In the field of integrated-circuit (IC) design, low power designs are widely used these days to meet the power requirements of the chip without hindering the performance. In a low power design, some power supply nets are switchable and can be turned off, and some power supply nets are always on.
When the switch SW1 is turned off and the switch SW2 is turned on, the power domain PD1 is not powered, and the power domain PD2 is powered. Hence, the power domains PD1 and PD2 are respectively regarded as an OFF domain and an ON domain.
A signal 51 is transmitted from a logic gate 111 of the power domain PD1 to the power domain PD2. When the power domain PD1 is not powered, the logic gate 111 is in a transient stage, so the signal 51 has an indefinite value. This will lead to functionality failure or high leakage current. To reduce this problem, an isolation circuit (a.k.a. isolation cell) 112 is embedded in the OFF domain (e.g., power domain PD1) and coupled to the logic gate 111. The isolation circuit 112 receives the signals 51 and SISO and provides a signal S2 accordingly.
When the power domain PD1 is powered to the ON domain, the signal SISO has a predetermined value (e.g., 0), and the signal S2 has the same value as the signal 51. When the power domain PD1 is not powered to the OFF domain, the signal SISO has a predetermined value (e.g., 1), and the signal S2 has a predetermined value (e.g., 0) instead of an unwanted indefinite value.
Although the structure of
An embodiment provides an isolation circuit including an inverter and a NOR-gate. The inverter includes an input terminal configured to receive an input signal, an output terminal configured to output an output signal according to the input signal, and a power terminal coupled to a power supply. The output signal is complementary to the input signal. The NOR-gate is used to perform a logical NOR operation using the output signal and an isolation control signal to generate a result signal. The NOR-gate includes a first input terminal coupled to the output terminal of the inverter and configured to receive the output signal, a second input terminal configured to receive the isolation control signal, and an output terminal configured to output the result signal.
These and other objectives of the present invention will no doubt become obvious to those of ordinary skill in the art after reading the following detailed description of the preferred embodiment that is illustrated in the various figures and drawings.
Here in the text, a power domain is regarded as an ON domain when the power domain is powered; the power domain is regarded as an OFF domain when the power domain is not powered; a high voltage level may be corresponding to a value 1; and a low voltage level may be corresponding to a value 0.
In order to reduce the problem of congestion of place-and-route, and decrease the number of transistors in an isolation circuit, an isolation circuit 200 is proposed according to an embodiment as shown in
The isolation circuit 200 may include an inverter 210 and a NOR-gate 220. The inverter 210 may include an input terminal 21A used to receive an input signal SI, an output terminal 210 used to output an output signal SO according to the input signal SI, and a power terminal 21P coupled to a power supply DVDD. The output signal SO may be complementary to the input signal SI.
The NOR-gate 220 may be used to perform a logic NOR operation using the output signal SO and an isolation control signal SISO to generate a result signal SZ. The NOR-gate may include a first input terminal 22A, a second input terminal 22B and an output terminal 220.
The first input terminal 22A is coupled to the output terminal of the inverter 210 and used to receive the output signal SO. The second input terminal 22B is used to receive the isolation control signal SISO. The output terminal 220 is used to output the result signal SZ.
As shown in
According to an embodiment, the power supply DVDD may be switchable instead of being always on. For example, when the power supply DVDD is turned on, the inverter 210 and the NOR-gate 220 may be powered; and when the power supply DVDD is turned off, the inverter 210 and the NOR-gate 220 may not be powered.
The operations of the isolation circuit 200 may be described as Table 1. The result signal SZ is at a low voltage level (e.g., denoted as 0) when the input signal SI is at the low voltage level and the isolation control signal SISO is at the low voltage level.
The result signal SZ is at a high voltage level (e.g., denoted as 1) when the input signal SI is at the high voltage level and the isolation control signal SISO is at a low voltage level.
The result signal SZ is at a low voltage level when the isolation control signal SISO is at a high voltage level.
According to an embodiment, the isolation control signal SISO is at the low voltage level when the power supply DVDD is powered; and the isolation control signal SISO is at the high voltage level when the power supply DVDD is not powered. In other words, when the domain the isolation circuit 200 is not powered and thus is in an OFF domain, the isolation control signal SISO has the high voltage value.
As shown in Table 1, when the isolation circuit 200 is in an OFF domain, the isolation circuit 200 may output the result signal SZ having a predetermined value (e.g., 0) instead of an unwanted indefinite voltage level. Regarding
Regarding
The second transistor 222 may include a first terminal, a second terminal and a control terminal, where the first terminal is coupled to the second terminal of the first transistor 221, the second terminal is coupled to the output terminal 220 of the NOR-gate 220, and the control terminal is coupled to the first input terminal 22A of the NOR-gate 220 to receive the output signal SO.
The third transistor 223 may include a first terminal, a second terminal and a control terminal, where the first terminal is coupled to the output terminal 220 of the NOR-gate 220, and the control terminal is coupled to the first input terminal 22A of the NOR-gate 220.
The fourth transistor 224 may include a first terminal, a second terminal and a control terminal, where the first terminal is coupled to the output terminal 220 of the NOR-gate 220, and the control terminal is coupled to the second input terminal 22B of the NOR-gate 220.
As shown in
According to an embodiment, the first transistor 221 and the second transistor 222 may be P-type transistors, and the third transistor 223 and the fourth transistor 224 may be N-type transistors.
In each of the first transistor 221 and the second transistor 222, the first terminal, the second terminal and the control terminal may be a source terminal, a drain terminal and a gate terminal respectively. In each of the third transistor 223 and the fourth transistor 224, the first terminal, the second terminal and the control terminal may be a drain terminal, a source terminal and a gate terminal respectively.
Regarding
According to an embodiment, the first transistor 211 of the inverter 210 may be a P-type transistor, and the second transistor 212 of the inverter 210 may be an N-type transistor.
In the first transistor 211, the first terminal, the second terminal and the control terminal may be a source terminal, a drain terminal and a gate terminal respectively. In the second transistor 212, the first terminal, the second terminal and the control terminal may be a drain terminal, a source terminal and a gate terminal respectively.
As shown in
As shown in
In
As shown in
As shown in
As shown in
In
As shown in
In
As shown in
As shown in
As shown in
In
As shown in
In summary, by means of the isolation circuit 200 provided by an embodiment, the number of transistors in an isolation circuit can be reduced. Conductive path(s) for connecting to an always-on power supply are no longer required and need not be routed, thus less conductive portions and layers are required. A plurality of isolation circuits 200 can be tiled as an array, embedded in an OFF domain and used to transmit signals to an ON domain to avoid functionality failure and high leakage current. The problem of congestion in the place-and-route process can be reduced. The area and conductive path lengths of a chip can be also decreased. According to experiments, the chip area can be reduced by 38%, and conductive path lengths can be decreased by 36%. Hence, solutions to mitigate problems in the field are provided.
Those skilled in the art will readily observe that numerous modifications and alterations of the device and method may be made while retaining the teachings of the invention. Accordingly, the above disclosure should be construed as limited only by the metes and bounds of the appended claims.