Patent Grant
9277306
Embodiments of the invention relate to speakers in electronic devices. More particularly, embodiments of the invention relate to speaker enclosures/boxes for speakers in electronic devices.
The design of acoustics and speakers on electronic systems (e.g., smart phones, ULTRABOOKS™, tablets and all-in-ones) are often designed as ‘drop-in’ solutions that do not fully utilize available internal volume or achieve best/premium audio output. This leads to a compromised audio experience that in inconsistent with the trend for high quality visual experience. Thus, current audio solutions do not provide an optimal user experience. ULTRABOOK™ is a trademark of Intel Corporation in the United States and/or other countries.
Embodiments of the invention are illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings in which like reference numerals refer to similar elements.
In the following description, numerous specific details are set forth. However, embodiments of the invention may be practiced without these specific details. In other instances, well-known circuits, structures and techniques have not been shown in detail in order not to obscure the understanding of this description.
By utilizing the back-skin (chassis) of a system as one or more sides of the acoustic enclosure with a speaker improved audio performance can be achieved. Further, this can intricately grab internal volume between major system components. As a consequence weight, thickness and overall dimensions of the acoustic module are reduced while grabbing the maximum volume available between system components for acoustic advantage. By combining various chassis materials with acoustic module material (e.g., polyurethane, plastic) better acoustic performance can be achieved. Because a large ‘x’-‘y’ surface is available in case of all-in-one systems, overall vibration is dampened using this approach.
The use of this approach delivers more compact form factors with reduced thickness and/or weight or leverages existing dead system volume for an enhance audio experience. Vibration (while playing high Sound Pressure Levels) is absorbed into the chassis, which acts as a damper. The embodiments and strategies described can be used in any form factor—especially in smaller form factor devices like smartphones, tablets or ULTRABOOKS™ where available volume for acoustic module is very limited. By using these embodiments, potential increase in acoustic volume could be achieved without impacting overall system volume.
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Edges 125 of speaker enclosure section 120 engage with, or meet with, an inner surface of chassis portion 100. Thus, inner surface 130 of speaker enclosure 120 becomes an inner surface of the resulting audio enclosure. Outer surface 160 of chassis portion 100 can include any features useful for the electronic device, for example, rubber feet, cooling features, etc.
In one embodiment, chassis portion 100 includes audio enclosure edges 155 for alignment with and/or placement of speaker enclosure section 120. In one embodiment, edges 125 of speaker enclosure section 120 fit within audio enclosure edges 155 and chassis portion edge 105.
Audio enclosure 150 can be tuned in any manner known in the art. For example, the shape of various portions of chassis portion and/or speaker enclosure section 120 can be designed to give the desired audio performance.
Electronic system 400 includes bus 405 or other communication device to communicate information, and processor 410 coupled to bus 405 that may process information. While electronic system 400 is illustrated with a single processor, electronic system 400 may include multiple processors and/or co-processors. Electronic system 400 further may include random access memory (RAM) or other dynamic storage device 420 (referred to as main memory), coupled to bus 405 and may store information and instructions that may be executed by processor 410. Main memory 420 may also be used to store temporary variables or other intermediate information during execution of instructions by processor 410.
Electronic system 400 may also include read only memory (ROM) and/or other static storage device 430 coupled to bus 405 that may store static information and instructions for processor 410. Data storage device 440 may be coupled to bus 405 to store information and instructions. Data storage device 440 such as a magnetic disk or optical disc and corresponding drive may be coupled to electronic system 400.
Electronic system 400 may also be coupled via bus 405 to display device 450, such as a cathode ray tube (CRT) or liquid crystal display (LCD), to display information to a user. Alphanumeric input device 460, including alphanumeric and other keys, may be coupled to bus 405 to communicate information and command selections to processor 410. Another type of user input device is cursor control 470, such as a mouse, a trackball, or cursor direction keys to communicate direction information and command selections to processor 410 and to control cursor movement on display 450.
Electronic system 400 further may include network interface(s) 480 to provide access to a network, such as a local area network. Network interface(s) 480 may include, for example, a wireless network interface having antenna 485, which may represent one or more antenna(e). Network interface(s) 480 may also include, for example, a wired network interface to communicate with remote devices via network cable 487, which may be, for example, an Ethernet cable, a coaxial cable, a fiber optic cable, a serial cable, or a parallel cable.
In one embodiment, network interface(s) 480 may provide access to a local area network, for example, by conforming to IEEE 802.11b and/or IEEE 802.11g standards, and/or the wireless network interface may provide access to a personal area network, for example, by conforming to Bluetooth standards. Other wireless network interfaces and/or protocols can also be supported.
IEEE 802.11b corresponds to IEEE Std. 802.11b-1999 entitled “Local and Metropolitan Area Networks, Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications: Higher-Speed Physical Layer Extension in the 2.4 GHz Band,” approved Sep. 16, 1999 as well as related documents. IEEE 802.11g corresponds to IEEE Std. 802.11g-2003 entitled “Local and Metropolitan Area Networks, Part 11: Wireless LAN Medium Access Control (MAC) and Physical Layer (PHY) Specifications, Amendment 4: Further Higher Rate Extension in the 2.4 GHz Band,” approved Jun. 27, 2003 as well as related documents. Bluetooth protocols are described in “Specification of the Bluetooth System: Core, Version 1.1,” published Feb. 22, 2001 by the Bluetooth Special Interest Group, Inc. Associated as well as previous or subsequent versions of the Bluetooth standard may also be supported.
In addition to, or instead of, communication via wireless LAN standards, network interface(s) 480 may provide wireless communications using, for example, Time Division, Multiple Access (TDMA) protocols, Global System for Mobile Communications (GSM) protocols, Code Division, Multiple Access (CDMA) protocols, and/or any other type of wireless communications protocol.
In one embodiment, front chassis portion 510 includes at least a touchscreen interface for a tablet computing device. Front chassis portion 510 may also include other components of the system, for example, sensors, cameras, input/output (I/O) ports, one or more antennae, etc. As another example, top chassis portion 510 can include a keyboard and/or a track pad for interacting with a mobile computing device. Top chassis portion 510 may also include other components of the system, for example, sensors, cameras, input/output (I/O) ports, one or more antennae, etc.
In one embodiment, a device chassis portion with an inner face and an outer face can be connected with a speaker enclosure portion with an inner face, an outer face, and edges. The edges match the inner face of the device chassis portion to provide an audio enclosure when the speaker enclosure portion is aligned with and in contact with the device chassis portion.
In one embodiment, one or more speakers can be at least partially within the audio enclosure. In one embodiment, the device chassis portion includes a lip to engage the edges of the speaker enclosure portion. In one embodiment, an upper enclosure portion can connect with the device chassis portion that, when connected together enclose the speaker enclosure portion and one or more electronic components.
In one embodiment, a tablet device includes a rear chassis portion with an inner face and an outer face can be connected with a speaker enclosure portion with an inner face, an outer face, and edges. The edges match the inner face of the rear chassis portion to provide an audio enclosure when the speaker enclosure portion is aligned with and in contact with the rear chassis portion.
In one embodiment, one or more speakers can be at least partially within the audio enclosure. In one embodiment, the rear chassis portion includes a lip to engage the edges of the speaker enclosure portion. In one embodiment, an upper enclosure portion can connect with the rear chassis portion that, when connected together enclose the speaker enclosure portion and one or more electronic components.
In one embodiment, the front chassis portion includes at least a touch screen interface. In one embodiment, the front chassis portion comprises at least one antenna.
In one embodiment, a mobile computing device includes a lower chassis portion with an inner face and an outer face can be connected with a speaker enclosure portion with an inner face, an outer face, and edges. The edges match the inner face of the lower chassis portion to provide an audio enclosure when the speaker enclosure portion is aligned with and in contact with the lower chassis portion.
In one embodiment, one or more speakers can be at least partially within the audio enclosure. In one embodiment, the lower chassis portion includes a lip to engage the edges of the speaker enclosure portion. In one embodiment, an upper enclosure portion can connect with the lower chassis portion that, when connected together enclose the speaker enclosure portion and one or more electronic components.
In one embodiment, the upper chassis portion includes at least a keyboard interface. In one embodiment, the upper chassis portion includes at least a trackpad interface. In one embodiment, the front chassis portion includes at least one antenna.
Reference in the specification to “one embodiment” or “an embodiment” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase “in one embodiment” in various places in the specification are not necessarily all referring to the same embodiment.
While the invention has been described in terms of several embodiments, those skilled in the art will recognize that the invention is not limited to the embodiments described, but can be practiced with modification and alteration within the spirit and scope of the appended claims. The description is thus to be regarded as illustrative instead of limiting.
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| Number | Date | Country | |
|---|---|---|---|
| 20150189415 A1 | Jul 2015 | US |
