INTEGRATED LIQUID-COOLED TEMPERATURE EQUALIZATION MODULE

Abstract

An integrated liquid-cooled temperature equalization module includes a top cover and a temperature equalization plate. The top cover includes a first flow channel, a second flow channel, a passage connecting the first and second flow channels, an inlet connecting the first flow channel for coolant flowing into the top cover, and an outlet connecting the second flow channel for coolant flowing out of the top cover. The temperature equalization plate includes a main body having a cooling zone, a tin soldering surface, and a protrusion; a first heat sink unit mounted on the cooling zone and accommodated in the first flow channel; a second heat sink unit mounted on the cooling zone and accommodated in the second flow channel; and an internal support structure accommodated in the protrusion. Accordingly, heat dissipation efficiency of the present disclosure is improved and made more uniform.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present disclosure relates to heat dissipation technology and more particularly, to an integrated liquid-cooled temperature equalization module.

2. Description of the Related Art

Some of the prior temperature equalization modules include a temperature equalization plate equipped with heat sink unit and internal support structure. However, because the top cover is secured with a locking mechanism or the temperature equalization plate and the heat sink unit are additional soldering therebetween, the heat dissipation area is undesirably reduced or the thermal resistance between the temperature equalization plate and the heat sink unit is undesirably increased, resulting in that the prior temperature equalization modules are not able to provide uniform heat dissipation and heat dissipation efficiency thereof is poor. Therefore, improvements are required.

SUMMARY OF THE INVENTION

In view of the above problems, it is an objective of the present disclosure to provide an integrated liquid-cooled temperature equalization module, which can improve heat dissipation efficiency and provide more uniform heat dissipation.

To attain the above objective, the integrated liquid-cooled temperature equalization module of the present disclosure comprises a top cover and a temperature equalization plate. The top cover includes a first flow channel, a second flow channel, a passage connecting the first flow channel and the second flow channel, an inlet connecting the first flow channel for coolant flowing into the top cover, and an outlet connecting the second flow channel for coolant flowing out of the top cover. The temperature equalization plate includes a main body having a cooling zone, a tin soldering surface, and a protrusion; a first heat sink unit mounted on the cooling zone of the main body and accommodated in the first flow channel of the top cover; a second heat sink unit mounted on the cooling zone of the main body and accommodated in the second flow channel of the top cover; and an internal support structure accommodated in the protrusion of the main body. The first heat sink unit and the second heat sink unit are located corresponding to the protrusion.

Because heat can be conducted to both the first heat sink unit and the second heat sink unit through the internal support structure, and the first heat sink unit and the second heat sink unit can then be cooled sequentially through the coolant flowing in the first flow channel and the second flow channel of the top cover to provide an alternating cooling effect, the temperature equalization module of the present disclosure can enhance heat dissipation efficiency and provide more uniform heat dissipation.

Preferably, the top cover has an upper part, a surrounding part located around the upper part, and a separating part positioned in the upper part and located within the surrounding part. The passage is formed between the separating part and the surrounding part. The surrounding part and the separating part define the first flow channel and the second flow channel.

Preferably, each of the first heat sink unit and the second heat sink unit has a plurality of fins and each fin is arranged parallel to the separating part.

Preferably, each of the first heat sink unit and the second heat sink unit has a plurality of fins integrally mounted on the cooling zone of the main body.

Preferably, the protrusion of the temperature equalization plate has a heat source contact surface.

Preferably, the integrated liquid-cooled temperature equalization module of the present disclosure further comprises a base plate having a welding surface abutting the tin soldering surface of the temperature equalization plate.

Preferably, the base plate has a through hole for accommodating the protrusion of the temperature equalization plate.

Preferably, the protrusion of the temperature equalization plate has a heat source contact surface, and the base plate has a locking surface substantially coplanar with the heat source contact surface of the temperature equalization plate.

Preferably, the base plate has a plurality of positioning pillars located around the through hole.

Preferably, the base plate has a plurality of screw holes located around the through hole.

The detailed construction, technical features, assembly, or usage of integrated liquid-cooled temperature equalization module provided by the present disclosure will be described in the detailed description of the subsequent embodiments. However, it should be understood that the detailed description and specific embodiments of the present disclosure, are given by way of illustration only and not by way of limitation, since various changes and modifications within the spirit and scope of the disclosure will become apparent to those skilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective, assembled view of an integrated liquid-cooled temperature equalization module of one embodiment of the present disclosure.

FIG. 2 is a perspective, assembled view, in another direction, of the integrated liquid-cooled temperature equalization module shown in FIG. 1.

FIG. 3 is an exploded perspective view of the integrated liquid-cooled temperature equalization module shown in FIG. 1.

FIG. 4 is an exploded perspective view of the integrated liquid-cooled temperature equalization module shown in FIG. 2.

FIG. 5 is a cross-sectional side view of the integrated liquid-cooled temperature equalization module shown in FIG. 1.

FIG. 6 is a bottom view of the integrated liquid-cooled temperature equalization module shown in FIG. 1.

FIG. 7 is a cross-sectional view of the integrated liquid-cooled temperature equalization module shown in FIG. 1 taken along line 7-7 in FIG. 5.

FIG. 8 is a cross-sectional view of the integrated liquid-cooled temperature equalization module shown in FIG. 1 taken along line 8-8 in FIG. 5.

FIG. 9 is a perspective, assembled view of an integrated liquid-cooled temperature equalization module of another embodiment of the present disclosure.

FIG. 10 is a perspective, assembled view, in another direction, of the integrated liquid-cooled temperature equalization module shown in FIG. 9.

FIG. 11 is an exploded perspective view of the integrated liquid-cooled temperature equalization module shown in FIG. 9.

FIG. 12 is an exploded perspective view of the integrated liquid-cooled temperature equalization module shown in FIG. 10.

FIG. 13 is a side view of the integrated liquid-cooled temperature equalization module shown in FIG. 10.

FIG. 14 is a bottom view of the integrated liquid-cooled temperature equalization module shown in FIG. 10.

FIG. 15 is a cross-sectional view of the integrated liquid-cooled temperature equalization module shown in FIG. 10 taken along line 15-15 in FIG. 13.

FIG. 16 is a cross-sectional view of the integrated liquid-cooled temperature equalization module shown in FIG. 10 taken along line 16-16 in FIG. 13.

DETAILED DESCRIPTION OF THE INVENTION

It is to be mentioned first that, throughout the entire specification, including the embodiments to be described below and the claims of the present disclosure, directional terms are based on the orientation in the drawings. In addition, in the embodiments and drawings to be described below, the same reference numerals represent the same or similar components or structural features.

Referring to FIGS. 1 to 8, an integrated liquid-cooled temperature equalization module 1 of one embodiment of the present disclosure comprises a top cover 10 and a temperature equalization plate 20.

The top cover 10 comprises an upper part 11, a surrounding part 12, a separating part 13, a first flow channel 14, a second flow channel 15, a passage 16, an inlet 17, and an outlet 18. The upper part 11 is flat-shaped and the surrounding part 12 is connected around the upper part 11. The separating part 13 is located within the surrounding part 12 and is connected to the upper part 11 in a way that one end of the separating part 13 is fixed to the surrounding part 12 and the other end thereof is free. The first flow channel 14 and the second flow channel 15 are thus formed respectively between the surrounding part 12 and the separating part 13, and the passage 16 is thus formed between the separating part 13 and the surrounding part 12 and is adjacent to the free end of the separating part 13. The inlet 17 and the outlet 18 are arranged on the surrounding part 12 and communicate respectively with the first flow channel 14 and the second flow channel 15.

A coolant is able to be introduced into the first flow channel 14 through the inlet 17, then flows to the second flow channel 15 through the passage 16, and finally exits through the outlet 18.

The temperature equalization plate 20 has a main body 21, three first heat sink units 23, three second heat sink units 24, and an internal support structure 25.

The main body 21 has a cooling zone 211, a tin soldering surface 212, and three protrusions 213. In addition, the main body 21 has a sealing part 22 attached to and abutted against the bottom of the surrounding part 12 of the top cover 10. Each of the first heat sink units 23 has a plurality of fins integrally mounted on the cooling zone 211 of the main body 21 and each of the second heat sink units 24 has a plurality of fins integrally mounted on the cooling zone 211 of the main body 21. Each of the protrusions 213 is located on the tin soldering surface 212 of the main body 21 and corresponds to one of the first heat sink units 23 and one of the second heat sink units 24. In addition, each of the protrusion 213 has a heat source contact surface 214. The internal support structure 25 is located inside each protrusion 213. In this embodiment, the internal support structure 25 may be a vapor chamber with capillary structure formed, for example, by a plurality of columns or wave-shaped bodies having pores. Or, the internal support structure 25 may be a vapor chamber having both capillary structure and support structure. The support structure may be a plurality of columns or wave-shaped bodies.

Both the soldering surface 212 of the main body 21 and the heat source contact surface 214 contribute to dissipating heat from object to dissipate heat. The main body 21 may also have internal support structures 25, which may or may not be in communication with the internal support structure 25 inside the protrusions 213, in locations other than the protrusions 213.

Because each first heat sink unit 23 has a plurality of fins integrally mounted on the cooling zone 211 and each second heat sink unit 24 has a plurality of fins integrally mounted on the cooling zone 211, the cooling zone 211 and each first heat sink unit 23 form a skiving fin structure and the cooling zone 211 and each second heat sink unit 24 form a skiving fin structure. Since an integral structure eliminates additional thermal resistance, direct heat transfer can be achieved for better heat dissipation.

Further, because heat can be conducted simultaneously through the internal support structures 25 to both the first heat sink unit 23 and the second heat sink unit 24, which in turn are cooled by coolant flowing sequentially through the first flow channel 14 and the second flow channel 15 of the top cover 10, a mutual cooling effect can be generated, resulting in that the integrated liquid-cooled temperature equalization module 1 of the present disclosure can provide enhanced heat dissipation efficiency and more uniform heat dissipation.

Based on the actual heat dissipation test result obtained in this embodiment, the temperatures measured at the six positions of the three heat source contact surfaces 214 each corresponding to the three first heat sink units 23 and three second heat sink units 24 range from 59.7° C. to 60.9° C. Compared to the temperatures ranging from 59.1° C. to 65.4° C. measured in a prior temperature equalization module, the present disclosure exhibits more uniform heat dissipation.

Referring to FIGS. 9 to 16, an integrated liquid-cooled temperature equalization module 1 of another embodiment of the present disclosure comprises a top cover 10, a temperature equalization plate 20, and a base plate 30. The top cover 10 and the temperature equalization plate 20 are identical to those described in the previous embodiment.

The base plate 30 has a welding surface 31, a locking surface 32, three through holes 33, twelve positioning pillars 34, twelve recessed grooves 35, and twelve screw holes 36. The welding surface 31 is welded to the tin soldering surface 212 of the temperature equalization plate 20. Each through hole 33 accommodates one of the protrusions 213 of the temperature equalization plate 20. Four of the positioning pillars 34 and four of the screw holes 36 are located around each through hole 33. Each of the positioning pillars 34 and each of the screw holes 36 contribute to positioning and fixation. Each recessed groove 35 is located at the bottom of each positioning pillar 34.

In this embodiment, the heat source contact surface 214 of the temperature equalization plate 20 is substantially coplanar with the locking surface 32 of the base plate 30; however, it should be understood that the present disclosure is not limited to the aforesaid coplanar feature and the present disclosure may not include the base plate 30.

The heat of the object to dissipate heat can be absorbed by the locking surface 32 of the base plate 30, which in turn can be transferred to the temperature equalization plate 20 via the welding surface 31 so as to accelerate the heat exchange. In addition, the internal support structure 25 assists the heat transfer between the base plate 30 and the temperature equalization plate 20. As a result, the heat dissipation efficiency can be enhanced and the heat dissipation can be more uniform, thereby achieving the purpose of the present disclosure.

It should be noted that the integrated liquid-cooled temperature equalization module 1 of the present disclosure is not limited to the embodiments described above and may be implemented as follows.

For example, the number of the first heat sink unit 23 and the second heat sink unit 24 is not specifically limited and may be more than or less than three. Or, the number of the heat source contact surface 214 is not specifically limited and may be more than or less than three. In addition, the top cover 10 may include only one flow channel, i.e., a chamber, or the first flow channel 14 and the second flow channel 15 may each be divided into a plurality of flow channels.

Claims

1. An integrated liquid-cooled temperature equalization module, comprising: a top cover including a first flow channel, a second flow channel, a passage communicating with the first flow channel and the second flow channel, an inlet communicating with the first flow channel for allowing a coolant to flow into the top cover, and an outlet communicating with the second flow channel for allowing the coolant to flow out of the top cover;a temperature equalization plate including a main body, a first heat sink unit, a second heat sink unit, and an internal support structure, wherein the main body has a cooling zone, a tin soldering surface, and a protrusion, wherein the first heat sink unit is mounted on the cooling zone of the main body and is accommodated in the first flow channel of the top cover, wherein the second heat sink unit is mounted on the cooling zone of the main body and is accommodated in the second flow channel of the top cover, wherein the first heat sink unit and the second heat sink unit correspond to the protrusion, and wherein the internal support structure is accommodated in the protrusion of the main body and located beneath the first heat sink unit and the second heat sink unit.

2. The integrated liquid-cooled temperature equalization module as claimed in claim 1, wherein the top cover includes an upper part, a surrounding part located around the upper part, and a separating part disposed on the upper part and located within the surrounding part, wherein the passage is located between the separating part and the surrounding part, and wherein the surrounding part and the separating part define the first flow channel and the second flow channel.

3. The integrated liquid-cooled temperature equalization module as claimed in claim 2, wherein each of the first heat sink unit and the second heat sink unit has a plurality of fins and each fin is arranged parallel to the separating part.

4. The integrated liquid-cooled temperature equalization module as claimed in claim 1, wherein the first heat sink unit has a plurality of fins integrally mounted on the cooling zone of the main body, and the second heat sink unit has a plurality of fins integrally mounted on the cooling zone of the main body.

5. The integrated liquid-cooled temperature equalization module as claimed in claim 1, wherein the protrusion of the temperature equalization plate has a heat source contact surface.

6. The integrated liquid-cooled temperature equalization module as claimed in claim 1, further comprising a base plate having a welding surface welded to the tin soldering surface of the temperature equalization plate.

7. The integrated liquid-cooled temperature equalization module as claimed in claim 6, wherein the base plate has a through hole for accommodating the protrusion of the temperature equalization plate.

8. The integrated liquid-cooled temperature equalization module as claimed in claim 7, wherein the protrusion of the temperature equalization plate has a heat source contact surface, and the base plate has a locking surface substantially coplanar with the heat source contact surface of the temperature equalization plate.

9. The integrated liquid-cooled temperature equalization module as claimed in claim 7, wherein the base plate has a plurality of positioning pillars located around the through hole.

10. The integrated liquid-cooled temperature equalization module as claimed in claim 7, wherein the base plate has a plurality of screw holes located around the through hole.