Existing technologies to communicate across an isolation barrier include opto-couplers and digital isolation technologies. Optical couplers worked well and meet the requirement of isolation testing at the component level, but are not particular reliable or fast. In addition, optical couplers lack benefits provided by CMOS technologies whereby cost and size improves with each generation of technology. Existing digital isolators can provide improved speed and reliability over optical couplers but are not capable of being tested for compliance to component level standards of isolation. In addition, existing isolators that employ transformers transfer significant energy between isolation components compared to the low power, digital, isolators described below.
The present subject matter discusses, among other things, electrical isolation, and more particularly wireless electrical isolation methods and apparatus. In an example, an electrical isolator can include a transmit circuit including a transmit antenna, and a receive circuit including a receive antenna. The transmit circuit can be configured to receive digital data and to modulate a transmit signal with the digital data, and to transmit the transit signal using the transmit antenna. The receive antenna can be configured to receive the transmit signal and to demodulate and provide the digital data from the transmit signal using a demodulation clock signal.
This overview is intended to provide a non-exclusive summary of the subject matter of the present patent application. It is not intended to provide an exclusive or exhaustive explanation of the invention. The detailed description is included to provide further information about the present patent application.
In the drawings, which are not necessarily drawn to scale, like numerals may describe similar components in different views. Like numerals having different letter suffixes may represent different instances of similar components. The drawings illustrate generally, by way of example, but not by way of limitation, various embodiments discussed in the present document.
This application discusses, among other things, methods and apparatus for communicating across an isolation barrier and more particularly, methods and apparatus for communicating across an isolation barrier that allows one to test isolation compliance at the component level without significant energy transfer between isolation components. Existing opto-coupler technology allows isolation testing at the component level, but is not particularly reliable or fast. In addition, opto-coupler technology does not provide the benefit of CMOS technologies whereby cost and size can improve with each generation of the technology. Existing digital isolators that rely in dielectric isolation can provide speed and reliability but does not provide the capability of being tested for full component level compliance with standards of isolation.
The present inventors have recognized an electrical isolation technology that can remove the need for a dielectrically isolated device, e.g., capacitor or transformer, can provide the speed and reliability, and can provide the capability of being tested for full component level isolation compliance. The technology can be used, in certain examples, to communicate digital data between high voltage and low voltage portions of a system. For example, the technology can be used to communicate data between two integrated circuits that except for the isolation technology are electrically isolated from each other. The technology can include a wireless implementation via coupled oscillators. Transmission of data can be accomplished via injection locking coupled oscillators, wherein a transmitting side (TX) can be driven to a known frequency via digital input control and the receiving side (RX) can lock to the known frequency and can demodulate the data. In certain examples, injection locking coupled oscillators can take advantage of the benefits of CMOS technology and still be able to meet isolation standards at the component level. The technology can be used in many applications including but not limited to, power conversion, isolated gate drivers, high-speed digital isolators, and current sensors.
In certain examples, the digital isolator 100 can be used to communicate information from a first integrated circuit to a second integrated circuit. The isolation function of the digital isolator 100 can be very useful where electrical isolation between, for example, a high-voltage first integrated circuit and a second low-voltage integrated circuit. Transmission of received data (D0IN) can be performed via injection locking coupled oscillators, wherein transmitter circuit (TX0) is driven to a predetermined frequency via digital input control and the receiver circuit (RX0) can lock onto the predetermined frequency and demodulate output data (D0OUT).
In certain examples, each side of the digital isolator can include a voltage controlled oscillator (VCO) coupled to an antenna/inductor for modulating the digital data communicated between the different halves of the isolator. In certain examples, the injection locking range of a digital isolator can be limited. In some examples, the inject locking range can be limited based on the following formula:
where E can be the voltage of the self-oscillating receiver loop, and E1 can be the induced voltage from the transmit antenna/inductor/coil. In certain examples, the coupling coefficient can be very low (e.g., 1-4%). If Q=7, for a 15 gigahertz (GHz) carrier, the locking range can be between about 10 megahertz (MHz) and about 40 MHz. In certain examples, direct current (DC) components can be rejected and other harmonics greatly attenuated by a phased-lock loop (PLL) filter, thus creating a very narrow band system in the locking range. In certain examples, the system can exchange data using amplitude modulation (AM). In some examples, an AM digital isolator having the same frequency selectivity of the FM digital isolator described above can include a low noise amplifier having a Q greater than 500.
In general, example digital isolators can be fabricated as a system and can include one or more transmitters and one or more corresponding receivers to form a self-contained wireless communication system. A benefit of such a system is the ability for a designer to impedance match each receiver circuit to the corresponding transmitter circuit, or vice versa, instead of matching the impedance of a transmitter or receiver to an industry standard, such as 50 ohms, for example. As such, the communication system can be designed to minimize space while maintain speed, and reliability. By not limiting the impedance of the components of a digital isolator to a specific termination impedance, the antennas can be quite small and still provide the needed performance for communication as well as accommodating the physical spacing to maintain electrical isolation.
Unlike opto-couplers that can be sensitive to extreme temperatures, the example digital isolators can provide robust isolation and data communication over a wide range of temperature. In certain examples, a first and second integrated circuits can form an example digital isolator. Each integrated circuit can include a die including the circuitry and an antenna separated from the circuitry using an insulative material such as a polymide. Such a structure can save die space by stacking the antenna and the isolator circuitry instead of using die space for the antenna.
In Example 1, an electrical isolator can include a transmit circuit including a transmit antenna, the transmit circuit configured to receive digital data and to modulate a transmit signal with the digital data, and to transmit the transit signal using the transmit antenna, the transmit signal having a first nominal frequency and a receive circuit mechanically coupled to the transmit circuit, the receive circuit including a receive antenna configured to receive the transmit signal, the receive circuit is configured to demodulate and provide the digital data from the transmit signal using a demodulation clock signal.
In Example 2, the receive circuit of Example 1 optionally includes an injection-locked oscillator configured to receive the transmit signal and to lock on to the first nominal frequency to provide the demodulation clock signal.
In Example 3, the injection-locked oscillator of any one or more of Examples 1-2 optionally includes the receive antenna.
In Example 4, the transmit antenna of any one or more of Examples 1-3 optionally is separated from the receive antenna by about 1 millimeter or less.
In Example 5, a first integrated circuit die optionally includes the transmit circuit of any one or more of Examples 1-4, a second integrated circuit die optionally includes the receive circuit of any one or more of Examples 1-4, and
the electrical isolator of any one or more of Examples 1-4 optionally includes a single encapsulation including the first integrated circuit die and the second integrated circuit die.
In Example 6, the transmit antenna of any one or more of Examples 1-5 optionally includes a single loop inductor antenna.
In Example 7, the transmit antenna of any one or more of Examples 1-6 optionally includes a dipole antenna.
In Example 8, the transmit antenna of any one or more of Examples 1-7 optionally includes an end-loaded dipole antenna.
In Example 9, the transmit circuit of any one or more of Examples 1-8 optionally includes a transmit oscillator, and the transmit oscillator optionally includes the transmit antenna.
In Example 10, the receive antenna of any one or more of Examples 1-9 optionally includes a single loop inductor antenna.
In Example 11, the receive antenna of any one or more of Examples 1-10 optionally includes a dipole antenna.
In Example 12, the receive antenna of any one or more of Examples 1-11 optionally includes an end-loaded dipole antenna.
In Example 13, the first nominal frequency of any one or more of Examples 1-12 optionally is above 8 gigahertz (GHz).
In Example 14, the first nominal frequency of any one or more of Examples 1-13 optionally is between about 8 gigahertz (GHz) and about 40 GHz.
In Example 15, a system can include a first circuit, a second circuit adjacent and mechanically coupled to the first circuit, and an electrical isolator configured to provide a communication path between the first circuit and the second circuit and to maintain electrical isolation between the first circuit and the second circuit, wherein the electrical isolator can include a first transmit circuit including a first transmit antenna, the transmit circuit configured to receive first digital data from the first circuit and to modulate a first transmit signal with the first digital data, and to transmit the first transit signal using the first transmit antenna, the first transmit signal having a first nominal frequency, and a first receive circuit including a first receive antenna configured to receive the first transmit signal and to demodulate and provide the first digital data to the second circuit using a first demodulation clock signal, and a first injection-locked oscillator configured to receive the first transmit signal and to lock on to the first nominal frequency to provide the first demodulation clock signal.
In Example 16, the electrical isolator of any one or more of Examples 1-15 optionally includes a second transmit circuit including a second transmit antenna, the transmit circuit configured to receive second digital data from the second circuit and to modulate a second transmit signal with the second digital data, and to transmit the second transit signal using the second transmit antenna, the second transmit signal having a second nominal frequency and a second receive circuit including a second receive antenna configured to receive the second transmit signal and to demodulate and provide the second digital data to the first circuit using a second demodulation clock signal, and a second injection-locked oscillator configured to receive the second transmit signal and to lock on to the second nominal frequency to provide the second demodulation clock signal.
In Example 17, a first integrated circuit die can include the first transmit circuit and the second receive circuit, a second integrated circuit die can include the second transmit circuit and the first receive circuit, and the electrical isolator of any one or more of Examples 1-16 optionally includes a single encapsulation including the first integrated circuit die and the second integrated circuit die.
In Example 18, at least one of the first transmit antenna and the second transmit antenna of any one or more of Examples 1-17 optionally include an end-loaded dipole antenna.
In Example 19, at least one of the first receive antenna and the second receive antenna of any one or more of Examples 1-18 optionally include an end-loaded dipole antenna.
In Example 20, an electrical isolator can include a transmit circuit including a transmit antenna, the transmit circuit configured to receive digital data and to modulate a transmit signal with the digital data, and to transmit the transit signal using the transmit antenna, the transmit signal having a first nominal frequency, and a receive circuit including a receive antenna configured to receive the transmit signal and to demodulate and provide the digital data from the transmit signal using a demodulation clock signal, and wherein at least one of the transmit antenna or the receive antenna include a resonant dipole antenna.
In Example 21, the resonant dipole antenna of any one or more of Examples 1-20 optionally includes an end-loaded dipole antenna.
In Example 22, the transmit circuit of any one or more of Examples 1-21 optionally includes an amplitude modulated (AM) transmit circuit.
The above detailed description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the invention can be practiced. These embodiments are also referred to herein as “examples.” All publications, patents, and patent documents referred to in this document are incorporated by reference herein in their entirety, as though individually incorporated by reference. In the event of inconsistent usages between this document and those documents so incorporated by reference, the usage in the incorporated reference(s) should be considered supplementary to that of this document; for irreconcilable inconsistencies, the usage in this document controls.
In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of “at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, device, article, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.
The above description is intended to be illustrative, and not restrictive. For example, the above-described examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments can be used, such as by one of ordinary skill in the art upon reviewing the above description. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, inventive subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description, with each claim standing on its own as a separate embodiment. The scope of the invention should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
This application claims the benefit of priority under 35 U.S.C. §119(e) of Philip J. Crawley, U.S. Provisional Application Ser. No. 61/767,074, titled, “ISOLATION COMMUNICATION TECHNOLOGY USING COUPLED OSCILLATORS/ANTENNAS,” filed on Feb. 20, 2013, U.S. which hereby is incorporated by reference herein in its entirety.
Number | Date | Country | |
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61767074 | Feb 2013 | US |