Patent Grant
8235504
1. Field of the Invention
The present invention relates to an inkjet head, an inkjet apparatus, and a method for producing the inkjet apparatus.
2. Description of the Related Art
An inkjet head is mounted to a recording apparatus and performs recording by discharging an ink on a recording medium such as a paper sheet.
Japanese Patent Application Laid-Open No. 7-232439 discusses a use of a moisture-curable material containing as abase resin silicone-modified polyetherpolyol as a sealant for a liquid ink use unit of an inkjet head. A silicone compound having at an end of its molecule an alkoxy group that is easily hydrolyzed is added to the silicone-modified polyetherpolyol for the purpose of imparting a moisture-curing property. The alkoxy group is changed into silanol through decomposition by moisture. Since silanol is unstable, silanol is turned into a gel by addition of a slight amount of a catalyst such as organic tin for polymerization of silanol.
In recent years, to improve the image quality of a recorded image, materials to be used for ink have become versatile. Also, in an electric connection unit of an electric wiring tape that is electrically connected to a substrate having a discharge port and an element for generating energy for discharging ink, a protection film of a surface of the electric wiring tape generally has low adhesiveness to a resin material.
Therefore, there is a concern that the sealing member discussed in Japanese Patent Application Laid-Open No. 7-232439 can be detached when contacting ink depending on a material of a sealing portion and the type of the ink.
The present invention is directed to an inkjet head improved in reliability of a sealing portion in the vicinity of an electric connection portion.
The present invention is further directed to an inkjet apparatus to which the highly reliable inkjet head that is improved in reliability of the sealing portion in the vicinity of the electric connection portion is mounted.
According to an aspect of the present invention, an inkjet head includes a discharge element substrate including a base material provided with an energy generation element for generating energy to be used for discharging ink, a discharge port provided corresponding to the energy generation element, and an electrode pad electrically connected to the energy generation element, an electric contact substrate including an electric contact terminal for receiving an electric signal from an inkjet apparatus, and an electric wiring tape for electrically connecting the electric contact substrate and the discharge element substrate to each other, wherein a sealing member sealing a vicinity of an electric connection portion between the electric contact substrate and the electric wiring tape is a cured product of a composition including a compound having a structure represented by Formula (1), a boron trifluoride compound, and a mercaptosilane compound:
where n is 1 or more and 3 or less; X1 is a substituted or unsubstituted organic group having 1 to 20 carbon atoms; X2 is a hydrolyzable group; R1 is a divalent organic group having a molecular weight of 1000 or less; and R2 is at least one selected from the group consisting of polyoxyalkylene, a saturated hydrocarbon polymer, a vinyl polymer, polyester, and polycarbonate.
According to an exemplary embodiment of the present invention, it is possible to provide a highly reliable inkjet head improved in reliability of a sealing portion in the vicinity of an electric connection portion and an inkjet apparatus to which the inkjet head is mounted.
Further features and aspects of the present invention will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings.
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate exemplary embodiments, features, and aspects of the invention and, together with the description, serve to explain the principles of the invention.
Various exemplary embodiments, features, and aspects of the invention will be described in detail below with reference to the drawings.
As illustrated in
As illustrated in
The second plate 5 has the shape of having two openings that are larger than the outside dimensions of the first discharge element substrate 2 and the second discharge element substrate 3, which are adhesion-fixed to the first plate 4 with a first adhesive agent. The second plate 5 is fixed to the first plate 4 with a second adhesive agent. Thus, it is possible to electrically connect the electric wiring tape 6 to the first discharge element substrate 2 and the second discharge element substrate 3 by the contact on an adhesion plane when the electric wiring tape 6 is bonded to the second plate 5.
The electric wiring tape 6 forms an electric signal path for applying an electric signal for causing ink to be discharged to the first discharge element substrate 2 and the second discharge element substrate 3. Two openings corresponding to the discharge element substrates 2 and 3 are formed on the electric wiring tape 6. An electrode terminal 16 to be connected to the electrode pad 300 of each of the discharge element substrates 2 and 3 is formed in the vicinity of edges of each of the openings. The electrode pad 300 is electrically connected to the energy generation elements for generating energy to be used for discharging inks, and the energy for discharging inks is transmitted from the electrode pad 300 to the discharge element substrates. At one end portion of the electric wiring tape 6, a second electric connection terminal portion 18 for electrically connecting a first electric connection terminal portion 23 of the electric contact substrate 7 having the electric contact terminal 17 serving to input an external signal for receiving the electric signal is formed. The electric terminals 16 and the second electric connection terminal portion 18 are connected via a continuous copper foil wiring pattern. A reverse side of the electric wiring tape 6 is adhesion-fixed to a lower surface of the second plate 5 with a third adhesive agent, and the electric wiring tape 6 is bent toward one side of the first plate 4 and adhesion-fixed to the side of the first plate 4 with a fourth heat-curable adhesive agent.
The electric connection between the electric wiring tape 6 and the first discharge element substrate 2 and the second discharge element substrate 3 is attained by electric bonding of the electrode pads 300 of the discharge element substrates 2 and 3 to the electrode terminals 16 of the electric wiring tape 6 by a thermal ultrasonic compression bonding.
As illustrated in
where n is 1 or more and 3 or less; X1 is a substituted or unsubstituted organic group having 1 to 20 carbon atoms; X2 is a hydrolyzable group; R1 is a divalent organic group having a molecular weight of 1000 or less; R2 is at least one selected from the group consisting of polyoxyalkylene, a saturated hydrocarbon polymer, a vinyl polymer, polyester, and polycarbonate).
Hereinafter, a composition of the sealing member 21 before curing will be described. In the composition of the sealing member 21 before curing, a) the compound having the structure represented by Formula (1) is a silicone-modified resin obtained by silicone modification of an end of an organic polymer compound for imparting a moisture-curing property to the organic polymer compound. By the addition of silicone having a hydrolyzable group to an end of a molecule, the hydrolyzable group is changed into silanol through decomposition by moisture. The silanol is considerably unstable and has the property of gelling by polymerization by addition of a slight amount of a catalyst. To impart the moisture-curing property to general organic polymer compounds, the modification using the silicone compound having the hydrolyzable group in the polymer is performed.
A method for introducing the hydrolyzable group X2 is not particularly limited. The most simple silicone modification method may be a method of adding a silane coupling agent. Since the silane coupling agent has in its molecule a hydrolyzable group and a reaction group that reacts with an organic polymer compound, it is possible to easily modify the organic polymer compound into a moisture-curable compound. Examples of the hydrolyzable group include an alkoxy group, an acyloxy group, a ketoxymate group, an amino group, an amide group, an acid amide group, an aminooxy group, a mercapto group, an oxime group, and alkenyloxy group as well as a hydrogen atom and a halogen atom. Among the above, the hydrogen atom, alkoxy group, acyloxy group, ketoxymate group, amino group, amide group, acid amide group, aminooxy group, mercapto group, oxime group, and alkenyloxy group are preferred, and, from the viewpoint of high reactivity, suppressed odor, and the like, the alkoxy group is particularly preferred. As the alkoxy group, the alkoxy group having 1 to 12 carbon atoms is preferred, and a methoxy group and an ethoxy group are particularly preferred. Hydrolyzable groups in a bifunctional or trifunctional hydrolyzable silyl group maybe the same or different, and the hydrolyzable silyl groups in the compound represented by Formula (1) maybe the same or may include various types of groups. A combination of different types of curable resins such as a combination of a bifunctional resin and a trifunctional resin may be used.
Examples of the silane coupling agent include vinylsilane such as vinyltrichlorosilane, vinyltrimethoxysilane, and vinyltris(2-methoxyethoxy)silane; methacrylsilane such as 3-methacryloxypropyltrimethoxysilane; epoxysilane such as 3-glycidoxypropyltrimethoxysilane and 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane; 3-aminopropyltriethoxysilane; N-2-(aminoethyl)-3-aminopropyltrimethoxysilane; aminosilane such as N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane; mercaptosilane such as 3-mercaptopropyltrimethoxysilane; and the like.
A method for introducing a urethane bond is not particularly limited. A linking group generated when linking a plurality of raw materials by a chemical reaction may be the urethane bond, or a compound having the urethane bond may be linked by a chemical reaction.
However, when it is desired to obtain a sealing member having stable viscosity and tack-free time, it is necessary to add the hydrolyzable silyl group to the organic polymer under the conditions of not causing decomposition of the hydrolyzable group. In other words, since the hydrolyzable group added to the silicon atom has the considerably unstable property of being decomposed in the presence of a slight amount of moisture, it is necessary to set reaction conditions and a molecular structure that enables an addition reaction of the hydrolyzable silyl group to the organic polymer compound.
As the most suitable method, the method of using polyvalent isocyanate described in Japanese Patent Publication No. 46-307711 may be employed. Isocyanate has a high reaction property with active hydrogen of a hydroxy group or an amino group and generates a urethane bond or a urine bond. With the property, it is possible to add the hydrolyzable silyl group to the organic polymer.
Examples of organic polyisocyanate which is the polyvalent isocyanate used in the present exemplary embodiment include trimethylenediisocyanate, tetramethylenediisocyanate, hexamethylenediisocyanate, pentamethylenediisocyanate, 1,2-propylenediisocyanate, 1,2-butylenediisocyanate, 2,3-butylenediisocyanate, 1,3-butylenediisocyanate, and 2,4,4- or 2,2,4-trimethylhexamethylenediisocyanate. Other examples of the organic polyisocyanate include aliphatic diisocyanate such as 2,6-diisocyanatemethylcaproate including 1,3-cyclopentanediisocyanate, 1,4-cyclohexanediisocyanate, and 1,3-cyclohexanediisocyanate.
Yet other examples of the organic polyisocyanate include alicyclic diisocyanate such as 1,3-bis(isocyanatemethyl)cyclohexane including m-phenylenediisocyanate and p-phenylenediisocyanate; aromatic diisocyanate such as 4,4′-diphenyletherdiisocyanate; araliphatic diisocyanate such as 1,3- or 1,4-bis(1-isocyanate-1-methylethyl)benzene and a mixture thereof; organic triisocyanate such as 1,3,5-triisocyanatebenzene and 2,4,6-triisocyanatetoluene; a polyisocyanate monomer of organic tetraisocyanate such as 4,4′-diphenyldimethylmethane-2,2′,5,5′-tetraisocyanate; a dimmer, a trimer, a biuret, an allophanate derived from the polyisocyanate monomer; polyisocyanate having a 2,4,6-oxadiazinetrione ring obtained from a carbonate gas and the polyisocyanate monomer; and an adduct with a low molecular weight polyol having a molecular weight of less than 200, such as ethyleneglycol and propyleneglycol.
Examples of a main chain skeleton of the silicone-modified resin include polyoxyalkylene, a saturated hydrocarbon polymer, a vinyl polymer (e.g., copolymer of acryl monomer), polyester, and polycarbonate. The main chain skeleton may more preferably be polyoxyalkylene, a saturated hydrocarbon polymer, or a vinyl polymer, further preferably polyoxyalkylene or a vinyl polymer.
As the polyoxyalkylene polymer to be the main chain skeleton, those produced by a reaction between an initiator and monoepoxide or the like in the presence of a catalyst are preferred. As the initiator, a hydroxy compound having one or more hydroxyl groups or the like may be used.
As the monoepoxide, ethylene oxide, propylene oxide, butylene oxide, hexylene oxide, or the like and tetrahydrofuran or the like may be used in combination.
Examples of the catalyst include, but not limited to, an alkali metal catalyst such as potassium compound and a cesium compound; a composite metal cyan compound complex catalyst; and a metal porphyrin catalyst. As the composite metal cyan compound complex catalyst, a complex containing zinc hexacyanocobaltate as a main component and an ether and/or alcohol complex are preferred. As a composition of the ether and/or alcohol complex, the one discussed in Japanese Patent Publication No. 46-27250 is usable. As the ether, ethyleneglycol dimethylether (grime), diethyleneglycol dimethylether (digrime), and the like are preferred, and, grime is particularly preferred from the viewpoint of handling during production of the complex. As the alcohol, the one discussed in Japanese Patent Application Laid-Open No. 4-145123 is usable, but tert-butanol is particularly preferred.
The row material polyoxyalkylene polymer may preferably have 2 or more functional groups, and specific examples thereof include a copolymer of polyoxyethylene, polyoxypropylene, polyoxybutylene, polyoxyhexylene, polyoxytetramethylene, and the like. The raw material polyoxyalkylene polymer may preferably be polyoxypropylene polyol having 2 to 6 valences, particularly preferably polyoxypropylenediol and polyoxypropylenetriol. Also, a polyoxyalkylene polymer containing in its molecule an amino group is usable.
Examples of the hydrocarbon polymer to be the main chain skeleton include a polymer having as a main monomer a monoolefin having 1 to 6 carbon atoms such as ethylene, propylene, 1-butene, isobutene, and 1-hexene and a diolefin homopolymer such as butadiene and isoprene. Also, a hydrogenated additive of a copolymer of the diolefin and the monoolefin is usable. Among the hydrocarbon polymers, the polymer containing isobutene as the main monomer and the hydrogenated additive of the butadiene polymer are preferred in view of easiness of introduction of a functional group into an end and adjustment of a molecular amount as well as capability of increasing the number of end functional groups.
As the polymer containing isobutene as the main monomer, an isobutene homopolymer and a copolymer containing 50 wt % or less, preferably 30 wt % or less, more preferably 10 wt % or less of a monomer that is copolymerizable with isobutene are usable.
As the monomer that is copolymerizable with isobutene, olefins having 4 to 12 carbon atoms, vinylether, an aromatic vinyl compound, vinylsilanes, allylsilanes, and the like are usable. Examples of the monomer include 1-butene, 2-butene, 2-methyl-1-butene, 3-methyl-1-butene, 1-pentene, 4-methyl-1-pentene, 1-hexene, vinylcyclohexene, methylvinylether, ethylvinylether, isobutylvinylether, styrene, α-methylstyrene, divinylstyrene, vinyltrimethoxysilane, vinyltriethoxysilane, allylaminotrimethylsilane, allyldimethoxysilane, and the like.
Examples of the vinyl polymer to be the main chain skeleton include a polymer of a compound having in its molecule at least one polymerizable alkenyl group. A reaction for obtaining the main chain skeleton of the vinyl polymer by polymerization of the compound having in its molecule at least one polymerizable alkenyl group is performed according to Reaction Method (4) described below.
As the polyester to be the main chain skeleton, those synthesized by the method discussed in Japanese Patent Application Laid-Open No. 2003-193019 are usable without limitation thereto.
As the polycarbonate to be the main chain skeleton, those synthesized by the method discussed in Japanese Patent Application Laid-Open No. 2002-356550, Japanese Patent Application Laid-Open No. 2002-179787, and the like are usable without limitation thereto.
As a molecular weight of the main chain skeleton of the silicone-modified resin to be used in the present exemplary embodiment, a number average molecular weight may preferably be 500 to 30,000, more preferably 1,000 to 10,000, particularly preferably 2,000 to 20,000, from the viewpoint of a coating property.
The silicone-modified resin as the compound represented by Formula (1) is a main component of the composition and contained in a ratio of 50 wt % or more.
As an adhesiveness imparting agent, b) mercaptosilane compound is used. With the use of the mercaptosilane compound, it is possible to impart excellent ink-resistant adhesiveness. Examples of the mercaptosilane compound include 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, and the like. Examples of the adhesiveness imparting agents that can be added for improving adhesiveness include an aminosilane compound such as γ-aminopropyltrimethoxysilane and an epoxysilane compound such as γ-glycidoxypropyltriethoxysilane.
From the viewpoints of improvement in curing property of the composition, strength and workability of the cured product, a ratio of the mercaptosilane compound to be blended may preferably be about 0.01 to 10 wt %, particularly preferably 0.1 to 5 wt %, with respect to an entire composition.
As the curing catalyst of the compound of Formula (1), a boron trifluoride compound is used. With the use of the boron trifluoride compound, it is possible to attain a good curing property and to add the mercaptosilane compound as the adhesiveness imparting agent. Particularly, complexes of boron trifluoride are preferred from the viewpoint of handling easiness. Among the complexes of boron trifluoride, an amine complex having both of stability and catalyst activity is particularly preferred. Examples of the complexes include a piperidine complex (Formula (2)) of boron trifluoride.
There are commercially available amine complexes of boron trifluoride, and it is possible to use them in the present exemplary embodiment. Examples of an amine compound to be used for the amine complex of boron trifluoride include, but not limited to, ammonium, monoethylamine, triethylamine, piperidine, aniline, morpholine, cyclohexylamine, n-butylamine, monoethanolamine, diethanolamine, triethanolamine, guanidine, 2,2,6,6-tetramethylpiperidine, 1,2,2,6,6-pentamethylpiperidine, N-methyl-3,3′-iminobis(propylamine), ethylenediamine, diethylenetriamine, triethylenediamine, pentaethylenediamine, 1,2-diaminopropane, 1,3-diaminopropane, 1,2-diaminobutane, 1,4-diaminobutane, 1,9-diaminononane, ATU(3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro[5.5]undec ane), CTU guanamine, dihydrazide dodecanoate, hexamethylenediamine, m-xylylenediamine, dianisidine, 4,4′-diamino-3,3′-diethyldiphenylmethane, diaminodiphenylether, 3,3′-dimethyl-4,4′-diaminodiphenylmethane, a tolidine base, m-tolylenediamine, o-phenylenediamine, m-phenylenediamine, p-phenylenediamine, melamine, 1,3-diphenylguanidine, di-o-tolylguanidine, 1,1,3,3-tetramethylguanidine, bis(aminopropyl)piperazine, a compound having a plurality of primary amino group such as N-(3-aminopropyl)-1,3-propanediamine, bis(3-aminopropyl)ether, and Jeffamine manufactured by Sun Technochemical, piperazine, cis-2,6-dimethylpiperazine, cis-2,5-dimethylpiperazine, 2-methylpiperazine, N,N′-di-t-butylethylenediamine, 2-aminomethylpiperidine, 4-aminomethylpiperidine, 1,3-di-(4-piperidyl)-propane, a compound having a plurality of secondary amino groups such as 4-aminopropylaniline, homopiperazine, N,N′-diphenylthiourea, N,N′-diethylthiourea, and N-methyl-1,3-propanediamine, methylaminopropylamine, ethylaminopropylamine, ethylaminoethylamine, laurylaminepropylamine, 2-hydroxyethylaminopropylamine, 1-(2-aminoethyl)piperazine, N-aminopropylpiperazine, 3-aminopyrroridine, a compound represented by H2 N (C2 H4 NH) nH (n approximately equals to 5), Poly-8 (trade name, manufactured by Tosoh Corporation), N-alkylmorpholine, 1,8-diazabicyclo[5.4.0]undecen-7, a heterocyclic tertiary amine compound such as 7-methyl-1,5,7-triazabicylco[4.4.0]deca-5-ene, an aminosilane compound such as γ-aminopropyltriethoxysilane, γ-aminopropylmethyldiethoxysilane, and 4-amino-3-dimethylbutyltriethoxysilane.
The boron trifluoride compound may be used alone or in combination of two or more kinds. A ratio of the boron trifluoride compound to be blended may preferably be about 0.001 to 10 wt %, particularly preferably 0.01 to 5 wt %, with respect to the entire compound in view of the curing property and a balance among the components.
The sealant composition is applied onto the vicinity of the electric connection portion between the electric wiring tape 6 and the electric contact substrate 7 and cured by moisture.
As illustrated in
The inkjet apparatus H101 transmits a driving force generated by a carriage motor M1 from a transmission mechanism H103 to a carriage H102, to which the inkjet head 1000 is mounted, thereby causing the carriage H102 to reciprocate in the directions of two-headed arrow A. The inkjet apparatus H101 performs recording by feeding a recording medium P such as a recording sheet via a sheet feeding mechanism 5, conveying the recording medium P to a recording position, and discharging ink onto the recording medium P from the inkjet head 1000 at the recording position.
An electricity supply terminal for supplying power from a power source provided in the carriage H102 of the main body and the electric contact terminal 17 of the electric contact substrate 7 of the inkjet head 1000 are capable of attaining and maintaining required electric connection when contact surfaces thereof are brought into property contact. The inkjet head 1000 enables recording by applying energy in response to a recording signal and selectively discharging ink form a plurality of discharge ports.
The main body of the inkjet apparatus H101 is provided with a platen (not illustrated), which is located opposite to discharge port surfaces, on which the discharge ports (not illustrated) of the inkjet head 1000 are formed. The ink is discharged in response to the recording signal applied to the inkjet head 1000 simultaneously with the reciprocation of the carriage H102 caused by the driving force of the carriage motor M1, so that recording is performed over an entire width of the recording medium P conveyed onto the platen.
Referring to
A discharge roller H108 discharges the recording medium P on which an image is formed by the inkjet head 1000 to the outside of the recording apparatus and is driven by transmission of the rotation of the conveyance motor M2. The discharge roller H108 presses the recording medium P against a spur roller (not illustrated) by a spring (not illustrated). A spur holder H109 rotatably supports the spur roller. The recording medium P is movable on a conveyance path inside the inkjet apparatus by the above-described mechanism.
In production of the inkjet apparatus, the inkjet head 1000 is processed according to the flow illustrated in
Since the sealing member 21 is alkylene in which the main chain has the urethane bond, it is possible to obtain a cured product without containing a volatile low molecular compound. Therefore, a gas is prevented from invading the flow paths even when the sealing member 21 is left for a long time in the packaged state where the flow paths are empty.
Hereinafter, examples of the present invention will be specifically described, but the technical scope of the present invention is not limited to the examples.
A reaction product S was obtained by charging a reaction vessel with 90 g of KBM903 (*2) (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.) and 92 g of 2-ethylhexyl acrylate and allowing a reaction at 80° C. for 5 hours while mixing with stirring under a nitrogen atmosphere.
A polyoxyalkylene resin PU having in its molecule an isocyanate group was obtained by charging another reaction vessel with 350 g of PML4010 (*5) (trade name; manufactured by Asahi Glass Co., Ltd.,) 150 g of PR5007 (*6) (trade name; manufactured by Adeka Corporation), and 29.4 g of Desmodur I (*7) (trade name; manufactured by Sumika Bayer Urethane Co., Ltd.) and allowing a reaction at 90° C. for 4 hours while mixing with stirring under a nitrogen atmosphere. A curable resin U which is in the form of a liquid at a room temperature and is a curable polyoxyalkylene resin having in its molecule an urethane bond and a hydrolyzable silyl group was obtained by adding 60 g of the reaction product S to the polyoxyalkylene resin PU and allowing a reaction at 90° C. for one hour while mixing with stirring under a nitrogen atmosphere.
A sealant composition was prepared by adding 1 g of KBM803 (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.) and 0.2 g of boron trifluoride piperidine complex to 100 g of the obtained curable resin U.
The sealant composition 21a was cured by hydrolysis and condensation of the main ingredient by moisture to become the sealing member 21 (
As illustrated in the flowchart of
The inkjet head before performing the flow illustrated in
Inkjet heads A-2 and B-2 were produced in the same manner as in Example 1 except for changing the use amount of KBM803 (*1) (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.) to 0.01 g with respect to 100 g of the curable resin U.
Inkjet heads A-3 and B-3 were produced in the same manner as in Example 1 except for changing the use amount of KBM803 (*1) (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.) to 10 g with respect to 100 g of the curable resin U.
Inkjet heads A-4 and B-4 were produced in the same manner as in Example 1 except for changing the use amount of boron trifluoride piperidine complex to 0.01 g with respect to 100 g of the curable resin U.
Inkjet heads A-5 and B-5 were produced in the same manner as in Example 1 except for changing the use amount of boron trifluoride piperidine complex to 0.01 g with respect to 10 g of the curable resin U.
A sealant composition was prepared by adding 1 g of KBM903 (*2) in place of KBM803 (*1) (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.) and 0.2 g of the boron trifluoride piperidine complex with respect to 100 g of the curable resin U.
Inkjet heads A-6 and B-6 were produced in the same manner as in Examples by using the sealant composition.
1 g of KBM903 (*2) was used in place of KBM803 (*1) (trade name; manufactured by Shin-Etsu Chemical Co., Ltd.) with respect to 100 g of the curable resin U. A sealant composition was prepared by adding 0.2 g of Neostan U-303 (*3) (trade name; manufactured by Nitto Kasei Kogyo K. K.) in place of the boron trifluoride piperidine complex.
Inkjet heads A-7 and B-7 were produced in the same manner as in Examples by using the sealant composition.
SE9186L (*4) (trade name; manufactured by Dow Corning Toray Co., Ltd.) was used as a sealant composition. Inkjet heads A-8 and B-8 were produced in the same manner as in Examples by using the sealant composition.
A sealant composition was prepared by adding 0.2 g of Neostan U-303 (trade name; manufactured by Nitto Kasei Kogyo K. K.) in place of the boron trifluoride piperidine complex with respect to 100 g of the curable resin U.
However, since the sealant composition was not cured under an atmosphere of a temperature of 25° C. and humidity of 50%, it was impossible to produce an inkjet head.
(Printing Evaluation)
The inkjet heads of Examples 1 to 5 and Comparative Examples 1 to 3 and 30 g of each of the sealant compositions used for the inkjet heads were placed on a glass petri dish and packaged into a teflon jar (500 mL), followed by storage at 60° C. for 2 weeks. After that, the printing test was performed to obtain printing evaluation A of the inkjet heads A-1 to A-8 and printing evaluation B of the inkjet heads B-1 to B-8.
(Evaluation Standard)
∘: Capable of good printing
Δ: Discharge port (s) failed to discharge and adversely influenced on printing
(Adhesiveness Evaluation)
A substrate A in which an acrylic resin (PSR-4000 manufactured by Taiyo Ink Mfg, Co., Ltd.) which is an example of a surface coating resin of the electric contact substrate 7 was provided on a surface was prepared. A substrate B in which a polyimide film (Upilex manufactured by Ube Industries, Ltd.) which is an example of a surface coating resin of the electric wiring tape is provided on a surface was prepared. Ink-resistant adhesiveness of the sealing member 21 to the electric wiring tape 6 and the electric contact substrate 7 was evaluated by using the substrate A and substrate B.
As illustrated in
(Evaluation Standard)
⊙: Detachment of sealant composition was not observed in all of samples
∘: Large part of sealant composition was in close contact with very few small detachment portions
Δ: Detachment of sealant composition was observed in half or more of the samples
The above-described evaluations are summarized in Table 1.
In the evaluation of the discharge evaluation A of Table 1, no difference was observed in discharge performance of the inkjet heads of Examples 1 to 5 and Comparative Examples 1 to 3. However, in the discharge evaluation B, non-discharge occurred in high duty printing in Comparative Example 3. It is considered that the non-discharge occurred due to insufficient ink refill speed which was caused since, though outgas did not invade the flow paths in a state where the inks were charged, low molecular siloxane generated from the silicone resin invaded the flow paths in the head in a state where the flow paths were empty to make a part of the flow paths hydrophobic.
As is apparent from the evaluations of adhesiveness, good adhesiveness was confirmed in each of Examples 1 to 5 with the use of the substrate A (made from polyimide film) and the substrate B (made from electric contact substrate coating resin). It is considered that the good adhesiveness was attained since invasion by the inks was prevented due to the improvement in adhesiveness between the substrate and the sealant composition attained by the addition of the mercaptosilane compound as the adhesiveness imparting agent.
It is considered that the low curing property of Comparative Example 4 was caused by deactivation of Neostan U-303, which is the dialkyltin compound by the thiol group of KBM803. In other words, the use of the boron trifluoride compound as the curing catalyst enables using the mercaptosilane compound as the adhesiveness imparting agent without deteriorating the curing property.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all modifications, equivalent structures, and functions.
This application claims priority from Japanese Patent Application No. 2010-015853 filed Jan. 27, 2010, which is hereby incorporated by reference herein in its entirety.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2010-015853 | Jan 2010 | JP | national |
| Number | Name | Date | Kind |
|---|---|---|---|
| 3278457 | Milgrom | Oct 1966 | A |
| 3632557 | Brode | Jan 1972 | A |
| 5650805 | Shimomura et al. | Jul 1997 | A |
| 6905342 | Swier et al. | Jun 2005 | B2 |
| Number | Date | Country |
|---|---|---|
| 46-27250 | Aug 1971 | JP |
| 46-30711 | Sep 1971 | JP |
| 4-145123 | May 1992 | JP |
| 7-232439 | Sep 1995 | JP |
| 2002-179787 | Jun 2002 | JP |
| 2002-356550 | Dec 2002 | JP |
| 2003-193019 | Jul 2003 | JP |
| Number | Date | Country | |
|---|---|---|---|
| 20110181665 A1 | Jul 2011 | US |
