Claims
- 1. An interlink for connecting a first hydrophone element and a distinct second hydrophone element, comprising:
- a first interlink end for connecting to said first hydrophone element;
- a second interlink end for connecting to said second hydrophone element;
- means to affix said first and second interlink ends to said corresponding first and second hydrophone elements; and
- a helical spring element between the first and second interlink ends of at least one turn between said first interlink end and said second interlink end, such that the distance traveled along said at least one turn between said first and second interlink ends is greater than the linear distance between said first and second interlink ends.
- 2. The interlink of claim 1 further comprising a depression etched along the interlink surface to form a groove that begins at said first interlink end, follows the interlink along said at least one turn, and continues to said second interlink end.
- 3. The interlink of claim 2 wherein said groove has size to guide a sensing fiber along said at least one turn.
- 4. The interlink of claim 3 further comprising a means for affixing said sensing fiber to said groove.
- 5. The interlink of claim 4 wherein said means for affixing said sensing fiber to said groove further comprises epoxy.
- 6. The interlink of claim 1 wherein the interlink is formed of polycarbonate.
- 7. The interlink of claim 1 wherein said means to affix said interlink ends to said hydrophone elements comprises epoxy.
- 8. The interlink of claim 1 wherein the interlink provides a surface to guide a sensing fiber from said first hydrophone element to said second hydrophone element.
- 9. The interlink of claim 8 further comprising a means to affix said sensing fiber to said interlink surface.
- 10. The interlink of claim 9 wherein said means to affix said sensing fiber to said interlink surface further comprises epoxy.
CROSS-REFERENCE TO RELATED APPLICATIONS
This patent application is co-pending with a related patent application entitled Semi-Rigid Low-Noise Interlink for Spatially Extended Hydrophones Ser. No. 09/412,198, now allowed, by the same inventor as this patent application, and a related application entitled Reduced Mechanical Coupling Interlink for Spatially Extended Hydrophones Ser. No. 09/412,197, now allowed, by the same inventor with two additional co-inventors.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5737278 |
Frederick et al. |
Apr 1998 |
|
5748565 |
Cherbettchian et al. |
May 1998 |
|