Claims
- 1. Joined copper alloys to be used for electrical conductors, which comprises: copper alloys containing less than about 20% alloying additions and at least 0.01% each of at least one of the alloying elements tin, iron, zirconium, cadmium, beryllium, silver and magnesium, and having substantially planar end faces thereof in contacting relationship and which are joined together in a welding zone under a continuous compressive force below the yield strength of the copper alloy in the room temperature condition at a temperature of at least 300.degree. C. but below the solvus temperature of the copper alloy, said joined copper alloy having good strength and conductivity properties, with the alloying elements substantially out of solution and with the mechanical properties in the welding zone being substantially the same the parent material.
- 2. Joined alloys according to claim 1 wherein the copper alloy is a copper alloy conductor.
- 3. Joined alloys according to claim 2 wherein the alloys contain less than 5% alloying additions.
- 4. Joined alloys according to claim 2 wherein the joined copper alloy conductor is in the form of a coil of copper alloy conductor.
- 5. Joined alloys according to claim 1 in the form of strip having a width no greater than twenty times thickness.
- 6. Joined alloys according to claim 1 in the form of wire or shaped wire.
- 7. Joined alloys according to claim 1 characterized by the presence of alloying elements in undissolved precipitates which yields improved conductivity.
- 8. Joined copper alloys according to claim 2 wherein the joined copper alloy conductor is a section of a coil of copper alloy conductor which has uniform resulting properties in sections cut therefrom.
- 9. Joined copper alloys according to claim 7 wherein the joined copper alloy conductor is a continuous coil of copper alloy conductor.
- 10. Joined copper alloys according to claim 1 characterized by the absence of substantial thermal treatment in the weld zone.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of copending U.S. patent application Ser. No. 08/048,816, filed Apr. 16, 1993.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4269344 |
Vervleit |
May 1981 |
|
5310985 |
Fisk et al. |
May 1994 |
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1500678 |
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Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
48816 |
Apr 1993 |
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