Instrument module

Information

  • Patent Grant
  • D804681
  • Patent Number
    D804,681
  • Date Filed
    Monday, June 27, 2016
    8 years ago
  • Date Issued
    Tuesday, December 5, 2017
    6 years ago
  • US Classifications
    Field of Search
    • US
    • D24 216
    • D24 111
    • D24 127
    • D24 107
    • D24 169
    • D24 186
    • D24 217
    • D24 219
    • D24 223-224
    • D24 231-234
    • D10 46
    • D10 70
    • D10 81
    • D10 97
    • 422 001000
    • 422 062-065
    • 422 067000
    • 422 068100
    • 422 070000
    • 422 081000
    • 422 129000
    • 422 500000
    • 422 506000
    • 422 561000
    • 422 FOR0106
    • 435 287100
    • 435 287300
    • 436 043000
    • 436 045000
    • 436 047000
    • 600 300000
    • 600 301000
    • 600 368000
    • 600 372000
    • 600 481000
    • 600 529000
    • 600 544000
    • 600 554000
    • 600 561000
    • 607 004000
    • 607 005000
    • 607 009000
    • 607 030000
    • CPC
    • G01R31/31907
    • B04B13/00
    • B04B15/00
    • B04B2005/0435
    • B04B5/0421
    • A61B5/157
    • G06F19/366
    • B01D21/262
  • International Classifications
    • 2401
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a front perspective view of an instrument module in accordance with an embodiment;



FIG. 2 is a rear perspective view of an instrument module in accordance with an embodiment;



FIG. 3 is a front elevational view of an instrument module in accordance with an embodiment;



FIG. 4 is a rear elevational view of an instrument module in accordance with an embodiment;



FIG. 5 is a left side elevational view of an instrument module in accordance with an embodiment;



FIG. 6 is a right side elevational view of an instrument module in accordance with an embodiment;



FIG. 7 is a top view of an instrument module in accordance with an embodiment; and,



FIG. 8 is a bottom view of an instrument module in accordance with an embodiment.


The broken lines shown in the figures represent portions of the instrument module that form no part of the claimed design.


Claims
  • The ornamental design for an instrument module, as shown and described.
US Referenced Citations (7)
Number Name Date Kind
D645367 Hayashi Sep 2011 S
D669189 Liu Oct 2012 S
D676143 Liu Feb 2013 S
D676568 Liu Feb 2013 S
D685483 Licalzi Jul 2013 S
D735878 Chang Aug 2015 S
D738243 Selberg Sep 2015 S