Patent Application
20150008994
The present invention relates to an interface apparatus and in particular to an interface apparatus which supplies electromagnetic waves to a communication sheet which allows electromagnetic waves to propagate through the region between a mesh sheet-shaped conductor layer and sheet-shaped conductor layer of the communication sheet so that communication is conducted.
In recent years, electromagnetic wave transmission media have been developed which allow electromagnetic waves to propagate through the region between a mesh sheet-shaped conductor layer (mesh conductor layer) and a sheet-shaped conductor layer (sheet conductor layer) serving as a transmission path and to couple with electromagnetic waves in the leakage region leaking from the mesh conductor layer so that communication can be conducted (e.g., Patent Literature 1). The communication system where communication is conducted by coupling electromagnetic waves propagating through the transmission path with evanescent waves, which are electromagnetic waves leaking from the mesh conductor layer of the electromagnetic wave transmission medium (hereafter referred to as the “communication sheet”), is called “surface communication.”
Various types of interface apparatuses which supply electromagnetic waves to the communication sheet have also been developed. For example, Patent Literature 2 discloses an interface apparatus which supplies electromagnetic waves to the communication through the mesh conductor layer from over the communication sheet. Since this interface apparatus is a mounting type one, it is advantageous in that it can transmit power from any position regardless of the location of the communication sheet. Patent Literature 3 discloses an interface apparatus which is such a mounting type one and transmits power with increased efficiency by reducing leakage of electromagnetic waves.
While the interface apparatus disclosed in Patent Literature 3 transmits power with increased efficiency by reducing leakage of electromagnetic waves, in order to supply sufficient electromagnetic waves to the entire communication sheet using this power transmission system, upsizing of the interface apparatus is required. However, up sizing of the mounting-type interface apparatus would have the unfavorable effect of reducing the area of the communication sheet available for receiving apparatus.
For this reason, interface apparatuses which supply electromagnetic waves from the side surfaces of the communication sheet have been developed. Patent Literature 4 discloses a clip-type interface apparatus configured to vertically sandwich an end of a communication sheet between two electrodes thereof opposed to a mesh conductor layer and a sheet conductor layer included in the communication sheet and to supply electromagnetic waves from the side surfaces of the communication sheet. This interface apparatus can transmit power more efficiently than the interface apparatus of Patent Literature 2 does.
Patent Literature 5 discloses an interface apparatus which is a clip-type interface apparatus similar to Patent Literature 4 and which can transmit power much more efficiently owing to its configuration which is capable of reducing leakage of electromagnetic waves.
[Patent Literature 1] International Patent Publication No. WO2007/032049
[Patent Literature 2] Japanese Unexamined Patent Application Publication No. 2007-82178
[Patent Literature 3] International Patent Publication No. WO2011/052361
[Patent Literature 4] Japanese Unexamined Patent Application Publication No. 2010-16592
[Patent Literature 5] Japanese Unexamined Patent Application Publication No. 2011-9801
In an actual communication sheet, a mesh conductor layer and a sheet conductor layer are each covered by a protective layer having a predetermined thickness to electrically isolate from outside. A problem with the clip-type interface apparatus of Patent Literature 4 is that when power is transmitted from the side surfaces of the communication sheet using the interface apparatus, electromagnetic waves propagate through the protective layer and emanate therefrom as leaking electromagnetic waves.
Similarly, a problem with the clip-type interface apparatus of Patent Literature 5 is that when the communication sheet and the interface apparatus are displaced from each other, electromagnetic waves propagates through the protective layer as a path and leak therefrom. Prevention of such leaking electromagnetic waves requires exactly fixing the communication sheet and the interface apparatus. This is problematic not only in that applications of the interface apparatus are limited but also in that the connection position of the interface to the communication sheet is inevitably limited.
The present invention has been made in view of the foregoing, and an object thereof is to provide an interface apparatus which can suppress leakage of electromagnetic waves and supply electromagnetic waves efficiently without limiting applications or mounting positions of the apparatus.
An interface apparatus according to an aspect of the present invention is an interface apparatus for supplying electromagnetic waves to a sheet-shaped electromagnetic wave transmission medium for propagating electromagnetic waves, the interface apparatus including: a first conductor surface; a second conductor surface disposed in an opposed state to and substantially parallel with the first conductor surface; electromagnetic wave supplying means configured to supply electromagnetic waves to a gap between the first and second conductor surfaces; a first structure disposed on the first conductor surface and configured to reflect electromagnetic waves supplied by the electromagnetic wave supplying means with an end of the electromagnetic wave transmission medium inserted in the gap; and a second structure disposed on the second conductor surface and configured to reflect electromagnetic waves supplied by the electromagnetic wave supplying means with the end of the electromagnetic wave transmission medium inserted in the gap.
According to the present invention, it is possible to provide an interface apparatus which can suppress leakage of electromagnetic waves and supply electromagnetic waves efficiently without limiting applications or mounting positions of the apparatus.
Now, preferred embodiments of the present invention will be described with reference to the drawings. However, the embodiments do not limit the scope of the invention. In the following description, the same reference signs represent substantially similar components.
A first embodiment of the present invention will be described with reference to the drawings.
The electromagnetic wave propagation layer 130 is a layer through which electromagnetic waves supplied by the interface apparatus 200 propagate.
Specifically, this layer is formed of a sheet-shaped dielectric substrate 131. As used herein, “sheet-shaped” means having a wide surface and being thin; for example, having a shape like a cloth, paper, foil, plate, membrane, film, or mesh.
The plane conductor layer 120 is a sheet-shaped sheet conductor 121 and is formed on one of the surfaces of the dielectric substrate 131.
The mesh layer 140 consists of a mesh-shaped mesh conductor 141 and is formed on one of the surfaces of the dielectric substrate 131 opposite to the surface facing the sheet conductor 121; that is, the surface thereof remote from the sheet conductor 121. As used herein, “mesh-shaped” means that apertures having a size smaller than the wavelength of electromagnetic waves propagating through the electromagnetic wave propagation layer 130 are periodically formed.
The first protective layer 110 is a sheet-shaped sheet insulator 111 and formed in order to keep the sheet conductor 121 serving as the plane conductor layer 120 electrically insulated from outside.
The second protective layer 150 is a sheet-shaped sheet insulator 151 and formed in order to keep the mesh conductor 141 serving as the mesh layer 140 electrically insulated from outside. The medium of the sheet insulators 111 and 151 is a medium which has a particular dielectric constant and magnetic susceptibility and which does not transmit a direct current.
Next, the configuration of the interface apparatus 200 will be described in detail.
The first electrode 210 is a conductor and is connected to the electromagnetic wave supplying portion 230. The first electrode 210 has a flat conductor surface covering part of the front surface of the electromagnetic wave transmission medium 100, which is inserted in the interface apparatus 200. In the following description, this conductor surface of the first electrode 210 will be referred to as the first conductor surface.
The second electrode 220 is a conductor and is connected to the electromagnetic wave supplying portion 230. The second electrode 220 has a flat conductor surface covering part of the bottom surface of the electromagnetic wave transmission medium 100, which is inserted in the interface apparatus 200. In the following description, this conductor surface of the second electrode 220 will be referred to as the second conductor surface. The first conductor surface of the first electrode 210 and the second conductor surface of the second electrode 220 are formed in an opposed state to and substantially parallel with each other.
The electromagnetic wave supplying portion 230 supplies electromagnetic waves to a gap between the first and second conductor surfaces. Specifically, a first voltage terminal of the electromagnetic wave supplying portion 230 is connected to one of the first electrode 210 and the second electrode 220, so that a first voltage is applied to the one electrode. On the other hand, a ground terminal of the electromagnetic wave supplying portion 230 is connected to the other electrode, so that the other electrode is connected to a ground potential. Alternatively, both the first electrode 210 and the second electrode 220 may be connected to the ground terminal.
For example, the electromagnetic wave supplying portion 230 is a power supply cable. The first voltage terminal of the electromagnetic wave supplying portion 230 serving as a core wire is connected to the first electrode 210, so that the first voltage is applied to the first electrode 210, whereas a braided wire of the electromagnetic wave supplying portion 230 serving as a ground terminal is connected to the second electrode 220, so that the second electrode 220 is connected to a ground potential. The electromagnetic wave supplying portion 230 supplies electromagnetic waves to the electromagnetic wave propagation layer 130 through the side surfaces of the electromagnetic wave transmission medium 100, which is inserted in the interface apparatus 200. Then the electromagnetic waves propagate through this layer. In this way, the electromagnetic waves are used in the communication with the receiving apparatus 300. The frequency band of such electromagnetic waves for communication may be, for example, a 900 MHz band.
The first electromagnetic wave suppressing structure 240 is disposed on the first conductor surface of the first electrode 210. It reflects electromagnetic waves supplied by the electromagnetic wave supplying portion 230 in a state in which the end of the electromagnetic wave transmission medium 100 is inserted in the gap between the first and second conductor surfaces.
Specifically, the first electromagnetic wave suppressing structure 240 is an electromagnetic band-gap (EBG) structure including a rectangular plate-shaped patch conductor 241 disposed in an opposed state to and substantially parallel with the first conductor surface of the first electrode 210 and a first conductor post 242 connecting the patch conductor 241 to the first conductor surface. As used herein, a “patch” refers to a chip or piece. As a plate-shaped micro-strip antenna is called a “patch antenna,” a “patch” is commonly used in the above meaning in the field of electromagnetic wave engineering.
As shown by a broken-line arrow of
To allow the first electromagnetic wave suppressing structure 240 to suppress leakage of electromagnetic waves in this way, it is preferable to design the first electromagnetic wave suppressing structure 240 so that the region between the patch conductor 241 and the mesh conductor 141 has an extremely high or extremely low characteristic impedance as a transmission path. Specifically, this is accomplished by configuring the first electromagnetic wave suppressing structure 240 so that it resonates around the frequency band of electromagnetic waves supplied by the electromagnetic wave supplying portion 230.
The second electromagnetic wave suppressing structure 250 is disposed on the second conductor surface of the second electrode 220. The second electromagnetic wave suppressing structure 250 reflects electromagnetic waves supplied by the electromagnetic wave supplying portion 230 in a state in which the end of the electromagnetic wave transmission medium 100 is inserted in the gap between the first and second conductor surfaces.
Specifically, the second electromagnetic wave suppressing structure 250 is an EBG structure including a plate-shaped patch conductor 251 disposed in an opposed state to and substantially parallel with the second conductor surface of the second electrode 220 and a second conductor post 252 connecting the patch conductor 251 to the second conductor surface.
As shown by a broken-line arrow of
As with the first electromagnetic wave suppressing structure 240, it is preferable to design the second electromagnetic wave suppressing structure 250 so that the region between the patch conductor 251 and the sheet conductor 121 has an extremely high or extremely low characteristic impedance as a transmission path.
As described above, the electromagnetic wave interface apparatus of the first embodiment includes the first conductor surface and the second conductor surface disposed in an opposed state to and substantially parallel with the first conductor surface. The sheet-shaped electromagnetic wave transmission medium is inserted in the gap between the first and second conductor surfaces. The electromagnetic wave interface apparatus includes the electromagnetic wave supplying portion for supplying electromagnetic waves to the gap between the first and second conductor surfaces. Thus, this configuration of the electromagnetic wave interface apparatus allows electromagnetic waves to propagate through the electromagnetic wave transmission medium. The first structure is disposed on the first conductor surface and reflects electromagnetic waves supplied by the electromagnetic wave supplying portion in a state where the end of the electromagnetic wave transmission medium is inserted in the gap. Similarly, the second structure is disposed on the second conductor surface and reflects electromagnetic waves supplied by the electromagnetic wave supplying portion in a state where the end of the electromagnetic wave transmission medium is inserted in the gap.
Since the interface apparatus for supplying electromagnetic waves to the electromagnetic wave transmission medium for propagating electromagnetic waves is configured as described above, it is possible to suppress leakage of electromagnetic waves from the clearance between the interface apparatus and the electromagnetic wave transmission medium so as to improve power transmission efficiency.
While the case where the patch conductors of the first electromagnetic wave suppressing structure 240 and the second electromagnetic wave suppressing structure 250 have a rectangular shape has been described above, the patch conductors may have other shapes. For example, the patch conductors may have a shape having a smooth boundary, such as any polygon or circle. A conductor having a notch or aperture may be used.
While the case where the first electromagnetic wave suppressing structure 240 and the second electromagnetic wave suppressing structure 250 are mushroom-type EBG structures including a patch conductor and a conductor post has been described above, the electromagnetic wave suppressing structures are not limited to this type. The electromagnetic wave suppressing structures may be other types of EBG structures, as long as they are structures configured to reflect electromagnetic waves propagating in a direction in which the electromagnetic waves leak out.
Now, a second embodiment of the present invention will be described with reference to the drawings. Note that to clarify the invention, description of some of the components which have already been described in the first embodiment will be omitted.
As in the first embodiment, the first electromagnetic wave suppressing structures 240 periodically arranged are mushroom-type EBG structures. The first electromagnetic wave suppressing structure 240 are periodically arranged on the first conductor surface at predetermined intervals so that adjacent patch conductors do not contact each other.
When the capacitive coupling between adjacent patch conductors 241 and the inductive coupling caused by adjacent patch conductors 241 and conductor posts 242 and the loop current passing through the first conductor surface of the first electrode 410 serving as a reference conductor are dominant in the first electromagnetic wave suppressing structures 240, the first electromagnetic wave suppressing structures 240 can be regarded as being an equivalent circuit where parallel resonant circuits are connected together in series. On the other hand, when the inductive coupling caused by the conductor posts 242 and the inductive coupling between the patch conductors 241 and the mesh layer 140 of the electromagnetic wave transmission medium 100 are dominant in the first electromagnetic wave suppressing structures 240, the first electromagnetic wave suppressing structures 240 can be regarded as being an equivalent circuit where series resonant circuits are connected together in parallel. The equivalent circuit where parallel resonant circuits are connected together in series has an extremely high characteristic impedance at a particular frequency, whereas the equivalent circuit where series resonant circuits are connected together in parallel has an extremely low characteristic impedance at a particular frequency. Since the disposition of the multiple first electromagnetic wave suppressing structures 240 causes resonance, most of the electromagnetic waves which will leak out are reflected toward the electromagnetic wave supplying portion 230 or reflected so that the electromagnetic waves pass through the mesh layer 140 and enter the electromagnetic wave propagation layer 130. This applies to the second electromagnetic wave suppressing structures 250 as well.
As seen above, in the interface apparatus according to the second embodiment, the multiple first electromagnetic wave suppressing structures are periodically arranged on the first conductor surface of the first electrode, and the multiple second electromagnetic wave suppressing structures are periodically arranged on the second conductor surface of the second electrode. Since the electromagnetic wave suppressing structures are repeatedly disposed as described above, it is possible to further suppress leakage of electromagnetic waves so as to improve power transmission efficiency.
While the configuration where the same number (five) of electromagnetic wave suppressing structures are disposed in both the vertical and horizontal directions on each electrode has been described above, other configurations may be employed. The number of electromagnetic wave suppressing structures may vary in accordance with the direction, for example, one in one direction and three in the other direction. Generally, the electromagnetic wave leakage suppression effect increases as the number of electromagnetic wave suppressing structures in each direction increases. Accordingly, it is preferable to dispose multiple electromagnetic wave suppressing structures in each direction.
The multiple electromagnetic wave suppressing structures disposed on each electrode do not need to have the same physical shape. These structures may be designed to have different physical shapes as long as the frequency of the resonance is close to the frequency band in which suppression of leakage of electromagnetic waves is desired.
Alternatively, as shown in
Specifically, in this configuration, multiple electromagnetic wave suppressing structures 240 are not periodically arranged in the region on the electromagnetic wave supplying portion 230 side, which is a region on an inner side of a first boundary of the first conductor surface of the first electrode 410, whereas multiple electromagnetic wave suppressing structures 240 are periodically arranged in the region on an outer side of the first boundary of the first conductor surface of the first electrode 410. The region on the inner side of the first boundary, which is the region on the electromagnetic wave supplying portion side, is defined as the matching adjustment portion 460 serving as a region for matching design.
Since the matching adjustment portion 460 can be used as a region for matching design, power can be transmitted more efficiently. The first boundary, which separates the region where the first electromagnetic wave suppressing structures 240 are periodically arranged on the first electrode 410 and the region where the first electromagnetic wave suppressing structures 240 are not periodically arranged on the first electrode 240 may be determined as appropriate in terms of matching design.
For example, in the interface apparatus 400 shown in
Alternatively, as shown in
The method for forming the matching adjustment portion 460 is not limited to eliminating the first electromagnetic wave suppressing structures 240 from the first electrode 410. That is, a configuration may be employed where multiple electromagnetic wave suppressing structure 250 are not periodically arranged in the region inside a second boundary on the second conductor surface of the second electrode 420; that is, in a region adjacent to the electromagnetic wave supplying portion 230 and where multiple electromagnetic wave suppressing structures 250 are periodically arranged the region outside the second boundary. The region inside the second boundary, which is adjacent to the electromagnetic wave supplying portion, may be defined as being a matching adjustment portion 460 serving as a region for matching design.
Now, a third embodiment of the present invention will be described with reference to the drawings. Note that to clarify the invention, description of some of the components which have already been described in the first and second embodiments will be omitted.
The third electrode 560 is protected by a dielectric 570. Specifically, the gap corresponding to a predetermined distance from the electromagnetic wave supplying portion 230 between the first and second conductor surfaces is filled with the dielectric 570. Note that the dielectric 570 may be air. The surface in contact with the electromagnetic wave transmission medium 100 inserted in the interface apparatus 500, of the dielectric 570 is vertical, and matching is accomplished at the joint. The electromagnetic wave transmission medium 100 is inserted between the first and second conductor surfaces until it contacts the vertical surface of the dielectric 570. To prevent electromagnetic waves from leaking from the side surfaces of the dielectric 570, both of the side surfaces are shielded by conductors.
The first electrode 510 and the second electrode 520 are connected to a ground potential by connecting them to the braided wire of the electromagnetic wave supplying portion 230. Thus, the first electrode 510 and the second electrode 520 function as shield electrodes.
Twenty-five (5 columns×5 rows) first electromagnetic wave suppressing structures 240 are periodically two-dimensionally arranged on the first conductor surface of the first electrode 510. In a state where the electromagnetic wave transmission medium 100 is inserted until reaching the vertical surface of the dielectric 570, the first electromagnetic wave suppressing structures 240 are in contact with the front surface of the electromagnetic wave transmission medium 100. These structures reflect electromagnetic waves which will leak out along the front surface of the electromagnetic wave transmission medium 100.
As with the first conductor surface of the first electrode 510, 25 (5 columns×5 rows) second electromagnetic wave suppressing structures 250 are periodically two-dimensionally arranged on the second conductor surface of the second electrode 520.
As seen above, the interface apparatus according to the present embodiment further includes the third electrode, which is disposed in the gap between the first and second conductor surfaces. The electromagnetic wave supplying portion supplies electromagnetic waves to the gap by applying a first alternating-current voltage to the third electrode and connecting the first and second conductor surfaces to a ground potential. In this configuration, the third electrode serving as an internal electrode is separately disposed, and the first and second electrodes function as shield electrodes. Thus, leakage of electromagnetic waves is further suppressed.
At least the gap around the third electrode of the gap between the first and second conductor surfaces is filled with the dielectric, and the side surfaces of the dielectric are shielded by the conductors. Matching is accomplished at the joint between the dielectric and the inserted electromagnetic wave transmission medium, and the shield conductors disposed on both side surfaces of the dielectric are in contact with the inserted electromagnetic wave transmission medium in such a manner that matching is accomplished. Thus, leakage of electromagnetic waves from these joints can be suppressed.
The core wire 231 may be used as an element for matching design as it is, or a conductor which is separately matching-designed may be connected to the core wire 231 as a third electrode. The interior of the dielectric 570 may be used as a region for matching design.
For example, if the dielectric 570 is regarded as being a cavity resonator, electromagnetic waves may be distributed in a resonant mode in such a manner that a magnetic field moves around along a shield conductor 581 disposed on the back of the dielectric 570 and shield conductors 582 and 583 disposed on both surfaces thereof. In this case, as shown in
While the configuration where the dielectric 570 is a block-shaped dielectric and where the third conductor 560 is disposed in this block has been described above, other configurations may be employed. For example, as shown in
Now, a fourth embodiment of the present invention will be described with reference to the drawings. Note that to clarify the invention, description of some of the components which have already been described in the first to third embodiments will be omitted.
As with a first electromagnetic wave suppressing structure 240, each third electromagnetic wave suppressing structure 670 is an EBG structure including a patch conductor 671 and a conductor post 672. Each conductor post 672 is longer than a conductor post 242. Each patch conductor 671 is located adjacent to the second conductor surface of a second electrode 220.
The third electromagnetic wave suppressing structures 670 are intended to prevent leakage from the side surfaces of electromagnetic waves that the electromagnetic wave supplying portion 230 supplies to the gap between the first and second conductor surfaces.
The third electromagnetic wave suppressing structures 670 are disposed on both sides of a third conductor 560. In
When the inductive coupling caused by the loop current passing through the first electrode 610 serving as a reference conductor is dominant, the third electromagnetic wave suppressing structures 670 disposed in parallel can be regarded as an equivalent circuit where parallel resonant circuits are connected together in series. When the inductive coupling caused by conductor posts 672 and the inductive coupling between the patch conductors 671 and the second conductor surface of a second electrode 620 are dominant, the third electromagnetic wave suppressing structures 670 can be regarded as an equivalent circuit where series resonant circuits are connected together in parallel. The equivalent circuit where parallel resonant circuits are connected together in series has an extremely high characteristic impedance at a particular frequency, whereas the equivalent circuit where series resonant circuits are connected together in parallel has an extremely low characteristic impedance at a particular frequency. By designing the size of the patch conductor 671, the distance to the second conductor surface, the capacitance of the conductor post 672, or the like so that an extremely high or extremely low characteristic impedance is obtained at the frequency (e.g., 900 MHz) used for communication, it is possible to reflect electromagnetic waves attempting to propagate toward the side surfaces of the apparatus through the third electromagnetic wave suppressing structures 670.
Thus, electromagnetic waves supplied by the electromagnetic wave supplying portion 230 are confined within the resonance region between the third electromagnetic wave suppressing structures 670 disposed on both sides of the third conductor 560. As a result, the electromagnetic waves are amplified in the matching-designed resonance region. The electromagnetic waves use, as a path, only the electromagnetic wave propagation layer 130 of the electromagnetic wave transmission medium 100. In this way, the electromagnetic waves can be efficiently supplied to the receiving apparatus 300 through the electromagnetic wave transmission medium 100.
As seen above, in the interface apparatus according to the fourth embodiment, the first electromagnetic wave suppressing structures and third electromagnetic wave suppressing structures are disposed on the first conductor surface. The first electromagnetic wave suppressing structures are intended to reflect electromagnetic waves supplied by the electromagnetic wave supplying portion and propagating along the surface of the electromagnetic wave transmission medium in a state where the end of the electromagnetic wave transmission medium is inserted in the interface apparatus. On the other hand, the third electromagnetic wave suppressing structures are disposed in parallel on both sides of the third electrode up to near the electromagnetic wave transmission medium. The third electromagnetic wave suppressing structures are intended to reflect electromagnetic waves supplied by the electromagnetic wave supplying portion and propagating toward the side surfaces of the interface apparatus in a state where the end of the electromagnetic wave transmission medium is inserted in the interface apparatus. Use of such a configuration allows electromagnetic waves supplied by the electromagnetic wave supplying portion to be efficiently supplied to the receiving apparatus through the electromagnetic wave transmission medium.
Preferably, matching design is performed so that the resonance region formed by the third electromagnetic wave suppressing structures disposed on both sides of the third electrode resonates in the frequency band of electromagnetic waves for communication. Thus, electromagnetic waves can be supplied more efficiently.
While the configuration where the third electromagnetic wave suppressing structures are disposed on the first conductor surface of the first electrode has been described, other configurations may be employed. The third electromagnetic wave suppressing structures may be disposed on the second conductor surface of the second electrode, or, as shown in
In an interface apparatus according to a fifth embodiment, second electromagnetic wave suppressing structures disposed on a second electrode are structures other than mushroom-type EBG structures. Now, the fifth embodiment of the present invention will be described with reference to the drawings. Note that to clarify the invention, description of some of the components which have already been described in the first to fourth embodiments will be omitted.
Each second electromagnetic wave suppressing structure 750 includes a patch conductor 751 and connection lines 752 which electrically connect the patch conductor 751 to adjacent ones. While each connection line 752 is disposed around the midpoint on a side of the corresponding patch conductor 751 in
The second electromagnetic wave suppressing structures 750 shown in
The second electromagnetic wave suppressing structures 750, which are flat EBG structures, shown in
As seen above, the second electromagnetic wave suppressing structures according to the present embodiment each include a patch conductor disposed flush with the second conductor surface and connection lines connecting the patch conductor to adjacent ones. By using such EBG structures as the second electromagnetic wave suppressing structures, the thickness thereof can be reduced.
While the case where flat EBG structures are used as the second electromagnetic wave suppressing structures 750 has been described above, flat EBG structures may also be used as first electromagnetic wave suppressing structures 740. By using flat EBG structures also as the first electromagnetic wave suppressing structures 740, the entire interface apparatus 700 can be thinned.
As described in the above embodiments, the interface apparatuses of the present invention can supply electromagnetic waves to the receiving apparatus through the electromagnetic wave communication medium with increased power transmission efficiency.
Note that the electromagnetic wave suppressing structures disposed on the first and second conductor surfaces of each interface apparatus are not limited to the above EBG structures and may be various types of EBG structures.
For example, as shown in
While the case where the interface apparatus is used to transmit power has been described in the above embodiments, the interface apparatus may be used in other applications. The interface apparatuses of the present invention can be used not only to transmit power but also to supply electromagnetic waves for signals.
The present invention is not limited to the above embodiments, and changes can be made to the embodiments as appropriate without departing from the spirit and scope of the invention. For example, the following configurations may be employed.
An interface apparatus for supplying electromagnetic waves to a sheet-shaped electromagnetic wave transmission medium for propagating electromagnetic waves, the interface apparatus comprising:
The interface apparatus according to Supplementary note 1,
The interface apparatus according to Supplementary note 1 or 2, wherein the plurality of first structures are periodically arranged on the first conductor surface, and
The interface apparatus according to Supplementary note 1, wherein the second structure comprises:
The interface apparatus according to any one of Supplementary notes 1 to 4,
The interface apparatus according to Supplementary note 5,
The interface apparatus according to any one of Supplementary notes 1 to 6, wherein the electromagnetic wave supplying means supplies electromagnetic waves to the gap by applying a first voltage to one of the first and second conductor surfaces and connecting the other conductor surface to a ground potential.
The interface apparatus according to any one of Supplementary notes 1 to 6, further comprising a third electrode disposed in the gap, wherein
The interface apparatus according to Supplementary note 8, further comprising a third structure configured to reflect electromagnetic waves supplied by the electromagnetic wave supplying means disposed on both sides of the third electrode, wherein
The interface apparatus according to any one of Supplementary notes 3 to 9, wherein matching adjustment means having at least one of the first and second structures not disposed thereon is disposed adjacent to the electromagnetic wave supplying means.
The interface apparatus according to any one of Supplementary notes 3 to 10, wherein the first structures are ?not? periodically arranged in a region on the electromagnetic wave supplying portion side which is a region on an inner side of a first boundary on the first conductor surface, and the first structures are periodically arranged in a region on an outer side of the first boundary thereon.
The interface apparatus according to any one of Supplementary notes 3 to 10, wherein the first structures are not periodically arranged in a region on the electromagnetic wave supplying portion side which is a region on an inner side of a second boundary on the second conductor surface, and the second structures are periodically arranged in a region on an outer side of the second boundary thereon.
While the invention of the present application has been described with reference to the embodiments, the invention is not limited thereto. Various changes understandable for those skilled in the art can be made to the configuration or details of the invention of the present application without departing from the scope of the invention.
The present application claims priority based on Japanese Patent Application No. 2012-004001, filed on Jan. 12, 2012, the disclosure of which is incorporated herein in its entirety.
100 electromagnetic wave transmission medium
110 first protective layer
111 sheet insulator
120 plane conductor layer
121 sheet conductor
130 electromagnetic wave propagation layer
131 dielectric substrate
140 mesh layer
141 mesh conductor
150 second protective layer
151 sheet insulator
200 interface apparatus
210 first electrode
220 second electrode
230: electromagnetic wave supplying portion
240 first electromagnetic wave suppressing structure
241 patch conductor
242 conductor post
50 second electromagnetic wave suppressing structure
251 patch conductor
252 conductor post
300: receiving apparatus
| Number | Date | Country | Kind |
|---|---|---|---|
| 2012-004001 | Jan 2012 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2012/007564 | 11/26/2012 | WO | 00 |
