Integrated Thermoelectric Cooling Element and Positive Temperature Coefficient Heater

Abstract

An integrated thermoelectric cooling element and a positive temperature coefficient heating element are integrated into a single package. A heat sink is shared between the thermoelectric cooling element and the positive temperature coefficient.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a temperature regulation system, and more particularly to a solid state temperature regulation system.

2. Related Art

Solid state heating and cooling elements, such as thermoelectric cooling elements and positive temperature coefficient heating elements, have been used apart from each other in temperature regulation devices (U.S. Pat. Nos. 4,857,711, 5,138,851, 5,626,021, 5,653,741, 5,934,079, 6,263,530 and 6,486,452). Thermoelectric cooling elements with two heat sinks have been used in combination with a heating layer to regulate the temperature in a seat cushion. However, in such prior art temperature regulation systems, the heating layer is separate and apart from the thermoelectric cooling elements. These prior art systems heat up slowly and can overheat. Additionally, since the heating and cooling elements are separate from each other, there are duplicate parts which increase the overall size of the unit. Some current heating layers can overheat and may fail.

SUMMARY OF THE INVENTION

The present invention combines a thermoelectric cooling element and a positive temperature coefficient heating element into a single unit for a temperature regulation system with a simplified package. This unique combination results in a temperature regulation system that heats up quicker than current systems and has more heating power while eliminating a separate heating layer (pad) that are found in current systems. The temperature coefficient heating element is self-regulating and will not overheat while providing more durability.

Further areas of applicability of the present invention will become apparent from the detailed description provided hereinafter. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The following description of the preferred embodiment(s) is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.

As shown in the illustrations below, a temperature regulation system 19 has a thermoelectric cooling element 20 and a positive temperature coefficient heating element 22. A sandwiched heat sink 24 is attached to and situated between the thermoelectric cooling element 20 and the positive temperature coefficient heating element 22, and another heat sink 26 is preferably attached to the thermoelectric cooling element 20 on the side opposite to the sandwiched heat sink 24. In the embodiment shown in the illustrations, the positive temperature coefficient heating element 22 is attached to the heat sink 24 inside the thermoelectric cooling element housing (not shown), and closed cell foam 32 is used to insulate the positive temperature coefficient heating element 22.

The layers of the temperature regulation devices, i.e., the thermoelectric cooling element 20 and the positive temperature coefficient heating element 24, are bonded to each other using solder, epoxy or glue or are clamped together with grease or other thermal compound between the layers for good heat transfer. Generally, there should be good heat transfer characteristics for any material that is located between the positive temperature coefficient heating element 22 and the first heat sink 24. When a solder (not shown) is the bonding element between the layers, the melting temperature of the solder should be higher than the operating temperature of the positive temperature coefficient heating element 22 and should also be lower than the melting temperature of the solder used within the thermoelectric cooling element 20 (or between the thermoelectric cooling element and the sandwiched heat sink).

The temperature regulation system 19 includes blower (not shown) in operative communication with the thermoelectric cooling element 20 and the positive temperature coefficient heating element 22. The blower provides air to an air distribution insert (not shown).

The entire temperature regulation system 19 package can be built into the cushions for a seat.

As various modifications could be made to the exemplary embodiments, as described above with reference to the corresponding illustrations, without departing from the scope of the invention, it is intended that all matter contained in the foregoing description and shown in the accompanying drawings shall be interpreted as illustrative rather than limiting. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims appended hereto and their equivalents.

Claims

1. A temperature regulation device, comprising a thermoelectric cooling element;a positive temperature coefficient heating element; anda first heat sink attached to and situated between said thermoelectric cooling element and said positive temperature coefficient heating element.

2. The temperature regulation device set forth in claim 1, further comprising a foam insulating said positive temperature coefficient heating element.

3. The temperature regulation device set forth in claim 2, wherein said foam is comprised of a closed cell foam.

4. The temperature regulation device set forth in claim 1, wherein said thermoelectric cooling element further comprises a housing and wherein said positive temperature coefficient heating element is attached to said heat sink within said housing.

5. The temperature regulation device set forth in claim 1, further comprising a heat transfer layer between said positive temperature coefficient heating element and said first heat sink.

6. The temperature regulation device set forth in claim 5, wherein said heat transfer layer is selected from the group consisting of a solder, an epoxy, a glue, a grease, a thermal compound, and any combination thereof.

7. The temperature regulation device set forth in claim 1, further comprising a bonding element between said positive temperature coefficient heating element and said first heat sink, said bonding element being selected from the group consisting of a solder, an epoxy and a glue.

8. The temperature regulation device set forth in claim 1, further comprising a second heat sink attached to said thermoelectric cooling element opposite said first heat sink.

9. The temperature regulation device set forth in claim 1, further comprising a blower in operative communication with said thermoelectric cooling element and said positive temperature coefficient heating element.

10. The temperature regulation device set forth in claim 1, further comprising an air distribution fiber insert.

11. A temperature regulation system for a seat cushion, comprising a thermoelectric cooling element;a positive temperature coefficient heating element;a first heat sink attached to and situated between said thermoelectric cooling element and said positive temperature coefficient heating element; anda blower in operative communication with said thermoelectric cooling element and said positive temperature coefficient heating element.