This invention relates to systems and methods for cooling electronic equipment in equipment cabinets. In particular, the invention relates to intake ducts for directing cooled air through equipment cabinets for cooling electronic equipment.
In a typical data center equipments cabinets are used to hold various types of electronic equipment such as servers and other mission-critical data-processing equipment. When in use, the electronic equipment housed in the cabinets generates heat that must be extracted or damage to the equipment can result. As equipment densities in the cabinets increase, so do the heat extraction (cooling) needs. Today, in a typical data center, it is not unusual for electronic equipment to generate 10 kilowatts and beyond of heat per cabinet (typical range 2 to 20 kilowatts per cabinet).
Currently, one method for cooling the electronic equipment in a data center is the use of the “hot aisle/cold aisle” concept; that is cool, conditioned air flows underneath a raised floor and enters the room through perforated floor tiles. The perforated tiles are strategically placed in front of the cabinets (thus creating the “cold aisle”) such that the cool air can be pulled into the cabinets, through a perforated door, to cool the equipment. The cool air picks up heat as it is drawn through the equipment by fans and then the warm air exits the back of the cabinet through another perforated door into the “hot aisle.” The exiting warm air is eventually drawn back into the room air conditioners and the cooling cycle repeats.
Although it is reasonably effective, the hot aisle/cold aisle method of cooling electronic equipment can be very inefficient and has various drawbacks. For example, warm air that exits the cabinet into the hot aisle can be drawn back to the cold aisle via the action of the equipment fans and normal room air circulation. In addition, the perforated floor tiles must be carefully placed and sized to effectively cool the equipment. If equipment is added or changed, or if a tile is accidentally moved or covered up, inefficient cooling results and cooling must be increased. Finally, since the flow of cool air is not directed to the equipment that needs cooling any change in the room configuration or even people standing in the aisles can disrupt the cool air flow. These disruptions result in a smaller portion of the cool air actually cooling the equipment, which further decreases efficiency. The inefficiencies of the hot aisle/cold aisle system lead to wasted energy (e.g. electricity to power the air conditioners), due to the need to “overcool” the data center to make up for cooling losses. In addition, data loss and downtime can result due to equipment damage from overheating.
Therefore, there is a need for a system and method for cooling electronic equipment in a cabinet that efficiently and effectively delivers cooled air where it is needed, with no warm air mixing. It would also be beneficial to eliminate the dependence on a cold aisle for cool air delivery, for example by sending the cooled air directly into the cabinet.
In one example, an electronic equipment cabinet is provided comprising a first duct positioned in a side portion of the electronic equipment cabinet. The first duct has a first opening formed in a bottom wall of the duct and a second opening formed in an inside wall of the duct. The first opening is configured to generally align with a cool air source and receive cool air from the cool air source with the duct installed in the cabinet. The second opening is in fluid communication with a front internal portion of the cabinet and is configured to direct cool air from the duct to the front internal portion of the cabinet with the first duct installed in the cabinet.
In another example, an electronic equipment cabinet is provided comprising a duct positioned in a side portion of the electronic equipment cabinet. The duct has an intake opening formed in a bottom wall of the duct and a plurality of exhaust openings formed in an inside wall of the duct. The intake opening is configured to generally align with a cool air source and receive cool air from the cool air source with the duct installed in the cabinet. The plurality of exhaust openings are configured to generally align with intake vents of electronic equipment installed in the cabinet and to direct cool air from the duct to the side intake vents of the electronic equipment with the duct installed in the cabinet.
In another example, an intake duct system for an electronic equipment cabinet is provided comprising a first duct configured for installation in a side portion of the cabinet. The duct has a first opening formed in a bottom wall of the duct and a second opening formed in an inside wall of the duct. The first opening is configured to generally align with a cool air source and receive cool air from the cool air source with the duct installed in the cabinet and the second opening is in fluid communication with a front internal portion of the cabinet and is configured to direct cool air from the duct to the front internal portion with the duct installed in the cabinet.
In another example, an intake duct system for an electronic equipment cabinet is provided comprising a duct configured for installation in a side portion of the electronic equipment cabinet. The duct has an intake opening formed in a bottom wall of the duct and a plurality of exhaust openings formed in an inside wall of the duct. The intake opening is configured to generally align with a cool air source and receive cool air from the cool air source with the duct installed in the cabinet and the plurality of exhaust openings are configured to generally align with intake vents of electronic equipment installed in the cabinet and to direct cool air from the duct to the side intake vents with the duct installed in the cabinet.
Certain examples of the present invention are illustrated by the accompanying figures. It should be understood that the figures are not necessarily to scale and that details that are not necessary for an understanding of the invention or that render other details difficult to perceive may be omitted. It should be understood, of course that the invention is not necessarily limited to the particular examples illustrated herein.
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In the example shown, perforated intake panel 22, having multiple holes 23, is positioned over opening 20 to deliver more uniform air flow to duct 10. Holes 23 are formed in intake panel 22 such that intake panel 22 is approximately 56% open. In some instances, it has been found that wide-open inlets may not provide consistent airflow into duct 10 (e.g. the air entering duct 10 will try to take the path of least resistance, so some areas will receive more cool air and be overcooled while others will not receive enough cool air and will be starved). The use of intake panel 22 has been shown to provide more uniform air flow over the entire area of opening 20 by converting high velocity, low pressure air into low velocity, high pressure air. Alternatively, if uniform air flow through the duct is not a problem or concern in a particular application, intake panel 22 can be removed.
An opening is also formed in inside wall 10C and in the example shown extends the entire height of inside wall 10C and back a predetermined distance from front wall 10A. The opening in inside wall 10C provides an exhaust for cool air out of duct 10 and directs the cool air flowing through duct 10 towards the front of the electronic equipment mounted in the cabinet. In the example shown, perforated exhaust panel 32, having multiple holes 34, is positioned over the opening in inside wall 10C to more uniformly disperse the cool air flowing out of duct 10. Holes 34 in exhaust panel 32 are formed in exhaust panel 32 such that six sections 32A-F are defined in exhaust panel 32. As can best be seen in
In the example shown, to further assist in providing uniform air flow from duct 10 across the front of the electronic equipment deflector 40 extends from inside wall 10C along the edge of the opening in inside wall 10C. Deflector 40 is generally L-shaped, extends the entire height of inside wall 10C, and is used to force all air to the front of the server equipment and prevent cool air from flowing past the face of the electronic equipment by disrupting the cool air flowing from exhaust panel 32, thus providing more uniform air flow across the entire front of the electronic equipment. Again, if uniform air flow across the front of the electronic equipment is not a problem or concern in a particular application, deflector 40 can be removed.
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The exemplary intake duct 10 described above provides cool air, in the proper location, with no mixing of warm air from a hot aisle through the locating, sizing, and shaping of duct 10, as well as the strategic placement of baffles 50 to control air direction, pressure and velocity. It has been demonstrated that the use of exemplary duct 10 described above can increase cool air utilization efficiency by 50% by limiting the flow of cool air to only the air spaces within the cabinet (e.g. the ducts and the front of the equipment), thus reducing the volume of cold air required, which increases efficiency of the cold air delivery method. This increased efficiency allows the data center cooling to be “dialed back,” or existing capacity can be used to cool more equipment (e.g. higher density). In addition, data center “over cooling” to overcome inefficient cool-air delivery can be reduced.
Some additional benefits that may be realized through use of the exemplary intake duct 10 are: provides all of the cool air required by the cabinet, not just supplemental air to add to hot/cold aisle air; the ability to use a solid front door on the cabinet instead of a perforated door, which prevents unwanted air from entering the cabinet; the delivery of cool air along the full height of the cabinet, not just top or bottom; reduction of air usage (as measured in cfm) by 25-50%; reduced energy costs; reduction of the number of perforated floor tiles required; direction of the cool air to the front of the cabinet where it is needed most; and providing a system that requires no adjustment.
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The bottom of center duct 70 is left open such that front wall 70A, back wall 70B and side walls 70C and 70D define opening 74, which will be aligned with a perforated or open floor cutout when center duct 70 is installed in a cabinet. Opening 74 provides an inlet into center duct 70 for cooled air flowing from the perforated or open floor cutout, which allows a typical perforated front cabinet door to be replaced by a solid door, if desired, and allows the flow of cool air from under the floor to enter center duct 70. In this example, the perforations are formed in the intake panel over opening 74 such that the intake panel is approximately 56% open. Alternatively, if uniform air flow and/or pressure regulation of the air flowing through center duct 70 is not a problem or concern in a particular application the intake panel can be removed.
Opening 72 is formed in top wall 70E and in the example shown extends the entire width of top wall 70E and back a predetermined distance from front wall 70A. Opening 72 provides an exhaust for cool air out of center duct 70 and directs the cool air flowing through center duct 70 towards the front of the electronic equipment mounted in the cabinet.
Cool air from a perforated or open floor cutout flows into center duct 70 through opening 74. The cool air then flows from opening 74 through duct 70 and exhausts through opening 72.
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The bottom of intake duct 80 is left open such that front wall 80A, back wall 80B and side walls 80C and 80D define opening 82, which will be generally aligned with a perforated or open floor cutout when intake duct 80 is installed in a cabinet. Opening 82 provides an inlet into intake duct 80 for cooled air flowing from the perforated or open floor cutout, which allows a typical perforated front cabinet door to be replaced by a solid door, if desired, and allows the flow of cool air from under the floor to enter intake duct 80. Similar to that described above, a perforated intake panel (not shown) can be positioned over opening 82 to deliver more uniform air flow and pressure to intake duct 80. In this example, the perforations are formed in the intake panel such that the intake panel is approximately 56% open. Alternatively, if uniform air flow and/or pressure regulation of the air flowing through intake duct 80 is not a problem or concern in a particular application, the intake panel can be removed.
Multiple openings 84 are formed in inside wall 80C and are positioned such that openings 84 will generally align with the intake vents in electronic equipment 110. Openings 84 in inside wall 80C provide an exhaust for cool air out of intake duct 80 and direct the cool air flowing through duct 80 towards the intakes of electronic equipment 110 in the cabinet.
In addition to receiving cool air through opening 82, the example shown also includes perforations 86 formed in outside wall 80D, which allows intake duct 80 to receive supplemental cool air from cool air sources adjacent to the cabinet. In this example, perforations 86 are approximately 56% open. Perforations 86 can be used in various situations, such as when there is a perforated floor tile 100 adjacent to the cabinet (see
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This application claims priority to U.S. Provisional Patent Application No. 60/968,425, filed Aug. 28. 2007.
Number | Date | Country | |
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60968425 | Aug 2007 | US |