Patent Application
20160004897
This invention relates to a fingerprint sensor for integration in smart phones or similar.
Finger print sensors comprising electrodes for measuring characteristics in a finger surface are well known, eg EP0988614, U.S. Pat. Nos. 5,963,679 and 6,069,970 describe sensors based on different measuring impedance or capacitance principles with stripe shaped or matrix sensors comprising a number of individual sensor elements.
A disadvantage with the abovementioned sensors is, however the sensor surfaces are not suitable for having direct contact with the environment, and usually has to be provided with a housing protecting the circuits from humidity, wear, corrosion, chemical substances, electronic noise, mechanical influences, sun light electric discharges etc. U.S. Pat. No. 5,862,248 provides a possible solution to this problem, in which the circuit is enclosed in such a way that the finger is allowed to direct contact with the sensitive surface of the sensor through an opening in the top of the enclosure. In many cases this solution will not sufficient to provide the required reliability. The materials (metal, dielectrics) being used on the surface of the integrated circuits are usually not sufficiently reliable to withstand exposure from the outer environment and contact with the finger over a longer period of time, and thus this solution will also lead to reliability problems. Another solution may be adding additional layers of metal and dielectrics on the chip surface, as described in U.S. Pat. No. 6,069,970. Such layers will however, increase the production costs and create compatibility problems with the semiconductor process in general (related to processing temperature, varying dimensions due to temperature differences etc). Yet another solution is described in U.S. Pat. No. 7,251,351 leading the conductors through a substrate to the processor then being positioned safely on the back side of the substrate, inside the device. This solution is not easily implemented in smart phones requiring large, transparent panels.
In US2011/0182488 also describes a fingerprint sensor in which the processing unit is positioned on one side of s substrate and there are conductors leading through the substrate to the other side. The substrate is a semi conducting material and the conductors are made from the same material being insulated from the substrate. U.S. Pat. No. 6,327,376 on the other hand described a transparent substrate carrying transparent conductors, evidently positioned on the same side of the substrate as the sensor, thus making it vulnerable to wear.
The object of this invention is to secure a cost effective miniature sensor solution both eliminating the technical risk at exposing of the sensor to the external environment, which may be realized in smart phones with touch screen interfaces. It is also an object of the present invention to provide a solution for touch screen driven units such as smart phones with few, if any, additional buttons, where space is becoming very limited on front surface of phones where the display area is approaching 100% utilization. These objects are obtained as disclosed in the independent claims.
This way it is possible to integrate a fingerprint swipe sensor in the shell of a mobile phone, especially through the front glass or protective covering of a smart phone, taking the design and ergonomics are key design criteria for different handset manufacturers.
The present invention will be described in more detail with reference to the accompanying drawings, illustrating the invention by way of example.
As illustrated in
A full sensor matrix covering the complete, immobile finger, may also be contemplated but at the disadvantage of the number of electrodes necessary.
As stated above the conductor leads 2 from the electrodes are lead vertically through the cover material then laterally routed or redistributed to a signal processor 3, e.g. for analog signal conditioning, being positioned on the rear side of the cover. This may be a CMOS ASIC. Vertical and lateral conductor leads may be fashioned in such a way that small feature size or transparent materials such as Indium Tin Oxide (ITO) renders the conductors invisible to the user. Standard metal routing and via processing are available for this. Electrodes and associated conductor leads may be processed partially on the front or back side of the glass, or on additional intermittent planes in between.
The unit may also include optional silicon dies and circuitry 4 for secure biometric authentication . Typical options include microcontrollers for running biometric algorithms and communication and other functions requiring logic processing, various secure elements and USIM chips for authorizing financial transactions or service providere identification, as well as NFC controllers for radio frequency communication.
As illustrated the unit also may include an interface 5 to other parts of the smart phone or external connectors and equipment. An antenna (not shown) is also possible to integrate in combination with an NFC controller.
Thus is possible to integrate a fingerprint swipe sensor in the shell of a mobile phone while taking into account design and ergonomics are key design criteria for handset manufacturers. This will provide additional advantages such as:
Thus the invention relates to a fingerprint sensor especially for integration in a unit having a cover material such as glass being transparent in a certain area. The fingerprint sensor comprises a number of electrodes positioned in a predetermined pattern on or close to the surface of said cover material. This may be made by locally reducing the cover thickness or ny additional layers on the cover and electrodes so as to obtain a galvanic or capacitive coupling to the finger surface. Each electrode is connected to a conductor lead extending through or almost through said cover material, the conductor lead being essentially transparent and being routed on the opposite side from the electrodes to a processing unit being positioned outside said transparent area.
Additional circuitry for authentication means connected to said processor, as well as interface means for communication with other circuitry in the unit. These may also include a display for communicating indications to the user resulting from the fingerprint scan.
| Number | Date | Country | Kind |
|---|---|---|---|
| 20130289 | Feb 2013 | NO | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2014/053403 | 2/21/2014 | WO | 00 |
