Claims
- 1. An electrode comprising:
- metallic electrode material; and
- a nonporous solid composite material encapsulating said electrode material, said composite material comprising an inert matrix material having hydrogel substantially uniformly dispersed therein, the hydrogel comprising 10% to approximately 50% by weight of the dry composite material, there being sufficient bonding between molecules of the hydrogel and the matrix material to prevent substantial leach-out of hydrogel molecules from the composite.
- 2. The electrode of claim 1 wherein the electrode material comprises material selected from the group consisting of zinc, silver, lead, lead oxide, lead sulfate, zinc oxide, copper, copper oxide, silver oxide, platinum, carbon and stainless steel.
- 3. The electrode of claim 1 wherein the electrode material is dispersed within said composite material.
- 4. The electrode of claim 3 wherein the ratio of the weight of the composite material to the electrode material is in the range of approximately 1.0 to 1.5.
- 5. The electrode of claim 1 further comprising a conductive material dispersed within the composite material.
- 6. The electrode of claim 1 wherein the matrix material is selected from the group consisting of polyvinylidene chloride, polyvinyl chloride, polyvinylidene fluoride, polyethylene, polypropylene, polyurethane, vinyl acetate/ethylene, and phenol formaldehyde.
- 7. The electrode of claim 6 wherein the hydrogel is a synthetic material selected from the group consisting of polyethylene oxide, polyacrylic acid and polyacrylamide.
- 8. The electrode of claim 6 wherein the hydrogel is devised from natural materials selected from the group consisting of hydroxyethyl cellulose, gelatin, pectin, cellulose and starch.
- 9. The electrode of claim 8 further comprising a coupling agent to facilitate the bonding between the hydrogel and the matrix material.
- 10. The electrode of claim 6 further comprising a coupling agent to facilitate the bonding between the hydrogel and the matrix material.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of application Ser. No. 275,977 filed Nov. 25, 1988, now abandoned. Application Ser. No. 275,977 was a continuation-in-part of application No. 915,994 filed Oct. 6, 1986, now U.S. Pat. No. 4,797,190.
US Referenced Citations (4)
Continuation in Parts (2)
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Number |
Date |
Country |
Parent |
275977 |
Nov 1988 |
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Parent |
915994 |
Oct 1986 |
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