Input member with capacitive sensor

Information

  • Patent Grant
  • 10262179
  • Patent Number
    10,262,179
  • Date Filed
    Tuesday, May 2, 2017
    7 years ago
  • Date Issued
    Tuesday, April 16, 2019
    6 years ago
Abstract
Input members with capacitive sensors are disclosed. In one embodiment of an electronic button, a first circuit is configured to capture a fingerprint of a user's finger placed on the electronic button, and a second circuit is configured to sense a force applied to the electronic button by the user's finger. The first circuit is further configured to provide temperature information to compensate for temperature sensitivities of the second circuit, and the second circuit is further configured to provide force information to the first circuit.
Description
TECHNICAL FIELD

The present invention relates generally to electronic devices, and, more specifically, to input members with capacitive sensors for use in electronic devices.


BACKGROUND

Electronic devices in use today typically require input from a user in order to, for example, turn the electronic device on or complete some operation. A variety of different mechanisms are in place for receiving input from the user, such as a mechanical button. A mechanical button typically includes a body that is depressed by the user in order to complete an electrical circuit or otherwise trigger a reaction from the device. A restoring force then restores the button back to its original, non-depressed position, until the body is again depressed. Mechanical buttons such as these, however, typically consume a large amount of space in today's ever-slimming electronic devices. Furthermore, mechanical buttons such as these usually allow only for a binary output—indicating that the button is either depressed or is not depressed—and do not provide a smooth, continuous response. Such a smooth, continuous response is usually precluded by the structure of mechanical buttons as the depressed button either completes an electrical circuit or does not complete the circuit.


SUMMARY

In one aspect, an electronic button can include a first circuit configured to capture a fingerprint of a user's finger placed on the electronic button, and a second circuit configured to sense a force applied to the electronic button by the user's finger. In some embodiments, the first circuit is further configured to provide temperature information to compensate for temperature sensitivities of the second circuit, and the second circuit is further configured to provide force information to the first circuit. The first circuit may be configured to determine when to sense a fingerprint based on the force information provided by the second circuit. Additionally or alternatively, the first circuit can be configured to correct the captured fingerprint responsive to the sensed force being greater than a predefined acceptable force for fingerprint capture.


In other embodiments, the temperature information is provided to a third circuit, the third circuit being configured to correct the sensed force using the temperature information.


Additionally or alternatively, a third circuit configured to combine an orientation of the captured fingerprint and the sensed force to provide three dimensional control of an electronic device.


In another aspect, a method of operating an electronic button includes sensing a force applied to the electronic button using a force sensor, and correcting the sensed force using a temperature measurement. A fingerprint sensor is configured to trigger the force sensor to sense the force responsive to human skin being detected by the fingerprint sensor. The force sensor may be further configured to trigger capturing a fingerprint responsive to sensing a predefined level of force applied to the electronic button. In some embodiments, a user is notified when the sensed force exceeds a predefined level of force at which a fingerprint can be properly captured.


In yet another aspect, an electronic device includes an electronic button, where the electronic button includes a rigid body defining a beam and at least one opening adjacent the beam, and a strain gauge coupled to the rigid body. At least one portion of the strain gauge is mounted to the beam and sensitive to strain applied to a longitudinal axis of the beam.


In some embodiments, the electronic device also includes a capacitive fingerprint sensor configured to provide a temperature measurement to correct measurements from the strain gauge.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1A is a front view of an electronic device including an electronic button;



FIG. 1B is a graph showing a continuous response that may be provided by the electronic button of the electronic device of FIG. 1A;



FIG. 2 is a simplified block diagram of the electronic button of the electronic device in FIG. 1A;



FIGS. 3A-3C are simplified flow diagrams illustrating several uses of the electronic button of the electronic device in FIG. 1A;



FIG. 4 is an exploded view of one embodiment of the electronic button of the electronic device in FIG. 1A;



FIG. 5 is a bottom view of the electronic button of the electronic device in FIG. 1A;



FIG. 6A is a cross-sectional view of the electronic button of the electronic device in FIG. 1A, taken along line H-H of FIG. 1A;



FIG. 6B is another cross-sectional view of the electronic button of the electronic device in FIG. 1A, taken along line V-V of FIG. 1A;



FIG. 7 is a simplified schematic view of a strain gauge of the electronic button of the electronic device in FIG. 1A;



FIG. 8 is a simplified schematic view of a capacitive fingerprint sensor of the electronic button of the electronic device in FIG. 1A;



FIG. 9 is an exploded view of a second embodiment of the electronic button of the electronic device in FIG. 1A;



FIG. 10 is a cross-sectional view of the electronic button of the second embodiment of the electronic button shown in FIG. 9;



FIG. 11 is an exploded view of a third embodiment of the electronic button of the electronic device in FIG. 1A;



FIG. 12 is a cross-sectional view of another embodiment of an electronic button; and



FIGS. 13A and 13B are perspective and cross-sectional views of a button assembly.





DETAILED DESCRIPTION

Embodiments of an input member with a capacitive sensor, such as an electronic button, are described herein. FIG. 1A is a front view of an electronic device 100 including one or more electronic buttons 110. The electronic device 100 may be substantially any type of electronic or computing device, such as, but not limited to, a computer, a laptop, a tablet, a smart phone, a digital camera, a printer, a scanner, a copier, or the like. The electronic device 100 may also include one or more components typical of a computing or electronic device, such as, but not limited to, one or more processors, memory components, network interfaces, displays, cameras, and so on.


The electronic button 110 allows a user to interact with the electronic device 100. For example, the electronic button 110 may turn the electronic device 100 on, allow a user to perform some action such as returning to a home screen, and the like. The electronic device 100 may include more than one electronic button 110 in some embodiments, or may include only a single electronic button 110. The electronic device 100 may also include other input mechanisms, such as a mechanical button, multi-touch capacitive sensing display screen, one or more input/output ports, and so forth.


The electronic button 110 may in some embodiments be mechanically decoupled (e.g., isolated) from a housing 103 that surrounds the button 110 on one or more sides of the electronic button 110, or be decoupled from another part of the body of the electronic device 100. In other embodiments, the electronic button 110 may not be mechanically decoupled from the housing 103 or body (e.g., may be mechanically coupled to the housing 103), or may only be partially decoupled from the housing 103 or body. For example, in some embodiments, the housing 103 may be a glass plate, in which case one or more portions of the electronic button 110 may be integral with the glass plate.


As mentioned above, although not explicitly shown in FIG. 1A, the electronic device 100 may include a number of internal components, such as one or more processors, a storage or memory component, an input/output interface, a power source, and one or more sensors. The one or more processors may control operation of the electronic device 100 (including the electronic button 110 as described herein), and may individually or collectively be in communication with substantially all of the components of the electronic device 100. The processor may be any electronic device cable of processing, receiving, and/or transmitting instructions. As described herein, the term “processor” is meant to encompass a single processor or processing unit, multiple processors, or multiple processing units, or other suitably configured computing element.



FIG. 1B illustrates a graph demonstrating the response of an electronic button, such as the electronic button 110 illustrated in FIG. 1A, that has a continuous response to varying levels of force applied to the button. As used herein, continuous refers to a measurement that can take more than two values—for example, a measurement of force that can take one of five, ten, twenty, fifty, a hundred, a thousand, or tens of thousands of different values. The electronic button 110 in FIG. 1A may have a continuous response to applied forces, as compared with a mechanical button, which may only be on or off.



FIG. 2 is a simplified block diagram of one embodiment of the electronic button 110 of the electronic device 100 in FIG. 1A. The electronic button 110 in FIG. 2 includes a first circuit 130 and a second circuit 160. The first circuit 130 may be configured to capture a fingerprint of a user's finger placed on the electronic button 110. The first circuit 130 may include, for example, a capacitive fingerprint sensor. The first circuit 130 may also include one or more temperatures sensors embedded within or positioned external to the first circuit.


The second circuit 160 may be configured to sense a force applied to the electronic button 110 by the user's finger. The second circuit 160 may include, for example, a strain gauge, a capacitive gap sensor, and so forth. In some embodiments, such as when the second circuit 160 is a strain gauge, the second circuit 160 may be susceptible to temperature variations such that the force measurements provided by the second circuit 160 depend not only on the displacement of the electronic button 110, but also on the ambient temperature around the second circuit 160 or on the temperature of the components of the second circuit 160 themselves. The temperature of the components of the second circuit 160 may change in some embodiments as a result of, for example, the heat from a user's finger and/or the heat from the first circuit 130 operating, if the first and second circuits 130, 160 are positioned in proximity to one another.


In some embodiments, and as illustrated in FIG. 2, the first circuit 130 may be configured to provide temperature information to compensate for temperature sensitivities of the second circuit 160. This information may be used by the second circuit 160 to compensate for the temperature dependency of the force measurements. In some examples, the temperature information from the first circuit 130 may be provided to a third circuit (not illustrated in FIG. 2). Such a third circuit may also receive the raw force measurement from the second circuit 160, and may correct such raw force measurements using the temperature information. In other words, while the temperature information from the first circuit 130 may in some examples be provided directly to the second circuit 160 for the second circuit 160 itself to correct for the temperature dependency of the force measurements, in other examples, the temperature information from the first circuit 130 may be combined with the raw force information from the second circuit 160 in a separate, third circuit, such as a processor, to correct for the temperature distortions.


As also illustrated in FIG. 2, the second circuit 160 may be configured to provide force information to the first circuit 130 in some embodiments. The force information from the second circuit 160 may be feedback to the first circuit 130 in order to better understand a fingerprint captured by the first circuit 130. For example, if a user applies a relatively large amount of force to the electronic button 110, the fingerprint captured by the first circuit 130 may be distorted, or otherwise different than if the user had applied a normal amount of force. Similarly, if not enough force is used to press the electronic button 110, the ridges and valleys of the fingerprint may not be properly captured by the fingerprint button 110. The first and second circuits 130, 160, optionally together with a third circuit (not shown), can thus work together to allow a shallower electronic button 110 to be used in an electronic device 100 in place of a conventional mechanical button. The feedback between the first and second circuits 130, 160 of the electronic button 110 enables the cooperation of the first and second circuits 130, 160.


Turning now to FIGS. 3A through 3C, flowcharts are shown illustrating a few examples of how the electronic button 110 may be used in operation.


With reference to FIG. 3A, the electronic button 110 may in some examples be configured to estimate an actual force applied to the electronic button 110. Specifically, the force measurement 302 from the second circuit 160 may be combined with the temperature measurement 304 from the first circuit 130 in order to provide an estimated force 308 with which the electronic button 110 was depressed. Using the estimated force 308, the electronic button 110 may be able to correct a fingerprint captured using the first circuit 130 if, for example, the sensed force 302 is greater than a predefined acceptable force for fingerprint capture, as also explained in more detail below.


In some embodiments, and still with reference to FIG. 3A, the electronic button 110 may be configured to trigger the second circuit 160 to sense the force applied to the electronic button 110 responsive to human skin (e.g., a finger, palm, etc.) being detected by the first circuit 130. In order to conserve power, for example, the second circuit 160 may not continuously measure the force applied to the electronic button 110, but instead may only activate the sensing circuitry of the second circuit 160 if human skin or a finger is detected on the electronic button. In another embodiment, the second circuit 160 may continuously measure the force applied to the electronic button 110, but may signal a “click” to the electronic device 100 only in the event that a human finger or other portion of human skin is detected on the electronic button 110. This may reduce accidental activation of the electronic button 110, particularly when the electronic button 110 is not decoupled from one or more other portions of the electronic device 100, but also when the electronic button is decoupled from one or more other portions of the electronic device 100. This may reduce the likelihood that the electronic button 110 would signal a click activation if a pen in a user's pocket accidentally depresses the button. In still other embodiments, however, the second circuit 160 may continuously measure the force applied to the electronic button 110, and provide the same to the electronic device 100, regardless of whether human skin or a human finger is detected by the first circuit 130.


With reference to FIG. 3B, the electronic button 110 may in some examples be configured to determine when to sense a fingerprint based on the force information provided by the second circuit 160. Specifically, the force measurement 312 from the second circuit 160 may be combined with a finger detection indication 316 from the first circuit 130 to provide an indication 318 that triggers the first circuit 130 to capture the fingerprint of the user. In some examples, a temperature measurement 314 from the first circuit 130 may optionally be used during this process in order to, for example, correct the force measurement 312 provided by the second circuit 160 for temperature distortions.


In one example, if the force measurement 312 from the second circuit 160, as optionally corrected using the temperature measurement 314, is within a range of forces at which a fingerprint can be properly captured, the indication 316 may be provided to the first circuit 130 in order to capture the fingerprint. If, on the other hand, the force measurement 312 from the second circuit 160, as optionally corrected using the temperature measurement 314, is below a predefined level of force, the electronic button 110 may cause the electronic device 100 to request that the user try again, pressing more firmly on the electronic button 110. If, however, the sensed force 312 from the second circuit 160, as optionally corrected using the temperature measurement 314, exceeds a predefined level of force at which a fingerprint can be properly captured, the electronic button 110 may cause the electronic device 100 to request that the user try again, pressing less firmly on the electronic button 110.


In still other examples, the force measurements 312 may be used in other manners. For example, the force measurements 312 may be monitored such that when the force applied to the electronic button 110 is relatively stable (e.g., is not rapidly varying), the indication 318 is given to capture the fingerprint. Alternatively, the force measurement 312 may be used by the electronic button 1110 to compensate for the effect of too much or too little force being used to press the button 110—for example, if too much force is used, and the force measurement 312 reflects this excess, an algorithm may be applied to a fingerprint that is nonetheless captured by the first circuit 130 in order to compensate for the distortions in the captured fingerprint caused by the excess force. If, for example, the excess force causes the ridges of a fingerprint to be more spaced out and the valleys of the fingerprint to be wider, the force measurement 312 representative of the force applied to the electronic button 110 at that time may be used to adjust the width of the valleys and the spacing of the ridges.


In some embodiments, the force sensing accomplished by the second circuit 160 may consume less power and generate less heat than the fingerprint capturing of the first circuit 130, and thus it may be more economical to measure the force applied to the electronic button 110 at a relatively high sample rate, and only capture a fingerprint when a sufficient, but not excessive, force is applied to the electronic button 110. The first circuit 130 may nonetheless operate in a limited fashion, for example it may obtain and provide the temperature measurement 314 in order to adjust the force measurements 312 from the second circuit 1160 during operation, without necessarily activating the components of the first circuit 130 that actually function to capture the fingerprint (e.g., the capacitive sensing aspects of the first circuit 130).


With reference to FIG. 3C, the electronic button 110 may in some examples be configured to provide a 3-dimensional orientation of a user's finger that is used to depress the electronic button 110. Specifically, the force measurement 322 from the second circuit 160 may be combined with a finger detection indication 326 from the first circuit 130 in order to provide the 3-dimensional orientation 328—e.g., the first circuit 130 may provide vertical and horizontal orientation of the finger using the fingerprint ridges and valleys, while the second circuit 160 may provide the depth aspect of the 3-dimensional orientation. The 3-dimensional orientation 328 provided by the electronic button 110 may be used, for example, to control the electronic device 100—such as controlling a character or other object in a game, or otherwise controlling the navigation within the electronic device 100.


With reference now to FIG. 4, an exploded view of one embodiment of an electronic button 110 is shown. The electronic button 110 includes a first circuit 130 and a second circuit 160, similar to those shown in FIG. 2 and described above.


The first circuit 130 includes a cylindrical member 132, which may include sapphire, glass, and so forth. The cylindrical member 132 may include a layer of ink 134 positioned on the bottom of the cylindrical member 132. The first circuit 130 also includes a capacitive fingerprint sensor 138, which may be embodied in a silicon die with circuitry for detecting and capturing a fingerprint, circuitry for sensing human skin, temperature sensors, and so forth.


The electronic button 110 also includes a second circuit 160, which may include a strain gauge 162. The strain gauge 162 may generally define a T-shape, and may in some embodiments include four gauge components 164, 165, 166, 167, as explained in more detail below. The four gauge components 1164, 165, 166, 167 may together form a full-bridge, in order to thermally and electrically match the strain gauge 162.


The electronic button also includes trim 112, which may generally have a ring shape, and may be coupled between the first and second circuits 130, 160. The trim 112 may be a rigid body (comprised, for example, of stainless steel or another hard material), and may define a beam 116 and one or more openings 114, 115 adjacent the beam. As illustrated in FIG. 4, the capacitive fingerprint sensor 138 may be positioned on an opposite side of the trim 112 from the strain gauge 162, as described in more detail below with reference to FIG. 6A, in order to provide thermal insulation and/or electrical shielding between the strain gauge 1162 and the capacitive fingerprint sensor 138.


The electronic button 110 may also include a flex circuit 118 configured to be coupled to the first and second circuits 130, 160, and to route signals from the first and second circuits 130, 160 to a processor or other portion of the electronic device 100.


As illustrated in 4, the electronic button 110 may be mechanically decoupled from a housing 103 surrounding the electronic button 110; however in other embodiments, one or more components of the electronic button 110 (e.g., cylindrical member 132) may be integral with the housing 103 of the electronic device 100.


With reference to FIG. 5, which is a bottom view of the embodiment of an electronic button 110 shown in FIG. 4, the strain gauge 162 of the second circuit 160 may be coupled to the rigid body of the trim 112. More specifically, in one example, an elongated trunk of the T-shaped strain gauge 162 including NE and SE gauge components 164, 165 may be mounted to the beam 1116 of the trim 112. One or more of the NE, SE gauge components 164, 165 may be sensitive to strain applied to a longitudinal axis of the beam. In this example, NE gauge component 1164 may be sensitive to strain applied to the longitudinal axis of the beam, whereas SE gauge component 165 may be sensitive to strain applied to the vertical axis of the beam. Due to their proximity to one another and their common location on the beam 116, the NE gauge component 164 and the SE gauge component 165 may both be subject to similar temperature variations. Thus, the NE gauge component 164 is sensitive to strain applied along the horizontal axis of the beam 116 and also to temperature variations, while the SE gauge component 165 is not sensitive to strain applied along the horizontal axis of the beam 116 but is sensitive to temperature variations. Signals generated by the SE and NE gauge components 164, 165 can thus be combined in order to provide a first level of temperature correction, however the temperature sensors in the first circuit 130 can further be used to compensate for the temperature sensitivities of the strain gauge 162.


Still with reference to FIG. 5, NW and SW gauge components 166, 167 of the strain gauge 162 may also be coupled to the rigid body of the trim 112, but they may not be sensitive to displacement of the electronic button 110. Instead, the NW, SW gauge components 166, 167 may be used to electrically match the NE, SE gauge components 164, 165.


As mentioned above, the trim 112 may include one or more openings 114, 115, which may facilitate communication of signals between the strain gauge 162 and the capacitive fingerprint sensor 138, and also may allow a single flex circuit 118 to be used to route signals from both the strain gauge 162 and the capacitive fingerprint sensor 138 to another location of the electronic device 100, such as a processor. As illustrated for example in FIG. 5, a plurality of through silicon vias (TSVs) 120 of the capacitive fingerprint sensor 138 may be positioned near one of the openings 115 in the trim 112, such that signals E, N, S, W from the strain gauge 162 may be provided to the capacitive fingerprint sensor 138 and also to the flex circuit 118. Signals from the capacitive fingerprint sensor 138 may also be provided to the strain gauge 162 and/or to the flex circuit 118 through the one or more openings 114, 115, as shown in FIG. 5. In other words, the flex circuit 118 may be coupled to the capacitive fingerprint sensor 138 through the opening 115 of the trim 112 and also coupled to the strain gauge 162.


As illustrated in FIG. 5, one or more components of the strain gauge 162 may be adjusted. For example, region 158 in FIG. 5 illustrates a region 158 where one or more strain gauge 162 components can be laser trimmed in order to provide electrical matching between two or more portions of the strain gauge, in order for the strain gauge to properly function as a full bridge with good cancellation. The region 158 may be trimmed after the strain gauge 162 is mounted to the trim 112 in some examples.


As also illustrated in FIG. 5, in some examples, the NW, SW gauge components 1166, 167 may be interdigitated in order to increase the thermal and strain matching.



FIG. 6A illustrates a cross-sectional view of the electronic button 1110 shown in FIGS. 4 and 5, taken along line H-H of FIG. 1A, and FIG. 6B illustrates a cross-sectional view of the electronic button 110 shown in FIGS. 4 and 5, taken along line V-V of FIG. 1A. With reference to both FIGS. 6A and 6B, the cylindrical member 132 and ink layer 134 are coupled to the trim 112 via adhesive 136. The ink layer 134 is also coupled to the capacitive fingerprint sensor 138 through adhesive 140, and the capacitive fingerprint sensor 138 is coupled to the trim 112 through adhesive 142. The strain gauge 162 is coupled to the beam 116 of the trim 112 through adhesive 161. Also, flex circuit 118 is coupled to one or more TSVs of the capacitive fingerprint sensor 138 through adhesive 144, and trim 112 is moveable within housing 103 via shim member 104.


As can be seen in FIGS. 6A and 6B, the trim 112 allows some separation between the capacitive fingerprint sensor 138 and the strain gauge 162. Such separation may provide a thermal buffer and/or an electrostatic shield between the capacitive fingerprint sensor 138 and the strain gauge 162. The trim 112, however, provides stiffness, with the beam 116 dissipating some of the pressure applied to the electronic button 110, and the openings 114, 115 in the trim facilitating communication of signals and measurements between the first and second circuits 130, 160.



FIG. 7 illustrates a full bridge, including all of the NE, SE, SW, NW components 164, 165, 166, 167 of the strain gauge 162. The full bridge strain gauge 162 provides many benefits, including helping eliminate errors due to the flex circuit 118 and wire or trace bond connection resistances. In other embodiments, however, a quarter or half bridge could be used with a single or only two components of a strain gauge 162, in which case the first circuit can still provide temperature correction information in order to correct the temperature dependency of the measurements of force by the strain gauge 162.



FIG. 8 illustrates a top view of a capacitive fingerprint sensor 138 of the first circuit 130, with a plurality of different quadrants 139-A, 139-B, 139-C, 139-D, 139-E, 139-F, 139-G, 139-H, 139-I. In some embodiments, each of the plurality of quadrants 139-A, 139-B, 139-C, 139-D, 139-E, 139-F, 1139-G, 1139-H, 139-I includes one or more temperatures sensors.


The layout of the capacitive fingerprint sensor 138 may be such that its various components are arranged in order to provide a substantially uniform temperature gradient of the capacitive fingerprint sensor adjacent the beam 116 of the trim 112. So, for example, relatively “cool” digital components of the capacitive fingerprint sensor 138 may be positioned in quadrants 1139-F, 1139-G, 139-H, and 139-I so that the temperature gradient along those quadrants is minimized. In another example, the “warm” analog components of the capacitive fingerprint sensor 138 may be evenly distributed among quadrants 139-F, 139-G, 139-H, and 139-I in order to reduce the temperature gradient therealong.


Minimizing the temperature gradient along the NE and SE components 164, 165 of the strain gauge 162 may allow the SE component 165 to better cancel out the thermal dependency of the NE component 164, because both SE, NE components 164, 165 will be subjected to similar thermal conditions. If, on the other hand, quadrants 139-F and 139-G were much warmer or much cooler than quadrants 139-H, 139-I, the effectiveness of the thermal cancelation between the NE and SE components 164, 165 of the strain gauge 162 may be reduced.


As mentioned above, and with reference still to the quadrants 139-A, 139-B, 139-C, 139-D, 139-E, 139-F, 139-G, 139-H, 139-I illustrated in FIG. 8, one or more temperature sensors may be included in each of the quadrants 139-A, 139-B, 139-C, 139-D, 139-E, 139-F, 139-G, 139-H, 139-I in order to, for example, measure and correct for any temperature gradient that nonetheless exists in the capacitive fingerprint sensor 138.


With reference to FIGS. 9 and 10, another embodiment of an electronic button 910 is shown. The electronic button 910 illustrated in FIGS. 9 and 10 is similar to the electronic button 110 shown and described above, except that the strain gauge 962 is mounted directly to the capacitive fingerprint sensor 938.


With reference to FIG. 11, another embodiment of an electronic button 1110 is shown. The electronic button 1110 illustrated in FIG. 11 is similar to the electronic button 110 shown and described above, except that the second circuit 1160 (including the strain gauge, for example) is integrally included within a semiconductor die that also includes capacitive fingerprint sensor 1139. In this manner, a single semiconductor die can include circuitry for performing the functions of both the first and second circuits 130, 160 described above.



FIG. 112 illustrates another embodiment of an electronic button, with a stacked die configuration. It should be appreciated that the embodiment shown in FIG. 12 is oriented such that the exterior surface of the button (or other input element) is at the bottom of the figure.


The sensor circuit 1201 is shown bonded to a control circuit 1203 via bond 1202, which may be an adhesive. The sensor circuit 1201 may likewise be bonded to flex circuit 1208 by an adhesive or the like. As also shown, the sensor circuit may be positioned adjacent the button, which may be generally cylindrical in shape (although this shape is not necessary).


Wire bonding 1206 connects the flex circuit 1208 to the control circuit 1203, and the wire bonding 1206 is encapsulated by rigid encapsulant 1210 and secondary compliant encapsulant 1212 to protect the wire bonding 1206. The wire bonding 1206 is seated underneath locally thinned stiffener 1214 (with respect to the orientation shown in, and a second flex circuit 1218 is positioned between stiffener 1214 and switch 1226. A complaint encapsulant may fill at least a portion of the space between the stiffener 1214 and one or more of the flex 1208, encapsulant 1210, and control circuit 1203. The stiffener may be locally thinned to form a cavity or depression in which the wire bond and/or rigid encapsulant may be at least partially located.



FIG. 13A illustrates a button assembly embodiment, with switch 1326 and trim 1330, and FIG. 13B is a corresponding cross-sectional representation taken along plane P13B in FIG. 13A. FIG. 13B illustrates sensor circuit to flex circuit wire bonds at 1340 and further sensor circuit to control circuit 1303 wire bonds at 1345. The sensor circuit to flex circuit wire bonds 1340 as disclosed in this embodiment carry signals to the underside of the die, where the wires are bonded to the flex circuit 1308 inset from the die perimeter.


The foregoing description has broad application. For example, while examples disclosed herein may focus on a strain gauge type of force sensing circuit, it should be appreciated that the concepts disclosed herein may equally apply to substantially any other type of force sensing circuit with or without appropriate modifications as would be appreciated by one skilled in the art of input members for electronic devices. Moreover, although certain examples have been described with reference to particular figures, it will be understood that other embodiments are also within the scope of this disclosure and the appended claims.


As another example of an alternate embodiment, in some examples a force concentrator may be coupled between the capacitive fingerprint sensor and the strain gauge, and may translate motion of the fingerprint sensor into deflection of the strain gauge, thereby indirectly causing strain. In this manner, strain can be applied in a localized area, which can allow for a very small strain gauge to be used, which may be more accurate and sensitive than a relatively larger strain gauge. This also may allow for thermal separation (e.g., air) between the capacitive fingerprint sensor and the strain gauge.


Accordingly, the discussion of any embodiment is meant only to be exemplary and is not intended to suggest that the scope of the disclosure, including the claims, is limited to these examples.

Claims
  • 1. A method of operating an electronic button, comprising: sensing, using a force sensor, a force applied to a surface of the electronic button; andcorrecting the sensed force using a temperature measurement;wherein a biometric sensor is configured to trigger the force sensor to sense the force responsive to human skin being detected by the biometric sensor.
  • 2. The method of claim 1, wherein the sensed force takes one of a plurality of values, thereby representing a continuous measurement of force.
  • 3. The method of claim 1, further comprising: determining that the sensed force exceeds a predefined level of force; andtriggering capture of a biometric by the biometric sensor when the sensed force is determined to exceed the predefined level of force.
  • 4. The method of claim 3, further comprising: notifying a user when the sensed force exceeds the predefined level of force.
  • 5. The method of claim 1, further comprising: concentrating force using a force concentrator coupled between the biometric sensor and the force sensor; andtranslating motion of the biometric sensor into deflection of the force sensor using the force concentrator.
  • 6. An electronic button, comprising: a first circuit configured to sense a force applied to a surface of the electronic button;a second circuit configured to capture a biometric on the surface of the electronic button; anda third circuit configured to combine an orientation of the captured biometric and the sensed force to provide three dimensional control of an electronic device.
  • 7. The electronic button of claim 6, wherein the second circuit is configured to capture the biometric responsive to the sensed force being greater than a predefined force for biometric capture.
  • 8. The electronic button of claim 6, wherein the first circuit comprises a strain gauge and the second circuit comprises a capacitive biometric sensor.
  • 9. The electronic button of claim 6, wherein the electronic button is mechanically decoupled from a housing surrounding the electronic button.
  • 10. The electronic button of claim 6, wherein the second circuit is mounted directly on the first circuit.
  • 11. The electronic button of claim 6, wherein the second circuit is integrally included within a semiconductor die that also includes the first circuit.
  • 12. A method of operating an electronic button, comprising: sensing, using a force sensor, a force applied to a surface of the electronic button; andcapturing, using a biometric sensor, a biometric on the surface of the electronic button; andcombining an orientation of the captured biometric and the sensed force to provide three dimensional control of an electronic device.
  • 13. The method of claim 12, wherein the biometric sensor is configured to trigger the force sensor to sense the force responsive to human skin being detected by the biometric sensor.
  • 14. The method of claim 12, further comprising determining, by a processor of the electronic button, whether the sensed force is within a range of forces at which the biometric can properly be captured.
  • 15. The method of claim 12, wherein: sensing the force occurs over a period of time, resulting in two or more force values; andthe method further comprises determining, by a processor of the electronic button, whether the two or more force values indicate that the force applied to the surface of the electronic button is stable over the period of time.
  • 16. The method of claim 15, wherein capturing the biometric occurs responsive to determining that the two or more force values indicate that the force applied to the surface of the electronic button is stable over the period of time.
  • 17. The method of claim 12, wherein the force sensor is further configured to trigger capturing a biometric responsive to sensing a predefined level of force applied to the surface of the electronic button.
  • 18. The method of claim 12, further comprising adjusting, by a processor of the electronic button, the captured biometric based on the sensed force.
  • 19. The electronic device of claim 6, wherein the first circuit is further configured to provide force information to the second circuit, and the second circuit is further configured to determine when to capture a biometric based on the force information provided by the first circuit.
  • 20. The electronic device of claim 12, wherein the biometric sensor is configured to capture the biometric responsive to sensing the force.
CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No. 14/340,138, filed Jul. 24, 2014, and entitled “Input Member with Capacitive Sensor,” which claims the benefit under 35 U.S.C. § 119(e) of U.S. Provisional Patent Application No. 61/858,606, filed Jul. 25, 2013, entitled “Input Member with Capacitive Sensor,” the contents of which are incorporated herein by reference as if fully disclosed herein.

US Referenced Citations (171)
Number Name Date Kind
4527862 Arakawa Jul 1985 A
5343064 Spangler et al. Aug 1994 A
5929517 Distefano et al. Jul 1999 A
6002389 Kasser Dec 1999 A
6079282 Lanter Jun 2000 A
6154580 Kuriyama et al. Nov 2000 A
6323846 Westerman et al. Nov 2001 B1
6545495 Warmack et al. Apr 2003 B2
6568275 Scholz et al. May 2003 B2
6570557 Westerman et al. May 2003 B1
6570707 Murakami May 2003 B1
6676611 Bromba Jan 2004 B1
6677932 Westerman Jan 2004 B1
6933031 Ohta et al. Aug 2005 B2
6989728 Van Zeeland et al. Jan 2006 B2
7158122 Roberts Jan 2007 B2
7211885 Nordal et al. May 2007 B2
7337085 Soss Feb 2008 B2
7409876 Ganapathi et al. Aug 2008 B2
7511702 Hotelling Mar 2009 B2
7538760 Hotelling et al. May 2009 B2
7609178 Son et al. Oct 2009 B2
7719522 Lyon et al. May 2010 B2
7784366 Daverman et al. Aug 2010 B2
7800592 Kerr et al. Sep 2010 B2
7920134 Krah Apr 2011 B2
7920225 Nishikawa et al. Apr 2011 B2
7946758 Mooring May 2011 B2
8072437 Miller et al. Dec 2011 B2
8111248 Lee et al. Feb 2012 B2
8169332 Bernstein et al. May 2012 B2
8169416 Han May 2012 B2
8228306 Long Jul 2012 B2
8253711 Kim et al. Aug 2012 B2
8274495 Lee Sep 2012 B2
8289290 Klinghult Oct 2012 B2
8334849 Murphy et al. Dec 2012 B2
8351993 Nunes Jan 2013 B2
8390481 Pance et al. Mar 2013 B2
8421978 Wang et al. Apr 2013 B2
8436823 Kanehira et al. May 2013 B2
8525797 Liu et al. Sep 2013 B2
8547350 Anglin et al. Oct 2013 B2
8577289 Schlub et al. Nov 2013 B2
8577644 Ksondzyk et al. Nov 2013 B1
8633916 Bernstein et al. Jan 2014 B2
8638316 Badaye et al. Jan 2014 B2
8669963 Baker et al. Mar 2014 B2
8704787 Yamamoto et al. Apr 2014 B2
8711122 Wada et al. Apr 2014 B2
8724861 Sun May 2014 B1
8743083 Zanone et al. Jun 2014 B2
8760413 Peterson et al. Jun 2014 B2
8780055 Marchand et al. Jul 2014 B2
8780062 Hibara et al. Jul 2014 B2
8780075 Yamano et al. Jul 2014 B2
8810521 Ito Aug 2014 B2
8830205 Chang et al. Sep 2014 B2
8913031 Honda et al. Dec 2014 B2
8922523 Lynch et al. Dec 2014 B2
8963874 Li et al. Feb 2015 B2
8970507 Holbein et al. Mar 2015 B2
9001080 Okayama et al. Apr 2015 B2
9007331 Sobel et al. Apr 2015 B2
9024898 Kim et al. May 2015 B2
9024907 Bolender May 2015 B2
9030440 Pope et al. May 2015 B2
9057653 Schediwy et al. Jun 2015 B2
9086768 Elias et al. Jul 2015 B2
9088282 Holenarsipur et al. Jul 2015 B2
9092129 Abdo et al. Jul 2015 B2
9104898 Case Aug 2015 B2
9116569 Stacy et al. Aug 2015 B2
9207134 Ting et al. Dec 2015 B2
9229587 Kawaguchi et al. Jan 2016 B2
9235645 Ishizone et al. Jan 2016 B1
9262002 Momeyer et al. Feb 2016 B2
9354752 Kanehira et al. May 2016 B2
9375874 Lin et al. Jun 2016 B2
9390308 Mankowski et al. Jul 2016 B2
9411457 Perlin et al. Aug 2016 B2
9411458 Worfolk et al. Aug 2016 B2
9430102 Prest et al. Aug 2016 B2
9454268 Badaye et al. Sep 2016 B2
9459738 Lin et al. Oct 2016 B2
9477342 Daverman et al. Oct 2016 B2
9490804 Hanumanthaiah et al. Nov 2016 B2
9494473 Hanson et al. Nov 2016 B2
9535518 Kang et al. Jan 2017 B2
9541578 Shimata et al. Jan 2017 B2
9542589 Thammasouk et al. Jan 2017 B2
9671889 Miller et al. Jun 2017 B1
9678586 Reynolds Jun 2017 B2
9710095 Hotelling Jul 2017 B2
9715301 Kuboyama et al. Jul 2017 B2
9772245 Besling et al. Sep 2017 B2
9851828 Richards et al. Dec 2017 B2
9910529 Chang et al. Mar 2018 B2
20060197753 Hotelling Sep 2006 A1
20070272919 Mori et al. Nov 2007 A1
20080150901 Lowles et al. Jun 2008 A1
20080309622 Krah Dec 2008 A1
20090015564 Ye et al. Jan 2009 A1
20090066345 Klauk et al. Mar 2009 A1
20090237374 Li et al. Sep 2009 A1
20100045628 Gettemy et al. Feb 2010 A1
20100117989 Chang May 2010 A1
20100123686 Klinghult et al. May 2010 A1
20100220065 Ma Sep 2010 A1
20110012845 Rothkopf et al. Jan 2011 A1
20110037706 Pasquero et al. Feb 2011 A1
20110080373 Wang et al. Apr 2011 A1
20110096013 Krumpelman et al. Apr 2011 A1
20110216016 Rosener Sep 2011 A1
20110227872 Huska et al. Sep 2011 A1
20110235156 Kothari et al. Sep 2011 A1
20120038577 Brown et al. Feb 2012 A1
20120056826 Kim et al. Mar 2012 A1
20120086669 Kim et al. Apr 2012 A1
20120089348 Perlin et al. Apr 2012 A1
20120090757 Buchan et al. Apr 2012 A1
20120092285 Osborn et al. Apr 2012 A1
20120098760 Chuang Apr 2012 A1
20120098767 Takai et al. Apr 2012 A1
20120104097 Moran et al. May 2012 A1
20120169612 Alameh et al. Jul 2012 A1
20120188202 Tsujino et al. Jul 2012 A1
20120229417 Badaye et al. Sep 2012 A1
20120274602 Bita et al. Nov 2012 A1
20120313863 Hsu Dec 2012 A1
20120319987 Woo Dec 2012 A1
20130076375 Hanumanthaiah et al. Mar 2013 A1
20130113732 Kang et al. May 2013 A1
20130128416 Weber May 2013 A1
20130176270 Cattivelli et al. Jul 2013 A1
20130285973 Elias et al. Oct 2013 A1
20130328575 Ra et al. Dec 2013 A1
20140085213 Huppi et al. Mar 2014 A1
20140085247 Leung et al. Mar 2014 A1
20140111953 McClure et al. Apr 2014 A1
20140152621 Okayama et al. Jun 2014 A1
20140176332 Alameh Jun 2014 A1
20150071509 Myers Mar 2015 A1
20150135108 Pope et al. May 2015 A1
20150153829 Shiraishi Jun 2015 A1
20150185909 Gecnuk Jul 2015 A1
20150185946 Fourie Jul 2015 A1
20150370376 Harley et al. Dec 2015 A1
20150370396 Ogata et al. Dec 2015 A1
20160033342 Lyon et al. Feb 2016 A1
20160034088 Richards et al. Feb 2016 A1
20160041648 Richards Feb 2016 A1
20160042166 Kang Feb 2016 A1
20160062498 Huppi et al. Mar 2016 A1
20160070404 Kerr et al. Mar 2016 A1
20160098131 Ogata et al. Apr 2016 A1
20160103542 Ogata et al. Apr 2016 A1
20160103544 Filiz et al. Apr 2016 A1
20160139716 Filiz et al. May 2016 A1
20160258981 Bushnell et al. Sep 2016 A1
20160314334 He et al. Oct 2016 A1
20160378255 Butler et al. Dec 2016 A1
20170038877 Kuboyama et al. Feb 2017 A1
20170046008 Chen et al. Feb 2017 A1
20170285746 Kim et al. Oct 2017 A1
20170322660 Kuboyama et al. Nov 2017 A1
20180048058 Ehman et al. Feb 2018 A1
20180069588 Jiang et al. Mar 2018 A1
20180088702 Shutzberg et al. Mar 2018 A1
20180138102 Pan et al. May 2018 A1
20180275811 Filiz et al. Sep 2018 A1
Foreign Referenced Citations (59)
Number Date Country
1502166 Jun 2004 CN
1577385 Feb 2005 CN
1582453 Feb 2005 CN
1707415 Dec 2005 CN
1714336 Dec 2005 CN
101046720 Oct 2007 CN
101207971 Jun 2008 CN
101427468 May 2009 CN
101673001 Mar 2010 CN
101950224 Jan 2011 CN
102016780 Apr 2011 CN
201828892 May 2011 CN
102103445 Jun 2011 CN
102138120 Jul 2011 CN
102193699 Sep 2011 CN
102299166 Dec 2011 CN
102365608 Feb 2012 CN
102449583 May 2012 CN
102467308 May 2012 CN
102483673 May 2012 CN
103221906 Jul 2013 CN
204650590 Sep 2015 CN
2073107 Jun 2009 EP
2128747 Dec 2009 EP
2237142 Oct 2010 EP
2267791 Dec 2010 EP
2315102 Apr 2011 EP
2315186 Apr 2011 EP
2357547 Aug 2011 EP
2413224 Feb 2012 EP
2418561 Feb 2012 EP
2420918 Feb 2012 EP
2508960 Oct 2012 EP
2660688 Nov 2013 EP
2708985 Mar 2014 EP
2313195 Nov 1997 GB
S61292732 Dec 1986 JP
2005031425 Feb 2005 JP
2007310539 Nov 2007 JP
2010225031 Oct 2010 JP
2010244252 Oct 2010 JP
2011100364 May 2011 JP
2011134000 Jul 2011 JP
2011197991 Oct 2011 JP
2012064108 Mar 2012 JP
2014052997 Mar 2014 JP
1020070110114 Nov 2007 KR
1020100074005 Jul 2010 KR
WO 97018528 May 1997 WO
WO 11081882 Jul 2011 WO
WO 11156447 Dec 2011 WO
WO 12031564 Mar 2012 WO
WO 12147659 Nov 2012 WO
WO 12160844 Nov 2012 WO
WO 13083207 Jun 2013 WO
WO 13183191 Dec 2013 WO
WO 14018121 Jan 2014 WO
WO 12153555 Jul 2014 WO
WO 14124173 Aug 2014 WO
Non-Patent Literature Citations (4)
Entry
Bau, et al., “TeslaTouch: Electrovibration for Touch Surfaces,” UIST'10, Oct. 3-6, 2010, New York, New York USA, 10 pages.
Engineers Edge, Common Plastic Molding Design Material Specification, 2015, http://www.engineersedge.com/plastic/materials_common_plastic.htm, 3 pages.
Feist, “Samsung snags patent for new pressure sensitive touchscreens,” posted on AndroidAuthority.com at URL: http://www.androidauthority.com/samsung-patent-pressure-sensitive-touchscreens-354860, Mar. 7, 2014, 1 page.
Widdle, “Measurement of the Poisson's ratio of flexible polyurethane foam and its influence on a uniaxial compression model,” International Journal of Engineering Science, vol. 46, 2008, pp. 31-49.
Related Publications (1)
Number Date Country
20170235403 A1 Aug 2017 US
Provisional Applications (1)
Number Date Country
61858606 Jul 2013 US
Continuations (1)
Number Date Country
Parent 14340138 Jul 2014 US
Child 15585074 US