INPUT DEVICE

Abstract

An input device includes a rectangular sheet-form optical waveguide including a rectangular sheet-form under-cladding layer, a rectangular sheet-form over-cladding layer and linear cores arranged in a lattice pattern and held between the under-cladding layer and the over-cladding layer. A surface portion of the over-cladding layer corresponding to the plurality of linear cores arranged in the lattice pattern is defined as an input region. The under-cladding layer and the over-cladding layer each have an elasticity modulus that is set at 10 to 100% of the elasticity modulus of the cores, whereby the cores are prevented from being cracked when the input tip portion of the input element is pressed against the input region or moved on the input region.

Description

TECHNICAL FIELD

The present invention relates to an input device including optical position detecting means.

BACKGROUND ART

A position sensor for optically sensing a pressed position has been hitherto proposed (see, for example, PTL 1). The position sensor includes a sheet-form optical waveguide including a plurality of linear light-path cores arranged in two orthogonal directions and a cladding which covers peripheral portions of the cores, and is configured such that light emitted from a light emitting element is inputted to one-side end faces of the cores to be transmitted through the cores and received on the other-side end faces of the cores by a light receiving element. When a part of a surface of the sheet-form position sensor is pressed with a finger or the like, core portions in the pressed part are compressed (the pressed core portions each have a sectional area reduced in a pressing direction) and, therefore, the level of light received by the light receiving element is decreased in the pressed core portions. Thus, the position sensor senses the pressed position.

RELATED ART DOCUMENT

Patent Document

PTL 1: JP-A-HEI8(1996)-234895

SUMMARY OF INVENTION

When a user inputs a character or the like on the surface of the sheet-form position sensor of PTL 1 with the use of an input element such as a pen, however, the optical waveguide may be damaged by an input tip portion of the input element (a pen tip or the like) in some case. For easy deformation of the cores by the pressing and easy detection of the pressed position, more specifically, an over-cladding layer of the optical waveguide often has a smaller thickness (e.g., not greater than 200 μm) on the cores. In this case, if a pressing force applied onto the surface of the position sensor by the input tip portion of the input element is greater than a preset level (which is determined in consideration that an average pressing force to be applied by users is about 1.5 N), the input tip portion is liable to deeply sink into a square portion of the cladding surrounded by linear cores. This may crack the cladding portion, and the cracking may extend to the surrounding cores. When the input tip portion is moved by continuously applying the greater pressing force, the input tip portion may be caught by the linear cores to crack the cores. The cracked cores cannot properly transmit the light, so that the position sensor loses its function.

In view of the foregoing, it is an object of the present invention to provide an input device including an optical waveguide free from cracking of cores which may otherwise occur when an input tip portion of an input element is pressed against the input device or moved on the input device.

To accomplish the aforementioned object, an input device according to the present invention includes: a sheet-form optical waveguide including a sheet-form under-cladding layer, a sheet-form over-cladding layer and a plurality of linear cores arranged in a lattice pattern and held between the under-cladding layer and the over-cladding layer; a light emitting element connected to one-side end faces of the cores of the optical waveguide; and a light receiving element connected to the other-side end faces of the cores; wherein light emitted from the light emitting element is transmitted through the cores of the optical waveguide and received by the light receiving element; wherein a surface portion of the over-cladding layer corresponding to the plurality of linear cores arranged in the lattice pattern is defined as an input region, and a pressed position at which the input region is pressed with an input tip portion of an input element is detected based on light transmission amounts of the cores changed by the pressing; wherein the under-cladding layer and the over-cladding layer each have an elasticity modulus that is set at 10 to 100% of the elasticity modulus of the cores, whereby the cores are prevented from being cracked when the input region is pressed with the input tip portion.

The inventors of the present invention conducted studies on the elasticity modulus of the optical waveguide in order to prevent the cores of the optical waveguide from being cracked when the input tip portion of the input element (a pen or the like) is pressed against the input device and moved on the input device to input a character or the like on the input device by means of the input element, even if the over-cladding layer is formed as having a thickness of not greater than 200 μm on the cores. In the studies, the inventors found that, in the prior art, the cracking of the cores occurs when the elasticity moduli of the under-cladding layer and the over-cladding layer are significantly smaller than the elasticity modulus of the cores (not greater than 5% of the elasticity of the cores). In view of this, the inventors conceived an idea that the elasticity moduli of the under-cladding layer and the over-cladding layer are set closer to the elasticity modulus of the cores, and further conducted studies. As a result, the inventors found that, where the elasticity moduli of the under-cladding layer and the over-cladding layer are set at 10 to 100% of the elasticity modulus of the cores, the cracking of the cores can be prevented which may otherwise occur when the input tip portion of the input element is pressed against the input device or moved on the input device, and attained the present invention.

In the inventive input device, the elasticity moduli of the under-cladding layer and the over-cladding layer of the optical waveguide are set at 10 to 100% of the elasticity modulus of the cores. That is, the elasticity moduli of the under-cladding layer and the over-cladding layer are set substantially equal to or close to the elasticity modulus of the cores. Thus, the over-cladding layer, the cores and the under-cladding layer are deformed in the same manner when the input tip portion of the input element is pressed against the input region defined on the surface of the over-cladding layer or moved on the input region. Therefore, the cores are prevented from being heavily stressed. As a result, the cores are prevented from being cracked. Even if a square portion of the over-cladding layer or the under-cladding layer surrounded by linear cores is deformed by strong pressing with the input tip portion of the input element, for example, the cores are prevented from being cracked. Further, even if the input tip portion of the input element is moved by the strong pressing, the input tip portion is not caught by the cores, so that the cores are free from the cracking.

Particularly, where the elasticity modulus of the cores is set in a range of 1 M to 10 GPa, the elasticity modulus of the over-cladding layer to be brought into contact with the input tip portion of the input element can be set at a level suitable for the inputting with the use of the input element, thereby ensuring good writing feeling.

The optical waveguide may be configured such that the cores are embedded in a surface of the under-cladding layer with top surfaces thereof being flush with the surface of the under-cladding layer, and the over-cladding layer covers the surface of the under-cladding layer and the top surfaces of the cores. In this case, the synergistic effect of the configuration of the optical waveguide and the setting of the elasticity moduli makes it easier to detect the pressed position at which the input region is pressed with the input tip portion of the input element.

BRIEF DESCRIPTION OF DRAWINGS

FIGS. 1A and 1B are a plan view and a major enlarged sectional view, respectively, schematically showing an input device according to an embodiment of the present invention.

FIG. 2 is an enlarged partial sectional view schematically showing the input device in use.

FIGS. 3A to 3D are schematic diagrams for explaining a method for fabricating an optical waveguide of the input device.

FIG. 4 is a major enlarged sectional view schematically illustrating an optical waveguide of an input device according to another embodiment of the present invention.

FIG. 5 is a major enlarged sectional view schematically showing a modification of the input device.

FIGS. 6A to 6F are enlarged plan views each schematically showing an intersecting core portion of linear cores arranged in a lattice pattern in the input device.

FIGS. 7A and 7B are enlarged plan views each schematically showing light ray paths in an intersecting core portion of the linear cores arranged in a lattice pattern.

DESCRIPTION OF EMBODIMENTS

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1A is a plan view showing an input device according to an embodiment, and FIG. 1B is an enlarged view showing a middle portion of the input device in section. The input device according to this embodiment includes: a rectangular sheet-form optical waveguide W including a rectangular sheet-form under-cladding layer 1, a rectangular sheet-form over-cladding layer 3 and linear cores 2 arranged in a lattice pattern and held between the under-cladding layer 1 and the over-cladding layer 3; a light emitting element 4 connected to one-side end faces of the linear cores 2 arranged in the lattice pattern; and a light receiving element 5 connected to the other-side end faces of the linear cores 2. Light emitted from the light emitting element 4 is transmitted through the cores 2, and received by the light receiving element 5. A surface portion of the over-cladding layer 3 corresponding to the plurality of linear cores arranged in the lattice pattern is defined as an input region. In FIG. 1A, the cores 2 are indicated by broken lines, and the thicknesses of the broken lines correspond to the thicknesses of the cores 2. In FIG. 1A, some of the cores 2 are omitted. In FIG. 1A, arrows each indicate a light traveling direction.

In the optical waveguide W, the under-cladding layer 1 and the over-cladding layer 3 each have an elasticity modulus that is set at 10 to 100% of the elasticity modulus of the cores 2. This is a major characteristic feature of the present invention. Thus, the elasticity moduli of the under-cladding layer 1 and the over-cladding layer 3 are set substantially equal to or close to the elasticity modulus of the cores 2. When the input region on the surface of the over-cladding layer 3 is pressed, the over-cladding layer 3, the cores 2 and the under-cladding layer 1 are deformed in the same manner and, therefore, the cores 2 are not heavily stressed. As a result, the cores 2 are prevented from being cracked. The elasticity modulus of the under-cladding layer 1 and the elasticity modulus of the over-cladding layer 3 may be the same value or different values. If the elasticity modulus of the under-cladding layer 1 and the elasticity modulus of the over-cladding layer 3 are greater than the elasticity modulus of the cores 2 (greater than 100% of the elasticity modulus of the cores 2), peripheral portions of the cores 2 will become harder. Therefore, the cores 2 are not properly deformed with respect to the pressing, thereby making it difficult to accurately sense the pressed position. If the elasticity modulus of the under-cladding layer 1 and the elasticity modulus of the over-cladding layer 3 are too small with respect to the elasticity modulus of the cores 2 (not greater than 5% of the elasticity modulus of the cores 2), the cores 2 and the like are liable to be cracked by the pressing.

In this embodiment, the cores 2 arranged in the lattice pattern are embedded in a surface of the sheet-form under-cladding layer 1 with top surfaces thereof being flush with the surface of the under-cladding layer 1, and the sheet-form over-cladding layer 3 covers the surface of the under-cladding layer 1 and the top surfaces of the cores 2. Thus, the optical waveguide W is configured in a sheet form. In the optical waveguide W having this specific configuration, the over-cladding layer 3 has a uniform thickness, and the elasticity moduli of the under-cladding layer 1, the cores 2 and the over-cladding layer 3 are set in the aforementioned manner. Thus, the input device can easily sense the pressed position at which the input region is pressed with an input tip portion of an input element. Where the optical waveguide W has the aforementioned configuration, the under-cladding layer 1 has a thickness of, for example, 1 to 200 μm, and the cores 2 each have a thickness of, for example, 5 to 100 μm. Further, the over-cladding layer 3 has a thickness of, for example, 1 to 200 μm.

As shown in a sectional view of FIG. 2, for example, the input device is placed on a planar base 30 such as a table and, in use, information such as a character is written on the input region by means of the input element 10 such as a pen. In the writing, the surface of the over-cladding layer 3 of the optical waveguide W is pressed with the input tip portion 10a such as a pen tip. In a part of the input device pressed with the input tip portion 10a (the pen tip or the like), a core portion 2 is bent along the input tip portion 10a (the pen tip or the like) to sink in the under-cladding layer 1. Light is leaked (scattered) from the bent core portion 2. Therefore, the level of light received by the light receiving element 5 is decreased in the core portion 2 pressed with the input tip portion 10a (the pen tip or the like). The input device can sense the position (coordinates) and the movement locus of the input tip portion 10a (the pen tip or the like) based on the reduction in light receiving level.

As described above, the elasticity modulus of the under-cladding layer 1 and the elasticity modulus of the over-cladding layer 3 are set at 10 to 100% of the elasticity modulus of the cores 2. When the input device is pressed with the input tip portion 10a (the pen tip or the like), therefore, the over-cladding layer 3, the cores 2 and the under-cladding layer 1 are deformed in the same manner, so that the cores 2 are not heavily stressed. Even if square portions of the over-cladding layer 3 and the under-cladding layer 1 surrounded by linear cores 2 are deformed by strong pressing with the input tip portion 10a of the input element 1, for example, the cores 2 are free from the cracking. Even if the input tip portion 10a of the input element 10 is moved by the strong pressing, the input tip portion 10a is not caught by the cores 2. Therefore, the cores 2 are free from the cracking. As a result, the input device can function for its purpose.

The elasticity modulus of the cores 2 is preferably set in a range of 1 M to 10 GPa. Thus, the elasticity modulus of the over-cladding layer 3 to be brought into contact with the input tip portion 10a of the input element 10 can be set at a level suitable for the inputting with the use of the input element 10, thereby ensuring good writing feeling.

When the pressing with the input tip portion 10a is removed (the inputting ends), the under-cladding layer 1, the cores 2 and the over-cladding layer 3 are restored to their original states (see FIG. 1B) by their own resilience. The upper limit of the sinking depth D by which the cores 2 sink into the under-cladding layer 1 is preferably 2000 μm. If the sinking depth D is greater than the upper limit, there is a possibility that the under-cladding layer 1, the cores 2 and the over-cladding layer 3 are not restored to their original states and the optical waveguide W is cracked.

The input device further includes a CPU (central processing unit) (not shown) for controlling the input device. The CPU incorporates a program which determines the position and the movement locus of the input tip portion 10a (the pen tip or the like) based on the reduction in level of light received by the light receiving element 5. For example, data indicative of the position and the movement locus of the input tip portion 10a is stored (memorized) as electronic data in storage means such as a memory.

Further, information such as notes stored (memorized) in the storage means can be reproduced (displayed) on a reproduction terminal (a personal computer, a smartphone or a tablet terminal), or stored in the reproduction terminal. In this case, the reproduction terminal and the input device are connected to each other via a connection cable such as a micro USB cable. The information is stored (memorized) in a versatile file form such as a pdf form in the storage means (memory).

Next, a method for fabricating the optical waveguide W will be described. Exemplary materials for the under-cladding layer 1, the cores 2 and the over-cladding layer 3 of the optical waveguide W include photosensitive resins and thermosetting resins. The optical waveguide W may be fabricated by a method suitable for the materials to be used. First, as shown in FIG. 3A, the sheet-form over-cladding layer 3 is formed as having a uniform thickness. Then, as shown in FIG. 3B, the cores 2 are formed in the predetermined pattern on an upper surface of the over-cladding layer 3 as projecting from the upper surface of the over-cladding layer 3. In turn, as shown in FIG. 3C, the sheet-form under-cladding layer 1 is formed over the upper surface of the over-cladding layer 3 to cover the cores 2. Subsequently, as shown in FIG. 3B, the resulting structure is turned upside down, so that the under-cladding layer 1 is located on a lower side and the over-cladding layer 3 is located on an upper side. Thus, the optical waveguide W is fabricated.

The refractive index of the cores 2 is set greater than the refractive indices of the under-cladding layer 1 and the over-cladding layer 3. The elasticity moduli and the refractive indices are adjusted by controlling the selection of the types of the materials and the formulations of the materials.

The optical waveguide W may have a construction different from that of the aforementioned embodiment. As shown in a sectional view of FIG. 4, the optical waveguide W may be configured such that cores 2 arranged in a predetermined pattern project from a surface of a sheet-form under-cladding layer 1 having a uniform thickness, and a sheet-form over-cladding layer 3 is provided over the surface of the under-cladding layer 1 to cover the cores 2.

As shown in a sectional view of FIG. 5, an elastic layer R such as a rubber layer may be provided on a back surface of the under-cladding layer 1 of the optical waveguide W. In FIG. 5, the elastic layer R is provided on the optical waveguide W shown in the sectional view of FIG. 1B. The elastic layer R may be provided in the same manner as described above on the optical waveguide W shown in the sectional view of FIG. 4. In these cases, even if the under-cladding layer 1, the cores 2 and the over-cladding layer 3 each have lower resilience or are each formed of a material intrinsically having lower resilience, the elasticity of the elastic layer R can compensate for the lower resilience. Therefore, the optical waveguide W can be restored to its original state after the pressing with the input tip portion 10a of the input element 10 (see FIG. 2) is removed. For example, the elastic layer R has a thickness of 20 to 2000 μm, and an elasticity modulus of 0.1 M to 1 GPa.

The input element 10 is merely required to be able to properly press the optical waveguide W as described above, and examples of the input element 10 include a writing implement capable of writing on a paper sheet with ink or the like and a simple rod that is not adapted for writing with ink.

In the aforementioned embodiment, intersecting core portions of the cores 2 arranged in the lattice pattern each continuously extend in four intersecting directions as shown in an enlarged plan view of FIG. 6A, but may be configured in other ways. For example, as shown in FIG. 6B, a part of the intersecting core portion may be discontinuous and separated in one of the intersecting directions from the other part of the intersecting core portion by a gap G. The gap G is filled with the material for the under-cladding layer 1 or the over-cladding layer 3. The gap G has a width d that is greater than 0 (zero) (sufficient to form the gap G) and typically not greater than 20 μm. Similarly, as shown in FIGS. 6C and 6D, two parts of the intersecting core portion may be discontinuous in two of the intersecting directions (in two opposite directions in FIG. 6C, or in two adjacent directions in FIG. 6D) from the other part of the intersecting core portion. Further, as shown in FIG. 6E, three parts of the intersecting core portion may be discontinuous in three of the intersecting directions from the other part of the intersecting core portion. As shown in FIG. 6F, four parts of the intersecting core portion may be discontinuous in all the four intersecting directions from the other part of the intersecting core portion. Further, the cores 2 may be arranged in a lattice pattern including two or more of the aforementioned types of intersecting core portions shown in FIGS. 6A to 6F. In the present invention, the lattice pattern defined by the plurality of linear cores 2 is herein meant to include intersecting core portions some or all of which are configured in any of the aforementioned manners.

Where at least one part of the intersecting core portion is discontinuous in at least one of the intersecting directions from the other part of the intersecting core portion as shown in FIGS. 6B to 6F, intersection light loss can be reduced. In an intersecting core portion continuously extending in all the four intersecting directions, as shown in FIG. 7A, light traveling through a core 2 orthogonally intersecting a specific core 2 extending in one of the intersecting directions (in an upward direction in FIG. 7A) is incident on the intersecting core portion to partly reach a wall surface 2a of the specific core 2, and goes out of the specific core 2 (as indicated by arrows of two-dot-and-dash lines in FIG. 7A) because of greater reflection angles on the wall surface 2a. Similarly, light goes out of a part of the specific core 2 extending in a direction opposite from the aforementioned direction (in a downward direction in FIG. 7A). Where a part of the intersecting core portion is discontinuous in one of the intersecting directions (in an upward direction in FIG. 7B) from the other part of the intersecting core portion in the presence of a gap G, as shown in FIG. 7B, an interface is defined between the gap G and the core 2 and, therefore, the light transmitted through the core 2 in FIG. 7A is partly reflected at smaller reflection angles on the interface without passing through the interface, and continuously travels through the core 2 (as indicated by arrows of two-dot-and-dash lines in FIG. 7B). Therefore, where at least one part of the intersecting core portion is discontinuous in at least one of the intersecting directions from the other part of the intersecting core portion, as described above, the intersection light loss can be reduced. As a result, the pressed position at which the input region is pressed with the pen tip or the like can be detected at a higher detection sensitivity.

Next, inventive examples will be described in conjunction with comparative examples. It should be understood that the invention be not limited to the inventive examples.

Examples

[Under-Cladding Layer Formation Materials and Over-Cladding Layer Formation Materials]

Component (a): Epoxy resin (EP4080E available from ADEKA Corporation)Component (b): Photo-acid generator (CPI101A available from San-Apro Ltd.)

Under-cladding layer formation materials and over-cladding layer formation materials were each prepared by mixing Components (a) and (b).

[Core Formation Materials]

Component (c): Epoxy resin (EHPE3150 available from Daicel Corporation)Component (d): Epoxy resin (KI-3000-4 available from Toto Chemical Industry Co., Ltd.)Component (e): Photo-acid generator (SP170 available from ADEKA Corporation)Component (f): Ethyl lactate (solvent available from Wako Pure Chemical Industries, Ltd.)

Core formation materials were each prepared by mixing Components (c) to (f).

[Fabrication of Optical Waveguides]

Optical waveguides were each fabricated in the following manner. The thicknesses and the elasticity moduli of the over-cladding layer and other members of the optical waveguide thus fabricated are shown below in Table 1. The elasticity moduli were controlled by adjusting the proportions of Components (a) and (b), and Components (c) and (d). The elasticity moduli were measured by means of a viscoelasticity measuring apparatus (RSA3 available from TA Instruments Japan Inc.)

More specifically, an over-cladding layer was first formed on a surface of a glass substrate with the use of the over-cladding layer formation material by a spin coating method.

Then, cores were formed on an upper surface of the over-cladding layer as projecting from the upper surface of the over-cladding layer with the use of the core formation material by a photolithography method.

Subsequently, an under-cladding layer was formed over an upper surface of the over-cladding layer with the use of the under-cladding layer formation material by a spin coating method to cover the cores.

In turn, the over-cladding layer was separated from the glass substrate. Then, the under-cladding layer was bonded to a surface of an aluminum plate with an adhesive agent. Thus, the optical waveguides (see FIG. 1(b)) were each fabricated on the surface of the aluminum plate with the intervention of the adhesive agent.

Comparative Examples

Optical waveguides were each fabricated in substantially the same manner as in Examples, except that the following materials were used as the under-cladding layer formation material and the over-cladding layer formation material, and a material prepared in the same manner as in the Examples was used as the core formation material. The thicknesses and the elasticity moduli of an over-cladding layer and other members of the optical waveguide thus fabricated are shown below in Table 2. The elasticity moduli were controlled by adjusting the proportions of the following components (g) and (h).

[Under-Cladding Layer Formation Materials and Over-Cladding Layer Formation Materials]

Component (g): Epoxy resin (YL7410 available from Mitsubishi Chemical Corporation)Component (h): Epoxy resin (JER1007 available from Mitsubishi Chemical Corporation)Component (i): Photo-acid generator (CPI101A available from San-Apro Ltd.)

Under-cladding layer formation materials and over-cladding layer formation materials were prepared by mixing Components (g) to (i).

[Evaluation of Optical Waveguides]

Characters were written on ten surface portions of the over-cladding layer with a ballpoint pen (having a tip diameter of 0.5 mm) by applying a load shown below in Tables 1 and 2 on the surface portions by a tip of the ballpoint pen. As a result, an optical waveguide free from cracking in the over-cladding layer, the cores and the under-cladding layer was rated as acceptable and marked with “o” in Tables 1 and 2, and an optical waveguide suffering from cracking in any of the over-cladding layer, the cores and the under-cladding layer was rated as unacceptable and marked with “x” in Tables 1 and 2.

	TABLE 1
	Example
	1	2	3	4	5	6	7	8	9
Over-cladding layer
Thickness (μm)	1	5	10	20	75	100	50	100	200
Elasticity modulus (Pa)	0.1 M	0.5 M	1 M	0.5 G	2.5 G	5 G	1 G	5 G	10 G
[Percentage with respect to cores]	[10%]	[50%]	[100%]	[10%]	[50%]	[100%]	[10%]	[50%]	[100%]
Cores
Thickness (μm)	5	50	100
Elasticity modules (Pa)	1 M	5 G	10 G
Under-cladding layer
Thickness (μm)	1	5	10	20	75	100	50	100	200
Elasticity modulus (Pa)	0.1 M	0.5 M	1 M	0.5 G	2.5 G	5 G	1 G	5 G	10 G
[Percentage with respect to cores]	[10%]	[50%]	[100%]	[10%]	[50%]	[100%]	[10%]	[50%]	[100%]
Evaluation
Load: 3 N	∘	∘	∘	∘	∘	∘	∘	∘	∘
Load: 5 N	∘	∘	∘	∘	∘	∘	∘	∘	∘
Load: 8 N	∘	∘	∘	∘	∘	∘	∘	∘	∘
Load: 10 N	∘	∘	∘	∘	∘	∘	∘	∘	∘

	TABLE 2
	Comparative Example
	1	2
Over-cladding layer
	Thickness (μm)	25	100
	Elasticity modulus (Pa)	3 M	0.1 G
	[Percentage with respect to cores]	[0.0015%]	[5%]
Cores
	Thickness (μm)	50
	Elasticity modules (Pa)	2 G
Under-cladding layer
	Thickness (μm)	25	5
	Elasticity modulus (Pa)	3 M	0.1 G
	[Percentage with respect to cores]	[0.0015%]	[5%]
Evaluation
	Load: 3 N	x	x
	Load: 5 N	x	x
	Load: 8 N	x	x
	Load: 10 N	x	x

The results shown above in Tables 1 and 2 indicate that the optical waveguides of Examples 1 to 9 were excellent in cracking resistance to a great pressing force and the optical waveguides of Comparative Examples 1 and 2 were inferior in cracking resistance. Differences in the results are attributable to differences between the elasticity moduli of the under-cladding layer and the over-cladding layer and the elasticity modulus of the cores.

The optical waveguides of Examples 1 to 9 each had a construction as shown in the sectional view of FIG. 1B. Where optical waveguides each having a construction as shown in the sectional view of FIG. 4 were fabricated, evaluation results had substantially the same tendency as in Examples 1 to 9.

In each of Examples 1 to 9, the under-cladding layer and the over-cladding layer had the same elasticity modulus. Where the under-cladding layer and the over-cladding layer had different elasticity moduli within a range of 10 to 100% of the elasticity modulus of the cores, evaluation results had substantially the same tendency as in Examples 1 to 9.

Further, where a rubber layer having a thickness of 20 to 20000 m and an elasticity modulus of 0.1 M to 1 GPa was provided on a lower surface of the under-cladding layer of each of the optical waveguides, evaluation results had substantially the same tendency as in Examples 1 to 9.

While specific forms of the embodiments of the present invention have been shown in the aforementioned inventive examples, the inventive examples are merely illustrative of the invention but not limitative of the invention. It is contemplated that various modifications apparent to those skilled in the art could be made within the scope of the invention.

The inventive input device is free from the cracking of the optical waveguide thereof, and properly functions for its purpose even if the input device is pressed with a great pressing force when information such as a character is inputted by means of an input element such as a pen.

REFERENCE SIGNS LIST

• • W: Optical waveguide
  • 1: Under-cladding layer
  • 2: Cores
  • 3: Over-cladding layer

Claims

1. An input device comprising: a sheet-form optical waveguide including a sheet-form under-cladding layer, a sheet-form over-cladding layer, and a plurality of linear cores arranged in a lattice pattern and held between the under-cladding layer and the over-cladding layer;a light emitting element connected to one-side end faces of the cores of the optical waveguide; anda light receiving element connected to the other-side end faces of the cores;wherein light emitted from the light emitting element is transmitted through the cores of the optical waveguide and received by the light receiving element;wherein a surface portion of the over-cladding layer corresponding to the plurality of linear cores arranged in the lattice pattern is defined as an input region, and a pressed position at which the input region is pressed with an input tip portion of an input element is detected based on light transmission amounts of the cores changed by the pressing; andwherein the under-cladding layer and the over-cladding layer each have an elasticity modulus that is set at 10 to 100% of an elasticity modulus of the cores, whereby the cores are prevented from being cracked when the input region is pressed with the input tip portion.

2. The input device according to claim 1, wherein the elasticity modulus of the cores is set in a range of 1 M to 10 GPa.

3. The input device according to claim 1, wherein the optical waveguide is configured such that the cores are embedded in a surface of the under-cladding layer with top surfaces thereof being flush with the surface of the under-cladding layer, andwherein the over-cladding layer covers the surface of the under-cladding layer and the top surfaces of the cores.

4. The input device according to claim 2, wherein the optical waveguide is configured such that the cores are embedded in a surface of the under-cladding layer with top surfaces thereof being flush with the surface of the under-cladding layer, andwherein the over-cladding layer covers the surface of the under-cladding layer and the top surfaces of the cores.