1. Field of the Invention
This invention generally relates to electrical connectors and, in particular, to insulation displacement connectors for surfaces mounted on a printed circuit board (PCB).
2. Description of the Related Art
An insulation displacement connector (IDC) forms a connection with an insulated conductor, such as a wire, by using a contact that can pierce the insulation to make contact with and connect to the conductor. IDCs are used extensively in the telecommunications industry because they can very quickly terminate a large number of wires. For the same reason, IDCs are now increasingly used on printed circuit boards (PCBs).
Insulation displacement connectors have become popular because they are highly economical and a cost-effective method for performing wire terminations. No wire or cable preparation is required. IDCs are designed to reduce wire termination cost by elimination the need to remove the insulation from the wire before terminating it. When a wire is inserted into the IDC slot, the piercing contacts cut and displace the wire insulation and pierce it and make contact with the conductor wires surrounded by the insulation.
Many designs for IDCs are known in the art. However, these known IDCs are unsuitable for use with surface mounting technology (SMT). SMT generally requires that an electrical contact be compact in size and light in weight and have a small footprint. The electrical contact must also be heat resistant and compatible with common soldering techniques used in SMT. In addition, since the most common pickup mechanism is a vacuum nozzle of a pick-and-place machine, it is desirable that electrical contacts for surface mounting have at least on suitable flat surface to which a vacuum nozzle can abut against and apply a sufficient vacuum for effective pickup.
It is an object of the present invention to provide an insulation displacement connector for surface mounting on a printed circuit board using an automatic pick-and-place machine.
It is also an object of the present invention to provide such an insulation displacement connector that is compact in size with a small footprint for surface mounting on a printed circuit board.
It is another object of the present invention to provide such an insulation displacement connector that is light in weight for surface mounting on a printed circuit board.
It is a further object of the present invention to provide such an insulation displacement connector that is heat resistant for surface mounting on a printed circuit board.
It is yet another object of the present invention to provide such an insulation displacement connector for surface mounting on a printed circuit board that is compatible with common soldering techniques.
It is an additional object of the present invention to provide such an insulation displacement connector for surface mounting on a printed circuit board that has at least one sufficiently large, flat surface to which a vacuum nozzle can affix itself.
It is still another object of the present invention to provide an insulation displacement connector that can make a connection with insulated multiple fine wire conductors in a short time with minimal labor.
These and other objects are achieved by an insulation displacement connector (IDC) assembly according to the present invention. The IDC assembly has a main body defining at least one wire channel. In addition, the main body has at least one substantially flat surface to which a vacuum nozzle may be affixed in order to pick up the IDC assembly. The IDC assembly has at least one contact member with a piercing, cutting or slicing end that is slideably disposed within the main body, and a mounting end that extends from the main body. The mounting end of the contact is attached to a printed circuit board. An insulated conductor, such as a wire, cable and/or ribbon, can be quickly and easily inserted in the channel without being pierced by the piercing end of the contact. When a user pushes down on the IDC, the contact slides into the channel and pierces the insulated conductor.
In a presently preferred embodiment, the IDC comprises a surface mount IDC connector for attaching wires to a printed circuit board, including a housing having a number of generally parallel wire-receiving channels at least equal to the number of wires to be connected and generally defining, when the connector is mounted on a printed circuit board (PCB), a plane substantially parallel to the surface of the PCB on which the connector is mounted, said wire receiving channels being dimensioned to receive the wires with little clearance to thereby generally fix the physical positions of the wires against lateral or transverse shifting. Said housing further includes a number of slots corresponding to the number of said channels, each slot being substantially normal to said plane and aligned with and communicating with an associated channel. A plurality of piercing blade assemblies are provided, one received in each of said slots, each piercing blade assembly including at least one piercing blade receivable into a slot for movement through a slot and being at least partially receivable within an associated channel, said piercing blades having a length greater than the dimension of said slots in said normal direction and including a soldering portion positioned beyond said housing when said piercing blades are fully moved into said channels, whereby insertion of said piercing blades through the insulation of wires within said channels pierces the wires while leaving said soldering portions exposed outside said housing for soldering to a PCB.
Other objects and features of the present invention may become clear from the following description taken in conjunction with the preferred embodiments thereof with reference to the accompanying drawings, in which:
Referring now specifically to the attached figures, in which the same or similar parts will be designated by the same reference numerals throughout, and first referring to
The IDC connector assembly 10 is especially suitable for terminating one or a number of fine wires to a surface mount (SM) IDC connector.
The IDC connector assembly 10 includes a housing block 12 which is typically formed or molded from a suitable plastic material, as will be discussed. The housing block or housing has a generally rectangular receptacle 14 in which there is formed a wire-receiving opening 16. When the IDC connector assembly 10 is mounted on a printed circuit board (PCB) the wire-receiving opening 16 is generally parallel to the mounting surface on the PCB. While the wire-receiving opening may be closed at one end, so that wires can only be received or inserted through the other end, in the presently preferred embodiment, the wire-receiving opening 16 is a through opening open at both ends of the receptacle 14.
The wire-receiving opening 16 is configured to create one or more generally parallel wire-receiving channels 18 the number of which is at least equal to the number of wires to the terminated or connected to the housing block 12. Referring to
To one side of the receptacle 14 there is provided a pressure plate or shoulder 22 which exhibits an exposed flat pickup/pressure surface 22′. As suggested in
At the opposing surface from the flat pickup surface 22′ there are provided a plurality of piercing blade slots 26 the number of which corresponds to the number of wire-receiving channels 18. Each slot 26 is substantially normal to the plane defined by the wire-receiving opening 16 and aligned to communicate with an associated channel 18. As best shown in
One or more piercing blade assemblies 30 are provided one receivable in each of the slots 26. Each piercing blade assembly includes at least one piercing blade 38 receivable into a slot 26 for movement through a slot and being at least partially receivable within an associated wire-receiving channel 18. The piercing blades 38 have a length greater than the dimension of the slots 26 in the normal direction and include a soldering portion including an edge surface 38′ positioned beyond the receptacle 14 when the piercing blades are fully moved into or inserted into the wire-receiving channels 18. It will be evident, therefore, that the insertion of the piercing blades 38 into the channels pierces or displaces the insulation of wires that are within the wire-receiving channels 18 while leaving the soldering edges or surfaces 38′ exposed outside of the housing block 12 or receptacle 14 for soldering to a PCB, as shown and suggested in
The piercing blade assemblies 30 may be produced as a continuous strip 28, as shown in
Referring to
In accordance with one feature of the invention, each piercing blade assembly 30 includes a plurality of substantially co-planar piercing blades 38, as aforementioned, that have a dimension substantially corresponding to the dimension of the slots 26 along the direction of the wire-receiving channels 18. Unidirectional material engaging means are preferably provided for engaging a material surface of the slots and permitting the piercing blade assemblies to be urged into the slots while preventing a piercing blade assemblies from being removed from the slots by providing significantly less resistance of movement during insertion then during extraction or removal of the piercing blade assemblies. Referring to
Referring to
The block 12 has a shoulder 22 having an exposed flat surface 22′ that is relatively broad and flat so that a vacuum pickup nozzle can effectively fasten itself thereto. This is a significant aspect of the present invention because it allows the IDC 10 to be handled by automated pick-and-place machines. The shoulder 22 may have any shape depending on the specific application, such as cylindrical or rectilinear. The shoulder 22 may have a similar or different shape compared to the block 12. As shown, shoulder 22 is generally rectangular in shape.
The surface 22′ may be about 0.225 inches in length and about 0.283 in width. The top surface 22′ has an area that is preferably larger than the area of the bottom surface 14′. At its tallest point, IDC 10 is about 0.130 inches tall between the top surface 22′ and the bottom surface 14′.
The wire channel 18 may be about 0.040 inches to about 0.043 inches in diameter. To facilitate the insertion of a wire into wire channel 18, the entrance portions 18a and 18b preferably flared outwardly or have a diameter that is slightly larger than the diameter of the remainder of the wire channel 18.
IDC 10 is preferably attached to a PCB using surface mounting technology. Accordingly, IDC 10 is specifically shaped to be releasably held by a vacuum nozzle of an automated pick-and-place machine. As stated above, top surface 22′ is preferably broad and flat to facilitate adequate suction from the vacuum nozzle, so that IDC 10 can be picked-up. Alternatively, top surface 22′ may have a lip and/or a groove shaped to mate and/or coordinate with the vacuum nozzle. For example, top portion 22 may have a raised portion or tab that extends a short distance into the opening of the vacuum nozzle. Further details of pick-and-place machines, in particular, and surface mounting technology, in general, are described in U.S. Pat. Nos. 5,605,403 and 5,730,608, which are incorporated herein by reference in their entirety. To mount IDC 10 on a PCB, vacuum nozzle of an automated pick-and-place machine is releasably affixed to top side 22′. IDC 10 is placed on the PCB in such a manner that the edge surfaces 24′ of the contacts or blades 38 are positioned on a PCB land or pad. Reflow soldering melts the metal of the PCT land and subsequent cooling of the melted metal forms a bond between blade 38 and the PCB.
As shown in
In use, the piercing blade assemblies 30 are at least partially inserted into the associated slots 24 and the IDC connector assembly 10 is positioned on associated lands or pads 50 of a PCB 48 as shown in
While the invention has been shown and described in connection with a preferred form of an embodiment it will be understood that modifications may be made without the departure from the scope or spirit of the invention.
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