Patent Application
20250007221
The present disclosure relates to an Electromagnetic Interference (EMI) shield, and more particularly to an EMI shield assembly for a Printed Circuit Board Assembly (PCBA).
Electromagnetic Interference (EMI) is any unwanted noise or interference in an electrical path or circuit caused by an electromagnetic field generated from an outside source. EMI can be caused by natural events, man-made sources and inherent sources. Natural events (e.g., solar flares, lightning storms) can cause EMI to occur in electronic devices due to bombardment of highly charged particles (solar flares) or strong electrostatic discharges and magnetic pulses (lightning storms). Man-made EMI is typically caused by man-made devices, equipment and structures such as communication towers, high-voltage power lines, radar systems and other electronic equipment (such as microwave devices, cell phones, etc.).
On the other hand, inherent EMI is typically caused by a device's own internal components which can radiate energy that causes interference with other internal components. And as electronics become smaller, faster and the components are more tightly packed together, this problem is exacerbated in that the electronics are more sensitive and more susceptible to the effects of EMI. In the electronics design industry, the threat of EMI to the health of a Printed Circuit Board Assembly (PCBA) and its onboard circuitry can be critical. For more complex electronic assemblies such as critical flight and engine controls, prevention and/or mitigation of EMI effects is especially important due to the critical functional requirements of these designs/components. In fact, failure of a mission critical component can result in the loss of aircraft and/or a life. Unfortunately, however, within these assemblies, design restrictions sometimes do not allow for the full separation or encapsulation of EMI-radiating areas to shield nearby EMI-sensitive circuitry.
Historically, EMI shielding has been achieved by using covers, tapes and/or frames/heatsinks to encapsulate the radiating component, circuit or PCBA. These design solutions help to keep the radiating areas from affecting nearby EMI-sensitive circuitry. One example of a common EMI shielding approach is used for a PCBA when a connector, such as a MIL-DTL-38999 connector (See
An Electromagnetic Interference (EMI) Shielding Assembly (EISA) for a Printed Circuit Board Assembly (PCBA) is provided and includes an enclosure, wherein the enclosure defines an enclosure cavity and an electrically conductive foundation associated with PCBA having an area of interest, wherein the electrically conductive foundation at least partially surrounds the area of interest, and wherein the enclosure is securely connected to the PCBA to completely cover the area of interest and to contact the electrically conductive foundation.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the area of interest is contained within the enclosure cavity.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the enclosure is constructed from an electromagnetic shielding material.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the enclosure is constructed from a ferrite material.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the electrically conductive foundation includes a plurality of mounting surfaces located along a perimeter of the area of interest.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the electrically conductive foundation further includes at least one conductive metal trace which is located along the perimeter of the area of interest and which conductively connects the plurality of mounting surfaces.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, at least one of the plurality of mounting surfaces is configured to be connected to a ground potential.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the area of interest is a connector pin field which includes at least one connector pin that protrudes from the PCBA.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the enclosure cavity includes a cavity height, a cavity width and a cavity length, wherein the cavity height, cavity width and cavity length are sized to completely enclose and contain the connector pin field.
An Electromagnetic Interference (EMI) Shielding Assembly (EISA) for a PCBA is provided and includes an enclosure, wherein the enclosure defines an enclosure cavity and a PCBA, wherein the PCBA includes a connector pin field which includes at least one connector pin and which is external to the PCBA, and an electrically conductive foundation associated with the PCBA to at least partially surround the connector pin field, wherein the enclosure is securely connected to the PCBA to contact the electrically conductive foundation and to completely contain the connector pin field within the enclosure cavity.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the enclosure is constructed from an electromagnetic shielding material.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the enclosure is constructed from a ferrite material.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the electrically conductive foundation includes a plurality of mounting surfaces located along a perimeter of the connector pin field.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the electrically conductive foundation further includes a plurality of conductive metal traces which are located along the perimeter of the connector pin field and which conductively connect the plurality of mounting surfaces.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, at least one of the plurality of mounting surfaces is configured to be connected to a ground potential.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the connector pin field includes at least one connector pin that protrudes from the PCBA.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the enclosure cavity includes a cavity height, a cavity width and a cavity length, wherein the cavity height, cavity width and cavity length are sized to completely enclose and contain the connector pin field.
A method for shielding an area of interest on a PCBA from EMI, wherein the method includes identifying an area of interest on a PCBA design to be shielded from EMI, wherein the PCBA includes a conductive foundation configurable to a ground potential and surrounding the area of interest, locating a shielding enclosure on the PCBA to completely cover the area of interest and to be in contact with the conductive foundation and securing the shielding enclosure to the PCBA to electromagnetically seal the area of interest within the shielding enclosure.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the conductive foundation includes conductive mounting interfaces and, securing includes securing the shielding enclosure with at least one mounting device to be in contact with the conductive mounting interfaces.
In addition to one or more of the features described above, or as an alternative to any of the foregoing embodiments, the conductive foundation includes an electrically conductive trace which surrounds at least a portion of the area of interest.
The following descriptions should not be considered limiting in any way. With reference to the accompanying drawings, like elements are numbered alike:
A detailed description of one or more embodiments of the disclosed apparatus and method are presented herein by way of exemplification and not limitation with reference to the several Figures.
Referring to
In accordance with an embodiment and referring to
Referring to
It should be appreciated that in an embodiment the enclosure 102 may be constructed from a ferrite material which acts to shield the connector pin field 150 from EMI. Additionally, each of the sidewall bottom surfaces 122 may include a conductive coating and/or the foundation 104 may be constructed from a conductive material (i.e., copper, etc.) that is configured to be conductively connected to a local or system ground potential.
Referring to
An enclosure 102, having the same footprint as the foundation 104, is located on the PCBA 128 to cover the connector pin field 150, as shown in operational block 608. The enclosure 102 is located on the PCBA 128 such that the connector pin field 150 is located within the enclosure cavity 120 and such that enclosure interface surfaces 125 are aligned with and contact the mounting interfaces 132. The enclosure 102 is securely connected to the PCBA 128 via mounting devices 126, as shown in operational block 610. The enclosure 102 is securely connected to the PCBA 128 such that the sidewall bottom surfaces 122 and the enclosure interface surfaces 125 are compressingly in contact with the foundation 104 to create a seal between the enclosure 102 and the PCBA 128.
It should be appreciated that PCBA EMI shielding assembly 100 provides for a localized shield component to protect board-side connector pins from EMI threats and utilizes existing connector envelopes, mounting features and hardware. Moreover, the PCBA EMI shielding assembly 100 of the invention provides for EMI shielding of the connector pin field while providing physical protection of connector pin field using the existing connector board footprint and mounting provisions. Additionally, the invention allows for the interfacing with existing board grounding surfaces (e.g. wagon wheels, copper moating) and can be made from alternate materials to shield against different EMI field types. Furthermore, the invention eliminates the need for additional shielding features on neighboring components and PCBAs, and requires no additional hardware for installation, utilizes existing connector hardware. Moreover, the present invention provides the ability to retrofit existing designs while allowing for a common, scalable design solution for various connector sizes and shapes.
The term “about” is intended to include the degree of error associated with measurement of the particular quantity based upon the equipment available at the time of filing the application. It should be appreciated that although the invention is disclosed herein with regards to a PCBA (i.e., a PCB containing components), the invention is also applicable to a PCB (i.e., an unpopulated printed circuit board) being prepared for population with components. For example, a newly designed PCB may be designed having mounting interfaces 132, 132′, mounting cavities 130, an electrically conductive foundation 104, 104′ and/or conductive metal traces 200.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present disclosure. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprises” and/or “comprising,” when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, element components, and/or groups thereof.
While the present disclosure has been described with reference to an exemplary embodiment or embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the scope of the present disclosure. Moreover, the embodiments or parts of the embodiments may be combined in whole or in part without departing from the scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the present disclosure without departing from the essential scope thereof. Therefore, it is intended that the present disclosure not be limited to the particular embodiment disclosed as the best mode contemplated for carrying out this disclosure, but that the present disclosure will include all embodiments falling within the scope of the claims.
