1. Field of the Invention
The present invention relates to an insert molding method and an insert molding device.
2. Description of the Related Art
Conventionally, for example according to Japanese Patent No. 3, 962, 295, there is known a method of forming an electronic substrate sealed with a resin by an insert injection molding.
In the insert injection molding method mentioned above, a metallic mold which forms a cavity between a front cavity and a rear cavity is used, and the electronic substrate as an inserted object is retained by retaining pins, that are provided so as to freely advance into and retreat from the cavity. After primarily injecting a molten resin into the cavity, a resin-sealed electronic substrate as an insert molded article is obtained, by retreating the retaining pins from the cavity.
However, by doing so, resin-lacking spaces (pin traces) are generated in the insert molded article, at the traces after the retaining pins are retreated from the cavity, so that there is an inconvenience that the pin traces must be filled by secondarily injecting the molten resin into those spaces.
In view of such circumstances, an object of the present invention is to provide an insert molding method and device which do not require secondary injection of the molten resin.
In order to achieve the above object, the present invention provides an insert molding method comprising: a process of retaining, in a metallic mold which forms a cavity between a front cavity and a rear cavity, an inserted object to a predetermined position in the cavity, by advancing into the cavity a retaining pin provided so as to freely advance into and retreat from the cavity; a process of making a molten resin flow inside the cavity, in the state where the inserted object is retained by the retaining pin; a process of detecting a positional relationship between a flow front of the molten resin within the cavity and the retaining pin; and a process of retreating the retaining pin from within the cavity, when it is detected that the flow front is at the position within a predetermined range with respect to the retaining pin.
According to the insert molding method of the present invention, first, the inserted object is arranged at the predetermined position inside the cavity formed between the front cavity and the rear cavity. Here, the inserted object arranged inside the cavity is retained by making the retaining pins provided so as to freely advance into and retreat from the cavity to advance into the cavity.
Next, the molten resin is made to flow inside the cavity. As a method of making the molten resin flow, for example, a method of making the resin flow by injecting the molten resin into the cavity from outside the metallic mold in the state where the metallic mold is closed, a method of making the resin flow by pressurizing the molten resin by closing the metallic mold in the state where the molten resin is preliminarily arranged inside the cavity, may be given.
Next, the positional relationship between the flow front of the molten resin flowing inside the cavity and the retaining pin is detected. The detection of the positional relationship between the flow front of the molten resin and the retaining pin may be carried out by providing, for example, sensors such as a pressure sensor or a temperature sensor. The sensor may be provided at a position facing the cavity at an upstream side of the flow of the molten resin by a predetermined distance from the position where the retaining pin retains the inserted object, or may be buried inside the metallic mold as long as it is capable of detecting the flow front of the molten resin.
Thereafter, when it is detected by the sensor that the flow front of the molten resin has reached the position within a predetermined range with respect to the retaining pin, the retaining pin is retreated from inside the cavity. As a result, the flowing molten resin is filled into the portion where the retaining pin had been positioned, so that it is possible to prevent occurrence of a space without resin (pin trace) formed at the trace where the retaining pin is retreated from the cavity, in the obtained insert molded article. Therefore, according to the insert molding method of the present invention, it becomes possible to make the secondary injection of the molten resin unnecessary.
Moreover, when a plurality of the retaining pins are provided, the sensors in a same number thereto may be provided in a corresponding manner to each retaining pin, or one sensor may be provided in a corresponding manner to the retaining pin positioned at a most upstream side in a flowing direction of the molten resin.
When only one sensor is provided to a plurality of the retaining pins, for example, a flow speed of the molten resin is calculated from the volume of the molten resin flowing inside the cavity and the capacity of the cavity. Then, when it is detected by the sensor that the flow front of the molten resin has reached the position within a predetermined range from the retaining pin at the most upstream side of the flow of the molten resin, the retaining pins may be sequentially retreated along the flow from the one positioned at the most upstream side of the flow of the molten resin, on the basis of the calculated flow speed of the molten resin.
The insert molding method of the present invention may be implemented advantageously by an insert molding device equipped with a metallic mold which forms a cavity between a front cavity and a rear cavity, and a retaining pin provided so as to freely advance into and retreat from the cavity for retaining an inserted object to a predetermined position of the cavity by advancing into the cavity, comprising; a flow front position detecting means which is provided so as to be capable of detecting a positional relationship between a flow front of a molten resin flowing inside the cavity and the retaining pin; and an advance/retreat controlling means which controls advancing and retreating of the retaining pin into and from the cavity, and which retreats the retaining pin from within the cavity, when it is detected by the flow front position detecting means that the flow front is at a position within a predetermined range with respect to the retaining pin.
A configuration of an insert molding device 1 according to a first embodiment of the present invention will be now described in detail with reference to
As shown in
The front cavity 3 is provided with a runner 7 which communicates with the cavity 5 via a gate 6 provided at the lower part of the cavity 5. The runner 7 communicates with a molten resin injection nozzle not shown. Further, the front cavity 3 is equipped with retaining pins 8a, 8b, and 8c that are provided so as to freely advance into and retreat from the cavity 5. Here, the retaining pin 8a is provided closest to the gate 6, the retaining pin 8c is provided farthest from the gate 6, and the retaining pin 8b is provided at the intermediate position between the retaining pins 8a and 8c.
The insert molding device 1 is equipped with retaining pin driving units 9a, 9b, and 9c for advancing and retreating the retaining pins 8a, 8b, and 8c into and from the cavity 5. The retaining pin driving units 9a, 9b, and 9c are electrically connected to a retaining pin controlling means 10. As the retaining pin driving units 9a, 9b, and 9c, for example, a servomotor or a hydraulic motor (not shown) may be used. The retaining pin controlling means 10 is equipped with, for example, a CPU, a RAM, a ROM or the like, and controls advancing and retreating of the retaining pins 8a, 8b, and 8c into and from the cavity 5.
The rear cavity 4 is equipped with a pressure sensor 11 at a wall departing from the wall coming into contact with the retaining pin 8a by a predetermined distance towards the gate 6 side. The pressure sensor 11 is provided so as to expose a sensor portion 11a at a position facing the cavity 5. The pressure sensor 11 operates as a flow front position detecting means which detects a flow front of molten resin R. The pressure sensor 11 is electrically connected to the retaining pin controlling means 10.
Next, an injection molding method of the present embodiment using the insert molding device 1 will be explained below with reference to
First, as is shown in
Next, as is shown in
When the retaining pin controlling means 10 receives the detection signal, as is shown in
After the cavity 5 is filled with the molten resin R, and the molten resin R is cooled and solidified, an insert molded article 12 is demolded and taken out from the metallic mold, by opening the rear cavity 4 and the front cavity 3, as is shown in
As is explained above, in the insert molding device 1, when the flow front of the molten resin R is detected by the pressure sensor 11, the retaining pin controlling means 10 controls respective retaining pins 8a, 8b, and 8c to which the distance to the flow front reached the predetermined distance range to sequentially retreat into the front cavity 3. By doing so, traces of the retaining pins 8a, 8b, and 8c, which retained the inserted object 2, are filled with the molten resin R, so that it is possible to obtain the insert molded article 12 without resin-lacking spaces (without pin traces). Therefore, according to the injection molding method of the present embodiment, it becomes possible to eliminate the need for a secondary injection of the molten resin R.
When trying to obtain a comparatively large inserted molded article 12 in the insert molding device 1 of the first embodiment, pin holes 13a, 13b, and 13c within which the retaining pins 8a, 8b, and 8c move may be provided so as to communicate with runners 14a, 14b, and 14c, as is shown in
Next, an insert molding device 21 of a second embodiment of the present invention will be explained with reference to
First, with reference to
In order to perform press molding mentioned above, as is shown in
The insert molding device 21 performs press molding by placing the pre-heated and melted resin R in the cavity 24, closing the mold 22 and mold 23, pressurizing the resin R and making the resin R flow.
The mold 22 is equipped with the retaining pins 8a, 8b, and 8c, and the retaining pin driving units 9a, 9b, and 9c, and the retaining pin driving units 9a, 9b, and 9c are electrically connected to the retaining pin controlling means 10. As the retaining pin driving units 9a, 9b, and 9c, for example, a servomotor (not shown) may be used. The retaining pin controlling means 10 is equipped with, for example, a CPU, a RAM, a ROM and the like, and controls advancing and retreating of the retaining pins 8a, 8b, and 8c into and from the cavity 24.
The mold 23 is equipped with the pressure sensor 11 at a wall departing from the wall coming into contact with the retaining pin 8a by a predetermined distance in the upstream side of the flow of the resin R. The pressure sensor 11 is provided so as to expose the sensor portion 11a at a position facing the cavity 24. The pressure sensor 11 operates as the flow front position detecting means which detects the flow front of the resin R flowing inside the cavity 24. The pressure sensor 11 is electrically connected to the retaining pin controlling means 10.
Next, a press molding method of the present embodiment using the insert molding device 21 will be explained below with reference to
First, as is shown in
Here, in the insert molding device 21, the resin R is pressurized and made to flow inside the cavity 24, by closing the mold 22 and the mold 23. Thereafter, when the flow front of the resin R reaches the position of the sensor portion 11a of the pressure sensor 11, the pressure sensor 11 transmits the detection signal thereof to the retaining pin controlling means 10.
When the retaining pin controlling means 10 receives the detection signal, as is shown in
After the melted resin R is filled all over the cavity 24, the insert molding device 21 holds the resin R at a pressurized state. Thereafter, when the resin R is cooled and solidified, an insert molded article 25 is demolded and taken out from the metallic mold, by opening the mold 23 and the mold 22, as is shown in
As is explained above, when the flow front of the melted resin R is detected by the pressure sensor 11, the retaining pin controlling means 10 controls respective retaining pins 8a, 8b, and 8c to which the distance to the flow front reached the predetermined distance to sequentially retreat into the mold 22. By doing so, traces of the retaining pins 8a, 8b, and 8c, which retained the inserted object 2, are filled with the melted resin R, so that it is possible to obtain the insert molded article 25 without resin-lacking spaces (without pin traces). Therefore, according to the injection molding method of the present embodiment, it becomes possible to eliminate the need for the resin that is secondarily filled to the pin traces during the post treatment.
According to the insert molding device 21 of the present embodiment, the resin R preliminarily heated and melted is arranged inside the cavity 24, and the resin R is pressurized and made to flow, by closing the mold 22 and the mold 23. However, in place thereof, the mold 22 and the mold 23 may be provided with a metallic mold heating means, and the solid resin R arranged inside the cavity 24 may be made to flow by heating and melting the solid resin R with the metallic mold heating means.
In the insert molding devices 1 and 21 of the respective embodiments, three retaining pins 8 are provided. However, the present invention is not limited thereto, and the retaining pins 8 may be in any number as long as it is capable of appropriately retaining the inserted object 2.
Further, in the insert molding devices 1 and 21 of the respective embodiments, one pressure sensor 11 is provided as the flow front position detecting means. However, the present invention is not limited thereto, and the pressure sensor 11 may be provided one each to the position in the vicinity of each retaining pins 8a, 8b, and 8c. Still further, the flow front position detecting means may be other sensor, such as a temperature sensor.
Number | Date | Country | Kind |
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2009-84848 | Mar 2009 | JP | national |