The subject matter disclosed herein relates to planar transformers and busbars and, more particularly, to a planar transformer and busbar integrated together as a single component for use, for example, in relatively high power electrical distribution and power conversion device applications.
A planar transformer and a planar inductor each typically comprises a plurality of parallel and/or interleaved copper conductors, separated by insulation layers, arranged in a stack and surrounded by a core. The planar transformer has oftentimes two separate strings of one or more serial connected coils, one string being the primary circuit and the other string being the secondary circuit, with the coils of each circuit commonly being interleaved with one another. Insulation layers may be interleaved with each coil of the primary circuit and the secondary circuit. A planar inductor has oftentimes only one string of one or more serial connected coils. These devices are used in applications such as relatively low power DC-DC converters and power conversion devices, and to a lesser extent in high power applications. Planar transformers and inductors are relatively compact in size compared to the common wound versions, and these planar devices may be designed with relatively higher efficiency and increased thermal management.
Planar transformers can be made with traditional laminated printed circuit board (“PCB”) technology, and may even be embedded within the PCB itself. However, in the power range of 1.5 kW or greater, or when electrical currents exceed 100 A, the ability to use traditional PCB technology for planar transformers is at its limits or is exceeded. Relatively high currents require relatively thick copper conductors (e.g., 0.2 mm up to 0.8 mm or greater), which is beyond the capability of typical PCB manufacturing processes. One of the problematic PCB manufacturing processes is the etching process, in which the edges of the circuit become increasingly less defined (i.e., “fuzzy”) with increasing copper thickness. Also, processing time increases significantly with increasing thickness of the copper layer. An alternative process, such as electrolytic copper plating to increase the copper thickness, is relatively expensive and the planarity of the conductor surface becomes more problematic as the thickness increases.
On the other hand, laminated busbars are suitable for circuits that conduct high frequency alternating currents. A busbar typically comprises a stack of a plurality of parallel and/or interleaved copper conductors, separated by insulation layers. The relatively high currents utilized in busbars require conductors with a relatively thick copper gauge to reduce resistance and excessive heating. Instead of chemical etching, the preferred methods to form the conductor paths are mechanical processes such as, for example, punching, water jetting, laser cutting, milling, and others.
The busbar circuit may have flat conductors that are positioned parallel to each other, with a relatively small distance in between different layers and the conductor layers are separated by layers of insulating material to form a stack. The insulation material, with or without an adhesive coating applied in advance or during the process, is typically positioned between the conductors and all the layers in the stack are pressed together in a lamination process using heat and pressure, resulting in a solid busbar circuit. Due to the relatively good thermal conductivity of copper, the busbar also has a relatively good thermal spreading capability. The exposed surface of the busbar also makes it relatively easy to cool.
Relatively high power DC-DC converters are finding increased use where power storage devices (e.g., batteries, super capacitors, etc.) are used. Other typical high power DC-DC converter applications include hybrid electrical vehicles, military, avionics, windmill pitch control and emerging applications related to renewable energy sources that produce DC voltage (e.g., solar).
It is known that when a busbar is used in a relatively high-power DC-DC converter (typical greater than 1.5 kW), the planar transformer, and most often the inductor, are separate components. The planar transformer, busbar and inductor are typically within the AC portion of the DC-DC converter. Other applications can be in the rectifier. The secondary circuit of the transformer is typically mounted to the busbar by means of screws and bolts, and drums if needed, or by soldering or other connection methods. The typically single interconnection location between the planar transformer and the busbar can be ground for additional connection losses, thereby creating an undesirable hot spot or local heating at that single connection location due to all of the electrical current being concentrated to one side at the single connection location.
As the power density increases, the temperature in the planar transformer tends to increase, as a result of which passive or active cooling may be required. Conductive, convection, or liquid cooling of the planar device is typically carried out through the ferrite core (or other suitable core material), in which the core is connected to a cooling plate, heat spreader or other cooling device or system.
What is needed is a planar transformer and a busbar integrated together to form a single integral component for use in relatively high power electrical distribution and conversion device applications, wherein integrating the planar transformer with the busbar creates a relatively more balanced connection between the transformer and the busbar, thereby improving the flow of current between the transformer and the busbar and reducing interconnection losses and electrical current hotspots.
According to embodiments of one aspect of the present invention, one or both of the primary and secondary coils of a relatively high power planar transformer are integrated together with a laminated busbar, thereby incorporating together the planar transformer and the busbar as a single integral component. A coil is cut out or otherwise formed in at least one of the busbar conductors, and when electrically connected, the busbar coils act as part of the primary and/or secondary circuit of the planar transformer. One or more coil lead frames are embedded in the laminated transformer/busbar stack, and when electrically connected, form the primary circuit and/or the secondary circuit, respectively, of the planar transformer. Insulating material coils are also embedded within the laminated transformer/busbar stack. The center leg of an E-shaped ferrite core passes through the center opening of each of the busbar coils, the coil lead frames, and the insulating material coils. The E-shaped core is located next to (i.e., with an opening) or closed with, an I-shaped or E-shaped core.
These and other advantages and features will become more apparent from the following description taken in conjunction with the drawings.
The subject matter, which is regarded as the invention, is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other features and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
The detailed description explains embodiments of the invention, together with advantages and features, by way of example with reference to the drawings.
Referring to
In a typical transformer, two coiled circuits are required, a primary and a secondary circuit. Each circuit typically comprises a string of serial connected coils. A core, typically magnetic, is also provided around which the coiled circuits are located. Embodiments of the present invention include at least one of the primary and/or secondary coiled circuits being an integral part of the busbar circuit. In the embodiment of the integrated component 100 shown in
In
The coils 104, 108 and the busbar conductors 112, 116 are electrically insulated from one another (and from the primary circuit coils) by a coil insulator 120, 124, 128 integrated together with a corresponding busbar insulator 132, 136, 140. The insulators 120-140 may comprise any suitable insulating material, with or without an adhesive coating. Typically the busbar coils 104, 108 and the busbar conductors 112, 116 may be insulated with the insulators 120-140 that may comprise UL-94 V-0 flame retardant dielectric films such as polyethylene terephtalate, polyethylene naphthalate, and polyvinylfluoride. In applications requiring high temperature resistance, polyimides, polyetheretherketones, polyaryletherketones, and polypheneylenesulfides may be used. The dielectric films may be coated on one or both sides with adhesives that may include epoxy, acrylate, or polyurethane modified resin systems. The use of the insulators 120-140 does not disturb the serial string connection of the busbar coils 104, 108 and the corresponding busbar conductors 112, 116.
The primary circuit of the planar transformer may be formed by interconnecting a plurality of electrically conductive lead frame coils 144-160 and interleaving these coils 144-160 with the coils 104-128 of the secondary circuit and with the insulation layers 120-128, 164-184. Each of the lead frame coils 144-160 may comprise at least one winding and, in some embodiments, each lead frame coil 144-160 may comprise multiple windings.
Referring also to
The stack of conductor and insulation layers may be laminated together by exposing the stack to temperature and pressure, thereby turning the stack into a solid construction or assembly, as illustrated in
Various topologies and configurations are possible for the planar transformer or inductor, as well as for the busbar; for example, a greater number of coil frames can be connected in series to the busbar coils to increase the number of windings, or a greater number of coiled busbar layers can be added in case of bifilar designs or to create multiple transformer outputs.
The integrated planar transformer and busbar component 100 according to embodiments of the present invention enables a relatively more compact construction of a power device, e.g., a DC-DC converter. The number of components and connections in the resulting assembly of the component 100 is reduced as compared to known designs. The thermal management of the component 100 is improved because the busbar is now directly part of the transformer function. The heat that is generated internally in the transformer can be evacuated relatively quickly through the busbar instead of through the ferrite (or other suitable material) transformer core. The hot spots related to connection losses between the planar transformer and the busbar can be eliminated.
Different constructions and conductor combinations are possible, depending on the type, design and characteristics of the device (e.g., DC-DC converter) in which the component 100 is utilized, and enables further reduction of connection losses and proximity losses. Embodiments of the present invention may be applicable as well to inductors instead of transformers; that is, components with only a single coiled circuit.
Embodiments of the present invention provide for the elimination of interconnection losses on the busbar side of the connection point between the planar transformer and the busbar. They also provide for relatively improved cooling such that more heat can dissipate through the busbar side without creating additional heating related to interconnection losses (i.e., some connections are eliminated). Further, embodiments of the present invention provide for a relatively more compact design and construction, while also making it possible to eliminate impregnation process (i.e., reducing technical and health and safety risks). Also, a reduction in the parts count may be achieved due to the fact that the planar transformer is now part of the busbar circuit. Other features include a reduction of electromagnetic field and proximity losses, and improved vibration and shock resistance due to the single, solid low-profile construction and reduced parts count. Further, improved diode commutation due to lower stray inductance of the output windings may be achieved.
While the invention has been described in detail in connection with only a limited number of embodiments, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the invention. Additionally, while various embodiments of the invention have been described, it is to be understood that aspects of the invention may include only some of the described embodiments. Accordingly, the invention is not to be seen as limited by the foregoing description, but is only limited by the scope of the appended claims.
Number | Name | Date | Kind |
---|---|---|---|
3258727 | Weinsheimer et al. | Jun 1966 | A |
5331536 | Lane | Jul 1994 | A |
5386206 | Iwatani et al. | Jan 1995 | A |
5781093 | Grandmont et al. | Jul 1998 | A |
6144276 | Booth | Nov 2000 | A |
6278351 | Wheatley | Aug 2001 | B1 |
6313991 | Nagashima et al. | Nov 2001 | B1 |
6356182 | Nagashima | Mar 2002 | B1 |
6461172 | Ross | Oct 2002 | B2 |
7123123 | Isurin et al. | Oct 2006 | B2 |
7207187 | Funahashi et al. | Apr 2007 | B2 |
7215555 | Takagi | May 2007 | B2 |
7318269 | Yoshida et al. | Jan 2008 | B2 |
7439839 | Podlisk et al. | Oct 2008 | B2 |
7514829 | Otsuji et al. | Apr 2009 | B2 |
7518851 | Tsuchiya et al. | Apr 2009 | B2 |
20020002771 | Lin et al. | Jan 2002 | A1 |
20020044331 | Agrawal et al. | Apr 2002 | A1 |
20030052767 | Yamanobe et al. | Mar 2003 | A1 |
20070188282 | Folts et al. | Aug 2007 | A1 |
20080100993 | Muller et al. | May 2008 | A1 |
20090121704 | Shibahara | May 2009 | A1 |
20090161301 | Woody et al. | Jun 2009 | A1 |
20090243782 | Fouquet et al. | Oct 2009 | A1 |
Number | Date | Country |
---|---|---|
101335442 | Dec 2008 | CN |
0919438 | Jun 1999 | EP |
1577977 | Sep 2005 | EP |
2476898 | Aug 1981 | FR |
418933 | Nov 1934 | GB |
2000215735 | Aug 2000 | JP |
2000350335 | Dec 2000 | JP |
2003219545 | Jul 2003 | JP |
2005036773 | Feb 2005 | JP |
2007028896 | Feb 2007 | JP |
2007294896 | Nov 2007 | JP |
2008287890 | Nov 2008 | JP |
2008295227 | Dec 2008 | JP |
2009011039 | Jan 2009 | JP |
0195435 | Dec 2001 | WO |
2008146770 | Dec 2008 | WO |
Number | Date | Country | |
---|---|---|---|
20110254649 A1 | Oct 2011 | US |