine pattern forms with simple processing by adopting the cliché of the present invention to the gravure offset printing device.




In the invention, the avoidance of grain formation is important. In a singlet molecule such as a metal, the probability of aggregation is very high, and grains are easily generated. On the other hand, organic materials have a very low probability of grain formation because of the interactions between the organic chains. Thus, a grain structure cannot be generated in an organic material (or layer), and the roughness of the organic layer is reduced. As a result, a cliché having fine patterns can be fabricated.




In addition, since the organic layer


103


is grain-free (or at least has very small grains), a smooth ink pattern is formed. Thus, a precise pattern can be formed. When fabricating a display device such as a liquid crystal display by the gravure printing device adopting the inventive cliché, a high resolution display device can be obtained.





FIGS. 4A through 4D

show a sequential process for fabricating a cliché in accordance with another embodiment of the present invention.




First, as shown in

FIG. 4A

, an organic material such as polymer, polyimide, BCB or photosensitive acrylate or methacrylate is deposited on a substrate


201


to form an organic layer


203


, over which a metal layer


204


is formed. The metal layer


204


can be made of AlNd, Cr, Mo, Cu, W, Si and alloys of these metals. Preferably, AlNd or Cr is used. A photoresist layer


210


is formed over the metal layer


204


.




At this time, though not shown in the drawing, an intermediate layer may be formed between the organic layer


203


and the metal layer


204


in order to improve the cementing force between the organic material and the metal.




Subsequently, a mask is positioned over the photoresist layer


210


, which is irradiated by light such as a ultraviolet ray, and a developer is applied to thereby pattern a photoresist layer


210


, as shown in FIG.


4


B.




A portion of the metal layer


204


is blocked with the patterned photoresist layer


210


, and a metal layer


204


is etched by an etching process to expose a portion of the organic layer


203


. As shown in

FIG. 4C

, the exposed organic layer


203


is etched by an etching process to form a groove


205


.




Thereafter, as shown in

FIG. 4D

, the photoresist layer


210


on the metal layer


204


is removed to complete a cliché


200


with a groove


205


formed therein.




For the etching of the metal layer


204


and the organic layer


203


, a general wet etching or a dry etching process can used. Wet etch solutions include acids, bases and organic solvents. Dry etching can include plasma etch or reactive ion etch (RIE).




When forming the cliché


200


with the substrate


201


, the organic layer


203


and the metal layer


204


, a life span lengthening effect can be also obtained due to the metal layer


204


. In addition, a fine ink pattern can be formed and a smooth ink pattern can be formed due to the properties of the organic layer


203


.




As shown in

FIG. 4D

, the metal layer


204


can be almost vertically etched, but as shown in

FIG. 5

, the metal layer


204


may be etched to be tapered by controlling the etching speed of the etchant used for etching.




If a pattern is formed by using the gravure offset printing device with the tapered cliché, a tapered pattern can be obtained, so that a problems due to pattern stepping can be avoided.




As mentioned above, in the invention, a cliché is fabricating by having a substrate and an organic layer, or a substrate and organic layer/metal layer is used. The organic layer or the organic layer/metal layer is processed to form the groove for filling ink therein. The cliché with such a structure is thus adapted to use a gravure offset printing device form a pattern.




In gravure offset printing, a fine ink pattern can be formed with the cliché having the above-described structure. Thus, when the cliché is used in conjunction with the gravure offset printing device, a gravure offset printing method can be used to produce various devices requiring a fine pattern. These devices include semiconductors as well as display devices such as liquid crystal displays. Other displays such as electrochemochromic displays can be also produced by the invention.




As described above, the inventive cliché of the gravure offset printing device used to form a pattern is made of an organic material, allowing fine processing to produce a fine ink pattern. This results in a device having high resolution.




In addition, by fabricating the cliché by forming a double layer of the organic material and the metal, a fine pattern can be formed while attaining a lengthened, semi-permanent life span.




It is to be understood that the foregoing descriptions and specific embodiments shown herein are merely illustrative of the best mode of the invention and the principles thereof, and that modifications and additions may be easily made by those skilled in the art without departing for the spirit and scope of the invention, which is therefore understood to be limited only by the scope of the appended claims.



Claims
  • 1. A gravure offset printing device, which comprises:a cliché, the cliché having a substrate and an etching object layer over the substrate, the etching object layer including an organic layer; a groove formed in the cliché in which ink is filled, the groove being formed in a portion of the organic layer; and a transfer roll for transferring the ink from the cliché to a process-object layer.
  • 2. The device of claim 1, further comprising a metal layer formed on the etching object layer, the metal layer a second groove aligned with the groove of the organic layer.
  • 3. The device of claim 2, further comprising an intermediate layer between the etching object layer and the metal layer, wherein the intermediate layer improves a cementing force between the etching object layer and the metal layer.
  • 4. The device of claim 2, wherein the metal layer is tapered.
  • 5. The device of claim 1, wherein the substrate is made of material selected from a group consisting of glass, plastic and a semiconductor wafer.
  • 6. The device of claim 1, wherein the etching object layer is an organic layer made of a material selected from the group consisting of polyimide, photosensitive acrylate, photosensitive methacrylate and BCB (benzocyclobutene).
  • 7. The device of claim 1, wherein the etching object layer is grain-free.
  • 8. A cliché fabrication method, which comprises:preparing a substrate; forming an etching-object layer and a photoresist layer over the substrate; developing the photoresist layer to form a photoresist pattern; and etching the etching-object layer to form a groove.
  • 9. The method of claim 8, wherein the etching-object layer comprises an organic layer.
  • 10. The method of claim 9, wherein the organic layer comprises a material selected from a group consisting of polyimide, photosensitive acrylate, photosensitive methacrylate and BCB (benzocyclobutene).
  • 11. The method according to claim 9, wherein the organic layer is grain-free.
  • 12. The method of claim 8, wherein the etching-object layer comprises:an organic layer; and a metal layer over the organic layer.
  • 13. The method of claim 12, wherein the organic layer comprises a material selected from a group consisting of polyimide, photosensitive acrylate, photosensitive methacrylate and BCB (benzocyclobutene).
  • 14. The method of claim 12, further comprising:forming an intermediate layer over the organic layer to improve a cementing force between the organic layer and the metal layer.
  • 15. The method according to claim 12, wherein the organic layer is grain-free.
Priority Claims (1)
Number Date Country Kind
2001-88553 Dec 2001 KR
US Referenced Citations (1)
Number Name Date Kind
20030084796 Kwon et al. May 2003 A1