Patent Application
20230240615
The subject matter described herein relates to intraluminal physiology sensing devices. For example, intravascular catheter or guidewires can include embedded, conformal metal conductors, and associated systems and methods.
Intraluminal physiology sensing devices may be introduced into a body lumen of a patient, and may for example include physiological sensors at a distal end of a catheter or guidewire. Electrical wires may be employed to couple sensing elements at the distal end of the catheter or guidewire with a connector at a proximal end of the catheter or guidewire. Fine-gauge electrical wires may be referred to as filars. Small-diameter medical devices such as intraluminal (e.g., intravascular) catheters and guidewires may incorporate sensors (e.g., pressure, temperature, flow, or imaging sensors) whose power and communications occur through multi-filar (e.g., bifilar, trifilar, etc.) electrical conductor bundle or flat metal ribbons. In both cases, decreases in device size drive challenges in the device manufacturing process related to routing, wrapping, and securing of electrical conductors.
Guide wires and catheters are typically constructed with fine gauge filars and/or flattened ribbon wires that enable the transmission of electrical signal between electrical components within the device e.g. sensors, transducers and contacts. In order to make these connections, the filars and/or flattened ribbon wires may be embedded into polymers along the length of the device via wrapping or pulling processes on continuous reel-to-reel coating equipment. A bundle of electrical filars, may be joined as two, three, or more fine-gauge conductive filars, to make electrical connections between electrical components, e.g. sensors or transducers near the distal end of the device, and electrical contacts near the proximal end of the device. In order to make these connections, the filars or ribbons may be wrapped or pulled along the length of the device, from one end of the device to the other end. Because copper and many copper alloys have a low tensile and yield strength, the mechanical strength of electrical conductor materials is typically low. The manufacturing process for an intraluminal catheter or guidewire device may involve wrapping or stretching of the ribbon or multi-filar conductor bundle, which requires tensioning. Unfortunately, this tensioning can cause the conductive filars or ribbons to plasticly deform, which can result in severe and undesirable elongation and/or necking, e.g., up to 100% elongation in some current processes. The associated narrowing of the conductor affects both the mechanical strength and the maximum electrical current capacity of the filar, which can lead to manufacturing defects.
Some presently used devices employ flat, conductive metal ribbons that can have comparable current carrying capacity to filars, with a greater width and lesser height, potentially enabling smaller-diameter devices. These conductive ribbons may in some cases be better able to withstand tensioning, but do not conform to the cylindrical shape of a core wire, and thus may employ a thicker insulating layer to avoid exposed conductor at the edges of the ribbon. These ribbons are often manufactured separately and must be added to the device. However, positioning and maintaining them in a straight arrangement is challenging.
The information included in this Background section of the specification, including any references cited herein and any description or discussion thereof, is included for technical reference purposes only and is not to be regarded as subject matter by which the scope of the disclosure is to be bound.
Disclosed are intraluminal physiology sensing devices that include metal ink conductor assemblies. In some aspects, a metal ink conductor assembly can provide a single-layer or multi-layer application of conductive metal ink traces which permit improved electrical/mechanical performance and reduce or eliminate manufacturing issues associated with conductive filars or ribbons. Using nano-metal ink traces enables the use of conductive materials with lower tensile strengths and larger conductor cross-sections or surface areas. This may provide for lower electrical resistance/impedance along the length of the electro-mechanical device, as well as improving the straightness and torque response of intraluminal devices, while reducing manufacturing defects and reducing the complexity of the intraluminal device manufacturing process.
A nano-metal ink may be applied as a liquid coating directly onto an insulating polymer surrounding the core wire. Each layer of ink can then be sintered, which turns the coating into a solid metal with material properties equivalent to bulk materials. After sintering, an additional insulation layer may be coated to a desired thickness. When the desired thickness is achieved, the nano-metal layer or layers can then be individuated to create traces with the desired cross-sectional area.
The metal ink conductor assembly disclosed herein has particular, but not exclusive, utility for intraluminal medical catheters and guidewires.
One general aspect an intraluminal sensing device. The intraluminal sensing device includes a guidewire configured to be positioned within a body lumen of a patient, where the guidewire includes: a core wire; a first insulative coating covering at least a portion of a circumference of the core wire along at least a portion of a length of the core wire; at least two conductive traces, each including a thickness and a width and extending longitudinally along at least the portion of the length of the core wire over an outer surface of the first insulative coating, where each conductive trace includes a cross-sectional shape conforming to a curvature of the first insulative coating, where the at least two conductive traces and the core wire are insulated from one another; and a second insulative coating covering an outer surface of the at least two conductive traces along at least the portion of the length of the core wire; a sensor configured to obtain physiological data while positioned within the body lumen, where the sensor positioned at a distal portion of the guidewire and in electrical communication with the at least two conductive traces; and a connector positioned at a proximal portion of the guidewire and in electrical communication with the at least two conductive traces.
In some embodiments, the intraluminal sensing device further includes a third insulative coating surrounding an entire circumference of the core wire, over a top surface of the second insulative coating along at least the portion of the length of the core wire. In some embodiments, the third insulative coating covers portions of at least one of the conductive traces, the first insulative coating, or the core wire. In some embodiments, the at least two conductive traces include three conductive traces. In some embodiments, the conductive traces include a conductive ink. In some embodiments, the conductive ink is colloidal. In some embodiments, the conductive ink is sintered. In some embodiments, the conductive ink includes particles of at least one of gold, copper, silver, or aluminum. In some embodiments, at least two of the first insulative coating, the second insulative coating, or the third insulative coating include the same insulative material. In some embodiments, at least two of the first insulative coating, the second insulative coating, and the third insulative coating include different insulative materials. In some embodiments, each conductive trace includes a cross-sectional shape conforming to a curvature of the first insulative coating, and the at least two conductive traces, the at least two additional conductive traces, and the core wire are all mutually insulated from one another.
One general aspect includes an intraluminal sensing system. The system includes an intraluminal sensing guidewire and a processor circuit in communication with the intraluminal sensing guidewire. The processor circuit is configured to receive physiology data obtained by the sensor, process the physiology data, and output a graphical representation of the physiology data to a display in communication with the processing system. In some embodiments, the system further includes a patient interface module (PIM). Implementations may include hardware, a method or process, or computer software on a computer-accessible medium.
One general aspect includes a method for manufacturing an intraluminal sensing guidewire. The method includes providing a core wire; coating a first insulative material around an entire circumference of the core wire along at least a portion of a length of the core wire; coating a conductive ink over the first insulative material around the entire circumference of the core wire along at least the portion of the length of the core wire; coating a second insulative material over the conductive ink around the entire circumference of the core wire along at least the portion of the length of the core wire; removing material from at least two circumferential arcs of at least the second insulative material and the conductive ink, such that the conductive ink forms at least two longitudinal conductive traces along at least the portion of the length of the core wire, where the at least two longitudinal conductive traces are electrically isolated from each other and from the core wire; and coating a third insulative material over the second insulative material and the two circumferential arcs, around the entire circumference of the core wire along at least the portion of the length of the core wire.
In some embodiments, the at least two conductive traces include three conductive traces. In some embodiments, the method further includes sintering the conductive ink. In some embodiments, the conductive ink includes particles of gold, copper, silver, or aluminum. In some embodiments, at least two of the first insulative material, the second insulative material, or the third insulative material include the same insulative material. In some embodiments, at least two of the first insulative material, the second insulative material, and the third insulative material include different insulative materials.
One general aspect includes an intravascular sensing device including a guidewire configured to positioned with a blood vessel of a patient, including: a core wire; a first insulative coating covering at least a portion of a circumference of the core wire along at least a portion of a length of the core wire; at least two conductive traces including a sintered metallic ink, each conductive trace including a thickness and a width and extending longitudinally along at least the portion of the length of the core wire over an outer surface of the first insulative coating, where each conductive trace includes a cross-sectional shape conforming to a curvature of the first insulative coating, where the at least two conductive traces and the core wire are insulated from one another; a second insulative coating covering an outer surface of the at least two conductive traces along at least the portion of the length of the core wire; a third insulative coating surrounding an entire circumference of the core wire, over a top surface of the second insulative coating along at least the portion of the length of the core wire, where the third insulative coating covers portions of at least one of the conductive traces, the first insulative coating, or the core wire; at least one of a pressure sensor or a flow sensor positioned at a distal portion of the guidewire and in electrical communication with the at least two conductive traces; and a connector positioned at a proximal portion of the guidewire and in electrical communication with the at least two conductive traces.
This Summary is provided to introduce a selection of concepts in a simplified form that are further described below in the Detailed Description. This Summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter. A more extensive presentation of features, details, utilities, and advantages of the metal ink conductor assembly, as defined in the claims, is provided in the following written description of various embodiments of the disclosure and illustrated in the accompanying drawings.
Illustrative embodiments of the present disclosure will be described with reference to the accompanying drawings, of which:
Disclosed is a metal ink conductor assembly that provides a single-layer or multi-layer application of conductive metal ink traces which permit improved electrical/mechanical performance and eliminate manufacturing issues associated with conductive filars or ribbons. Manufacturing or assembly processes that require tensioning and coating of a multi-filar bundle, or one or more conductive ribbons, can benefit from the metal ink conductor assembly of the present disclosure.
Replacing embedded filars and/or flattened ribbon wires with coatable conductive traces (e.g., nano-metal ink traces) enables the use of conductive materials with lower tensile strengths and larger conductor cross-sections or surface areas, due to potential for greater utilization of available space within the insulation layer. This may enable lower resistance/impedance along the length of the electro-mechanical device. Because ribbons and/or multi-filar conductor bundles add stiffness and local torques to a guidewire or catheter, the straightness and torque response of the intraluminal device with coatable conductive traces may be improved as well, which may lead to a reduction in mechanical “whipping” responses when the device is manipulated within intravascular anatomy. Whipping may for example indicate a failure to rotate smoothly around a curve, leading the guidewire to jump or twitch inside the blood vessel.
Other manufacturing issues may also be alleviated by using the metal ink conductor assembly of the present disclosure. For example, the process of holding multiple filars and/or flattened ribbon wires in tension while laying them down and overcoating with an insulating layer is very difficult. Some current processes are only capable of being performed with two flattened ribbon wires or multi-filar conductor bundles per device. Conversely, the present disclosure enables the implementation of as many traces as desired along the length of device. Eliminating the elongation and necking of the filars and/or ribbon wires reduces the occurrence of blisters within the insulation layer. During device assembly, the twisting of filars, filar bundles, and flattened ribbon wires can make downstream laser ablation processes more difficult in terms of alignment. Furthermore, the processes used to create filars and flattened ribbon wires, and to embed them along the length of a device, are close to physical limits of the materials, due to the electrical/mechanical specifications of the electro-mechanical device. This creates design and sourcing limitations. The metal ink conductor assembly of the present disclosure reduces or eliminates these difficulties.
In the present disclosure, a conductive ink (e.g., nano-metal ink) is applied directly onto an insulating polymer layer (e.g., polyimide) as a liquid, allowing it to evenly coat and conform to the insulating surface. Each layer of ink is then sintered which turns the liquid into a substantially solid metal with material properties equivalent to bulk materials. After sintering, an additional insulation layer may be coated to a desired thickness. When the desired thickness is achieved, the nano-metal layer or layers can then be individuated to create traces with the desired cross-sectional area. After individuation, the traces are coated with additional insulating layers to electrically isolate them. This process may be repeated to create any desired number of layers and metallic traces.
Example devices incorporating a multi-filar conductor bundle and/or conductive ribbons include intraluminal medical guidewire devices as described for example in U.S. Pat. No. 10,595,820 B2, U.S. Patent Publication Nos. 2014/0187874, 2016/0058977, and 2015/0273187, and in U.S. Provisional Patent Application No. 62/552,993 (filed Aug. 31, 2017), each of which is hereby incorporated by reference in its entirety as though fully set forth herein.
These descriptions are provided for exemplary purposes only, and should not be considered to limit the scope of the metal ink conductor assembly. Certain features may be added, removed, or modified without departing from the spirit of the claimed subject matter.
For the purposes of promoting an understanding of the principles of the present disclosure, reference will now be made to the embodiments illustrated in the drawings, and specific language will be used to describe the same. It is nevertheless understood that no limitation to the scope of the disclosure is intended. Any alterations and further modifications to the described devices, systems, and methods, and any further application of the principles of the present disclosure are fully contemplated and included within the present disclosure as would normally occur to one skilled in the art to which the disclosure relates. In particular, it is fully contemplated that the features, components, and/or steps described with respect to one embodiment may be combined with the features, components, and/or steps described with respect to other embodiments of the present disclosure. Further, while the embodiments of the present disclosure may be described with respect to a blood vessel, it will be understood that the devices, systems, and methods described herein may be configured for use in any suitable anatomical structure or body lumen including a blood vessel, blood vessel lumen, an esophagus, eustachian tube, urethra, fallopian tube, intestine, colon, and/or any other suitable anatomical structure or body lumen. In other embodiments, the devices, systems, and methods described herein may be used to examine any number of anatomical locations and tissue types, including without limitation, organs including the liver, heart, kidneys, gall bladder, pancreas, lungs; ducts; intestines; nervous system structures including the brain, dural sac, spinal cord and peripheral nerves; the urinary tract; as well as valves within the blood vessels, chambers or other parts of the heart, and/or other systems of the body. In addition to natural structures, the device 102 may be used to examine man-made structures such as, but without limitation, heart valves, stents, shunts, filters and other devices. For the sake of brevity, however, the numerous iterations of these combinations will not be described separately.
The intravascular device 102 in
In some embodiments, the intravascular device 102 comprises a distal subassembly and a proximal subassembly that are electrically and mechanically joined together, which creates an electrical communication between the electronic component 112 and the conductive portions 132, 134. For example, flow data obtained by the electronic component 112 (in this example, electronic component 112 is a flow sensor) can be transmitted to the conductive portions 132, 134. In an exemplary embodiment, the flow sensor 112 is a single ultrasound transducer element. The transducer element emits ultrasound signals and receives echoes. The transducer element generates electrical signals representative of the echoes. The signal carrying filars carry this electrical signal from the sensor at the distal portion to the connector at the proximal portion. The processing system 306 processes the electrical signals to extract the flow velocity of the fluid.
Control signals from a processing system 306 (e.g., a processor circuit of the processing system 306) in communication with the intravascular device 102 can be transmitted to the electronic component 112 via a connector 314 that attached to the conductive portions 132, 134. The distal subassembly can include the distal core 210. The distal subassembly can also include the electronic component 112, the conductive members 230, and/or one or more layers of insulative polymer/plastic 240 surrounding the conductive members 230 and the core 210. For example, the polymer/plastic layer(s) can insulate and protect the conductive members of the multi-filar cable or conductor bundle 230. The proximal subassembly can include the proximal core 220. The proximal subassembly can also include one or more polymer layers 250 (hereinafter polymer layer 250) surrounding the proximal core 220 and/or conductive ribbons 260 embedded within the one or more insulative and/or protective polymer layer 250. In some embodiments, the proximal subassembly and the distal subassembly are separately manufactured. During the assembly process for the intravascular device 102, the proximal subassembly and the distal subassembly can be electrically and mechanically joined together. As used herein, flexible elongate member can refer to one or more components along the entire length of the intravascular device 102, one or more components of the proximal subassembly (e.g., including the proximal core 220, etc.), and/or one or more components the distal subassembly 410 (e.g., including the distal core 210, etc.). Accordingly, flexible elongate member may refer to the combined proximal and distal subassemblies described above. The joint between the proximal core 220 and distal core 210 is surrounded by the hypotube 215.
In various embodiments, the intravascular device 102 can include one, two, three, or more core wires extending along its length. For example, a single core wire can extend substantially along the entire length of the flexible elongate member 106. In such embodiments, a locking section 118 and a section 120 can be integrally formed at the proximal portion of the single core wire. The electronic component 112 can be secured at the distal portion of the single core wire. In other embodiments, such as the embodiment illustrated in
The intravascular device 102 includes one or more conductive ribbons 260 at the proximal portion of the flexible elongate member 106. The conductive ribbons 260 are embedded within polymer layer 250. The conductive ribbons 260 are directly in communication with the conductive portions 132 and/or 134. In some instances, a multi-filar conductor bundle 230 is electrically and mechanically coupled to the electronic component 112 by, e.g., soldering. In some instances, the conductive portions 132 and/or 134 comprise conductive ink (e.g., metallic nano-ink, such as copper, silver, gold, or aluminum nano-ink) that is deposited or printed directed over the conductive ribbons 260.
As described herein, electrical communication between the conductive members 230 and the conductive ribbons 260 can be established at the connection portion 114 of the flexible elongate member 106. By establishing electrical communication between the conductor bundle 230 and the conductive ribbons 260, the conductive portions 132, 134 can be in electrical communication with the electronic component 112.
In some embodiments represented by
In some embodiments, a connector 314 provides electrical connectivity between the conductive portions 132, 134 and a patient interface monitor 304. The Patient Interface Monitor 304 may in some cases connect to a console or processing system 306, which includes or is in communication with a display 308.
The system 100 may be deployed in a catheterization laboratory having a control room. The processing system 306 may be located in the control room. Optionally, the processing system 306 may be located elsewhere, such as in the catheterization laboratory itself. The catheterization laboratory may include a sterile field while its associated control room may or may not be sterile depending on the procedure to be performed and/or on the health care facility. In some embodiments, device 102 may be controlled from a remote location such as the control room, such that an operator is not required to be in close proximity to the patient.
The intraluminal device 102, PIM 304, and display 308 may be communicatively coupled directly or indirectly to the processing system 306. These elements may be communicatively coupled to the medical processing system 306 via a wired connection such as a standard copper multi-filar conductor bundle 230. The processing system 306 may be communicatively coupled to one or more data networks, e.g., a TCP/IP-based local area network (LAN). In other embodiments, different protocols may be utilized such as Synchronous Optical Networking (SONET). In some cases, the processing system 306 may be communicatively coupled to a wide area network (WAN).
The PIM 304 transfers the received signals to the processing system 306 where the information is processed and displayed (e.g., as physiology data in graphical, symbolic, or alphanumeric form) on the display 308. The console or processing system 306 can include a processor and a memory. The processing system 306 may be operable to facilitate the features of the intravascular sensing system 100 described herein. For example, the processor can execute computer readable instructions stored on the non-transitory tangible computer readable medium.
The PIM 304 facilitates communication of signals between the processing system 306 and the intraluminal device 102. The PIM 304 can be communicatively positioned between the processing system 306 and the intraluminal device 102. In some embodiments, the PIM 304 performs preliminary processing of data prior to relaying the data to the processing system 306. In examples of such embodiments, the PIM 304 performs amplification, filtering, and/or aggregating of the data. In an embodiment, the PIM 304 also supplies high- and low-voltage DC power to support operation of the intraluminal device 102 via the conductive members 230.
A multi-filar cable or transmission line bundle 230 can include a plurality of conductors, including one, two, three, four, five, six, seven, or more conductors. In the example shown in
The display or monitor 308 may be a display device such as a computer monitor or other type of screen. The display or monitor 308 may be used to display selectable prompts, instructions, and visualizations of imaging data to a user. In some embodiments, the display 308 may be used to provide a procedure-specific workflow to a user to complete an intraluminal imaging procedure.
Before continuing, it should be noted that the examples described above are provided for purposes of illustration, and are not intended to be limiting. Other devices and/or device configurations may be utilized to carry out the operations described herein.
The intravascular device 102 includes a flexible elongate member 106, such as a guidewire. The electronic component 112 is disposed at the distal portion 107 of the flexible elongate member 106. The electronic component 112 can be mounted at the distal portion 107 within a housing 280 in some embodiments. A flexible tip coil 290 extends between the housing 280 and the distal end 108. The connection portion 114 is disposed at the proximal portion of the flexible elongate member 106. The connection portion includes the conductive portions 132, 134, 136. In some embodiments, the conductive portions 132, 134, 136 can be conductive ink that is printed and/or deposited around the flexible elongate member. In some embodiments, the conductive portions 132, 134, 136 are conductive, metallic rings or bands that are positioned around the flexible elongate member. The locking section 118 and retention section 120 are disposed at the proximal portion of the flexible elongate member 106.
In some embodiments, the intravascular device 102 comprises a distal subassembly 410 and a proximal subassembly 400 that are electrically and mechanically coupled, which provides for electrical communication between the electronic component 112 and the conductive portions 132, 134, 136. For example, pressure data obtained by the electronic component 112 (in this example, electronic component 112 is a pressure sensor) can be transmitted to the conductive portions 132, 134, 136. Control signals from a processing system in communication with the intravascular device 102 can be transmitted to the electronic component 112 via the conductive portions 132, 134, 136. The distal subassembly 410 can include the distal core 210. The distal subassembly 410 can also include the electronic component 112, the conductive members 230, and/or one or more layers of polymer/plastic 240 surrounding the conductive members 230 and the core 210. For example, the polymer/plastic layer(s) can protect the conductive members 230. The proximal subassembly 400 can include the proximal core 220. The proximal subassembly 400 can also include one or more polymer layers 250 surrounding the proximal core 220 and/or conductive ribbons 260 embedded within the one or more polymer layers 250. In some embodiments, the proximal subassembly 400 and the distal subassembly 410 can be separately manufactured. During the assembly process for the intravascular device 102, the proximal subassembly 400 and the distal subassembly 410 can be electrically and mechanically joined together, and the joint can be enclosed in a hypotube 215. As used herein, flexible elongate member can refer to one or more components along the entire length of the intravascular device 102, one or more components of the proximal subassembly 400 (e.g., including the proximal core 220, etc.), and/or one or more components the distal subassembly 410 (e.g., including the distal core 210, etc.).
In various embodiments, the intravascular device 102 can include one, two, three, or more core wires extending along its length. For example, a single core wire can extend substantially along the entire length of the flexible elongate member 106. In such embodiments, a locking section 118 and a retention section 120 can be integrally formed at the proximal portion of the single core wire. The electronic component 112 can be secured at the distal portion of the single core wire. In other embodiments, such as the embodiment illustrated in
The intravascular device 102 includes one or more conductive ribbons 260 at the proximal portion of the flexible elongate member 106. The conductive ribbons 260 are embedded within polymer layer(s) 250. The conductive ribbons 260 are directly in communication with the conductive portions 132, 134, and/or 136. In some instances, the conductive members 230 are electrically and mechanically coupled to the electronic component 112 by, e.g., soldering, welding, terminals, clamps, conductive adhesive, or other appropriate methods. In some instances, the conductive portions 132, 134, and/or 136 comprise conductive ink (e.g., metallic nano-ink, such as silver or gold nano-ink) that is deposited or printed directed over the conductive ribbons 260.
As described herein, electrical communication between the conductive members 230 and the conductive ribbons 260 can be established at the connection region 270 of the flexible elongate member 106. By establishing electrical communication between the conductive members 230 and the conductive ribbons 260, the conductive portions 132, 134, 136 can be in electrically communication with the electronic component 112.
In some instances, the machining process that forms locking section 118 may remove of the conductive ribbons 260, proximal ends of the conductive ribbons 260 would be exposed to moisture and/or liquids, such as blood, saline solutions, disinfectants, and/or enzyme cleaner solutions. In these cases, an insulation layer 158 can be formed over the proximal end portion of the connection portion 114 to insulate the exposed conductive ribbons 260.
During the manufacturing process for an intravascular device, the filars may be wrapped or pulled along the length of the device, from one end of the device to the other end. Because pure copper and many copper alloys have a low tensile and yield strength, the mechanical strength of electrical conductor materials is typically very low. The manufacturing process for the intravascular device may involve wrapping or stretching of the multi-filar conductor bundle, which may involve tensioning. Unfortunately, this tensioning can cause the conductive filars to plasticly deform, which can result in severe and undesirable elongation and/or necking, e.g., up to 100% elongation in some current processes, along with blistering of the insulation around the necking site. The associated narrowing of the conductor affects both the mechanical strength and the maximum electrical current capacity of the filar, which can lead to manufacturing defects. It may therefore be desirable to replace the filars with other types of conductors, and/or replace the manufacturing process with a process that does not require pulling, wrapping, or tensioning of the conductors.
Because the traces 660 are coated or deposited rather than wrapped or tensioned, they can for example be made of mechanically weak conductor materials such as pure metallic copper, without the risk of elongation or necking during the manufacturing process. Additionally, the deposited traces 660 conform to the shape or curvature of the wire, which can serve to reduce the cross-sectional size or profile of the device 102. Conductive nano-metal inks may be employed for this production process. The conductive nano-metal ink can be applied in many ways, including but not limited to inkjet printing, aerosol jet printing, felt/foam pad applicator, or dip coating. In some embodiments, the material is cured or dried, and the traces are formed from the cured or dried material. In some embodiments, the coated material is sintered, e.g., heated until the small metal particles in the coated ink melt together. Sintering can be accomplished with an oven, a laser, a torch, or by other means. Once cured, sintered, or otherwise turned into a solid metal, the coated metal layer or layers can be individuated via laser ablation, mechanical cutting/skiving or any other methods capable of removing metal and/or polymer material in a precise manner. This process can be implemented on continuous reel to reel type combination coater/oven equipment. In one example, ink application is performed with an ink-impregnated pad made of felt or foam, and individuation is performed by mechanical cutting. In another example, ink application is performed with an ink-impregnated felt or foam pad, and individuation is performed via laser ablation. In still another example, the ink application is performed by dip coating. This metal ink conductor assembly could be applied to any product that employs electrical conductors embedded into composite subassemblies.
In some embodiments, the conductive ink or material may be applied only to portions of the circumference, and not around the entire circumference. For example, longitudinal strips may be printed or coated on so that only portions of the circumference of the polymer coating are covered with the conductive ink. In these embodiments, individual traces are applied to the insulated core, using, e.g., inkjet printing, continuous reel-to-reel process, etc. The individual traces can be applied one at a time or can be simultaneously applied. These embodiments may or may not employ the manufacturing steps depicted in
It is noted that the cuts 1110 may, in some instances, be made before the outer polymer coating 1050 is deposited. However, this may tend to result in rougher edges and less regular depth, whereas cutting or skiving the metal layer 960 along with the outer polymer coating may tend to result in cleaner cuts.
In some embodiments, longitudinal traces 660 formed with conductive ink can be used in place of multi-filar conductor bundles 230 in the distal core wire assembly 410, instead of or in addition to replacing conductive metallic ribbons 260 in the proximal core wire assembly 400. In some embodiments, the outer polymer coating 1250 may be applied directly over the conductive traces 660, and the polymer coating 1050 may not be applied at all. In some embodiments, additional coatings may be applied over the outer polymer coating 1250 to, for example, reduce friction, improve lubricity, or alter the wetting properties of the device.
Depending on the implementation, the structure shown in
The conductive filars 310 and 330 connect the electronic component 112 with electrical contacts 1010 formed on the conformal, coated longitudinal traces 660 that make electrical contact with the conductive regions 132 and 134. The reinforced multi-filar conductor bundle 230 includes a straight region 232 that passes through or along the coil 290. The reinforced multi-filar conductor bundle 230 also includes a spiral region 234 that wraps around the distal core wire 210 and is overcoated with an insulative or protective polymer coating 240. The reinforced multi-filar conductor bundle 230 additionally includes a straight region 236 that passes through the hypotube 215. Between the hypotube 215 and the electrical contacts 1010, the conductive filars are overcoated with a polymer coating 250. Placement of the multi-filar conductor bundle in these regions 232, 234, and 236 may involve tensioning of the multi-filar conductor bundle, with attendant risk of unwanted elongation and/or necking of the conductors 230.
The device 102 can include any suitable quantity of conductors in the bundle 230, include two, three, four, five, or more. The device 102 can include any suitable quantity of conductive traces 660, include two, three, four, five, or more. In some embodiments, the device 102 includes the same quantity of conductors in the bundle 230 as conductive traces 660. In some embodiments, the quantity of conductors in the bundle 230 is greater than or less than the quantity of conductive traces 660. In that regard, in some embodiments, the bundle 230 includes one more conductor in the bundle 230 as the quantity of conductive traces 660. The one additional conductor in the bundle 230 can be electrically and mechanically terminated at the core wire 220 to provide an electrical ground. The device 102 can include any suitable number of conductive regions 132 and 134, include two, three, four, five or more. In some embodiments, the device 102 includes the same quantity of conductive traces 660 as conductive regions 132 and 134.
Placement of the coated conductive traces 1560 in these regions does not require tensioning, with attendant risk of unwanted elongation and/or necking, and may therefore represent an improvement over the use of multi-filar conductor bundles.
The processor 1660 may include a central processing unit (CPU), a digital signal processor (DSP), an ASIC, a controller, or any combination of general-purpose computing devices, reduced instruction set computing (RISC) devices, application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), or other related logic devices, including mechanical and quantum computers. The processor 1660 may also comprise another hardware device, a firmware device, or any combination thereof configured to perform the operations described herein. The processor 1660 may also be implemented as a combination of computing devices, e.g., a combination of a DSP and a microprocessor, a plurality of microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration.
The memory 1664 may include a cache memory (e.g., a cache memory of the processor 1660), random access memory (RAM), magnetoresistive RAM (MRAM), read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read only memory (EPROM), electrically erasable programmable read only memory (EEPROM), flash memory, solid state memory device, hard disk drives, other forms of volatile and non-volatile memory, or a combination of different types of memory. In an embodiment, the memory 1664 includes a non-transitory computer-readable medium. The memory 1664 may store instructions 1666. The instructions 1666 may include instructions that, when executed by the processor 1660, cause the processor 1660 to perform the operations described herein. Instructions 1666 may also be referred to as code. The terms “instructions” and “code” should be interpreted broadly to include any type of computer-readable statement(s). For example, the terms “instructions” and “code” may refer to one or more programs, routines, sub-routines, functions, procedures, etc. “Instructions” and “code” may include a single computer-readable statement or many computer-readable statements.
The communication module 1668 can include any electronic circuitry and/or logic circuitry to facilitate direct or indirect communication of data between the processor circuit 1650, and other processors or devices. In that regard, the communication module 1668 can be an input/output (I/O) device. In some instances, the communication module 1668 facilitates direct or indirect communication between various elements of the processor circuit 1650 and/or the intravascular measurement system 100. The communication module 1668 may communicate within the processor circuit 1650 through numerous methods or protocols. Serial communication protocols may include but are not limited to US SPI, I2C, RS-232, RS-485, CAN, Ethernet, ARINC 429, MODBUS, MIL-STD-1553, or any other suitable method or protocol. Parallel protocols include but are not limited to ISA, ATA, SCSI, PCI, IEEE-488, IEEE-1284, and other suitable protocols. Where appropriate, serial and parallel communications may be bridged by a UART, USART, or another appropriate subsystem.
External communication (including but not limited to software updates, firmware updates, preset sharing between the processor and central server, or readings from the intraluminal device) may be accomplished using any suitable wireless or wired communication technology, such as a cable interface such as a USB, micro USB, Lightning, or FireWire interface, Bluetooth, Wi-Fi, ZigBee, Li-Fi, or cellular data connections such as 2G/GSM, 3G/UMTS, 4G/LTE/WiMax, or 5G. For example, a Bluetooth Low Energy (BLE) radio can be used to establish connectivity with a cloud service, for transmission of data, and for receipt of software patches. The controller may be configured to communicate with a remote server, or a local device such as a laptop, tablet, or handheld device, or may include a display capable of showing status variables and other information. Information may also be transferred on physical media such as a USB flash drive or memory stick.
Accordingly, it can be seen that the metal ink conductor assembly advantageously reduces or eliminates the need for tensioning of multi-filar conductor bundles and/or conductive ribbons that may be used in the manufacture of small electronic devices such as intravascular medical catheters and guidewires. This may tend to eliminate the risk of elongation and/or necking that can compromise the mechanical and electrical properties of a conductor, as well as reducing the risk of gaps or thin spots in the outer insulative coating. A number of variations are possible on the examples and embodiments described above. For example, the conductive ink could be coated in the form of individual traces, rather than a uniform coating that is later individuated by cutting.
The metal ink conductor assembly could be applied to any product that involves electrical conductors to be embedded into composite subassemblies. The present disclosure permits conductors with similar cross-sectional area to flat conductive ribbons. However, unlike conductive ribbons, these conductors can conform to the curvature of the core wire. The present disclosure also creates detectable material transition layers in the areas where individuation occurs.
The logical operations making up the embodiments of the technology described herein are referred to variously as operations, steps, objects, elements, components, or modules. Furthermore, it should be understood that these may be arranged or performed in any order, unless explicitly claimed otherwise or a specific order is inherently necessitated by the claim language. It should further be understood that the described technology may be employed in single-use and multi-use electrical and electronic devices for medical or nonmedical use.
All directional references e.g., upper, lower, inner, outer, upward, downward, left, right, lateral, front, back, top, bottom, above, below, vertical, horizontal, clockwise, counterclockwise, proximal, and distal are only used for identification purposes to aid the reader's understanding of the claimed subject matter, and do not create limitations, particularly as to the position, orientation, or use of the metal ink conductor assembly. Connection references, e.g., attached, coupled, connected, and joined are to be construed broadly and may include intermediate members between a collection of elements and relative movement between elements unless otherwise indicated. As such, connection references do not necessarily imply that two elements are directly connected and in fixed relation to each other. The term “or” shall be interpreted to mean “and/or” rather than “exclusive or.” The word “comprising” does not exclude other elements or steps, and the indefinite article “a” or “an” does not exclude a plurality. Unless otherwise noted in the claims, stated values shall be interpreted as illustrative only and shall not be taken to be limiting.
The above specification, examples and data provide a complete description of the structure and use of exemplary embodiments of the metal ink conductor assembly as defined in the claims. Although various embodiments of the claimed subject matter have been described above with a certain degree of particularity, or with reference to one or more individual embodiments, those skilled in the art could make numerous alterations to the disclosed embodiments without departing from the spirit or scope of the claimed subject matter.
Still other embodiments are contemplated. It is intended that all matter contained in the above description and shown in the accompanying drawings shall be interpreted as illustrative only of particular embodiments and not limiting. Changes in detail or structure may be made without departing from the basic elements of the subject matter as defined in the following claims.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/EP2021/069545 | 7/14/2021 | WO |
| Number | Date | Country | |
|---|---|---|---|
| 63051927 | Jul 2020 | US |
