For a more complete understanding of embodiments of the present invention, needs satisfied thereby, and the objects, features, and advantages thereof, reference now is made to the following description taken in connection with the accompanying drawings.
Preferred embodiments of the present invention, and their features and advantages, may be understood by referring to
An inkjet head 1 according to an embodiment of the invention is shown in
Inkjet head 1 may be disposed in the recording apparatus in a direction facing a recording medium, hereinafter interchangeably referred to as a recording sheet, e.g., a sheet of plain paper or a transparency. The recording sheet may be fed by a feed mechanism. Inkjet head 1 may have a rectangular parallelepiped shaped line head, whose longitudinal direction may be set in a main scanning direction. The feed mechanism may include a conveyor belt and may be configured to feed a recording sheet, fed from a supply mechanism, on the conveyor belt to an area facing inkjet head 1. Inkjet head 1 may have a printing area extending across substantially the full width of the conveyor belt. A plurality, e.g., four, inkjet heads may be provided in the recording apparatus parallel to a direction in which a recording sheet is fed (hereinafter refereed to as a sheet feeding direction). Each inkjet head 1 may eject ink droplets of a different color, e.g., one each of yellow, cyan, magenta, and black, thereby enabling color printing. Based on externally transmitted image data, the feed mechanism may feed a recording sheet to an opposed position of each inkjet head 1, and each inkjet head 1 may eject ink droplets onto the recording sheet to form an image. The recording sheet on which the image has been formed further may be fed and stored in a sheet ejection portion.
In an embodiment of the invention, the main scanning direction may be defined as a lengthwise, or long, direction of the inkjet head in a plan view, while a sub scanning direction may be defined as a direction perpendicular to the main scanning direction in a horizontal axis, when viewed in a plan view. The direction in which ink droplets may be ejected from the inkjet head 1 may herein be interchangeably referred to as the bottom, downward, or down direction, and the direction opposite the bottom direction may herein be interchangeably referred to as the top, upward, or up direction.
As shown in
Inside flow path unit 140, ink paths, e.g., a common ink chamber and individual flow paths connecting the common ink chamber and nozzles via pressure chambers, may be formed. A plurality, e.g., four, of actuator units 120 may be mounted on an upper surface e.g., a mounting surface of flow path unit 140. Each actuator unit 120 may be configured to selectively apply ejection energy to ink in the pressure chambers, so as to eject ink droplets from the nozzles of flow path unit 140 in an ink ejection direction. Actuator unit 120 may be a unimorph-type, that is, a piezoelectric layer may be interposed between a common electrode and a number of individual electrodes may be disposed to face the corresponding pressure chambers. The piezoelectric layer may be made of a lead zirconium titanate (PZT)-based ceramic material having ferroelectric properties. The individual electrodes and the common electrode may be made of, e.g., an Ag—Pd-based metallic material. The individual electrodes may be electrically connected to corresponding wiring patterns 162a on Flexible Printed Circuits (FPCs) 162 on an upper surface of actuator unit 120, via lands which may be made of gold mixed with glass frit. When a predetermined voltage pulse may be applied from a driver IC 160 to an individual electrode via a corresponding wiring pattern 162a on FPC 162, an area on actuator unit 120 corresponding to the individual electrode may be deformed, and a volume of the pressure chamber facing the area may vary. In this manner, ejection energy, e.g., a pressure wave, may be generated in ink in the pressure chamber, and an ink droplet may be ejected from the corresponding nozzle.
As shown in
One end of each FPC 162 may be electrically connected to a side of each connector 170a. FPC 162 may be a flexible sheet on which wiring patterns 162a may be formed and driver IC 160 may be mounted. The other end of each FPC 162, which may be terminals of wiring patterns 162a, may be inserted into a recessed portion 133b of ink reservoir 130 and may be electrically connected to individual electrodes of actuator unit 120.
Driver IC 160 may be an IC chip configured to drive actuator unit 120. As shown in
Ink reservoir 130 may include an upper reservoir 131, a reservoir base 132, and a lower reservoir 133, which may be disposed in this order in a direction leading toward flow path unit 140. An ink path 135 may be formed inside upper reservoir 131. Ink path 135 may be in fluid communication with an ink supply valve 111. In addition, ink path 135 may be in fluid communication with flow path unit 140 via an ink path (not shown) formed in reservoir base 132. A part of a lower surface of ink path 135 may be defined by a flexible film 131d. A lower surface of flexible film 131d faces reservoir base 132 via a gap, and may be movable within the gap. Thus, when film 131d vibrates, film 131d may absorb the impact generated by a pressure wave in ink filled in ink path 135. A filter 131c having minute holes may be disposed in ink path 135.
As shown in
As shown in
Head cover 110 may include a plurality of sidewalls 112 facing each other in the sub scanning direction. Sidewalls 12 may have greater length in the main scanning direction than in an up and down direction, i.e., a vertical direction. Each sidewall 112 may be formed with a substantially rectangular-shaped opening 110a that may be elongated in the main scanning direction, at a lower edge of sidewall 112. Opening 110a may extend to substantially the midpoint of head cover 110 in a vertical direction. Opening 110a may be designed to expose a flat protrusion 150a formed in heat sink 150 from head cover 110. A cutout portion 110b may be formed on a portion of an inner wall surface of sidewall 112 along opening 110a. Each sidewall 112 may be formed with a recessed portion 112a on the inner wall surface so that sidewall 112 may be thin at recessed portion 112a. Upper end portion of heat sink 150 may be fitted in recessed portion 112a. Thus, heat sink 150 may be supported between sidewall 112 and flow path unit 140.
A heat sink 150 according to an embodiment of the invention may be shown in
Each heat sink 150 may be formed with a plurality, e.g., five, of protrusions 150b protruding downward on a lower edge of heat sink 150. Protrusions 150b may be spaced in a longitudinal direction of heat sink 150. As shown in
Referring again to
According to an embodiment of the invention, the gap between heat sink 150 and cutout portion 110b may be filled with potting material 156, so that sidewall 112 of head cover 110 and corresponding heat sink 150 may adhere to each other tightly and stably. This structure may prevent fluid, e.g., ink or ink mist from entering the inkjet head 1, and potentially adhering to actuator 120. In addition, this structure may prevent the potting material 156 from escaping, e.g., being squeezed out, so that the sides of inkjet head 1 may be resistant to foreign objects, e.g., dust, debris, and dirt.
In an embodiment of the invention, a plurality, e.g., two, of heat sinks 150 may be positioned in proximity to both sides of flow path unit 140, with respect to the sub scanning direction. However, the number of heat sinks 150 is not limited to two. In other embodiments of the invention, one or more heat sinks may be positioned in proximity to the flow path unit.
In an embodiment of the invention, cutout portion 110b may be formed in each sidewall 112 of head cover 110, and may be configured to form a gap between sidewall 112 and heat sink 150. However, in another embodiment of the invention, cutout portion 110b may not be formed in each sidewall 112, but a cutout or a recess may be formed in an inner wall of heat sink 150, to form a gap between heat sink 150 and sidewall 112 of head cover 110.
In an embodiment of the invention, heat sinks 150 may be configured to dissipate heat of driver ICs 160. In another embodiment of the invention, heat sinks 150 may be side plates which may not function to dissipate heat. Although the embodiment of the present invention has been described in detail herein, the scope of the invention is not limited thereto. It will be appreciated by those skilled in the art that various modifications may be made without departing from the scope of the invention. Accordingly, the embodiments disclosed herein are only exemplary. It is to be understood that the scope of the invention is not to be limited thereby, but is to be determined by the claims which follow.
Number | Date | Country | Kind |
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2006268136 | Sep 2006 | JP | national |