Instrument for transferring boats for thermal treatment of semiconductor wafers

Information

  • Patent Grant
  • D323173
  • Patent Number
    D323,173
  • Date Filed
    Wednesday, January 25, 1989
    35 years ago
  • Date Issued
    Tuesday, January 14, 1992
    32 years ago
  • US Classifications
    Field of Search
    • US
    • D15 144
    • D15 199
    • 219 390
    • 219 411
    • 414 222
    • 414 225
    • 414 226
    • 414 433
    • 432 6
    • 432 33
    • 432 153
    • 432 239
    • 432 253
    • 432 258-261
    • Term of Grant
      14Years
Abstract
Description
Claims
  • The ornamental design for an instrument for transferring boats for thermal treatment of semiconductor wafers, as shown and described.
Priority Claims (1)
Number Date Country Kind
63-29831 Jul 1988 JPX
US Referenced Citations (3)
Number Name Date Kind
D210208 Frelin Feb 1968
3961877 Johnson Jun 1976
4041278 Boah Aug 1977