The present invention relates to an inkjet head.
In response to demands for higher accuracy of image formation and higher speed of printing executed by an inkjet recording apparatus, there has been proposed a one-pass drawing system which uses line heads each containing a plurality of inkjet heads arranged in a zigzag shape to perform drawing only by conveyance of a recording medium. Each of the inkjet heads constituting the line heads contains a channel from which ink is ejected. For size reduction and two-dimensional and highly dense positioning of a plurality of channels of the respective inkjet heads, a method currently proposed arranges the channels in a zigzag shape (e.g., refer to Patent Literature 1).
There has been further proposed a structure which draws an upper portion of a piezoelectric device included in a small-sized channel for extraction of an electrode, forming such a shape that the piezoelectric device extends over a pressure chamber (e.g., refer to Patent Literature 2).
Patent Literature 1: JP 5-229115 A
Patent Literature 2: JP 2002-248765 A
According to Patent Literature 2, a connection portion between the piezoelectric device and the electrode is positioned on a side wall of the pressure chamber. This structure offers an advantage of higher durability against pressure applied for connection between the piezoelectric device and the electrode. However, this structure may inhibit displacement of the piezoelectric device, or converge stress to an area around the boundary between the displacement portion and the connection portion to such a level as to cause fatigue fracture by drive of the piezoelectric device.
The present invention has been developed to solve the above problems. It is an object of the present invention to provide an inkjet head capable of improving drive efficiency of a piezoelectric device while reducing fracture fatigue of the piezoelectric device.
In order to solve the above problems, an invention of claim 1 is an inkjet head including: a nozzle hole through which droplets are ejected; a pressure chamber so provided as to communicate with the nozzle hole; and a piezoelectric device disposed on the side opposite to the nozzle hole, and causing a pressure change inside the pressure chamber, wherein a cross-sectional shape of the pressure chamber in a direction substantially perpendicular to an arrangement direction where the pressure chamber and the piezoelectric device are arranged includes a circular-arc-shaped side wall portion that has a substantially circular-arc shape on the supply side for liquid supply to the pressure chamber, and linear side wall portions connected with two ends of the circular-arc-shaped side wall portion on the side opposite to the supply side, and forming such a shape that the distance between the linear side wall portions gradually decreases toward the side opposite to the supply side, the piezoelectric device includes a displacement portion that causes the pressure change inside the pressure chamber by displacement of the piezoelectric device, and an electrode connection portion electrically connecting the piezoelectric device and an electrode, a cross-sectional shape of the displacement portion in the direction substantially perpendicular to the arrangement direction includes a circular-arc-shaped portion that is formed inside the circular-arc-shaped side wall portion into a shape substantially equivalent to the shape formed by the circular-arc-shaped side wall portion as viewed in the arrangement direction, and has a smaller cross section in the direction substantially perpendicular to the arrangement direction than a corresponding cross section of the shape formed by the circular-arc-shaped side portion, the cross-sectional shape of the displacement portion in the direction substantially perpendicular to the arrangement direction further includes a linear portion that is formed inside the linear side wall portions into a shape substantially equivalent to the shape formed by the linear side wall portions as viewed in the arrangement direction, and has a smaller cross section in the direction substantially perpendicular to the arrangement direction than a corresponding cross section of the shape formed by the linear side portions, and the electrode connection portion is connected to the linear portion on the side opposite to the circular-arc-shaped portion in such a position as to overlap with a side wall portion of the pressure chamber in the arrangement direction.
An invention of claim 2 is the inkjet head according to claim 1, wherein an electrode portion is disposed on the piezoelectric device on the side opposite to the pressure chamber, voltage applied to the electrode portion at the time of displacement of the piezoelectric device, and the electrode portion has a shape substantially equivalent to the shape of the piezoelectric device.
An invention of claim 3 is the inkjet head according to claim 2, wherein the size of the electrode portion is substantially equivalent to or smaller than the size of the piezoelectric device.
An invention of claim 4 is the inkjet head according to any one of claims 1 to 3, wherein the electrode connection portion includes a connection portion body electrically connected with the electrode, and a junction portion so joined as to connect the connection portion body and the displacement portion, and the junction portion is disposed in such a position as to overlap with the linear side wall portions in the arrangement direction.
An invention of claim 5 is the inkjet head according to claim 4, wherein a width of the junction portion in the direction substantially perpendicular to the arrangement direction is substantially equivalent to or smaller than a width of the connection portion body in the direction substantially perpendicular to the arrangement direction.
An invention of claim 6 is the inkjet head according to any one of claims 1 to 5, wherein the thickness of the piezoelectric device in the arrangement direction is 100 μm or smaller.
An invention of claim 7 is the inkjet head according to any one of claims 1 to 6 further including: a supply channel connected to the circular-arc-shaped side wall portion on the side opposite to the linear side wall portions, and forming a channel through which liquid is supplied to the pressure chamber, wherein a width of the supply channel in the direction substantially perpendicular to the arrangement direction is smaller than the corresponding width of the pressure chamber, and the supply channel is so disposed as to intersect at an angle within a predetermined range with a straight line passing through the center of the pressure chamber and ends of the linear side wall portions on the side opposite to the circular-arc-shaped side wall portion.
An invention of claim 8 is the inkjet head according to any one of claims 1 to 7, wherein the nozzle hole communicates with the side opposite the supply side of the linear side wall portions.
According to the present invention, improvement of drive efficiency of a piezoelectric device, and reduction of fracture fatigue of the piezoelectric device are both achievable.
An embodiment according to the present invention is hereinafter described with reference to the drawings.
As illustrated in
In the following description, a conveyance direction of the recording medium M corresponds to the front-rear direction (or Y direction), a direction crossing the front-rear direction at right angles corresponds to the left-right direction (or X direction), and a direction crossing the front-rear direction and the left-right direction at right angles corresponds to the up-down direction.
Each of the line heads 3, 4, 5, and 6 has a long shape extending in the left-right direction. The line heads 3, 4, 5, and 6 are arranged in the direction from the upstream side to the downstream side with a predetermined clearance left between each other.
The inkjet recording apparatus 100 conveys the recording medium M supported by the platen 1 in the conveyance direction in accordance with drive of the conveyance rollers 2. During this period, ink in respective process colors of Y, M, C, and K are ejected to the recording medium M from the line heads 3, 4, 5, and 6, respectively.
The respective line heads 3, 4, 5, and 6 have substantially the same structure except for different colors of ink to be ejected. The line head 3 is hereinafter described in detail as a typical example of the respective line heads.
As illustrated in
The frame unit 20 is a component extended long in the left-right direction, and having a box shape opened downward. A predetermined number of (such as six for each surface) grooves 22 are formed at predetermined positions of each of a front surface 21 and a rear surface of the frame unit 20. The grooves 22 engage with projections al and a2 formed on the front surface side and the rear surface side, respectively, of a housing 30 of the inkjet heads 10.
The plurality of grooves 22 are formed with predetermined clearances left between the respective grooves 22, in correspondence with clearances left between the respective projections al on the front surface side, and between the respective projections a2 on the rear surface side.
Each of the grooves 22 is a notch cut from the lower end of the front surface 21 or the rear surface, and has a shape bended substantially at right angles as viewed in the front-rear direction. The deepest portion of each of the grooves 22 is curved in a circular-arc and downwardly convex shape, so that the cylindrical projections al and a2 can be placed at the circular-arc-shaped portions of the grooves 22.
Openings are formed in an upper surface of the frame unit 20 in correspondence with the respective inkjet heads 10. Supply connectors 15, a discharge connector 16, electric connectors 19 (described later) and others constituting the inkjet heads 10 are inserted through each of the openings of the frame unit 20.
The inkjet heads 10 are hereinafter detailed.
As illustrated in
The two supply connectors 15, the two IC substrates 17, and the two electric connectors 19 are provided both for the set of three head chips 11 disposed on the front side of the holding plate 12, and for the set of three head chips 11 disposed on the rear side of the holding plate 12, as will be detailed below.
The holding plate 12 is attached and fixed to a lower end of the housing 30.
The predetermined number of (such as six) head chips 11, each of which includes a nozzle substrate 111 having substantially uniform shape and size, are disposed on the holding plate 12 in a zigzag shape in the left-right direction. More specifically, the three head chips 11 disposed with a predetermined uniform clearance left between each other are provided on each of the front side and the rear side of the holding plate 12. The three head chips 11 on the front side and the three head chips 11 on the rear side are shifted from the opposite side in the left-right direction by a length equivalent to the width of the one head chip 11 in the left-right direction. The holding plate 12 has a stepped shape in correspondence with the arrangement of the predetermined number of (such as six) of the head chips 11.
Each of the head chips 11 is a plate-shaped component containing a plurality of nozzles 111a.
The head chips 11 are hereinafter detailed.
As illustrated in
The nozzle substrate 111 is a substrate made of silicon, and positioned on the lowermost layer of the head chip 11. The plurality of nozzles 111a are formed in the nozzle substrate 111.
The nozzles 111a are arranged in a nozzle surface substantially in matrix, for example.
The intermediate substrate 112 is a substrate made of glass, and laminated on and joined to the upper surface of the nozzle substrate 111. A through hole 112a communicating with the corresponding nozzle 111a of the nozzle substrate 111 is formed in the intermediate substrate 112.
The pressure chamber substrate 113 is constituted by a pressure chamber layer 113a and an oscillation plate 113b.
The pressure chamber layer 113a is a substrate made of silicon, and laminated on and joined to the upper surface of the intermediate substrate 112. A pressure chamber 113c is formed in the pressure chamber layer 113a in such a shape as to penetrate the pressure chamber layer 113a. The pressure chamber 113c applies ejection pressure to ink ejected from the nozzle 111a.
The pressure chamber 113c provided above the through hole 112a and the nozzle 111a communicates with the through hole 112a and the nozzle 111a. A communication hole 113d is formed in such a shape as to extend in the horizontal direction in the pressure chamber layer 113a. The communication hole 113d produces a channel for ink supplied to the pressure chamber.
The configurations of the pressure chamber 113c and the communication hole 113d are hereinafter detailed.
The pressure chamber 113c achieves a displacement in accordance with deformation of the oscillation plate 113b produced by drive of the piezoelectric device 114b to apply ejection pressure to ink for ejection from the nozzle 111a. More specifically, as illustrated in
The circular-arc-shaped side wall portion c1 is provided on the ink supply side of the pressure chamber 113c. More specifically, the circular-arc-shaped side wall portion c1 connects with the downstream side end of the communication hole 113d in the ink supply direction to make junction with the communication hole (supply channel) 113d which forms a channel for ink supplied to the pressure chamber 113c. A cross section of the circular-arc-shaped side wall portion c1 crossing the up-down direction (arrangement direction of the pressure chamber and the piezoelectric device) substantially at right angles is substantially semicircular.
The linear side wall portions c2 are connected with two ends of the circular-arc-shaped side wall portion c1 on the side opposite to the ink supply side of the circular-arc-shaped side wall portion c1, i.e., the communication hole 113d side.
The linear side wall portions c2 form a tapered shape where the distance between the linear side wall portions c2 in the front-rear direction substantially perpendicular to the up-down direction gradually deceases toward the side opposite to the ink supply side, i.e., the communication hole 113d side. More specifically, the two side wall portions constituting the linear side wall portions c2 cross each other at a predetermined angle (such as 90°) on the downstream side in the ink supply direction, and form a shape linearly symmetric with respect to a straight line (chain line L1 in
The angle at which the two side wall portions constituting the linear side wall portions c2 is only presented by way of example, and not limited to this specific example. It is therefore intended that this angle may be arbitrarily varied.
The length ratio of each of the linear side wall portions c2 to the circular-arc-shaped side wall portion c1 in the left-right direction may be arbitrarily varied. However, in consideration of stress convergence and displacement inhibition of the piezoelectric device 114b provided immediately above the pressure chamber 113c, it is preferable that each of the linear side wall portions c2 is relatively longer than the circular-arc-shaped side wall portion c1. More specifically, it is preferable that the distance between the center O of the pressure chamber 113c and the end P at which the two side wall portions constituting the linear side wall portions c2 cross each other becomes longer than the radial length between the center O of the pressure chamber 113c and the circular-arc-shaped side wall portion c1.
The communication hole 113d connects with the circular-arc-shaped side wall portion ci on the side opposite to the linear side wall portions c2, and has a substantially cylindrical shape, for example.
The width of the communication hole 113d in the direction substantially perpendicular to the up-down direction is smaller than the corresponding width of the pressure chamber 113c. The communication hole 113d is so disposed as to cross the straight line (chain line L1 in
It is considered as a preferable configuration that the two-dot chain line L2 extending in the extension direction of the communication hole 113d, and the chain line L1 passing through the end P at which the two side wall portions constituting the linear side wall portions c2 extend substantially in the same direction in view of reduction of residual ink and lowering of the survival degree of bubbles. However, it is preferable that these two lines cross each other at the angle θ within the predetermined range in view of increase in the degree of freedom in positioning the nozzle 111a.
The communication hole 113d is formed integrally with the pressure chamber 113c. Accordingly, the layer structure of the head chip 11 becomes simpler, and the cost of the inkjet head 10 lowers.
The oscillation plate 113b is laminated on and joined to the upper surface of the pressure chamber layer 113a in such a shape as to cover the opening of the pressure chamber 113c. In other words, the oscillation plate 113b constitutes an upper wall portion of the pressure chamber 113c. An oxide film is formed on the surface of the oscillation plate 113b. A through hole 113e communicating with the communication hole 113d is formed in the oscillation plate 113b.
The first bonding layer 114 is laminated on the upper surface of the oscillation plate 113b. The first bonding layer 114 functions as a photosensitive resin layer which bonds the oscillation plate 113b and the wiring layer 115, and as a partitioning layer which contains a space 114a. The space 114a is formed above the pressure chamber 113c in such a shape as to penetrate the first bonding layer 114, and accommodates the piezoelectric device 114b.
The configuration of the piezoelectric device 114b is now detailed.
The piezoelectric device 114b is disposed at a position facing to the pressure chamber 113c with the oscillation plate 113b interposed between the piezoelectric device 114b and the pressure chamber 113c. The piezoelectric device 114b is an actuator constituted by PZT (lead zirconium titanate) which deforms the oscillation plate 113b.
The piezoelectric device 114b has a thin shape having a thickness of 100 μm or smaller in the up-down direction, for example .
The piezoelectric device 114b includes a displacement portion bl having a substantially the same shape as the shape of the pressure chamber 113c, and an electrode connection portion b2 electrically connecting the piezoelectric device 114b and a conductive substrate 115f (described later) of the wiring layer 115.
The displacement portion b1 deforms the oscillation plate 113b by displacement of the displacement portion b1 to cause a pressure change inside the pressure chamber 113c. More specifically, as illustrated in
The circular-arc-shaped portion b11 has a substantially semicircular shape having a smaller cross section crossing the up-down direction (arrangement direction of the pressure chamber 113c and the piezoelectric device 114b) substantially at right angles than a corresponding cross section of the shape formed by the circular-arc-shaped side wall portion c1. The circular-arc-shaped portion bii is disposed in such a position as to overlap with the circular-arc-shaped side wall portion c1 with approximate concentricity.
The linear portion b12 is connected with the circular-arc-shaped portion b11 on the electrode connection portion b2 side. The linear portion b12 has a shape having a smaller cross section crossing the up-down direction substantially at right angles than a corresponding cross section of the shape formed by the linear side wall portions c2. The linear portion b12 is tapered so that the length in the front-rear direction substantially perpendicular to the up-down direction gradually decreases toward the side opposite to the circular-arc-shaped portion b11, in a manner substantially similar to the shape formed by the linear side wall portions c2. The electrode connection portion b2 is joined to the end of the linear portion b12 on the side opposite to the circular-arc-shaped portion b11.
The electrode connection portion b2 is drawn in the right direction from the end of the linear portion b12 of the displacement portion b1. More specifically, as illustrated in
The electrode connection portion b2 is disposed on the upper side in such a position as to overlap with the side wall portion of the pressure chamber 113c in the up-down direction. More specifically, the junction portion b22 of the electrode connection portion b2 is disposed on the upper side in such a position as to overlap with the linear side wall portions c2 in the up-down direction.
The width of the junction portion b22 in the front-rear direction substantially perpendicular to the up-down direction is smaller than the width of the displacement portion b1 in the front-rear direction, and substantially equivalent to the width of the connection portion body b21 in the front-rear direction. This structure further decreases the boundary area between the displacement portion b1 and the junction portion b22. According to this structure, the junction portion b22 is adjustable to a position away from the center of the pressure chamber 113c, i.e., the center of the displacement portion b1 of the piezoelectric device 114b by adjustment of the length ratio of each of the linear side wall portions c2 of the pressure chamber 113c to the circular-art-shaped side wall portion c1 in the left-right direction for reduction of stress convergence and displacement inhabitation at the boundary area between the displacement portion b1 and the junction portion b22.
The width of the junction portion b22 in the front-rear direction may be smaller than the width of the connection portion body b21 in the front-rear direction.
An upper electrode portion 114e is provided on the upper surface of the piezoelectric device 114b. On the other hand, a lower electrode portion (not shown) connected with the oscillation plate 113b is provided on the lower surface of the piezoelectric device 114b.
When voltage is applied between the upper electrode portion 114e and the lower electrode portion, the piezoelectric device 114b sandwiched between the upper electrode portion 114e and the lower electrode portion is deformed together with the oscillation plate 113b. As a result, ink contained in the pressure chamber 113c is pushed out and ejected from the nozzle 111a.
The upper electrode portion 114e may have a shape substantially equivalent to the shape of the piezoelectric device 114b, i.e., the shape of the displacement portion b1 and the electrode connection portion b2. This structure allows processing of the piezoelectric device 114b and the first bonding layer 114 by using an identical mask. In this case, the manufacturing step becomes easier, and the cost of the inkjet head 10 lowers.
The size of the upper electrode portion 114e (particularly the width in the front-rear direction) may be substantially equivalent to the size of the body of the piezoelectric device 114b, or smaller than this size. This structure further decreases the boundary area between the junction portion b22 and the displacement portion b1 corresponding to the displacement position of the piezoelectric device 114b.
A through hole 114c communicating with the through hole 113e of the oscillation plate 113b is formed in the first bonding layer 114 independently from the space 114a.
The wiring layer 115 includes an interposer 115a constituted by a silicon substrate. The lower surface of the interposer 115a is coated with two insulation layers 115b and 115c made of silicon oxide, while the upper surface of the interposer 115a is coated with an insulation layer 115d similarly made of silicon oxide. The insulation layer 115c corresponding to the lower one of the two insulation layers 115b and 115c is laminated on and joined to the upper surface of the first bonding layer 114.
A through electrode 115e is provided in such a shape as to penetrate the interposer 115a in the up-down direction. One end of the conductive substrate 115f extending in the horizontal direction is connected with the lower end of the through electrode 115e. A stud bump 114d is provided on the upper electrode portion 114e formed on the upper surface of the piezoelectric device 114b, and connected with the other end of the conductive substrate 115f via solder 115g exposed to the interior of the space 114a. At the time of displacement of the piezoelectric device 114b, voltage is applied between the upper electrode portion 114e and the lower electrode portion (not shown) via the conductive substrate 115f, the solder 115g, and the stud bump 114d.
More specifically, the conductive substrate 115f is disposed on the piezoelectric device 114b on the side opposite to the pressure chamber 113c to constitute an electrode electrically connected with the piezoelectric device 114b.
The conductive substrate 115f is protected between the two insulation layers 115b and 115c located below the interposer 115a.
An inlet 115h communicating with the through hole 114c of the first bonding layer 114 is provided in the interposer 115a in such a shape as to penetrate the interposer 115a in the up-down direction.
The second bonding layer 116 is laminated on and joined to the upper surface of the insulation layer 115d of the interposer 115a in such a position as to cover wiring 116a provided on the upper surface of the wiring layer 115. The second bonding layer 116 functions as a photosensitive resin layer which bonds the holding plate 12 and the head chip 11, and as a protection layer for protecting the wiring 116a. The wiring 116a extends in the horizontal direction. One end of the wiring 116a is connected with the upper end of the through electrode 115e, while the other end of the wiring 116a is connected with the electric connector 19 via the relay substrate 18a and the connector substrate 18b. A through hole 116b communicating with the inlet 115h is formed in the second bonding layer 116.
The communication hole 113d, the through holes 113e, 114c, and 116b, and the inlet 115h of the head chip 11 constitute a channel connecting the ink chamber 13 and the pressure chamber 113c, so that ink contained in the ink chamber 13 is supplied to the nozzle 111a through this channel.
Discussed hereinbelow with reference to
The piezoelectric device and pressure chamber according the present invention (see
More specifically, the circular-arc-shaped side wall portion c1 of the pressure chamber is substantially semicircular, while the linear side wall portions c2 are constituted by two side wall portions connecting with the ends of the circular-arc-shaped side wall portion c1 and crossing each other at substantially 90°.
The circular-arc-shaped portion b11 of the displacement portion of the piezoelectric device is substantially semicircular similarly to the circular-arc-shaped side wall portion c1 of the pressure chamber. The two straight lines of the linear-shaped portion b12 of the piezoelectric device are connected with the circular-arc-shaped portion b11, and extend substantially in parallel with the two straight lines of the linear side wall portions c2 of the pressure chamber. The electrode connection portion b2 is joined to the linear portion b12.
The electrode connection portion b2 is so formed as to extend substantially in the same direction as the direction of a straight line connecting the center O of the displacement portion and an intersection of assumed extension lines of the two straight lines of the linear portion b12.
The length of the pressure chamber in the portion corresponding to the diameter connecting both ends of the substantially semicircular circular-arc-shaped side wall portion c1 is 600 μm.
The length of the piezoelectric device in the portion corresponding to the diameter connecting both ends of the substantially semicircular circular-arc-shaped portion b11 is 550 μm, while the thickness of the piezoelectric device in the up-down direction is 50 μm.
The one side of the square shape of the respective piezoelectric devices illustrated in
For calculation of each driving voltage shown in
For calculation of each stress shown in
When the piezoelectric device containing no electrode connection portion is overlapped inside the pressure chamber with approximate concentricity, it is considered as advantageous that the piezoelectric device and the pressure chamber are circular in view of driving efficiency as can be seen from
On the other hand, when the piezoelectric device contains the electrode connection portion, the effect of displacement inhibition (stress) produced by the presence of the electrode connection portion is smaller for the substantially square piezoelectric device than for the substantially circular piezoelectric device. More specifically, in case of the substantially circular piezoelectric device, the distances between the center of the piezoelectric device and respective points on the circumference thereof are substantially uniform. Accordingly, when the electrode connection portion is drawn from the circumference of the piezoelectric device, the displacement and stress sharply change at the boundary area between the electrode connection portion and the piezoelectric device. On the other hand, when the electrode connection portion is drawn from a corner of the substantially square piezoelectric device, the distances between the center of the piezoelectric device and respective points on two sides which constitute the portion drawn to form the electrode connection portion of the piezoelectric device and cross each other substantially at right angles increase in the direction toward the electrode connection portion, in which condition the displacement and stress smoothly change. In addition, the boundary area between the displacement portion of the piezoelectric device and the electrode connection portion comes to the position farthest from the center of the piezoelectric device. Accordingly, the effect of displacement inhibition is considered to become the minimum at that position.
According to the inkjet head 10 in this embodiment as described herein, the cross-sectional shape of the pressure chamber 113c crossing the up-down direction substantially at right angles includes the circular-arc-shaped side wall portion c1 having a substantially circular-arc shape on the upstream side in the ink supply direction, and the linear side wall portions c2 so shaped that the distance between the linear side wall portions c2 decreases toward the side opposite to the upstream side in the ink supply direction, i.e., on the side where the nozzle hole is formed. The piezoelectric device 114b includes the displacement portion bi which produces a pressure change inside the pressure chamber 113c by displacement of the displacement portion b1, and the electrode connection portion b2 electrically connecting the piezoelectric device 114b and the conductive substrate 115f. The cross-sectional shape of the displacement portion bi taken in a direction substantially perpendicular to the up-down direction includes the circular-arc-shaped portion bii formed inside the circular-arc-shaped side wall portion c1 into a shape substantially equivalent to the shape formed by the circular-arc-shaped portion ci as viewed in the up-down direction, and having a smaller cross section in a direction substantially perpendicular to the up-down direction than the cross section of the circular-arc-shaped side wall portion c1. The cross-sectional shape of the displacement portion b1 further includes the linear portion b12 which connects with the circular-arc-shaped portion bii and has a shape formed inside the linear side wall portions c2 into a shape substantially equivalent to the shape formed by the linear side wall portions c2 as viewed in the up-down direction, and having a smaller cross section in a direction substantially perpendicular to the up-down direction than the cross section of the shape formed by the linear side wall portions c2. The electrode connection portion b2 connects with the linear portion b12 on the side opposite to the circular-arc-shaped portion b11, and so disposed as to overlap with the side wall portion of the pressure chamber 113c in the up-down direction. This structure reduces convergence of stress applied to the boundary area between the displacement portion bi of the piezoelectric device 114b and the electrode connection portion b2 while maintaining the durability against pressure applied to connect the piezoelectric device 114b and the conductive substrate 115f. Particularly, the structure of the piezoelectric device 114b and the pressure chamber 113c discussed above reduces convergence of stress to the boundary area between the displacement portion bl of the piezoelectric device 114b and the electrode connection portion b2 even in case of the piezoelectric device 114b which is thin and easily produces a large displacement, such as the piezoelectric device 114b having a thickness of 100 μm or smaller in the up-down direction.
Accordingly, improvement of the driving efficiency of the piezoelectric device 114b and reduction of fatigue fracture of the piezoelectric device 114b are both achievable.
Moreover, the junction portion b22 so joined as to connect the displacement portion bl and the connection portion body b21 of the electrode connection portion b2 electrically connected with the conductive substrate 115f is disposed at a position overlapped with the linear side wall portions c2 in the up-down direction. This structure also reduces sharp changes of displacement and stress applied to the connection portion body b21 of the electrode connection portion b2 provided on the side wall portion of the pressure chamber 113c.
The present invention is not limited to the embodiment described herein. Various improvements and design changes may be made to the embodiment without departing from the scope of the present invention.
For example, the electrode connection portion b2 which includes the junction portion b22 having a width substantially equivalent to the width of the connection portion body b21 in the direction substantially perpendicular to the up-down direction has been discussed by way of example. However, the electrode connection portion b2 is not limited to this specific example. The presence of the junction portion b22, and the shape and other conditions of the junction portion b22 may be arbitrarily determined as long as the electrode connection portion b2 electrically connects with the piezoelectric device 114b.
Needless to say, other specific detailed configurations and the like may be arbitrarily changed.
In addition, it should be understood that the embodiment disclosed herein is presented by way of example in all possible points, and not intended to limit the present invention in any way. The scope of the present invention is defined not by the foregoing description, but only by the appended claims. It is therefore intended that all changes within senses and ranges equivalent to the scope of the appended claims are all included in the scope of the present invention.
As described herein, the inkjet head according to the present invention is a useful device capable of increasing driving efficiency of a piezoelectric device while reducing fatigue fracture of the piezoelectric device.
Number | Date | Country | Kind |
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2012-258416 | Nov 2012 | JP | national |
This is the U.S. national stage of application No. PCT/JP2013/078580, filed on Oct. 22, 2013. Priority under 35 U.S.C. §119(a) and 35 U.S.C. §365(b) is claimed from Japanese Application No. 2012-258416, filed Nov. 27, 2012, the disclosure of which is also incorporated herein by reference.
Filing Document | Filing Date | Country | Kind |
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PCT/JP2013/078580 | 10/22/2013 | WO | 00 |