1. Field of the Invention
This invention relates generally to pneumatic and hydraulic equipment, and more particularly to the measurement of physical characteristics, such as flow rate, pressure, and temperature of a fluid used to control these devices.
2. Description of the Prior Art
A fluid flow device, such as a valve manifold 10 and its corresponding base plate 12 shown in
The base plate 12 is mounted to a bottom surface of the valve manifold 10, as shown by dashed lines in
To incorporate the flow sensor shown in
U.S. Pat. No. 3,424,000 to Chelner et al. (Chelner) describes a flow sensor, which includes four (4) strain gauges mounted on both the front and rear sides of a wafer. The wafer is deflected in response to fluid flow and provides a substrate for mounting strain gauges, electrical conductors, and contacts.
However, to modify the sensitivity of the Chelner flow sensor, the substrate for the electrical components must be modified, which has a significant impact on the deposition of electrical components thereon, and thus the overall manufacturing and standardization process. In addition, the double-sided placement of strain gauges on the wafer substantially complicates and adds to the cost of passivation and production of such flow sensors.
It is an object of the present invention to provide an integrated fluid sensing device, which significantly reduces measurement errors, space requirements, and the cost of installing and maintaining sensors that measure the physical characteristics of a fluid used to control hydraulic or pneumatic equipment.
It is a further object of the present invention to provide an integrated fluid sensing device, which includes sensors mounted on a single circuit board having common signal processing, communication, error control, and connecting circuitry.
It is still a further object of the present invention to provide an integrated fluid sensing device, which can readily be adapted to various physical characteristics of a fluid used to control hydraulic or pneumatic equipment by changing a single circuit board.
It is yet a further object of the present invention to provide an integrated fluid sensing device, which can readily display and transmit sensed data, via wired or wireless means, which represents physical characteristics of a fluid used to control hydraulic or pneumatic equipment.
It is still another object of the present invention to provide an integrated fluid sensing device that significantly reduces the amount of external tubing, connectors, and fittings required to sense the physical characteristics of a fluid used in the control of hydraulic or pneumatic equipment.
It is yet another object of the present invention to provide an integrated fluid sensing device, which substantially encloses sensors that measure the physical characteristics of a fluid and protects these sensors against environmental hazards.
It is another object of the present invention to provide a flow sensor, which can readily be adapted to different flow rates without any substantial change or additional cost in the manufacturing process.
It is yet another object of the present invention to provide a flow sensor, in which a generic support member includes one or more strain gauges.
It is still another object of the present invention to provide a flow sensor, in which a paddle that is displaced by fluid flow does not include a strain gauge.
It is a further object of the present invention to provide a flow sensor, in which a support member includes strain gauges on only one side of the of the support member.
In accordance with the present invention, an integrated fluid sensing device is provided, which includes a fluid flow device and a circuit board. The fluid flow device includes a first mating portion and a second mating portion. The first mating portion includes a first aperture, and the second mating portion includes a second aperture. The first aperture and the second aperture are at least partially aligned such that the first aperture and the second aperture define a first channel through the first and second, mating portions when the first and second mating portions are joined together. The first channel is able to communicate fluid therethrough. The circuit board is disposed between the first mating portion and the second mating portion and includes at least one sensor. The sensor is at least partially aligned with the first channel and is able to detect a physical characteristic of the fluid flowing through the first channel.
In further accordance with the present invention, a method of integrating a sensor in a fluid flow device is provided, which includes the steps of dividing the fluid flow device into a first mating portion and a second mating portion, and positioning a circuit board between the first mating portion and the second mating portion. The first mating portion including a first aperture, and the second mating portion including a second aperture. The first aperture and the second aperture are at least partially aligned such that the first aperture and the second aperture define a first channel through the first and second portions when the first and second mating portions are joined together. The first channel is able to communicate a fluid therethrough. The circuit board includes at least one sensor, which is at least partially aligned with the first channel. The sensor is able to detect a physical characteristic of the fluid flowing through the first channel.
In still further accordance with the present invention an integrated fluid sensing device is provided, which includes at least one valve, a base plate, and a circuit board. The base plate is removably coupled to the valve and includes a first mating portion and a second mating portion. The base plate includes a first channel through the first and second mating portions when the first and second mating portions are joined together. The circuit board is disposed between the first mating portion and the second mating portion. The circuit board includes at least one sensor and an electrical contact. The electrical contact is coupled to the sensor and is accessible to an exterior of the fluid flow device when the first and second portions are joined together. The sensor is at least partially aligned with the first channel and is able to detect a physical characteristic of the fluid flowing through the first channel.
In yet further accordance with the present invention, a flow sensor is provided, which includes a paddle and a support member. The paddle is disposed at least partially in an orifice and is displaced in response to fluid flow. The support member positions the paddle in the orifice and includes a plurality of strain gauges. The strain gauges are disposed on only one side of the support member and are mechanically stressed in response to the paddle being displaced by the fluid flow.
In accordance with the present invention, a method of sensing flow is provided, which includes the steps of disposing a paddle at least partially in an orifice, directing a fluid flow through the orifice, positioning the paddle in the orifice by a support member, and disposing the plurality of strain gauges on only one side of the support member. The paddle is displaced in response to the fluid flow. The support member includes a plurality of strain gauges and the plurality of strain gauges are mechanically stressed in response to the paddle being displaced by the fluid flow.
These and other objects, features, and advantages of the present invention will become apparent from the following detailed description of illustrative embodiments thereof, which is to be read in connection with the accompanying drawings.
a and 2b are side views of a flow sensor.
c is an isometric view of the flow sensor shown in
d is an isometric view of a conventional hot-wire anemometer.
a and 3b are bottom, and top views, respectively, of the conventional base plate shown in
c is a side, cross-sectional view of the base plate shown in
a is a side, cross-sectional view of the base plate in which a circuit board has been inserted between an upper portion and a lower portion of a base-plate in accordance with the present invention.
b is a side, cross-sectional view of one channel in the base plate shown in
c is a top, cross-sectional view of the base plate shown in
d is a side, cross-sectional view of one channel in an alternative embodiment of the base plate formed in accordance with the present invention.
e and 4f are top, cross-sectional views of two embodiments of the base plate shown in
g is a side, cross-sectional view of one channel in an alternative embodiment of the base plate formed in accordance with the present invention without a bypass channel directing flow around the sensor.
a and 5b are partially-exploded, side, cross-sectional views of two embodiments of the base plate formed in accordance with the present invention.
a is a top view of a circuit board.
b is a side, cross-sectional view of the circuit board shown in
c is an alternative embodiment of the circuit board shown in
d is an alternative embodiment of the circuit-board shown in
a is a top view of a spacing layer.
b is a side, cross-sectional view of the spacing layer shown in
a is a top view of a sealing layer.
b is a side, cross-sectional view of the sealing layer shown in
One type of sensor 18, which is used to measure the flow of liquid, is shown in
The fluid to be measured is directed through the orifice 20 in the flow sensor 18. The dynamic pressure built up by the fluid deflects the paddle structure 22. The mechanical stress of the paddle structure 22 changes the resistance of the piezo-resistive Wheatstone bridge 24 at the base of the paddle structure 22, and this change in resistance creates a corresponding change in voltage. The change in voltage is detected on a set of contacts 26 electrically connected to the Wheatstone bridge 24, as shown in
The output voltage of the Wheatstone bridge 24 is proportional to the square of the volumetric flow rate. The sensitivity of the flow sensor 18 is dependent upon the size of the orifice 20, and is adjustable over a broad range. Thus, since the paddle structure 22 is perpendicularly oriented to the direction of flow of liquid, as liquid passes through the orifice 20 in the flow sensor 18, the kinetic pressure of the liquid induces a mechanical stress that is detected by the piezo-resistors in the Wheatstone bridge 24.
a shows a bottom view of a multipole or base plate 12. Threaded holes 28 are provided in the base plate 12 to accommodate fittings 14 as shown in
b shows a top view of the conventional base plate 12 including a line A–A′.
a shows a side, cross-sectional view of the base plate 12 after it has been separated into an upper portion. 12A and a lower portion 12B along a line X–X′ shown in
b shows a side, cross-sectional view of the base plate portions 12A, 12B and the circuit board 30 in which the bypass path L′ has been implemented around the sensor 18.
d shows an alternative geometry for the channel in the base plate 12 having at least two (2) bypass paths L′.
By appropriate dimensioning of the sensor 18, the channel may be constructed without a bypass channel directing flow around the sensor 18.
In addition, one or more alignment, holes 36 are preferably provided through each of the layers 30, 32, and 34 and partially through the upper portion 12A and the lower portion 12B of the base plate. A guide pin (not shown) is preferably placed in each of the alignment holes, which ensures a preferably unique orientation of the layers 30, 32, and 34 with the portions of the base plate 12A, 12B as they are joined together.
One or more screw holes 38 are provided through the bottom portion 12B of the base plate, each of the layers 30, 32, 34, and partially through the upper portion 12A of the base plate to accommodate a screw, which joins the portions of the base plate together and sandwiches the layers. The screw maintains compression between the portions of the base plate, which aids in preventing leakage of fluid from the channel.
a shows the circuit board 30 with eight (8) sensors 18. Each of the sensors 18 is preferably positioned within a depression on the circuit board 30 and affixed to the circuit board 30 by an adhesive, surface mount technology (SMD), wire bond technology, flip-chip technology, or the like. The sensor 18 is preferably connected to bond pads 40, which are coupled to electrically conductive traces 42 on the circuit board 30. The traces 42 are brought to the edge of the board, which is preferably accessible from the outside of the base plate 12 when the upper portion 12A and the lower portion 12B of the base plate 12 are joined together.
The sensors 18 are advantageously encapsulated within and electrically accessible outside the integrated fluid sensing device formed in accordance with the present invention. Thus, the fragile components of the sensor 18 are inherently protected from shock, humidity, dust, corrosive chemicals, and other environmental hazards.
b is a side, cross-sectional view of the circuit board 30 taken along the line B–B′, which shows the alignment holes 36, screw hole 38 and sensor 18.
Fieldbus is a commercial standard describing a digital, serial, multi-drop, two-way communication link, which interconnects measurement and control equipment such as sensors, actuators, and controllers. It serves as a Local Area Network (LAN) for instruments used in process control and manufacturing automation applications and has a built-in capability to distribute the control application across the network.
d shows an alternative embodiment of the circuit board 30 shown in
a shows a top view of the spacing layer 34, which is also shown in
a shows the sealing layer 32, which prevents leakage from the channel to the exterior of the base plate 12. The functionality of the sealing layer 32 could alternatively be incorporated into the circuit board 30 by applying, for instance, independent seals around each of the orifices in the circuit board 30.
It is anticipated that the integrated fluid sensing device of the present invention can be implemented with any quantity of valves or manifolds used to control hydraulic and/or pneumatic equipment. It is also anticipated that the sensor can measure any conceivable physical characteristic of the fluid, such as temperature, flow rate, pressure, and the like. It is further anticipated that the sensor can be implemented as alternative types of transducers, such as a magnetic flowmeter, hot-wire anemometer, bimetallic strip, thermocouple, pressure cell, or pressure transducer. Additional details concerning transducers can be found in S. Wolf, “Guide to Electronic Measurements, and Laboratory Practice”, Prentice-Hall, Inc., pp. 414–451, (1973), which is incorporated herein by reference.
The hot-wire anemometer 19 is shown in
A flow sensor 50 formed in accordance with the present invention, which is used to measure the flow of fluid is shown in
The overall length and width of the flow sensor in the preferred embodiment, as indicated by dimension B, is approximately 5 mm. The flow sensor 50 preferably includes a paddle 54 at least partially disposed in the orifice 52. The length and width of the orifice 52 of the preferred embodiment, as indicated by dimension A, is approximately 1 mm. The width of the support member 56 in the preferred embodiment is preferably about 100 μm, as indicated by dimension D in
The surface area of the support member 56 is preferably less than that of the paddle 54 to concentrate the mechanical stress of deflection on the support member 56, and thus increase the sensitivity of the flow sensor 50. The overall size of the flow sensor 50 is preferably determined by the surface area of the paddle 54, which is adjustable in accordance with the needs and or sensitivity required for the specific control task.
The fluid to be measured is preferably directed through the orifice 52 in the flow sensor 50. The dynamic pressure provided by the fluid preferably deflects the paddle 54, which places mechanical stress on the support member 56. As shown in
This change in resistance creates a corresponding change in voltage, which is preferably provided on one or more electrical contacts or doped regions 60 coupled to the conductors 62, 64, 66, and 68, which are shown in greater detail in the exploded view of the support member 56 in
The output voltage of the Wheatstone bridge 70 is preferably proportional to the square of the volumetric flow rate; The sensitivity of the flow sensor 50 depends on the size of the orifice 52 and the size or surface area of the paddle 54, both of which are adjustable over a broad range. Thus, since the paddle 54 is preferably perpendicularly oriented to the direction of fluid flow, which is indicated by arrow C in
The stress gauges 72, 74, 76, and 78 are preferably exclusively disposed on the support member 56. The paddle 54 is preferably used exclusively for its mechanical resistance to fluid flow without any passive or active electronic components disposed thereon. Thus, the flow sensor 50 formed in accordance with a preferred embodiment of the present invention is preferably a two-part flow sensor including a standardized support member 56, which can be generically used for all such flow sensors, and a customizable paddle 54, which may be dimensionally tailored to the sensitivity requirements of a specific application without substantially changing the overall manufacturing process of the flow sensor 50.
Further, since the flow sensor 50 formed in accordance with the present invention preferably includes a full Wheatstone bridge to achieve optimal signal output and sensitivity, both positive and negative deflections must be detected by the strain gauges 72, 74, 76, and 78. Wire or foil strain gauges merely exhibit sensitivity to longitudinal stress, and thus must be disposed on both the front and rear faces, of the stressed component to detect the positive and negative deflections required by the full Wheatstone bridge. However, use of piezo-resistive stress gauges 72, 74, 76, and 78 in the flow sensor 50 formed in accordance with the present invention, which are able to detect both longitudinal and transverse stress, enable the full Wheatstone bridge 70 to be disposed on only one side of the support member 56, which significantly simplifies and reduces the cost of manufacturing the flow sensor 50 in accordance with the present invention.
From the foregoing description, it will be appreciated that the integrated fluid sensing device formed in accordance with the present invention significantly reduces measurement errors, space requirements, external tubing, connectors, fittings, and the cost of installation and maintenance of sensors that measure the physical characteristics of a fluid used to control hydraulic or pneumatic equipment. It will also be appreciated that the integrated fluid sensing device of the present invention enables sensors to be mounted on a single circuit board having common signal processing, communication, error control, and connective circuitry.
Further, it will be appreciated that the integrated fluid sensing device formed in accordance with the present invention is able to readily display and transmit data, which represents physical characteristics of the fluid used to control hydraulic and pneumatic equipment. It will also be appreciated that the integrated fluid sensing device formed in accordance with the present invention substantially encloses sensors that measure the physical characteristics of the fluid and protects these sensors from environmental hazards.
It will also be appreciated that the flow sensor formed in accordance with the present invention can readily be adapted to different flow rates without substantial change or additional cost in the manufacturing process. It will also be appreciated that the flow sensor includes a generic or standardized support member having one or more strain gauges disposed on only one side of the support member and a customizable paddle displaced by fluid flow, which does not include a strain gauge.
Although illustrative embodiments of the present invention have been described herein with reference to the accompanying drawings, it is to be understood that the invention is not limited to those precise embodiments, and that various other changes and modifications may be effected therein by one skilled in the art without departing from the scope or spirit of the invention.
This application is a divisional of co-pending U.S. application Ser. No. 10/634,606, filed Aug. 5, 2003, which is a continuation-in-part of U.S. application Ser. No. 09/666,990 filed Sep. 21, 2000, which issued as U.S. Pat. No. 6,619,142 on Sep. 16, 2003, the disclosure of which are incorporated herein by reference.
Number | Name | Date | Kind |
---|---|---|---|
3340733 | Lasher | Sep 1967 | A |
3424000 | Chelner et al. | Jan 1969 | A |
3927565 | Pavlin et al. | Dec 1975 | A |
4565098 | Herzl | Jan 1986 | A |
4729244 | Furuse | Mar 1988 | A |
4875932 | Uchiyama et al. | Oct 1989 | A |
4986127 | Shimada et al. | Jan 1991 | A |
5000226 | Stoll et al. | Mar 1991 | A |
5144843 | Tamura et al. | Sep 1992 | A |
5187984 | Mosser et al. | Feb 1993 | A |
5259248 | Ugai et al. | Nov 1993 | A |
5348047 | Stoll et al. | Sep 1994 | A |
5383470 | Kolbly | Jan 1995 | A |
5458048 | Hohner | Oct 1995 | A |
5463904 | Kalinoski | Nov 1995 | A |
5469749 | Shimada et al. | Nov 1995 | A |
5495769 | Broden et al. | Mar 1996 | A |
5511428 | Goldberg et al. | Apr 1996 | A |
5546794 | Kuhn et al. | Aug 1996 | A |
5551283 | Manaka et al. | Sep 1996 | A |
5663508 | Sparks | Sep 1997 | A |
5717147 | Basch et al. | Feb 1998 | A |
5791369 | Nishino et al. | Aug 1998 | A |
5820262 | Lechner | Oct 1998 | A |
5868159 | Loan et al. | Feb 1999 | A |
5883310 | Ho et al. | Mar 1999 | A |
5899962 | Louwagie et al. | May 1999 | A |
5965813 | Wan et al. | Oct 1999 | A |
6023969 | Feller | Feb 2000 | A |
6295874 | Strutt et al. | Oct 2001 | B1 |
6408698 | Brereton et al. | Jun 2002 | B1 |
6443328 | Fehl et al. | Sep 2002 | B1 |
6470741 | Fathollahzadeh | Oct 2002 | B1 |
6561216 | Kurosawa | May 2003 | B2 |
6615867 | Tajima et al. | Sep 2003 | B2 |
6631638 | James et al. | Oct 2003 | B2 |
20030159697 | Wallace | Aug 2003 | A1 |
Number | Date | Country |
---|---|---|
3732856 | Apr 1989 | DE |
19502499 | Aug 1996 | DE |
0087621 | Aug 1983 | EP |
0305134 | Mar 1989 | EP |
0319871 | Jun 1989 | EP |
0381775 | Aug 1990 | EP |
0561365 | Sep 1993 | EP |
1365216 | Nov 2003 | EP |
3-18735 | Jan 1991 | JP |
Number | Date | Country | |
---|---|---|---|
20050121080 A1 | Jun 2005 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10634606 | Aug 2003 | US |
Child | 11034703 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 09666990 | Sep 2000 | US |
Child | 10634606 | US |