This patent document pertains generally to implantable leads for linking implantable medical devices with selected body tissue to be sensed or stimulated by such devices. More particularly, but not by way of limitation, this patent document pertains to interconnections of implantable lead conductors and electrodes and reinforcement therefor.
Implantable leads represent the electrical link between an implantable medical device (often referred to simply as “IMD”) and a subject's cardiac or other tissue, which is to be sensed or stimulated. An implantable lead may include a single or multiple conductors that are connected to an electrode or an electrode assembly at a lead intermediate portion or a lead distal end portion. A connector is included at a lead proximal end portion to form an electrical connection (via the conductor(s)) between the electrode or electrode assembly and the IMD.
Over the years, a large number of different mechanisms and methods for interconnecting conductors and electrodes have been proposed. It is desirable that such connections between the conductor and the electrode provide a highly reliable electrical connection, with good mechanical properties including high tensile strength. It is also desirable that such connections allow for the lead assembly itself to retain a high degree of tensile strength through the area of the electrode. This is because cardiac (and other) leads undergo considerable stresses due to repetitive flexing caused by, for example, the motion of a beating heart and forces applied to the lead during an implantation, repositioning, or lead extraction procedure.
Typically, conductors in commercially marketed pacing and defibrillation leads have taken the form of single or multi-filar wire coils. Recently, there has been a high level of interest in designing leads having lead bodies with a reduced size (i.e., lead body diameter) or additional electrodes. One way to reduce to lead body size is to employ stranded wire conductors such as cables in lieu of coiled wire conductors. However, such stranded wire conductors present new challenges not faced by the use of coiled wire conductors. As one example, it has been a great challenge to electrically and reliably connect a small multi-strand conductor cable (often times having a cable outer diameter on the order of thousandths of an inch) to a ring electrode or a multi-filar shock coil electrode. Being of such small size, the connection is a very difficult one to make and fragile, if made incorrectly.
With respect to single or multi-filar wire coiled conductors, when such conductors are used to electrically connect a distal (tip) electrode to the IMD, portions of the distal electrode typically are polymer bonded (e.g., via an adhesive) to provide additional axial strength to the electrode. However, even with such additional polymer-provided strength, the distal electrode/lead body connection may still fall short of the axial strength necessary to resist permanent deformation or in order to pass industry standards (e.g., CEN/CENELEC 45502-2-1, §23.3).
An implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion, with a lead intermediate portion therebetween. The lead body includes one or more longitudinally extending lumens. A conductor is received in, and extends along, a first lumen. An electrically conductive interposer, coupled with the conductor, is also received, at least in part, in the first lumen. The implantable lead further comprises a tubular electrode that is co-axial with, and overlays portions of, the leady body. In varying examples, a portion of a first lumen wall compressively urges the interposer toward an inner surface of the tubular electrode.
Another implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion. The lead body includes an internal longitudinally extending lumen. A ring member is disposed within the lumen such that a portion of the ring member extends through a hole or slit (collectively termed “aperture”) in a lumen wall. A conductor is received in, and extends along, the lumen. A distal end portion of the conductor is drawn adjacent to an outer surface of the ring member and electrically coupled thereto. The implantable lead further comprises a tubular electrode that is co-axial with, and overlays portions of, the lead body. The tubular electrode is electrically coupled with the conductor via the ring member.
Yet another implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion, with at least one of a lumen or a slit therein. The lead comprises a first and a second conductor along with an electrically conductive connector. The electrically conductive connector includes a first end portion coupled with the first conductor and a second end portion coupled with the second conductor. The electrically conductive connector is received in the lumen or slit of the lead body. The lead further comprises a securing member disposed and deformed around a portion of one or both of the first conductor of the second conductor.
A further implantable lead comprises a lead body extending from a lead proximal end portion to a lead distal end portion, with a lead intermediate portion therebetween. The lead body includes at least a first and a second internal longitudinally extending lumens. A conductor is received in, and extends along, the first lumen and electrically couples to a distal electrode at the lead distal end portion. An axial support member is received in the second lumen and extends from an axial support member proximal end portion to an axial support member distal end portion. A first retaining member engaged with the lead body is coupled with the axial support member proximal end, while a second retaining member engaged with the distal electrode is coupled with the axial support member distal end.
The leads and methods described herein provide numerous advantages over conventional lead designs including secure electrical and mechanical connection between a conductor, such as a small multi-strand conductor cable, and an electrode (e.g., a ring electrode or a multi-filar shock coil electrode). In addition, the leads and methods provide axial reinforcement between a distal electrode and a lead body. Furthermore, the leads and methods allow for the creation of a small-sized lead (e.g., sub-5 French), which advantageously provides for easier and deeper lead delivery and lower sensing/stimulating thresholds. In one such example, the present leads and methods provide a small-sized lead with multiple conductors and electrodes. Multiple conductors and electrodes allow for electrode switching to prevent extra bodily tissue stimulation and optimize a variety of other sensing/stimulating related parameters (e.g., parameters relating to the selection of electrodes/vectors with the best thresholds, or optimizing hemodynamics) as further described in Hansen, et al., U.S. patent application Ser. No. 11/230,989, titled “MULTI-SITE LEAD/SYSTEM USING A MULTI-POLE CONNECTION AND METHODS THEREFOR,” filed Sep. 20, 2005, which is hereby incorporated by reference in its entirety.
Several other advantages are also made possible by the present leads and methods. In some examples, the leads and methods reduce or eliminate the reliance on adhesives to couple a conductor to an electrode. Advantageously, by reducing or eliminating reliance on adhesives, manufacturing efficiency can be increased (e.g., may not need to wait for adhesives to cure), and conductor/electrode joint failure caused by adhesive bond strength decreasing over time (e.g., due to reactions with bodily fluids or improper adhesive preparation) can be reduced or eliminated. These and other examples, aspects, advantages, and features of the leads and methods described herein will be set forth in part in the detailed description, which follows, and in part will become apparent to those skilled in the art by reference to the following description of the present leads and methods, and drawings or by practice of the same.
In the drawings, which are not necessarily drawn to scale, like numerals describe similar components throughout the several views. The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed in this patent document.
The following detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the present leads and methods may be practiced. These embodiments, which are also referred to herein as “examples,” are described in enough detail to enable those skilled in the art to practice the present leads and methods. The embodiments may be combined or varied, other embodiments may be utilized or structural or logical changes may be made without departing from the scope of the present leads and methods. It is also to be understood that the various embodiments of the present leads and methods, although different, are not necessarily mutually exclusive. For example, a particular feature, structure or characteristic described in one embodiment may be included within other embodiments. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present leads and methods are defined by the appended claims and their equivalents.
In this document the terms “a” or “an” are used to include one or more than one; the term “or” is used to refer to a nonexclusive or, unless otherwise indicated; and the term “subject” is used synonymously with the term “patient.”
Leads and methods discussed herein advantageously provide for secure electrical and mechanical connections between a conductor and an electrode or a conductor and another conductor, while further providing a small lead body diameter. In one example, a lead includes a (cable) conductor/electrode connection design using the compressive or elastic nature of a (polymer) lead body in conjunction with an appropriately (larger) sized electrically conductive interposer (e.g., metallic tube). In another example, a lead includes a (coil) conductor/electrode connection design using a ring member. In yet another example, a lead includes a conductor/conductor connection design using an electrically conductive connector couplable with a first conductor on a first end and couplable with a second conductor on a second end. In a further example, a lead includes an axial support member to reinforce a connection between a distal electrode and (a portion of) the lead body.
Turning now to the drawings, and initially to
In the examples shown in
As shown in
In the example shown in
Advantageously, the present leads and methods provide for secure electrical and mechanical connection between conductors 602 (cable) or 604 (coil) (both shown in
In this example, electrically conductive interposer 614 is a metal tube that is coupled with conductor 602 and inserted into the at least one lumen (e.g., 610) having an urging size and shape. The coupling between electrically conductive interposer 614 and conductor 602 may be performed by, among other techniques, crimping, swaging, welding, or brazing. In one such example, as shown in
In the example of
The distal end portion of conductor 604 may be coupled to ring member 706 using one or more of a variety of techniques. In one example, conductor 604 is coupled to ring member 706 by first urging conductor 604 over a slightly larger diameter ring member 706. In another example, a securing member 702 is disposed around the distal portion of conductor 604 and ring member 706 and deformed, such as by crimping, (rotary) swaging, welding, or brazing. Rotary swaging is a metal forming process for the diametrical reduction of annular securing members, such as bars, tubes, wires, etc. In this example, securing member 702 is deformed over the distal end portion of conductor 604 thereby coupling the conductor 604 to ring member 706. As shown in
In the example of
Electrically conductive connector 902 includes a first end portion 904 couplable with first conductor 604A and a second end portion 906 couplable with second conductor 604B. In the example shown, electrically conductive connector 902 includes one or more internal grooves (or threads) 908. In another example, electrically conductive connector 902 includes one or more external grooves (or threads). Conductors 604A, 604B may be further secured (i.e., in addition to the one or more grooves) to electrically conductive connector 902 by rotary swaging, laser or resistance welding, brazing, mechanical swaging, or crimping. In one example, conductors 604A, 604B are further secured to electrically conductive connector using a securing member disposed and deformed around a portion of the conductors by rotary swaging techniques. In examples in which one or both of first conductor 604A or second conductor 604B are coupled via one or more external grooves (such as those associated with screw threads), shrink tubing or a compressive/elastic lead body 202 (
To provide additional axial strength to the distal electrode 208D/conductor 604 connection joint, lead 104 (
Many options are possible for reinforcement design 1000. In one example, axial support member 1002 is a cable. In another example, first 1012 and second 1014 retaining members include at least one of a crimped tube, a swaged tube, a welded tube, or a brazed tube (i.e., a couplable tube). In one such example, distal electrode 208D is placed over an outer surface of the crimped or swaged tube and laser welded thereto. In another example, an outer diameter of first retaining member 1012 is greater than a diameter of second lumen 1006 (see
At 1108, the electrically conductive interposer is inserted into the first lumen such that the conductor is located therewithin (i.e., the (tubular) interposer is slid onto at least a portion of the conductor). At 1110, the electrically conductive interposer is coupled to the conductor. This may initially include, among other things, removing an insulative coating on an outer side of the conductor. In one example, the electrically conductive interposer is coupled to the conductor via crimping, swaging, welding, or brazing. In one such example, the electrically conductive interposer is crimped to the conductor such that an outer surface of the electrically conductive interposer mates with (a sized and shape of) an inner surface of the tubular electrode, thereby providing a more conducive juncture for the process of 1112.
At 1112, the conductor is slightly pulled from a conductor proximal end or an interposer distal end is pushed into the exposing hole or slit so that the interposer is fully within the outer boundaries of the lead body. Optionally, at 1114, a removable expanding mandrel may be disposed into a second lumen to urge the interposer outward toward the inner surface of the tubular electrode. At 1116, the interposer is coupled to the inner surface of the tubular electrode via welding, brazing, conductive adhesives, or other suitable techniques.
The conductor may be coupled to the ring member using a variety of techniques (see, e.g., 1210, 1216, and 1218). A first technique includes a securing member being disposed around the distal end portion of the conductor and the ring member (at 1210). Optionally, at 1212, one or more grooves or threads may be formed on the ring member. At 1214, the securing member is deformed over the conductor for coupling purposes. In one such example, portions of the securing member are pushed into or over the one or more grooves or threads. A second technique includes using a conductive adhesive to couple the conductor to the ring member (at 1216). A third coupling technique includes forming one or more grooves or threads on the ring member (at 1218) and urging the conductor onto the one or more grooves or threads (at 1220). Such urging may come by way of the compressive nature of the lead body or a removable preformed mandrel. In addition, the conductor may be coupled to the ring member using only urging forces, such as the compressive nature of the lead body or through the use of the removable preformed mandrel.
At 1222, a tubular electrode co-axial with the lead body is overlaid on portions thereof. In one example, the lead body is overlaid on portions of the lead body such that a substantially smooth, uninterrupted surface at the interface of the tubular electrode and an outer surface of the lead body results. A smooth outer lead body surface may be desirable as it allows for easy passage of the lead through veins of a subject and further minimizes thrombus formation and the like.
Using various techniques, the tubular electrode is electrically coupled with the conductor. In one example, the tubular electrode is coupled with a portion of the ring member, which (as discussed above) may be electrically coupled to the conductor. Such coupling may include one or more of welding (at 1224), brazing (at 1224), or using a conductive adhesive (at 1226). Portions of the ring member may be urged toward an inner surface of the tubular electrode using, for example, the preformed mandrel at 1228 or another urging means.
The leads and methods described herein provide numerous advantages over conventional lead designs including secure electrical and mechanical connection between a conductor, such as a small multi-strand conductor cable, and an electrode (e.g., a ring electrode or a multi-filar shock coil electrode). In addition, the leads and methods provide axial reinforcement between a distal electrode and a lead body. Furthermore, the leads and methods allow for the creation of a smaller-sized lead (e.g., sub-5 French), which advantageously provides for easier and deeper lead delivery and lower sensing/stimulating thresholds. In one such example, the present leads and methods provide a small-sized lead with multiple conductors and electrodes.
Several other advantages are also made possible by the present leads and methods. As one example, the leads and methods reduce or eliminate the reliance on adhesives to couple a conductor to an electrode. Advantageously, by reducing or eliminating reliance on adhesives, manufacturing efficiency can be increased (e.g., don't need to wait for adhesives to cure), and conductor/electrode joint failure caused by adhesive bond strength decreasing over time (e.g., due to reactions with bodily fluids or improper adhesive preparation) can be reduced or eliminated.
It is to be understood that the above description is intended to be illustrative, and not restrictive. It should be noted that the above text discusses, among other things, interconnections of implantable lead conductors and electrodes for use in cardiac situations; however, the present leads and methods are not so limited. Many other embodiments and contexts, such as for non-cardiac nerve and muscle situations, will be apparent to those of skill in the art upon reviewing the above description. The scope should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
This application is a divisional of U.S. patent application Ser. No. 11/305,925, filed on Dec. 19, 2005, now issued as U.S. Pat. No. 7,546,165, the specification of which is incorporated herein in its entirety by reference.
Number | Name | Date | Kind |
---|---|---|---|
3474791 | Bentov | Oct 1969 | A |
4214804 | Little | Jul 1980 | A |
4280511 | O'Neill | Jul 1981 | A |
4328812 | Ufford et al. | May 1982 | A |
4379462 | Borkan et al. | Apr 1983 | A |
4413636 | Jasso | Nov 1983 | A |
4466690 | Osypka | Aug 1984 | A |
4484586 | McMickle et al. | Nov 1984 | A |
4538623 | Proctor et al. | Sep 1985 | A |
4573481 | Bullara | Mar 1986 | A |
4592372 | Beranek | Jun 1986 | A |
4628934 | Pohndorf et al. | Dec 1986 | A |
4643202 | Roche | Feb 1987 | A |
4711027 | Harris | Dec 1987 | A |
4721115 | Owens | Jan 1988 | A |
4860446 | Lessar et al. | Aug 1989 | A |
4922607 | Doan et al. | May 1990 | A |
4934049 | Kiekhafer et al. | Jun 1990 | A |
5007435 | Doan et al. | Apr 1991 | A |
5014720 | Barcel et al. | May 1991 | A |
5016808 | Heil, Jr. et al. | May 1991 | A |
5040544 | Lessar et al. | Aug 1991 | A |
5076270 | Stutz, Jr. | Dec 1991 | A |
5115818 | Holleman et al. | May 1992 | A |
5170802 | Mehra | Dec 1992 | A |
5217027 | Hermens | Jun 1993 | A |
5224491 | Mehra | Jul 1993 | A |
5231996 | Bardy et al. | Aug 1993 | A |
5251643 | Osypka | Oct 1993 | A |
5303704 | Molacek et al. | Apr 1994 | A |
5324321 | Pohndorf et al. | Jun 1994 | A |
5330522 | Kreyenhagen | Jul 1994 | A |
5347708 | Bischoff et al. | Sep 1994 | A |
5350419 | Bendel et al. | Sep 1994 | A |
5387233 | Alferness et al. | Feb 1995 | A |
5417208 | Winkler | May 1995 | A |
5423865 | Bowald et al. | Jun 1995 | A |
5431683 | Bowald et al. | Jul 1995 | A |
5449381 | Imran | Sep 1995 | A |
5458629 | Baudino et al. | Oct 1995 | A |
5476498 | Ayers | Dec 1995 | A |
5483022 | Mar | Jan 1996 | A |
5487757 | Truckai et al. | Jan 1996 | A |
5522872 | Hoff | Jun 1996 | A |
5549642 | Min et al. | Aug 1996 | A |
5649974 | Nelson et al. | Jul 1997 | A |
5676694 | Boser et al. | Oct 1997 | A |
5725566 | Pioger et al. | Mar 1998 | A |
5746616 | Mar | May 1998 | A |
5845396 | Altman et al. | Dec 1998 | A |
5871531 | Struble | Feb 1999 | A |
5910129 | Koblish et al. | Jun 1999 | A |
5935159 | Cross, Jr. et al. | Aug 1999 | A |
5954759 | Swoyer et al. | Sep 1999 | A |
5957970 | Shoberg et al. | Sep 1999 | A |
6018684 | Bartig et al. | Jan 2000 | A |
6055457 | Bonner | Apr 2000 | A |
6083216 | Fischer, Sr. | Jul 2000 | A |
6129750 | Tockman et al. | Oct 2000 | A |
6144870 | Griffin, III | Nov 2000 | A |
6161029 | Spreigl et al. | Dec 2000 | A |
6181971 | Doan | Jan 2001 | B1 |
6256541 | Heil et al. | Jul 2001 | B1 |
6256542 | Marshall et al. | Jul 2001 | B1 |
6289251 | Huepenbecker et al. | Sep 2001 | B1 |
6301507 | Bakels et al. | Oct 2001 | B1 |
6321123 | Morris et al. | Nov 2001 | B1 |
6363288 | Bush et al. | Mar 2002 | B1 |
6366820 | Doan et al. | Apr 2002 | B1 |
6374476 | Ponzi et al. | Apr 2002 | B1 |
6400992 | Borgersen et al. | Jun 2002 | B1 |
6430449 | Hsu et al. | Aug 2002 | B1 |
6434430 | Borgersen et al. | Aug 2002 | B2 |
6466820 | Juran et al. | Oct 2002 | B1 |
6477427 | Stolz et al. | Nov 2002 | B1 |
6501990 | Sundberg et al. | Dec 2002 | B1 |
6501991 | Honeck et al. | Dec 2002 | B1 |
6505081 | Das | Jan 2003 | B1 |
6505401 | Doan | Jan 2003 | B1 |
6516232 | Skinner | Feb 2003 | B2 |
6556873 | Smits | Apr 2003 | B1 |
6567704 | Sundquist et al. | May 2003 | B2 |
6584362 | Scheiner et al. | Jun 2003 | B1 |
6643550 | Westlund et al. | Nov 2003 | B2 |
6650945 | Helland et al. | Nov 2003 | B2 |
6721598 | Helland et al. | Apr 2004 | B1 |
6757970 | Kuzma et al. | Jul 2004 | B1 |
6785576 | Verness | Aug 2004 | B2 |
6801809 | Laske et al. | Oct 2004 | B2 |
6843870 | Bluger | Jan 2005 | B1 |
6856822 | Larsson | Feb 2005 | B2 |
6871085 | Sommer | Mar 2005 | B2 |
6882886 | Witte et al. | Apr 2005 | B1 |
6895277 | Westlund et al. | May 2005 | B2 |
6912423 | Ley et al. | Jun 2005 | B2 |
7212868 | McAuliffe et al. | May 2007 | B2 |
7546165 | Zarembo et al. | Jun 2009 | B2 |
20020082651 | Stahmann et al. | Jun 2002 | A1 |
20020107551 | Stahmann et al. | Aug 2002 | A1 |
20020147484 | Dahl et al. | Oct 2002 | A1 |
20030074031 | Ley et al. | Apr 2003 | A1 |
20030199950 | Stolz et al. | Oct 2003 | A1 |
20030208119 | Crowley | Nov 2003 | A1 |
20040014355 | Osypka et al. | Jan 2004 | A1 |
20040064173 | Hine et al. | Apr 2004 | A1 |
20040064174 | Belden | Apr 2004 | A1 |
20040215299 | Zhao et al. | Oct 2004 | A1 |
20040230279 | Cates et al. | Nov 2004 | A1 |
20040230280 | Cates et al. | Nov 2004 | A1 |
20040230281 | Heil et al. | Nov 2004 | A1 |
20040230282 | Cates et al. | Nov 2004 | A1 |
20040243210 | Morgan et al. | Dec 2004 | A1 |
20040260374 | Zhang et al. | Dec 2004 | A1 |
20040260375 | Zhang et al. | Dec 2004 | A1 |
20050004642 | Shoberg | Jan 2005 | A1 |
20050010095 | Stewart et al. | Jan 2005 | A1 |
20050027339 | Schrom et al. | Feb 2005 | A1 |
20050027340 | Schrom et al. | Feb 2005 | A1 |
20050027341 | Schrom et al. | Feb 2005 | A1 |
20050060013 | van den Nieuwenhof et al. | Mar 2005 | A1 |
20050228469 | Zarembo et al. | Oct 2005 | A1 |
20070142890 | Zarembo et al. | Jun 2007 | A1 |
Number | Date | Country |
---|---|---|
0778048 | Jun 1997 | EP |
2508716 | Dec 1982 | FR |
WO-2007078360 | Jul 2007 | WO |
Number | Date | Country | |
---|---|---|---|
20090222074 A1 | Sep 2009 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 11305925 | Dec 2005 | US |
Child | 12467978 | US |