Claims
- 1. A method for mounting an electronic component within an enclosure, comprising the steps of:securing the electronic component to a board; attaching at least one grommet to the board; inserting a ferrule into the at least one grommet; placing an extensional damping material between the board and a surface of the enclosure, whereby at least 50% of a side of the board facing the surface of the enclosure is covered with the damping material; and inserting a screw through the ferrule and anchoring the screw to the enclosure.
- 2. The method according to claim 1, further comprising the step of attaching the extensional damping material to the board before anchoring the screw to the enclosure.
- 3. The method according to claim 1, further comprising the step of providing a plurality of mounting slots in the board, and attaching a plurality of grommets to the mounting slots.
- 4. The method according to claim 3, wherein the step of attaching the grommets to the board comprises attaching the grommets such that portions of the board adjacent said mounting slots are sandwiched between two surfaces of each grommet.
- 5. The method according to claim 1, wherein the step of anchoring the screw to the enclosure comprises tightening the screw to a specified torque.
- 6. The method according to claim 1, further comprising the step of applying a preload to the extensional damping material and to the grommet as said screw is anchored.
Parent Case Info
This Application is a divisional of Ser. No. 08/741,013 filed Oct. 30, 1996, U.S. Pat. No. 5,726,395.
US Referenced Citations (4)