The present disclosure relates to an irregularly-shaped die. The present application claims the priority based on Japanese Patent Application No. 2021-187105 filed on Nov. 17, 2021. The entire contents of the description in this Japanese patent application are incorporated herein by reference.
Conventionally, an irregularly-shaped die is disclosed in, for example, International Publication No. 2018/123513 (PTL 1).
PTL 1: International Publication No. 2018/123513
An irregularly-shaped die according to the present disclosure is an irregularly-shaped die for producing an irregularly-shaped wire, wherein a processing hole is provided, the processing hole having a reduction portion and a bearing portion in this order from an upstream side in a wire drawing direction, a corner portion having a curved shape and a non-corner portion located at a position different from a position of the corner portion are provided in a cross section of the bearing portion perpendicular to the wire drawing direction, and a surface roughness of the corner portion is greater than a surface roughness of the non-corner portion. The surface roughness Sa of the corner portion is equal to or less than 0.30 μm and the surface roughness Sa of the non-corner portion is equal to or less than 0.20 μm.
The accuracy of an irregularly-shaped wire produced using a conventional irregularly-shaped die is low.
According to the present disclosure, the processing accuracy of an irregularly-shaped wire can be improved.
An overview of a diamond die for wire drawing of an irregularly-shaped wire will be described with reference to the drawings.
At least a surface extending from bell portion 6a to bearing portion 6d, of hole inner surface 6 formed by processing hole 7, is formed by a smooth curved surface in a thickness direction of diamond. In other words, unlike a configuration in which each of bell portion 6a, approach portion 6b, reduction portion 6c, and bearing portion 6d is formed linearly and boundary portions thereof are rounded, the portions as a whole are formed by a smooth curved surface. This curved surface is formed by a curved surface of single R or a curved surface of composite R, and boundary portions thereof have a shape that is not clearly known.
A wire diameter of a wire subjected to a wire drawing process using irregularly-shaped diamond die 10 is approximately 10 mm, which is thick. In the case of subjecting such a thick wire to the wire drawing process, when the surface extending from bell portion 6a to bearing portion 6d is formed by a smooth curved surface, a wire drawing resistance does not change greatly, a scratch is less likely to occur on a surface of the wire subjected to the wire drawing process, and small surface roughness and undulation are achieved. In addition, from the perspective of supplying a lubricant, excellent lubrication conditions are achieved when the surface extending from bell portion 6a to bearing portion 6d is formed by a smooth curved line.
Polycrystalline diamond 5 around processing hole 7 is single polycrystalline diamond that is continuous in a circumferential direction of processing hole 7. Since polycrystalline diamond 5 around processing hole 7 is single polycrystalline diamond that is continuous in the circumferential direction of the processing hole, polycrystalline diamond 5 has a higher strength than a strength of divided diamond. As a result, the accuracy of the processing hole can be higher and the surface roughness of the wire subjected to wire drawing can be smaller.
When bearing portion 6d has a quadrangular front shape and D represents a distance between the facing surfaces of the quadrangular shape, a region having a length of 1.0 D in the wire drawing direction corresponds to bearing portion 6d. A portion having a smallest inner diameter corresponds to the center of bearing portion 6d, and a region extending upward by 0.5 D and downward by 0.5 D in the wire drawing direction from the portion corresponds to bearing portion 6d. A region located upstream of bearing portion 6d so as to be adjacent to bearing portion 6d and having a length of 0.5 D in the wire drawing direction corresponds to reduction portion 6c. Generally, longer length of bearing portion 6d is more preferable from the perspective of improving the life of irregularly-shaped diamond die 10, i.e., preventing wear and shape change of polycrystalline diamond 5.
However, when an ultrafine wire is subjected to wire drawing, wire breakage is a big problem, and thus, bearing portion 6d cannot be made long. In order to prevent wire breakage, it is necessary to take measures from the following two perspectives, i.e., decreasing a contact area between polycrystalline diamond 5 and the wire, and decreasing the friction force per unit area. Therefore, first of all, from the perspective of decreasing the contact area with the wire, it is preferable to make bearing portion 6d short. As a result, the friction force is reduced.
In addition, since the smooth curved surface makes it possible to decrease the contact area, to prevent the lubricant from running out, and to stabilize the wire drawing resistance, the wire breakage prevention effect is remarkable. Furthermore, in the case of subjecting bearing portion 6d to polishing, it is difficult to achieve a smooth surface having a small surface roughness when the length of bearing portion 6d is long. However, since the length of bearing portion 6d is short, polishing can be performed with high accuracy, which also provides the effect of stabilizing the wire drawing resistance.
When surface roughness Sa of a corner portion 7a and surface roughness Sa of a non-corner portion 7b having a straight line shape in bearing portion 6d are compared, the surface roughness of corner portion 7a is greater. The surface roughness Sa of the corner portion is equal to or less than 0.30 μm, and the surface roughness Sa of the non-corner portion is equal to or less than 0.20 μm. Preferably, the surface roughness Sa of corner portion 7a is equal to or less than 0.15 μm, and the surface roughness Sa of non-corner portion 7b is equal to or less than 0.10 μm. More preferably, the surface roughness Sa of corner portion 7a is equal to or less than 0.10 μm, and the surface roughness Sa of non-corner portion 7b is equal to or less than 0.07 μm.
The surface roughness Sa is defined by ISO 25178. A range in which there are 20 or more peaks and valleys therein is set as a measurement range. Measurement is conducted under the conditions of with measurement pretreatment, with inclination correction, and without a Gaussian filter. Bearing portion 6d is a portion of processing hole 7 having a smallest diameter and the surface roughness of bearing portion 6d is deeply related to the surface roughness of the wire. The surface roughness Sa of the non-corner portion of bearing portion 6d is preferably equal to or less than 0.05 μm. In order to achieve a high-accuracy and long-life die, the surface roughness Sa of bearing portion 6d is more preferably equal to or less than 0.03 μm, and most preferably equal to or less than 0.01 μm. Smaller surface roughness Sa of bearing portion 6d is more preferable. However, in consideration of the cost effectiveness on industrial production, the surface roughness Sa of bearing portion 6d is preferably equal to or more than 0.002 μm.
In order to measure the surface roughness Sa of bearing portion 6d, a transfer material (e.g., RepliSet manufactured by Marumoto Struers K.K.) is filled into processing hole 7 of the irregularly-shaped die and a replica onto which the surface of processing hole 7 has been transferred is produced. This replica is observed using a laser microscope (e.g., VK-X series shape analysis laser microscope manufactured by Keyence Corp.) and the surface roughness Sa is measured at arbitrary three locations in corner portion 7a and non-corner portion 7b. Average values of the surface roughnesses Sa measured at these three locations in corner portion 7a and non-corner portion 7b are defined as the surface roughnesses Sa of corner portion 7a and non-corner portion 7b of bearing portion 6d, respectively. As to the surface roughness Sa of the wire subjected to wire drawing as well, the surface is observed using the laser microscope and the surface roughness Sa is measured at arbitrary three locations. An average value of the surface roughnesses Sa at these three locations is defined as the surface roughness Sa of the wire.
In this case, the surface roughness of reduction portion 6c located upstream of bearing portion 6d is small, and thus, the surface roughness of the wire subjected to wire drawing can be made small.
In order to achieve a high-accuracy and long-life die, the surface roughness Sa of each of corner portion 7a1 and non-corner portion 7b1 of reduction portion 6c is more preferably equal to or less than 0.05 μm, and most preferably equal to or less than 0.03 μm. Smaller surface roughness Sa of reduction portion 6c is more preferable. However, in consideration of the cost effectiveness on industrial production, the surface roughness Sa of reduction portion 6c is preferably equal to or more than 0.01 μm.
The surface roughness of reduction portion 6c is measured using the same method as the method for measuring the surface roughness of bearing portion 6d.
The wire subjected to wire drawing is used as a winding of a motor, and the like. In such an application, winding the wire at high density is required, and thus, smaller R of the corner portion of the wire is more preferable. Therefore, the R of corner portion 7a of the quadrangular shape in the bearing portion is equal to or less than 20 μm. Smaller R of corner portion 7a is more preferable. However, in consideration of the cost effectiveness on industrial production, the R of corner portion 7a is preferably equal to or more than 1 μm.
Although the case in which processing hole 7 has a quadrangular shape is described in the present embodiment, the shape of processing hole 7 is not limited to the quadrangular shape and may be another polygonal shape such as a triangular shape or a hexagonal shape. It is preferable that many cross sections orthogonal to a longitudinal direction of the wire include a straight line portion. Furthermore, when the sides have different lengths, the length of the longest side is preferably equal to or less than 1000 μm. There is no lower limit to the length of the longest side. However, when the longest side is too short, the manufacturing cost is high on industrial production. Therefore, in consideration of the cost effectiveness, the length of the longest side is preferably equal to or more than 5 μm.
Although processing hole 7 has a quadrangular shape in the present embodiment, the shape of processing hole 7 is not limited thereto and may be a track shape formed by connecting a straight line and a semicircle.
A reduction angle of corner portion 7a1 may be different from a reduction angle of non-corner portion 7b1.
The reduction angle of corner portion 7a1 may be greater than the reduction angle of non-corner portion 7b1.
By making the reduction angle of corner portion 7a1 greater than the reduction angle of non-corner portion 7b1 as described above, an area reduction ratio of corner portion 7a1 can be set to be greater than an area reduction ratio of non-corner portion 7b1. As a result, the wire subjected to the wire drawing process is narrowed more sharply in corner portion 7a1 than in non-corner portion 7b1. By doing so, even a large-diameter wire targeted by the irregularly-shaped die according to the present disclosure is easily processed up to every part of corner portion 7a1. Thus, the shape accuracy of the wire subjected to the wire drawing process is improved. In addition, although increasing the area reduction ratio leads to an increase in resistance during wire drawing, the increase in resistance during wire drawing is suppressed and the problem of breakage of the wire becomes less likely to occur, by setting the surface roughness as described above.
Furthermore, the reduction angle of corner portion 7a1 becomes greater with increasing distance from non-corner portion 7b1. Specifically, the reduction angle may become greater toward a tip 7a2 of corner portion 7a1. Tip 7a2 of corner portion 7a1 refers to a portion of corner portion 7a1 having a greatest distance from center line 7d.
By setting the shape as described above, tip 7a2 of corner portion 7a1 has a largest area reduction ratio and the wire is easily processed up to tip 7a2 of corner portion 7a1. In addition, in a process for manufacturing the irregularly-shaped die, processing of corner portion 7a1 becomes easier and the accuracy of corner portion 7a1 can be easily improved.
In order to make the R of corner portion 7a1 smaller, and further to make the surface roughness Sa of bearing portion 6d smaller, diamond that constitutes polycrystalline diamond 5 must have a small particle size. Polycrystalline diamond (sintered diamond) 5 having an average particle size of equal to or less than 500 nm is preferably used.
In order to achieve a high-accuracy and long-life die, the average particle size of diamond is more preferably equal to or less than 300 nm, and most preferably equal to or less than 100 nm. Smaller average particle size of diamond is more preferable. However, the cost of ultrafine diamond particles is high on industrial production, and thus, the average particle size of diamond is preferably equal to or more than 5 nm.
In order to measure the average particle size of the diamond particles, a photograph of polycrystalline diamond 5 is taken at arbitrary three locations within a range of 5 μm×5 μm using a scanning electron microscope. Individual diamond particles are extracted from the taken image and the extracted diamond particles are subjected to a binarization process, thereby calculating an area of each diamond particle. A diameter of a circle having the same area as the area of each diamond particle is defined as the particle size of the diamond particle. An arithmetic average value of the diamond particle sizes (diameters of the circles) is defined as the average particle size.
Polycrystalline diamond 5 may include a binder. A ratio of the binder in the polycrystalline diamond is preferably equal to or less than 5 volume %. In order to achieve a high-accuracy and long-life die, the ratio of the binder is more preferably equal to or less than 3 volume %, and it is most preferable that polycrystalline diamond 5 should include no binder.
In order to measure the ratio of the binder, a photograph of polycrystalline diamond 5 is taken at arbitrary three locations within a range of 5 μm×5 μm using the scanning electron microscope as described in the paragraph of “(Diamond Particle Size)” above. The taken image is read using the Adobe Photoshop or the like, a threshold value that matches the original image is calculated through contour tracing, and black and white conversion is performed using the threshold value. An area of the binder displayed in white as a result of the black and white conversion can be calculated. The diamond particles are displayed in gray and a grain boundary is displayed in black. The area ratio of the binder is defined as the volume ratio of the binder.
In the example above, the wire is processed using diamond 1. However, in the irregularly-shaped die, bearing portion 6d may be made of a hard material other than diamond 1.
Examples of the material of bearing portion 6d include cubic boron nitride (CBN) or cemented carbide. The material of bearing portion 6d can be determined depending on a material of a wire to be processed.
As a material of irregularly-shaped diamond die 10, sintered diamond having an average particle size of equal to or less than 5 μm is prepared. The sintered diamond is processed into a cylindrical shape, and then, a hole is bored therein by a laser processing method. Next, coarse processing is performed by an electrical discharge processing method. Next, polishing of the hole is performed. Ultrasonic polishing is performed using a diamond powder and a polishing needle, and finishing is performed.
Non-corner portion 7b is polished in a more focused manner than corner portion 7a. As a result, the surface roughness Sa of non-corner portion 7b of bearing portion 6d becomes 0.026 μm and the surface roughness Sa of corner portion 7a of bearing portion 6d becomes 0.042 μm. The surface roughness Sa of non-corner portion 7b1 of reduction portion 6c becomes 0.029 μm and the surface roughness Sa of corner portion 7a1 of reduction portion 6c becomes 0.058 μm.
It is common practice to polish diamond while gradually making a powder for processing finer. Although diamond is adequately polished by spending a lot of time, there is no standard about how adequately diamond should be polished. In the present disclosure, the corner portion and the non-corner portion are polished within a defined value of high accuracy that is considered to be necessary for the wire drawing process, as compared with a conventional polishing method. Therefore, the stress in the wire can be made uniform and wire habits such as a twist can be improved.
A reason why the surface roughness of non-corner portion 7b is made smaller than the surface roughness of corner portion 7a is that non-corner portion 7b is processed greatly and corner portion 7a is not so greatly processed as compared with non-corner portion 7b in irregularly-shaped diamond die 10. By making smaller the surface roughness Sa of non-corner portion 7b where the wire is greatly processed, the occurrence of the problem such as a twist is suppressed.
In order to make the surface roughness of corner portion 7a small, corner portion 7a needs to be polished with high accuracy. However, since corner portion 7a is curved with a small radius R, polishing of corner portion 7a with high accuracy can possibly cause deformation of corner portion 7a, and in this case, the shape of the wire cannot be kept. Furthermore, since corner portion 7a does not so greatly contribute to processing as compared with non-corner portion 7b, making the surface roughness of corner portion 7a greater than the surface roughness of non-corner portion 7b does not cause the problem such as a twist of the wire.
An irregularly-shaped die according to the present disclosure is an irregularly-shaped die for producing an irregularly-shaped wire, wherein processing hole 7 is provided, processing hole 7 having reduction portion 6c and bearing portion 6d in this order from an upstream side in a wire drawing direction, corner portion 7a having a curved shape and non-corner portion 7b located at a position different from a position of corner portion 7a are provided in a cross section of bearing portion 6d perpendicular to the wire drawing direction, and a surface roughness of corner portion 7a is greater than a surface roughness of non-corner portion 7b.
Preferably, the surface roughness Sa of corner portion 7a is equal to or less than 0.10 μm, and the surface roughness Sa of non-corner portion 7b is equal to or less than 0.07 μm.
Preferably, corner portion 7a1 having a curved shape and non-corner portion 7b1 located at a position different from a position of corner portion 7a1 are provided in a cross section of reduction portion 6c perpendicular to the wire drawing direction, the surface roughness Sa of corner portion 7a1 of reduction portion 6c is equal to or less than 0.10 μm, the surface roughness Sa of non-corner portion 7b1 of reduction portion 6c is equal to or less than 0.07 μm, and a difference between the surface roughness Sa of non-corner portion 7b1 of reduction portion 6c and the surface roughness Sa of non-corner portion 7b of bearing portion 6d is equal to or less than 0.05 μm.
The wire to be subjected to wire drawing can be various types of metals such as copper, silver, iron, gold, and aluminum.
Irregularly-shaped diamond dies of Sample Nos. 1 to 8 shown in Table 1 in which various numerical values were variously set were prepared to have the shape shown in
The irregularly-shaped diamond die of Sample No. 1 was made by the following method. First, a pilot hole was bored in polycrystalline diamond having various average particle sizes by the laser processing method, and then, coarse processing was performed by the electrical discharge processing method. Next, finishing processing was performed by lapping processing. In the lapping processing method, a stainless wire having a rectangular cross-sectional shape of 95 μm×50 μm, with each corner portion thereof having roundness of R 20 μm, was first produced by a rolling processing method. A side of 95 μm of the stainless wire was brought into contact with one side of the die hole and moved in a reciprocating manner for finishing processing, while supplying a diamond slurry (including diamond having a particle size of 0.2 μm). The remaining three sides were also subjected to finishing processing by the same method.
A quadrangular wire having each side of 105 μm and made of copper was subjected to the wire drawing process (wire drawing speed: 10 m/min) in a lubricant and a test was performed for one hour, to obtain a quadrangular wire having a length of 600 m. The surface roughness Sa of the wire in a direction orthogonal to the wire drawing direction of the quadrangular wire subjected to one-hour wire drawing was evaluated in accordance with ISO 25178. The surface roughness was evaluated at a portion of the length of 600 m. The results are shown in Table 1.
When the surface roughness Sa of the quadrangular wire subjected to wire drawing in Sample No. 1 was represented as 1, a sample having the surface roughness Sa of 0.8 to 1 in relative value was determined as evaluation A, a sample having the surface roughness Sa of more than 1 and equal to or less than 1.1 in relative value was determined as evaluation B, a sample having the surface roughness Sa of more than 1.1 and equal to or less than 1.3 in relative value was determined as evaluation C, a sample having the surface roughness Sa of more than 1.3 and equal to or less than 1.4 in relative value was determined as evaluation D, and a sample having the surface roughness Sa of more than 1.4 in relative value was determined as evaluation E. The samples determined as evaluation A to evaluation D can be put to practical use.
According to Table 1, in all of the samples, the surface roughness of corner portion 7a is greater than the surface roughness of non-corner portion 7b.
Preferably, the surface roughness Sa of corner portion 7a is equal to or less than 0.15 μm and the surface roughness Sa of non-corner portion 7b is equal to or less than 0.10 μm.
More preferably, the surface roughness Sa of corner portion 7a is equal to or less than 0.10 μm and the surface roughness Sa of non-corner portion 7b is equal to or less than 0.07 μm.
More preferably, the surface roughness Sa of the corner portion of reduction portion 6c is equal to or less than 0.15 μm, the surface roughness Sa of the non-corner portion of the reduction portion is equal to or less than 0.10 μm, and a difference between the surface roughness Sa of the reduction portion and the surface roughness Sa of the bearing portion is equal to or less than 0.05 μm.
Irregularly-shaped diamond dies of Sample Nos. 11 to 13 shown in Table 2 in which various numerical values were variously set were prepared to have the shape shown in
The wire drawing conditions were stricter than the wire drawing conditions of Sample Nos. 1 to 8.
A quadrangular wire having each side of 105 μm and made of copper was subjected to the wire drawing process (wire drawing speed: 13 m/min) in a lubricant and a test was performed for one hour, to obtain a quadrangular wire having a length of 780 m. The surface roughness Sa of the wire in a direction orthogonal to the wire drawing direction of the quadrangular wire subjected to one-hour wire drawing was evaluated in accordance with ISO 25178. The surface roughness was evaluated at a portion of the length of 780 m. The results are shown in Table 2.
When the surface roughness Sa of the quadrangular wire subjected to wire drawing in Sample No. 11 was represented as 1, a sample having the surface roughness Sa of 0.8 to 1 in relative value was determined as evaluation A, and a sample having the surface roughness Sa of more than 1 and equal to or less than 1.1 in relative value was determined as evaluation B.
Irregularly-shaped diamond dies of Sample Nos. 21 to 28 shown in Table 3 in which various numerical values were variously set were prepared to have the shape shown in
A quadrangular wire having one side of 2100 μm and another side of 4200 μm and made of copper was subjected to the wire drawing process (wire drawing speed: 13 m/min) in a lubricant and a test was performed for one hour, to obtain a quadrangular wire having a length of 780 m. The surface roughness Sa of the wire in a direction orthogonal to the wire drawing direction of the quadrangular wire subjected to one-hour wire drawing was evaluated in accordance with ISO 25178. The surface roughness was evaluated at a portion of the length of 780 m. The results are shown in Table 3.
When the surface roughness Sa of the quadrangular wire subjected to wire drawing in Sample No. 21 was represented as 1, a sample having the surface roughness Sa of 0.8 to 1 in relative value was determined as evaluation A, a sample having the surface roughness Sa of more than 1 and equal to or less than 1.1 in relative value was determined as evaluation B, a sample having the surface roughness Sa of more than 1.1 and equal to or less than 1.3 in relative value was determined as evaluation C, a sample having the surface roughness Sa of more than 1.3 and equal to or less than 1.4 in relative value was determined as evaluation D, and a sample having the surface roughness Sa of more than 1.4 in relative value was determined as evaluation E. The samples determined as evaluation A to evaluation D can be put to practical use.
Irregularly-shaped diamond dies of Sample Nos. 31 to 38 shown in Table 4 in which various numerical values were variously set were prepared to have the shape shown in
A quadrangular wire having one side of 5250 μm and another side of 7350 μm and made of copper was subjected to the wire drawing process (wire drawing speed: 13 m/min) in a lubricant and a test was performed for one hour, to obtain a quadrangular wire having a length of 780 m. The surface roughness Sa of the wire in a direction orthogonal to the wire drawing direction of the quadrangular wire subjected to one-hour wire drawing was evaluated in accordance with ISO 25178. The surface roughness was evaluated at a portion of the length of 780 m. The results are shown in Table 4.
When the surface roughness Sa of the quadrangular wire subjected to wire drawing in Sample No. 31 was represented as 1, a sample having the surface roughness Sa of 0.8 to 1 in relative value was determined as evaluation A, a sample having the surface roughness Sa of more than 1 and equal to or less than 1.1 in relative value was determined as evaluation B, a sample having the surface roughness Sa of more than 1.1 and equal to or less than 1.3 in relative value was determined as evaluation C, a sample having the surface roughness Sa of more than 1.3 and equal to or less than 1.4 in relative value was determined as evaluation D, and a sample having the surface roughness Sa of more than 1.4 in relative value was determined as evaluation E. The samples determined as evaluation A to evaluation D can be put to practical use.
Irregularly-shaped diamond dies of Sample Nos. 41 to 48 shown in Table 5 in which various numerical values were variously set were prepared to have the shape shown in
A quadrangular wire having one side of 7350 μm and another side of 9450 μm and made of copper was subjected to the wire drawing process (wire drawing speed: 13 m/min) in a lubricant and a test was performed for one hour, to obtain a quadrangular wire having a length of 780 m. The surface roughness Sa of the wire in a direction orthogonal to the wire drawing direction of the quadrangular wire subjected to one-hour wire drawing was evaluated in accordance with ISO 25178. The surface roughness was evaluated at a portion of the length of 780 m. The results are shown in Table 5.
When the surface roughness Sa of the quadrangular wire subjected to wire drawing in Sample No. 41 was represented as 1, a sample having the surface roughness Sa of 0.8 to 1 in relative value was determined as evaluation A, a sample having the surface roughness Sa of more than 1 and equal to or less than 1.1 in relative value was determined as evaluation B, a sample having the surface roughness Sa of more than 1.1 and equal to or less than 1.3 in relative value was determined as evaluation C, a sample having the surface roughness Sa of more than 1.3 and equal to or less than 1.4 in relative value was determined as evaluation D, and a sample having the surface roughness Sa of more than 1.4 in relative value was determined as evaluation E. The samples determined as evaluation A to evaluation D can be put to practical use.
Irregularly-shaped diamond dies of Sample Nos. 51 to 58 shown in Table 6 in which various numerical values were variously set were prepared to have the shape shown in
A quadrangular wire having one side of 9450 μm and another side of 11550 μm and made of copper was subjected to the wire drawing process (wire drawing speed: 13 m/min) in a lubricant and a test was performed for one hour, to obtain a quadrangular wire having a length of 780 m. The surface roughness Sa of the wire in a direction orthogonal to the wire drawing direction of the quadrangular wire subjected to one-hour wire drawing was evaluated in accordance with ISO 25178. The surface roughness was evaluated at a portion of the length of 780 m. The results are shown in Table 6.
When the surface roughness Sa of the quadrangular wire subjected to wire drawing in Sample No. 51 was represented as 1, a sample having the surface roughness Sa of 0.8 to 1 in relative value was determined as evaluation A, a sample having the surface roughness Sa of more than 1 and equal to or less than 1.1 in relative value was determined as evaluation B, a sample having the surface roughness Sa of more than 1.1 and equal to or less than 1.3 in relative value was determined as evaluation C, a sample having the surface roughness Sa of more than 1.3 and equal to or less than 1.4 in relative value was determined as evaluation D, and a sample having the surface roughness Sa of more than 1.4 in relative value was determined as evaluation E. The samples determined as evaluation A to evaluation D can be put to practical use.
More preferably, the surface roughness Sa of corner portion 7a1 of reduction portion 6c is equal to or less than 0.15 μm, the surface roughness Sa of non-corner portion 7b1 of reduction portion 6c is equal to or less than 0.10 μm, and a difference between the surface roughness Sa of non-corner portion 7b1 of reduction portion 6c and the surface roughness Sa of non-corner portion 7b of bearing portion 6d is equal to or less than 0.05 μm.
It should be understood that the embodiment disclosed herein is illustrative and non-restrictive in every respect. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
1 diamond; 2 case; 3 sintered alloy; 4 support ring made of an alloy; 5 polycrystalline diamond; 6 hole inner surface; 6a bell portion; 6b approach portion; 6c reduction portion; 6d bearing portion; 6e back relief portion; 6f exit portion; 7 processing hole; 7a, 7a1 corner portion; 7b, 7b1 non-corner portion; 10 irregularly-shaped diamond die.
Number | Date | Country | Kind |
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2021-187105 | Nov 2021 | JP | national |
Filing Document | Filing Date | Country | Kind |
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PCT/JP2022/042424 | 11/15/2022 | WO |