The subject matter herein relates generally to interconnect devices for use between opposed arrays of contacts.
Interconnect devices are used to provide electrical connection between two or more opposing arrays of contacts for establishing at least one electrical circuit, where the respective arrays may be provided on various electrical components such as devices, printed circuit boards, Pin Grid Arrays (PGAs), Land Grid Arrays (LGAs), Ball Grid Arrays (BGAs), and/or the like. In one interconnect technique, the electrical connection is provided by an interconnect device that is physically interposed between corresponding electrical contacts of the opposing arrays of contacts.
At least some known interconnect devices use a plastic frame that defines a socket that receives an electrical component having one of the arrays of contacts. The plastic frame has deflectable spring fingers that locate the package in the socket. Such plastic frames are not without disadvantages. For example, as electrical components become smaller and smaller, the available space within the socket for holding and locating the electrical component also becomes smaller. The working range of the spring fingers may be inadequate for such smaller spaces such that the spring fingers lack the necessary compliance to both enable the electrical component to be inserted into the socket and also provide a sufficient spring force to hold and locate the electrical component within the socket. In other words, insertion of the electrical component into the socket may over-deflect the spring fingers past the working range thereof such that the spring fingers fail to exert a spring force that is sufficient to properly hold and locate the electrical component within the socket.
In one embodiment, an interconnect device includes a contact assembly having a carrier holding an array of conductors. Each of the conductors is configured to provide an electrical path between first and second electrical components such that the conductors electrically interconnect the first and second electrical components. The interconnect device also includes a frame defining a receiving space configured to receive the first electrical component therein. The frame includes corner frames that are configured to engage in physical contact with the first electrical component to locate the first electrical component within the receiving space. Each of the corner frames includes a base and an engagement member configured to engage in physical contact with the first electrical component as the first electrical component is received into the receiving space. The engagement member is configured to be resiliently deflected toward the base in a compliance direction via engagement with the first electrical component. Opposing spring beams mechanically connect the engagement member to the base. The spring beams are configured to spread apart from each other as the engagement member is deflected in the compliance direction.
In another embodiment, an interconnect device includes a contact assembly having a carrier holding an array of elastomeric columns. Each of the elastomeric columns is electrically conductive and is configured to provide an electrical path between first and second electrical components such that the elastomeric columns electrically interconnect the first and second electrical components. The interconnect device includes a frame defining a receiving space configured to receive the first electrical component therein. The frame includes corner frames that are configured to engage in physical contact with the first electrical component to locate the first electrical component within the receiving space. Each of the corner frames includes a base and an engagement member configured to engage in physical contact with the first electrical component as the first electrical component is received into the receiving space. The engagement member is configured to be resiliently deflected toward the base in a compliance direction via engagement with the first electrical component. Opposing spring beams mechanically connect the engagement member to the base. The spring beams are configured to spread apart from each other as the engagement member is deflected in the compliance direction.
In another embodiment, an interconnect device includes a contact assembly having a carrier holding an array of conductors. Each of the conductors is configured to provide an electrical path between first and second electrical components such that the conductors electrically interconnect the first and second electrical components. The interconnect device includes a frame defining a receiving space configured to receive the first electrical component therein. The frame includes at least one corner frame configured to engage in physical contact with the first electrical component to locate the first electrical component within the receiving space. The at least one corner frame comprises a base and an engagement member configured to engage in physical contact with the first electrical component as the first electrical component is received into the receiving space. The engagement member is configured to be resiliently deflected toward the base in a compliance direction via engagement with the first electrical component. Opposing spring beams mechanically connect the engagement member to the base. Each spring beam includes a base segment that extends outward from the base and a member segment that extends outward from the engagement member and is mechanically connected to the base segment. The base and member segments are angled with respect to each other at an angle that reduces as the engagement member is deflected in the compliance direction.
In the illustrated embodiment, the first electrical component 12 is an electronic package (such as, but not limited to, a chip, a processor, an integrated circuit, and/or the like) and the second electrical component 14 is a printed circuit board. In an exemplary embodiment, the interconnect device 16 constitutes a socket that is mounted to the printed circuit board and is configured to receive an electronic package. In other embodiments, other types of electrical components may be interconnected by the interconnect device 16. For example, both the first and second electrical components 12 and 14 may be printed circuit boards.
The first electrical component 12 includes a plurality of side edges 18 that intersect at corners 20 of the first electrical component 12. Each corner 20 includes a portion of the two corresponding side edges 18 that intersect at the corner 20. In the illustrated embodiment, the first electrical component 12 has a rectangular shape such that the first electrical component 12 includes four side edges 18 and four corners 20. But, the first electrical component 12 may have any other shape, any other number of side edges 18, and any other number of corners 20.
The interconnect device 16 includes a contact assembly 22 that is used to electrically interconnect the first and second electrical components 12 and 14. For example, the contact assembly 22 is configured to engage the arrays of contacts of the first and second electrical components 12 and 14. The contact assembly 22 has a first mating interface 24 and a second mating interface 26. The first mating interface 24 is configured to be electrically connected to the first electrical component 12. The second mating interface 26 is configured to be electrically connected to the second electrical component 14.
The contact assembly 22 of the interconnect device 16 includes an insulative carrier 28 holding an array of conductors 30. In the illustrated embodiment, the conductors 30 are elastomeric columns and may be referred to hereinafter as elastomeric columns 30. Other types of conductors may be used in alternative embodiments to define electrical paths through the contact assembly 22. For example, in addition or alternatively to the elastomeric columns 30, the conductors 30 may include electrical vias, electrical traces, solder balls, rigid metallic columns, electrical contacts, resiliently deflectable spring beams, pins, contact pads, and/or the like).
The insulative carrier 28 is fabricated from an insulative material, such as, but not limited to, a polyimide material that may be arranged as a polyimide film (e.g., a Kapton® material). The insulative carrier 28 may additionally or alternatively be fabricated from other insulative materials. The insulative carrier 28 may have one or more layers. For example, the insulative carrier 28 may have coverlays and bonding layers on first and second sides 32 and 34 of the carrier 28 that surround the elastomeric columns 30. The coverlays limit compression of the elastomeric columns 30. In some embodiments, the insulative carrier 28 is a printed circuit board.
The elastomeric columns 30 are arranged in an array having a predetermined pattern or layout that corresponds to the array of contacts of the first electrical component 12 and the second electrical component 14. The elastomeric columns 30 extend outward from both the first and second sides 32 and 34 of the insulative carrier 28. The elastomeric columns 30 extend between first ends 36 and second ends (not shown) that are opposite the first ends 36. In an exemplary embodiment, the elastomeric columns 30 are frustoconically shaped, being wider about the mid-section and narrower at the ends 36 thereof. But, the elastomeric columns 30 may additionally or alternatively include any other shape. The elastomeric columns 30 are held at the mid-sections by the insulative carrier 28. In an exemplary embodiment, the elastomeric columns 30 are electrically conductive elastomeric columns, such as, but not limited to, metalized particle interconnects (e.g., columns fabricated from a mixture of an elastic material and conductive flakes, and/or the like), columns having one or more internal and/or external electrical conductors (e.g., traces, pins, contacts, pads, vias, and/or the like), and/or the like. The elastomeric columns 30 provide conductive, electrical paths between the first ends 36 and the second ends thereof. Accordingly, when the mating interfaces 24 and 26 of the interconnect device 16 are mated with, and thereby electrically connected to, the electrical components 12 and 14, respectively, the elastomeric columns 30 provide electrical paths between the electrical components 12 and 14 such that the elastomeric columns 30 electrically interconnect the electrical components 12 and 14. The elastomeric columns 30 are at least partially compressible, for example when the first electrical component 12 is mounted to the contact assembly 22. In some embodiments, one or more metallic covers (not shown) are provided over the first ends 36 and/or the second ends of the elastomeric columns 30.
The interconnect device 16 includes a frame 38 having a plurality of corner frames 40. The corner frames 40 are separate from one another. The corner frames 40 define a receiving space 42 that receives the first electrical component 12. The corner frames 40 are configured to be mounted to the insulative carrier 28, such as, but not limited to, using one or more fasteners, latches, clips, clamps, posts, eyelets, and/or the like. In the illustrated embodiment, the corner frames 40 are configured to be mounted to mounting ears 41 of the insulative carrier 28. But, the corner frames 40 may additionally or alternatively be mounted to any other location along the insulative carrier 28. The corner frames 40 are configured to engage in physical contact with the first electrical component 12 to locate the first electrical component 12 within the receiving space 42. Specifically, and as will be described in more detail below, the corner frames 40 include resiliently deflectable engagement members 44 that engage in physical contact with corresponding corners 20 of the first electrical component 12. Although two are shown, the frame 38 may include any number of corner frames 40 necessary to engage the particular shape and/or configuration of the first electrical component 12. Each corner frame 40 may be formed from any materials, such as, but not limited to, a polymer, a plastic, a thermoplastic, a thermoset, a polyimide, a polyamide, polyetherimide, glass-filled polyetherimide, polyether ether ketone (PEEK), a metal, and/or the like.
In the illustrated embodiment, the engagement member 44 includes a receiver socket 64 that is configured to receive a corresponding corner 20 (
The engagement member 44 is not limited to having the receiver socket 64 for receiving a corner 20 of the first electrical component 12 therein. Rather, in some alternative embodiments, the engagement member 44 is configured to engage in physical contact with only one of the side edges 18 of the first electrical component 12. Moreover, the receiver socket 64 is not limited to having two discrete engagement surfaces 66 and 68 that are angled with respect to each other. Rather, instead of the angled shape shown in the exemplary embodiment, the receiver socket 64 may include a curved shape to accommodate embodiments wherein the first electrical component 12 has a curved shape (whether or not the curved shape received by the receiver socket 64 is a corner of the first electrical component 12). For example, the engagement surfaces 66 and 68 may define a continuous surface having a continuous radius of curvature to accommodate embodiments wherein the first electrical component 12 has a circular shape. Moreover, and for example, the engagement surfaces 66 and 68 may define a continuous surface having a non-continuous radius of curvature to accommodate embodiments wherein the first electrical component 12 has an oval shape.
Optionally, the engagement surfaces 66 and/or 68 of the engagement member 44 include guide features 70 that facilitate guiding the corresponding corner 20 of the first electrical component 12 into the receiver socket 64. In the illustrated embodiment, the guide feature 70 is a chamfer 70a. But, the guide feature 70 may include any other structure in addition or alternatively to the chamfer 70a.
Each of the spring beams 52a and 52b is a resiliently deflectable spring that is shown in
As can be seen in
The base segment 76 of each spring beam 52 extends a length from the base 50 to the member segment 78, which extends a length from the base segment 76 to the engagement member 44. In the illustrated embodiment, the base segment 76 and the member segment 78 of the spring beam 52a have approximately the same length, and the base segment 76 and the member segment 78 of the spring beam 52b have approximately the same length, as can be seen in
Referring again to
Referring again to
The corner frame 40 may include one or more fasteners 88 for securing the corner frame 40 to the insulative carrier 28. In an exemplary embodiment, the fasteners 88 are formed integral with the mounting platform 82 and/or the base 50. For example, the fasteners 88 may be injection molded along with all or a portion of the remainder (e.g., the mounting platform 82, the base 50, the engagement member 44, and/or the spring beams 52) of the corner frame 40. Alternatively, the fasteners 88 are discrete components that are coupled or otherwise affixed to the mounting platform 82 and/or the base 50. In the illustrated embodiment, the fasteners 88 are eyelets that may be forged or swaged (i.e., cold staked) to corresponding openings 89 (
As the first electrical component 12 (
In the illustrated embodiment, the spring beams 52a and 52b spread apart from each other in respective directions B and C that are approximately perpendicular to the compliance direction A. However, the spring beams 52a and 52b may spread apart from each other in any other transverse directions relative to the compliance direction A. The deflection of the engagement member 44 and the spring beams 52 operates similar to a conventional scissor jack (not shown) in that the corners 74 spread apart and the angle θ reduces as the engagement member 44 deflects in the compliance direction. The amount of deflection of the engagement member 44 in the compliance direction A shown in
Although shown as including two corner frames 40a and 40b, the frame 38 may include additional corner frames 40. For example, the frame 38 may include a corner frame 40 that engages in physical contact with a corner 20c of the first electrical component 12 and/or the frame 38 may include a corner frame 40 that engages in physical contact with a corner 20d of the first electrical component 12. In some embodiments, the corner frames 40 are not limited to engaging opposite corners 20 of the first electrical component 12. For example, the frame 38 may include two corner frames 40 that engage in physical contact with two adjacent corners 20 (e.g., the corners 20a and 20c) of the first electrical component 12. In some embodiments, the frame 38 may include only a single corner frame 40 which could be used in concert with a standard-sized center biased frame in the opposite corner as the corner frame 40. Moreover, the frame 38 could include one or more corner and/or side edge members (not shown) that includes a rigid engagement member that engages in physical contact with a corresponding corner 20 and/or one or more corresponding side edges 18 of the first electrical component 12 without resiliently deflection. For example, such corner and/or side edge members may be positioned opposite a corner frame 40.
The embodiments described and/or illustrated herein may provide a frame having an engagement member that has sufficient compliance to enable an electrical component to be inserted into a receiving space of the frame while also providing a sufficient spring force to hold and locate the electrical component within the receiving space. The embodiments described and/or illustrated herein may provide a frame that is capable of holding and locating an electrical component within a smaller receiving space than the frames of at least some known interconnect devices.
As used herein, an element or step recited in the singular and proceeded with the word “a” or “an” should be understood as not excluding plural of said elements or steps, unless such exclusion is explicitly stated. Furthermore, references to “one embodiment” or “an embodiment” are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features. Moreover, unless explicitly stated to the contrary, embodiments “comprising” or “having” an element or a plurality of elements having a particular property may include additional elements not having that property.
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The scope of the invention should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means—plus-function format and are not intended to be interpreted based on 35 U.S.C. §112, sixth paragraph, unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
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