Ionic Additives to Solvent-Based Strippers

Abstract

In a removal solution for removing a residue from a substrate, a first interfacial tension exists between the residue and the substrate. The solution includes a polar solvent and an ionic salt. The ionic salt is dissolved into the polar solvent, thereby forming the removal solution. The ionic salt includes at least one ion that, upon dissolution in the solvent, causes the removal solution to have a lower interfacial tension with the residue than the first interfacial tension.

Description

Claims

1. A removal solution for removing a residue from a substrate, a first interfacial tension existing between the residue and the substrate, comprising: a. a polar solvent; andb. an ionic salt dissolved into the polar solvent, thereby forming the removal solution, the ionic salt including at least one ion that, upon dissolution in the solvent, causes the removal solution to have a lower interfacial tension with the residue than the first interfacial tension.

2. The removal solution of claim 1, wherein the polar solvent comprises NMP.

3. The removal solution of claim 2, wherein the ionic salt includes a fluoride salt.

4. The removal solution of claim 3, wherein the fluoride salt is chosen from a group consisting of: TBAF, NH4F, and combinations thereof.

5. The removal solution of claim 2, wherein the ionic salt includes an acetate.

6. The removal solution of claim 5, wherein the acetate comprises TMAAC.

7. The removal solution of claim 1, wherein the polar solvent comprises de-ionized water.

8. The removal solution of claim 7, wherein the ionic salt includes a fluoride salt.

9. The removal solution of claim 8, wherein the fluoride salt is chosen from a group consisting of: TBABF4, NH4F and combinations thereof.

10. The removal solution of claim 1, wherein the ionic salt has a concentration of 0.1 M.

11. The removal solution of claim 1, heated to a temperature of 70° C.

12. A method of cleaning a residue from a substrate, a first interfacial tension existing between the residue and the substrate, comprising the actions of: a. selecting a polar solvent and an ionic salt so that a solution of the polar solvent and the ionic salt has an interfacial tension with the residue that is lower than the first interfacial tension;b. dissolving the ionic salt, in a predetermined concentration, with the polar solvent to form a removal solution;c. heating the removal solution to a predetermined temperature; andd. placing the substrate and the residue into the removal solution while maintaining the removal solution at the predetermined temperature.

13. The method of claim 12, wherein the residue comprises a photoresist.

14. The method of claim 13, wherein the photoresist comprises a plasma etch photoresist.

15. The method of claim 12, wherein the selecting action comprises selecting NMP as the polar solvent.

16. The method of claim 12, wherein the ionic salt includes a fluoride salt and wherein the selecting action comprises the action of selecting a fluoride salt from a group consisting of: TBAF, NH4F, and combinations thereof.

17. The method of claim 12, wherein the ionic salt includes TMAAC.

18. The method of claim 12, wherein the selecting action comprises selecting de-ionized water as the polar solvent.

19. The method of claim 18, wherein the ionic salt includes a fluoride salt that is chosen from a group consisting of: TBABF4, NH4F and combinations thereof.

20. The method of claim 12, wherein the predetermined concentration comprises 0.1 M of the ionic salt.

21. The method of claim 12, wherein the predetermined temperature comprises 70° C.