The present invention relates generally to hot melt adhesive material dispensing systems, and more particularly to a new and improved hot melt adhesive material dispensing system wherein both the control module and the dispensing nozzle are provided with internal alternative discharge and recirculation flow paths. A fixed orifice is incorporated in the recirculation flow path of the dispensing nozzle such that when hot melt adhesive material is not being supplied to the dispensing nozzle discharge orifice, the hot melt adhesive material can be recirculated through the dispensing nozzle in accordance with controlled backpressure parameters which correspond to the supply pressure which is characteristic of the hot melt adhesive material that is alternatively supplied to the dispensing nozzle and its discharge orifice.
Hot melt adhesive metered dispensing systems must be operated intermittently in order to, for example, only deposit the hot melt adhesive material upon predetermined regions of substrates, at predetermined times, so as not to cause operational problems or to result in undesirable product characteristics, and concomitantly, to control the flow of the hot melt adhesive material during those periods of time when the hot melt adhesive material is not actually being dispensed. Control modules, having suitable valve mechanisms incorporated therein, are conventionally used to effectively control the starting and stopping of the flow of the hot melt adhesive material to the dispensing nozzle and its associated discharge orifice. In view of the fact that the metering pumps, for supplying the hot melt adhesive material to the control module, are typically operated in a continuous manner for achieving proper or desirable operational and control parameters, the hot melt adhesive material must therefore be effectively re-routed during those periods of time that the hot melt adhesive material is not actually being conducted to the dispensing nozzle and its discharge orifice. This has been conventionally achieved by means of the control module which is effectively provided with two outlet ports whereby the hot melt adhesive material can alternatively be delivered to the dispensing nozzle and its discharge orifice or to a recirculation passage or circuit.
In connection with the fluid flow of the hot melt adhesive material through the recirculation passage, it is necessary to control the backpressure within the recirculation passage such that the backpressure within the recirculation passage will be similar to, correspond with, or effectively match the fluid pressure characteristic of the hot melt adhesive material which is being conducted through the sup-ply passage leading to the dispensing nozzle and its discharge orifice. As a result of the control of the backpressure within the recirculation passage, when compared to the fluid pressure characteristic of the hot melt adhesive material which is being conducted through the supply passage leading to the dispensing nozzle and its discharge orifice, it is therefore possible to effectively minimize pressure spikes within the system and therefore eliminate significant variations in the amount of hot melt adhesive material which is actually dispensed from the discharge orifice of the dispensing nozzle. In other words, problems in connection with the discharge of too much or too little hot melt adhesive material from the discharge orifice of the dispensing nozzle are effectively prevented or eliminated. The actual control of the backpressure within the recirculation passage is conventionally achieved by means of a suitable simple fixed orifice which is located at a predetermined location within the recirculation passage, that is, somewhere along the recirculation flow path.
Conventionally, the fixed orifice has been placed within the recirculation passage, or along the recirculation flow path, at a position which is located between the applicator and the control module, and external of the dispensing nozzle. In view of the fact, however, that the fixed orifice must effectively be matched with the size or configuration of the dispensing nozzle and its discharge orifice, in order to achieve essentially the same fluid pressure within both the recirculation passage and the supply passage leading to the dispensing nozzle and its discharge orifice, the provision of the fixed orifice at its conventional location, that is, between the applicator and the control module, and external of the dispensing nozzle, becomes problematic when the particular dispensing nozzle and its discharge orifice are changed or replaced with a dispensing nozzle and a discharge orifice having, for example, a different design, in order to, for example, achieve a different hot melt adhesive deposition or distribution pattern, because operational personnel must then likewise replace the fixed orifice. Not only does this process require the operational personnel to implement additional setup procedures, but there is the potential or possibility of operational personnel mismatching the fixed orifice with the dispensing nozzle and its discharge orifice.
Accordingly, there is a need in the art for a new and improved hot melt adhesive material dispensing system wherein the recirculation of the hot melt adhesive material, during those time periods of time that the hot melt adhesive material is not actually being conducted to the dispensing nozzle and its discharge orifice, would be implemented without encountering the aforenoted operational problems characteristic of conventional hot melt adhesive dispensing systems.
The foregoing and other objectives are achieved in accordance with the teachings and principles of the present invention through the provision of a new and improved hot melt adhesive dispensing system which comprises an applicator which supplies metered hot melt adhesive material, a control module in which alternative, divergent hot melt adhesive material supply and recirculating flow paths are defined, and a dispensing nozzle within which alternative, divergent hot melt adhesive material supply and recirculating flow paths are likewise defined. The dispensing nozzle is provided with a discharge orifice wherein the hot melt adhesive material supply flow path, defined within the dispensing nozzle, effectively fluidically interconnects the hot melt adhesive material supply flow path of the control module to the dispensing nozzle discharge orifice, while, in addition, the dispensing nozzle is also provided with a fixed orifice, which is located within the recirculating flow path defined within the dispensing nozzle, wherein the recirculating flow path, defined within the dispensing nozzle and having the fixed orifice incorporated therein, fluidically conducts the recirculated hot melt adhesive material, received from the control module, back to the control module.
As a result of the integral incorporation of the fixed orifice internally within the dispensing nozzle, the backpressure requirements of the hot melt adhesive material dispensing system are readily satisfied, and yet the operational drawbacks, comprising the need to separately install a fixed orifice so as to match the particular design and discharge characteristics of the discharge orifice of the dispensing nozzle, or the potential for installing a fixed orifice which is mismatched with respect to the discharge orifice of the dispensing nozzle, as is characteristic of the conventional hot melt adhesive dispensing systems, are obviated and eliminated. In other words, a separate installation process in connection with the fixed orifice is no longer necessary, and in addition, the fixed orifice is always properly matched to the discharge orifice of the dispensing nozzle, all as a result of its integral incorporation within the dispensing nozzle.
Various other features and attendant advantages of the present invention will be more fully appreciated from the following detailed description when considered in connection with the accompanying drawings in which like reference characters designate like or corresponding parts throughout the several views, and wherein:
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Still yet further, in accordance with the additional principles and teachings of the present invention, a suitable two-position valve mechanism 62, controlled by means of a suitable actuator 64 and a control rod 66, is movably incorporated within the control module 14 so as to effectively fluidically interconnect the first hot melt adhesive material supply inlet port of fluid connection 30 of the control module 12 with the sixth hot melt adhesive material outlet port or fluid connection 42 of the control module 12, or alternatively, to effectively fluidically interconnect the first hot melt adhesive material supply inlet port of fluid connection 30 of the control module 12 with the fourth hot melt adhesive material recirculation outlet port or fluid connection 38 so as to respectively supply the hot melt adhesive material to either the hot melt adhesive material supply path 56 within the dispensing nozzle 12, or to the hot melt adhesive material recirculation flow path 60 within the dispensing nozzle 12. It is further noted that in accordance with additional principles and teachings of the present invention, a fixed orifice 68, having fluid flow and pressure characteristics similar to those of the discharge orifice 54 of the dispensing nozzle 12, is incorporated within the hot melt adhesive material recirculation flow path 60 so as to effectively establish hot melt adhesive material backpressure parameters or levels, within the hot melt adhesive material recirculation flow path 60, which are effectively the same as those that exist within the hot melt adhesive material supply path 56. More particularly, the fixed orifice 68 may have predetermined structural contours so as to define a suitable nozzle structure, such as, for example, a Laval nozzle.
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It is believed that the operation of the new and improved hot melt adhesive material dispensing system 10 of the present invention is able to be readily appreciated, however, a short summary of the such operation, and the significance of the various structural components comprising the new and improved hot melt adhesive material dispensing system 10 of the present invention will now be described. More particularly, hot melt adhesive material is supplied from the reservoir 82 to the third hot melt adhesive material inlet port or fluid connection 80 of the applicator 36 by means of recirculation fluid flow path 90, and a precisely metered amount of the hot melt adhesive material is outputted from the fourth hot melt adhesive material outlet port or fluid connection 84 of the applicator 36, by means of its metering pumps, not shown, so as to effectively supply such precisely metered amount of the hot melt adhesive material to the first hot melt adhesive material inlet port of fluid connection 30 of the control module 14. Depending upon the position of the valve element 62 within the control module 14, as determined by means of the actuator 64, the hot melt adhesive material will be conducted or conveyed either to the sixth hot melt adhesive outlet port or fluid connection 42 of the control module 14 for ultimate dispensing from the discharge orifice 54 of the dispensing nozzle 12, or alternatively, the hot melt adhesive material will be conducted or conveyed to the fourth hot melt adhesive material outlet port or fluid connection 38 of the control module 14 so as to be recirculated through the hot melt adhesive recirculation flow path 60 of the dispensing nozzle 12.
It is to be particularly noted that as the recirculated hot melt adhesive material is being conveyed or conducted through or along the hot melt adhesive recirculation flow path 60 of the dispensing nozzle 12, it will pass through the fixed orifice 68, which is disposed internally within the dispensing nozzle 12, and more particularly within the hot melt adhesive recirculation flow path 60 of the dispensing nozzle 12, such that the backpressure values, levels, or parameters, characteristic of the hot melt adhesive material flowing within the hot melt adhesive recirculation flow path 60 of the dispensing nozzle 12, correspond to the pressure levels of the hot melt adhesive material flowing within or along the hot melt adhesive material supply path 56 of the dispensing nozzle 12. The recirculated hot melt adhesive material is, of course, ultimately recirculated or returned to the reservoir 82, along hot melt adhesive material recirculation flow path 90, after being outputted from the fourth hot melt adhesive material outlet port or fluid connection 52 of the dispensing nozzle 12, and after respectively traversing the fifth hot melt adhesive material inlet port or fluid connection 40 of the control module 14, the third hot melt adhesive material outlet port or fluid connection 34 of the control module 14, the fifth hot melt adhesive material inlet port or fluid connection 86 of the applicator 36, and the sixth hot melt adhesive material outlet port or fluid connection 88 of the applicator 36.
Thus, it may be seen that in accordance with the principles and teachings of the present invention, a new and improved hot melt adhesive material application or dispensing system has been disclosed wherein both the control module and the dispensing nozzle are effectively provided with internal alternative discharge and recirculation flow paths, and a fixed orifice, having flow and pressure characteristics similar to the discharge orifice of the dispensing nozzle, is provided within the recirculation flow path of the dispensing nozzle. Accordingly, when the hot melt adhesive material is not being supplied to the dispensing nozzle and its discharge orifice, the hot melt adhesive material can be recirculated through the dispensing nozzle and the control module in accordance with controlled backpressure parameters which correspond to the supply pressure which is characteristic of the hot melt adhesive material that is alternatively supplied to the dispensing nozzle and its discharge orifice. The fixed orifice is thus an integral component of the dispensing nozzle, and therefore cannot be separated from the dispensing nozzle or fluidically mismatched with respect to the discharge orifice of the dispensing nozzle.
Obviously, many variations and modifications of the present invention are possible in light of the above teachings. For example, while the disclosure has been oriented toward the fluid control and dispensing of hot melt adhesive material, the fluid control and dispensing of other fluids is of course possible. It is therefore to be understood that within the scope of the appended claims, the present invention may be practiced otherwise than as specifically described herein.