Patent Application
20080132097
1. Field of the Invention
This invention relates to electrical interconnecting components, and particularly to interconnecting devices that are constructed using ring-chain style configurations.
2. Description of Background
Before our invention, conventionally, multi-chip mounted (MCM) packages were constructed by connecting semiconductor processing chips to a system board using high-density interconnection substrates that typically comprised cinch buttons. Specifically, the cinch buttons were used to facilitate the connection between the processing chip and the system board. Typically, cinch buttons are composed of a contact, the contact being used to electrically connect the processing chip to the system board. The contact typically has a cylindrical shape, with a section of electrically conductive wire wound within the inside of the cylinder. Further, the contact can be compressed elastically over an axial displacement area when connected between the processing chip and the system board. However, the uses of cinch buttons as an interconnection solution have been problematic. MCMs constructed using cinch buttons run the risk of having electrical shorts, or open connection problems occur between the processing chip and the system board due to the physical composition of the cinch button. Therefore, there exists a need for an interconnection apparatus that has a more reliable contact feature mechanism than a conventional interconnection apparatus.
The shortcomings of the prior art are overcome and additional advantages are provided through the provision of a connector component for the electrical interconnection of electrical components, the connector component comprising a framing segment, wherein the framing segment is a planar surface having a top surface and a bottom surface, a planar grid, having a top planar surface and a bottom planar surface, constructed from a plurality of contact support cores, rails, and conductive annular cylinders, wherein the conductive annular cylinders comprise an outside surface, the outside surface area of the conductive annular cylinders further comprising a predetermined geometric configuration, the rails are formed with a plurality of holes that are spaced a predetermined distance apart from one another along length of the body of the rail, and the plurality of contact support cores longitudinally extending through the holes that are formed within the plurality rails and the conductive annular cylinders, the rails and conductive annular cylinders being positioned along the length of a contact support core so that a conductive annular cylinder is positioned in the spacing between rails, further, the plurality conductive annular cylinders physically protrude beyond the width of the bodies of the plurality rails to form a conductive contact area surface, and further, the bottom surface of the planar grid is mechanically mounted to the top surface of the framing segment.
Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with advantages and features, refer to the description and to the drawings.
The subject matter that is regarded as the invention is particularly pointed out and distinctly claimed in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
The detailed description explains the preferred embodiments of the invention, together with advantages and features, by way of example with reference to the drawings.
One or more exemplary embodiments of the invention are described below in detail. The disclosed embodiments are intended to be illustrative only, since numerous modifications and variations therein will be apparent to those of ordinary skill in the art. In reference to the drawings, like numbers will indicate like parts continuously throughout the view.
Currently, metal on elastomer electrical connector configurations are well known designs in the art. The design of the present invention is novel due in part to its structural configuration. The performance characteristics of the present invention as an electrical interconnecting apparatus are enhanced by the structural configuration of the present invention (e.g., by providing improved AC and DC electrical conduction characteristics). The size and mass of the electrically conductive component contacts of the present invention have the capability to efficiently conduct a current, while keeping crosstalk to a minimum. Specifically, the electrical current conducting characteristics of the present invention is enhanced due to the geometry (i.e., a continuous loop) of the electrically conductive components comprised within the electrical connector as disclosed within the present invention. Further, based upon the length of the electrically conductive contact, the electrically conductive connectors provides low signal attenuation, in addition to low crosstalk between signals, due in part to the length of the electrically conductive contacts, and because there is no overlap of the electrically conductive contacts that are implemented within aspects of the present invention.
Aspects of the present invention are constructed utilizing electrically conductive contacts made of beryllium copper (BeCu) that are plated with gold. The construction of this component is not limited to beryllium copper; therefore similar conductive materials may be utilized to craft the conductive contacts. Within the present invention the electrically conductive contacts can comprise a ring or sleeve (bushing) shape, however, the electrically conductive contacts are not limited to these two shapes. The electrically conductive contacts are mounted onto and supported by a contact support core such that the electrically conductive contacts can be compressed between two surfaces in one direction against the contact support core. Accordingly, when the force is removed from the electrically conductive contacts, the contact support core expands, and therefore the electrically conductive contacts return to their original shape.
Aspects of the current invention provide for the constructing of a conductive array grid, wherein the grids are comprised of an array of contact support cores with several electrically conductive contacts mounted upon each contact support core, thus producing an array of rows and columns of electrically conductive contacts. As configured, the contact support cores align the electrically conductive contacts with the electrical pads contained on the surfaces of the system processor and the system board that are to be connected. As shown in
It will be seen that in
The contact support cores 215 are fabricated from a silicone elastomer. Silicone was chosen due for the construction of the contact support cores 215 due to its elasticity, electrical resistance, resistance to take a set, and wide range of temperatures to which it can be exposed while maintaining these characteristics. However, the construction of the contact support cores 215 of the present invention is not limited to silicone, as any compliant material can be used that meets the above-mentioned requirements. Within aspects of the present invention, the contact support cores 215 comprise a longitudinal length; wherein the width of the contact support cores 215 can be configured to comprise a variety of geometric cross-sectional shapes (e.g., circular, triangular, square or cross-beam shapes). A foremost concept of the present invention is to provide a contact support core 215 that is constructed from an elastomer, the contact support core 215 being utilized to provide support and retention spring properties to the electrically conductive contacts 210 that it supports.
The rails 205 are required to be fabricated from a hard, non-conductive material. The rails 215 are used to align the contact support cores 215 in such a way that the spacing of the contacts points of the grid 200 are consistent with that of the electrical pads located on a system processor and system board. As mentioned above, the electrically conductive contacts 210 are fabricated from beryllium copper (BeCu) because of the materials excellent electrical conducting, and physical springing deformation characteristics. The combination of the material an electrically conductive contact 210 is made of, the thickness of the electrically conductive contact 210, and the rigidity of the elastomer contact support core 215 allow for a wide range of adaptability in defining the force required to compress an electrically conductive contact 210.
The electrically conductive contacts 210 can comprise the geometry of an annular cylinder (e.g., a bushing, or for increased contact area, a ring for increased force at the point of contact). This configuration additionally provides for the improved physical contact between the connector 100, a system processor 105 and a system board 110, even in the event that oxidation, or contaminations are present, thus ensuring an excellent electrical connection. The electrically conductive contacts 210 are constructed to comprise a continuous piece of material, thus allowing for a higher current carrying capacity. As shown in
Further, as shown in
Further shown in
While the preferred embodiment to the invention has been described, it will be understood that those skilled in the art, both now and in the future, may make various improvements and enhancements which fall within the scope of the claims which follow. These claims should be construed to maintain the proper protection for the invention first described.
