Claims
- 1. An integrated circuit transponder device comprising, in combination:
- a single package enclosing an integrated circuit semiconductor chip;
- a coil within said package being selectively exposed to an electromagetic filed; and
- detection means on said integrated circuit semiconductor chip and being coupled to each end of said coil for detecting when voltages at each end of said coil are approximately equal over a period of time, said detection means includes an exclusive NOR gate coupled to each end of said coil;
- wherein one end of said coil is input to a first pair of serially connected inverters having an output connected to a first input of said exclusive NOR gate, and wherein another end of said coil is input to a second pair of serially connected inverters having an output connected to a second input of said exclusive NOR gate.
- 2. A method of operating an integrated circuit transponder device comprising the steps of:
- providing a single package enclosing an integrated circuit semiconductor chip;
- providing a coil within said package being selectively exposed to an electromagetic field; and
- providing detection means on said integrated circuit semiconductor chip and being coupled to each end of said coil for detecting when voltages at each end of said coil are approximately equal over a period of time, said step of providing said detection means includes the step of providing an exclusive NOR gate coupled to each end of said coil;
- wherein one end of said coil is input to a first pair of serially connected inverters having an output connected to a first input of said exclusive NOR gate, and wherein another end of said coil is input to a second pair of serially connected inverters having an output connected to a second pair of said exclusive NOR gate.
RELATED APPLICATIONS
This patent application is related to pending U.S. patent application entitled "A Single-Sided Package Including an Integrated Circuit Semiconductor Chip and Inductive Coil and Method Therefor," filed in the names of Joseph Fernandez and Lee Furey, and is incorporated herein by reference. This patent application is also related to pending U.S patent application entitled "Combination Inductive Coil and Integrated Circuit Semiconductor Chip in a Single Lead Frame Package and Method Therefor," filed in the names of Lee Furey and Joseph Fernandez, and is incorporated herein by reference.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5041826 |
Milheiser |
Aug 1991 |
|
5905449 |
Tsubouchi et al. |
May 1999 |
|