Patent Application
20090230176
1. Field of the Invention
The present invention relates to a joining jig and a method for manufacturing a bonded body of different members by using the jig. More particularly, it relates to a joining jig capable of precisely obtaining a bonded body of different members in which an unjoined region and a joined region in a joined face are intricately intertwined, for example, a die for use in a ceramic honeycomb structure forming mold when sophisticated forming properties are demanded, or another accurate bonded body of different members in which an unjoined region and a joined region in a joined face are intricately intertwined, and it also relates to a method for manufacturing a bonded body of different members by using the joining jig.
2. Description of the Related Art
In Patent Document 1, an Al metal joined article is disclosed in which an Al metal member made of aluminum (Al) or a metal containing Al as a main component is joined to a heterogeneous member made of a material different from that of the Al metal member. The joined article includes a soft metal layer having an Hv hardness of 20 to 80 (micro-Vickers; a load of 100 gf) and a thickness of 0.1 to 3 mm in a joined interface between the Al metal member and the different member.
In a case where such a bonded body of different members is manufactured, for example, a method is sometimes used which laminates two platy members made of different members, and then heats the laminated platy members while the members are sandwiched between a pair of joining jigs, to join the two laminated platy members to each other.
As a manufacturing method of a ceramic honeycomb structure, heretofore a method has broadly been used to perform extrusion-forming by using a honeycomb structure forming die including a die base member provided with back holes for introducing a forming material (a kneaded clay) and lattice-like slits or the like communicating with the back holes. In this die, one face of the die base member is usually provided with the lattice-like slits or the like each having a width corresponding to the thickness of each partition wall of the honeycomb structure, and the opposite face (the other face) thereof is provided with the back holes communicating with the slits and having large open areas. Moreover, the back holes are usually provided in positions corresponding to positions where the lattice-like slits or the like intersect with one another, and both the back holes and the slits communicate with one another in the die base member. Therefore, a forming material such as a ceramic material introduced from the back holes moves from the back hole having a comparatively large inner diameter to the slit having a small width, and the material is extruded as a formed article having a honeycomb structure (the formed honeycomb article) from the openings of the slits.
As such a die base member constituting the honeycomb structure forming die, for example, there is used a platy member made of one type of alloy such as a stainless steel alloy or a super hard alloy, or a platy member formed by joining two different types of platy members to each other, for example, a member to be provided with the slits and a member to be provided with the back hole (e.g., see Patent Document 2 or 3).
In a conventional manufacturing method of the honeycomb structure forming die, the slits and the back holes are formed in such a die base member by mechanical processing.
[Patent Document 1] JP-A-10-5992
[Patent Document 2] JP-A-2000-326318
[Patent Document 3] JP-A-2003-285308
However, in the conventional manufacturing method of the honeycomb structure forming die as the bonded body of different members in which the unjoined region and the joined region in the joined face are intricately intertwined, when the two different types of platy members are joined to each other to obtain the die base member, a solder is sometimes disposed between the platy members, and heated to join the two types of platy members to each other. However, for example, when one of the platy members is provided with back holes and groove portions communicating with the back holes and provided from a side surface along a joined face and this platy member is joined to the other platy member, the solder enters the back holes and the groove portions, and this solder remain in the back holes and the groove portions.
In consequence, there has been a problem that the solder in the back holes and the groove portions as a resistor breaks a tool such as a grindstone for processing the slits during the processing of the slits or that distortion is generated in the formed slits. Moreover, when the solder remains in the back holes and the groove portions in this manner and the honeycomb structure is formed, there is a problem that flow paths connecting the back holes and the groove portions to the slits are sometimes closed or narrowed by the solder, to adversely affect the quality of the formed article.
Moreover, as to a honeycomb structure having cells 14 separated from one another by partition walls 13 as shown in
The present invention has been developed in view of the above problem, and an object thereof is to provide a joining jig and a method for manufacturing a bonded body of different members by using the jig capable of precisely obtaining a bonded body of different members in which an unjoined region and a joined region in a joined face are intricately intertwined.
That is, according to the present invention, there are provided the following joining jig and the following method for manufacturing a bonded body of different members by using the joining jig.
[1] A joining jig comprising: a pair of flat-plate sandwiching portions including sandwiching faces which sandwich therebetween a platy member laminate prepared by laminating two platy members while a solder is arranged on a joined face between the platy members; a plurality of vapor inflow ports provided in the sandwiching face so that surplus solder vapor on the joined face flows into the vapor inflow ports in a case where the platy member laminate is heated while the platy member laminate is sandwiched between the pair of sandwiching portions; vapor flow paths provided so that the vapor flow paths communicate with the vapor inflow ports to constitute the flow paths of the vapor of the solder; and vapor discharge ports provided in the side surface of the joining jig so that the vapor discharge ports communicate with the vapor flow paths to discharge the vapor of the solder to the outside.
[2] The joining jig according to the above [1], wherein the vapor flow paths are provided so as to connect the adjacent vapor inflow ports to each other.
[3] The joining jig according to the above [1] or [2], wherein the plurality of vapor discharge ports are provided at intervals over the whole periphery of the side surface of one of the sandwiching portions.
[4] The joining jig according to any one of the above [1] to [3], wherein at least a part of the vapor flow paths are provided in a lattice-like shape in parallel with the sandwiching face.
[5] The joining jig according to any one of the above [1] to [4], wherein the vapor flow paths have widths of 0.05 to 50 mm and depths of 0.05 to 50 mm.
[6] The joining jig according to any one of the above [1] to [5], wherein when the platy member laminate is sandwiched between the pair of sandwiching portions, one of the two platy members have a plurality of back holes connecting the joined face to the plurality of vapor inflow ports, and in a case where the platy member laminate is heated while the platy member laminate is sandwiched between the pair of sandwiching portions, the surplus solder vapor on the joined face is allowed to flow into the vapor inflow ports, and is discharged from the plurality of vapor discharge ports through the vapor flow paths to obtain a bonded body of different members in which the two platy members are joined to each other.
[7] The joining jig according to the above [6], wherein the pair of sandwiching portions are made of a material having a thermal conductivity (W/m2·K) 1.5 times or more as large as that of the one platy member.
[8] A manufacturing method of a bonded body of different members, comprising the steps of: sandwiching the platy member laminate between the sandwiching faces of the joining jig according to the above [6] or [7] so that the plurality of back holes communicate with at least a part of the plurality of vapor inflow ports; heating the platy member laminate to a temperature at which the solder melts or a higher temperature; decreasing the pressure of a heating atmosphere to a pressure lower than the vapor pressure of the solder to allow the surplus solder vapor on the joined face to flow into the vapor inflow ports from the back holes; and discharging the vapor from the vapor discharge ports through the vapor flow paths to obtain the bonded body of different members in which the two platy members are joined to each other.
[9] The manufacturing method of the bonded body of different members according to the above [8], wherein the one platy member constituting the bonded body of different members has groove portions communicating with the back holes as introduction holes of a kneaded forming clay and provided along the joined face in a lattice-like shape, the other platy member constituting the bonded body of different members is provided with slits to form a forming material into a lattice-like shape, the slits being formed into a lattice-like shape so as to communicate with the groove portions, and the bonded body of different members in which the two platy members are joined to each other is manufactured as a die to form a honeycomb structure.
The joining jig and the method for manufacturing the bonded body of different members by using the joining jig of the present invention are preferably used when manufacturing a bonded body of different members in which an unjoined region and a joined region in a joined face where the two platy members are joined to each other are intricately intertwined, for example, a bonded body of different members such as a die for use in a ceramic honeycomb structure forming mold. When the die obtained by this method for manufacturing the bonded body of different members is used as the ceramic honeycomb structure mold, in addition to sufficient strength and durability, sophisticated forming properties can be realized.
In particular, according to the joining jig of the present invention and the method for manufacturing the bonded body of different members by using the joining jig, the joining jig is provided with a mechanism for discharging the vapor of the solder during the manufacturing of the bonded body of different members having the joined article in which the unjoined region and the joined region are intricately intertwined, so that the remaining vapor of the solder can be prevented. In consequence, it is possible to very precisely obtain a bonded body of different members such as the die for use in the mold for forming the ceramic honeycomb structure having a large bore diameter and a high cell density.
Hereinafter, embodiments of a joining jig of the present invention and a method for manufacturing a bonded body of different members by using the joining jig will be described in detail with reference to the drawings, but the present invention is not limited to the embodiments when interpreted, and can variously be changed, modified or improved based on the knowledge of any person skilled in the art without departing from the scope of the present invention.
The joining jig of the present invention is constituted of a pair of flat-plate sandwiching portions 5 including sandwiching faces 15 which sandwich therebetween a platy member laminate 4 as shown in
It is to be noted that the platy member laminate does not have to be sandwiched so that the vapor inflow ports 41 correctly match the back holes 26, and a noticeable effect can be produced even if the back holes 26 partially come in contact with the vapor inflow ports 41. In consequence, when the vapor inflow ports 41 having diameters larger than those of the back holes 26 are provided at predetermined intervals in the sandwiching face as shown in
As shown in
As a method of forming the lattice-like vapor flow paths 40, a heretofore known method such as grind processing by a diamond grindstone or discharge processing (EDM processing) is preferably usable. Moreover, it is preferable to set the depths of the lattice-like vapor flow paths 40 to a range of 0.5 to 50 mm and to set the widths thereof to a range of 0.5 to 50 mm and to set lattice intervals to a range of 1.0 to 50 mm because the vapor of the solder can efficiently be discharged and from the viewpoint of the thermal conduction efficiency during the heating or the viewpoint that the joined face can more equally be pressurized when pressurized in the arrow directions shown in
Moreover, an angle at which this lattice-like vapor flow paths 40 intersect with each other does not have to be 90 degrees, and is preferably in a range of 45° to 90°. Moreover, the lattice-like vapor flow paths 40 may intersect with one another at an angle of 60 degrees from three directions.
However, the lattice-like vapor flow paths 40 necessarily do not have to be formed in a groove-like shape in the surface of the sandwiching face 15, and may extend through the sandwiching portion 17, and the vapor discharge ports 42 may be disposed in any portions as long as they are disposed in the side surface of the sandwiching portion 17. There is not any special restriction on the sectional shape of each lattice-like vapor flow path.
When the lattice-like vapor flow paths 40 are formed in the groove-like shape in the sandwiching face 15, the vapor flow paths 40 at this time preferably have a width in a range of 0.05 to 50 mm and a depth in a range of 0.05 to 50 mm. It is to be noted that when “the widths of the vapor flow paths” and “the depths of the vapor flow paths” are mentioned in the present specification, the dimensions of “the widths” and “the depths” of the groove-like vapor flow paths provided in the lattice-like shape are indicated in a case where as to at least a part of the vapor flow paths, the groove-like vapor flow paths are provided in the lattice-like shape on the sandwiching face or a plane parallel to the sandwiching face.
When the lattice-like vapor flow paths 40 are formed in the groove-like shape in the sandwiching face 15, the vapor flow paths at this time preferably have sectional areas of 0.1 to 100 mm2. It is to be noted that when “the sectional areas of the vapor flow paths” are mentioned in the present specification, the dimensions of “the sectional area (the width×the depth)” in the section of each groove-like vapor flow path provided in the lattice-like shape, the section being vertical to a vapor flowing direction, are indicated in a case where as to at least a part of the vapor flow paths, the groove-like vapor flow paths are provided in the lattice-like shape on the sandwiching face or the plane parallel to the sandwiching face.
Moreover, there is not any special restriction on the shape of the outer periphery of the joining jig of the present invention, and the shape can appropriately be changed in accordance with the shape of a member to be joined. For example, to join a bonded body of different members as a die for forming, for example, a cylindrical honeycomb structure shown in
The vapor flow paths which also serve as the vapor inflow ports provided in the sandwiching portion of the joining jig of the present invention may be provided in the sandwiching face. For example,
When the joining jig including a sandwiching portion 17 shown in
In a case where the groove-like vapor flow paths 40 which also serve as the vapor inflow ports 41 are provided in the sandwiching face as shown in
Moreover, hereinafter, a method for manufacturing a bonded body of different members according to the present embodiment will be described. The method for manufacturing the bonded body of different members of the present embodiment includes the steps of: sandwiching the platy member laminate between the sandwiching faces of the joining jigs described above in the present embodiment so that the plurality of back holes communicate with at least a part of the plurality of vapor inflow ports; heating the platy member laminate to a temperature at which the solder melts or a higher temperature; decreasing the pressure of a heating atmosphere to a pressure lower than the vapor pressure of the solder to allow the surplus solder vapor on the joined face to flow into the vapor inflow ports from the back holes; and discharging the vapor from the vapor discharge ports through the vapor flow paths to obtain the bonded body of different members in which the two platy members are joined to each other.
In the method for manufacturing the bonded body of different members of the present embodiment, as shown in
Furthermore, in the method for manufacturing the bonded body of different members of the present embodiment, as shown in
To heat the platy member laminate 4 sandwiched between the pair of joining jigs 5, as shown in
Moreover, since the joining jig 5 is used in the heating step, the joining jig 5 made of a material having a melting point of 500° C. or more is preferably used. The material further have a melting point 1.5 times or more as high as the joining temperature of the platy members 2, 3 constituting the platy member laminate 4. When this joining jig 5 is used, the joining jig 5 can sufficiently pressurize the platy member laminate 4. After manufacturing the bonded body of different members, the joining jig 5 can easily be removed, and can repeatedly be used. Furthermore, thermal deformation of the joining jig 5 in the heating step can be suppressed.
It is to be noted that the joining temperature is a temperature at which the article is heated and thus joined, and the temperature is specifically a maximum temperature reached during the heating.
It is to be noted that there is not any special restriction on the melting point of the joining jig 5, but the melting point is further preferably 1000° C. or more, more preferably 1500° C. or more. When such a material is used, the platy member laminate can firmly be held in the heating step. Moreover, the joining jig 5 further preferably has a melting point twice or more as high as the above joining temperature.
There is not any special restriction on the specific material constituting the joining jig 5 as long as the material has a thermal conductivity (W/m2·K) 1.5 times or more as large as that of at least one of the platy members 2, 3 constituting the platy member laminate 4. Preferable examples of the material include a material including at least one selected from the group consisting of silver, copper, gold, aluminum, magnesium, brass, tungsten, beryllium, iridium, molybdenum, silicon, carbon, aluminum nitride and silicon carbide.
Moreover, among the above materials, tungsten, molybdenum, carbon, aluminum nitride or the like can more preferably be used. Furthermore, carbon can especially preferably be used because the material is more inexpensive and has satisfactory processing properties.
It is to be noted that the thermal conductivity of the above-mentioned carbon, for example, isotropic graphite carbon noticeably changes in accordance with the density thereof. Therefore, when carbon is used as the material of the joining jig in the manufacturing method of the bonded body of different members of the present embodiment, the density is preferably 1.5 mg/m3 or more, further preferably 1.7 mg/m3 or more.
The carbon having such a density has a high thermal conductivity as compared with a material used in a conventional joining jig, and also has a remarkably high melting point, and hence the carbon can be used in the manufacturing method of the bonded body of different members using the platy members made of various materials.
The joining jig 5 having such a constitution has a remarkably satisfactory thermal conductivity, and can quickly be heated by radiant heat 10 of the heaters 7 or the like in the insulating container 16 as shown in
Moreover, in a case where the platy member laminate 4 is sandwiched between the pair of joining jigs 5, as shown in
According to such a constitution, fusion bonding between the platy member laminate 4 (or a bonded body of different members 1 obtained (see
It is to be noted that the elasticity of the sheet-like release material 8 is preferably sufficiently small. Specifically, the elasticity is preferably 100 Gpa or less, further preferably 10 Gpa or less. According to such a constitution, a gap between the joining jig and the platy member can be filled, and the density and the thermal conductivity can be increased. Moreover, face pressure distribution can be made uniform.
It is to be noted that there is not any special restriction on the material of the release material 8, but a material having an excellent thermal conductivity is preferable. For example, a sheet-like material made of a material including at least one selected from the group consisting of silicon, carbon, aluminum nitride, aluminum oxide and silicon carbide is preferably usable. It is to be noted that the sheet-like release material preferably has a sufficiently small thickness. Specifically, the thickness is preferably 1 mm or less, further preferably 0.2 mm or less.
When the release material 8 is used, the close contact properties between the platy member laminate 4 and the joining jig 5 can further be improved, and the heat from the sandwiching face 15 of the sandwiching portions 5 can further equally be conducted to the surface of the platy member laminate 4.
Moreover, when the platy member laminate 4 is sandwiched between the joining jigs 5 in the manufacturing method of the bonded body of different members of the present embodiment, a pressure of, for example, 0.1 to 100 MPa is preferably applied to the sandwiched platy member in the arrow directions shown in
Moreover, there is not any special restriction on the material of the two platy members 2, 3 constituting the platy member laminate 4 as shown in
Furthermore, when the above material made of the metal or alloy is used as the one platy member 2 of the two platy members 2, 3, as the other platy member 3, a material made of a tungsten carbide group super hard alloy is preferably usable.
In a case where the two platy members 2, 3 described above are used, it is possible to especially manufacture the bonded body of different members 1 (see
Moreover, in the manufacturing method of the bonded body of different members of the present embodiment, when the platy members 2, 3 made of the heterogeneous materials are laminated to obtain the platy member laminate 4, as shown in
It is to be noted that there is not any special restriction on the solder 27, but a material which can penetrate at least one of the two platy members 2, 3 is preferable as the solder. When the solder 27 made of such a material is used, the solder 27 does not exist in the form of the layer of the platy member laminate as it is in the joined face between the two platy members 2 and 3, and the lowering of the mechanical strength can effectively be prevented.
Preferable examples of the solder 27 for use in the manufacturing method of the bonded body of different members of the present embodiment include a solder including at least one selected from the group consisting of copper, silver, gold, nickel and aluminum.
Moreover, in the manufacturing method of the bonded body of different members of the present embodiment, as shown in, for example,
In the conventional manufacturing method of the bonded body of different members, as shown in
To solve the problem, in the manufacturing method of the bonded body of different members of the present embodiment, there is used a joining jig including, as shown in, for example,
In the joined face 28, unjoined regions 38, 39 of
In the manufacturing method of the bonded body of different members as a conventional honeycomb structure forming die, in a case where the one platy member 2 and the other platy member 3 are heated to a temperature at which the solder (e.g., pure copper) melts or a higher temperature, and are bonded to each other, the solder (pure copper) is melted, and the pressure of the heating atmosphere is decreased to a pressure lower than the vapor pressure of the solder 27, to vaporize and remove the solder 27 entering the back holes 26 during the joining. However, a part of the solder 27 enters the back holes 26 and the groove portions 37 formed in the one platy member, and remains in the back holes 26 and the groove portions 37. When the solder 27 remains in the back holes 26 and the groove portions 37 and the slits 25 (see
In the manufacturing method of the bonded body of different members as the honeycomb structure forming die of the present embodiment, as shown in
At this time, the surplus solder vapor on the joined face 28 shown in
As shown in
The die 21 is the die 21 constituted of the bonded body of different members 1 in which the platy member 2 provided with the back holes 26 for introducing the forming material is joined to the platy member 3 provided with the slits 25 for forming this forming material into the lattice-like shape.
It is to be noted that the honeycomb structure 12 shown in
To manufacture the die 21 shown in
The back holes 26 can be formed by a heretofore known method such as electrolytic processing (ECM processing), discharge processing (EDM processing), laser processing, or mechanical processing by a drill or the like.
The sizes of the opening diameters of the back holes 26 can appropriately be determined in accordance with the size of the honeycomb structure forming die 1 to be manufactured, the shape of the honeycomb structure 12 (see
Moreover, as shown in
Moreover, in a case where the lattice-like groove portions 37 are formed along the joined face in this manner and the other platy member constituting a part of a die base member is provided with slits by grind processing or the like, when the slits reach the lattice-like groove portions 37, the formation of the slits can be stopped, and the one platy member does not have to be subjected to extra processing. Therefore, the deterioration of the grindstone or the like for use in the processing can effectively be prevented. Furthermore, when the back holes and the groove portions are formed in advance, a thermal stress due to a difference between thermal expansion coefficients decreases. Therefore, when the one platy member is joined to the other platy member, peel of the joined face 28 can be decreased.
As a method of forming the lattice-like groove portions 37, a heretofore known method such as the grind processing by the diamond grindstone or the discharge processing (the ELM processing) is preferably usable. Moreover, the groove portions 37 preferably have depths in a range of 0.1 to 3.0 mm and widths in a range of 0.1 to 1.0 mm.
Next, as shown in
Next, as shown in
In particular, when the die 21 is manufactured in this manner, as the one platy member 2 is usable a material made of a metal or an alloy which can cause at least one phase transformation selected from the group consisting of martensite transformation, bainite transformation and pearlite transformation by the cooling of an austenite phase. Furthermore, as the other platy member 3, a material made of a tungsten carbide group super hard alloy is used. In consequence, the die 21 having an excellent wear resistance can be manufactured.
It is to be noted that the manufacturing method of the bonded body of different members of the present invention is a manufacturing method for manufacturing the bonded body of different members in which two platy members made of heterogeneous materials are joined to each other. However, needless to say, the method may preferably be used as the manufacturing method for manufacturing the bonded body of different members in which two platy members made of the same type of material are joined to each other. It is to be noted that to manufacture the platy member joined article made of the same type of material, the platy member joined article can be manufactured by a method similar to the above-mentioned manufacturing method of the bonded body of different members except that the two platy members made of the same type of material are used as members for use.
Hereinafter, the present invention will specifically be described in accordance with examples, but the present invention is not limited to the following examples.
In the present example, a pair of joining jigs 5 shown in
This joining jig has a plurality of vapor inflow ports 41 provided in the sandwiching face 15 so that surplus solder vapor on a joined face 28 flows into the vapor inflow ports in a case where the platy member laminate 4 is heated while the laminate is sandwiched between the pair of sandwiching portions 5; vapor flow paths 40 provided so that the vapor flow paths communicate with the vapor inflow ports 41 to form the flow paths of the vapor of the solder; and vapor discharge ports 42 provided in the side surface of the joining jig so that the vapor discharge ports communicate with the vapor flow paths 40 to discharge the vapor of the solder to the outside. The size of this sandwiching portion 17 is as follows. The joining jig (the sandwiching portion) had a disc-like shape having a diameter of 240 mm and a thickness of 15 mm. The diameter of each vapor inflow port was set to 6 mm. The section of a lattice-like groove portion of each vapor flow path had a width of 3.0 mm and a depth of 3.0 mm. The vertical size of each vapor discharge port was set to 3.0 mm and the lateral size thereof was set to 3.0 mm. The number of the parts: 256 vapor inflow ports in total in a range of a circular region having a diameter of 180 mm inside a disc-like joining jig (a diameter of 240 mm), each lattice-like vapor flow path having a lattice interval of 10 mm.
Back holes for introducing a forming material were formed in one platy member, and lattice-like groove portions corresponding to the shape of each slip were formed on the surface of the one platy member as a joined face, by grind processing using a boron nitride grindstone. A solder was arranged on this joined face, and the one platy member and the other platy member were laminated to obtain a platy member laminate. Next, this platy member laminate was heated in a vacuum container while the laminate was sandwiched between pushing molds via a release material, to obtain a die base member. Then, the other platy member constituting a part of the resultant die base member was provided with slits communicating with the groove portions of the one platy member to manufacture a honeycomb structure forming die.
In the example, the honeycomb structure forming die was manufactured by using the one platy member made of SUS630 (C; 0.07 or less, Si; 1.00 or less, Mn; 1.00 or less, P; 0.040 or less, S; 0.030 or less, Ni; 3.00 to 5.00, Cr; 15.50 to 17.50, Cu; 3.00 to 5.00, Nb+Ta; 0.15 to 0.45, and Fe; a balance (unit is mass %), the other platy member made of a tungsten carbide super hard alloy of WC-16 mass % of Co, and a solder made of copper.
The one platy member having a disc-like shape with a diameter of 215 mm as a face size and a thickness of 15 mm was used. The other platy member having a disc-like shape with a diameter of 210 mm as a face size and a thickness of 2.5 mm was used. The solder having a disc-like shape with a diameter of 210 mm as a face size and a thickness of 0.010 mm was used. The sheet-like release material having a disc-like shape with a diameter of 240 mm as a face size and a thickness of 0.2 mm was used.
First, the one platy member was provided with the back holes each having an opening diameter of 1.14 mm in positions corresponding to intersections of the lattice-like slits formed later, by electrolytic processing (ECM processing). Furthermore, the lattice-like groove portions each having equal vertical and lateral widths of 0.3 mm and a depth of 0.5 mm were provided at an interval of 0.8 mm in positions corresponding to the slits of the surface as the joined face, to connect the back holes to the openings in the side surface.
Next, the one platy member and the other platy member were laminated while the solder was arranged between the platy members, and the platy members were sandwiched between a pair of joining jigs via the release material. Subsequently, the solder (copper) melted, and a pressure was decreased to a pressure lower than the vapor pressure of this solder during heating. While surplus solder vapor on the joined face was discharged from vapor discharge ports provided in the joining jig to the outside, the one platy member was joined to the other platy member to obtain a die base member. Specific heating conditions were set to a heating temperature of 1120° C. and a pressure of 0.133 Pa or less.
After lowering the temperature of the resultant die base member to normal temperature, the other platy member was provided with the slits communicating with the back holes of the one platy member to obtain the honeycomb structure forming die. The slits were formed into a quadrangular lattice-like shape by use of the diamond grindstone. The width of each slit was set to about 100 μm, the depth thereof was set to about 2.5 mm, and an interval between the adjacent slits was set to about 1000 μm.
The solder which had entered unjoined regions such as the back holes and the groove portions of a heterogeneous member laminate was vaporized during the heating, fed from the vapor inflow ports provided in the sandwiching face of one sandwiching portion through the vapor flow paths in the sandwiching portion, and discharged to the outside from the vapor discharge ports provided in the side surface. Therefore, in a case where the slits were formed in the other platy member, the solder did not constitute a resistor, and the slits which were not distorted could correctly and simply be formed. Moreover, any solder did not remain in the back holes of the resultant honeycomb structure forming die, and the widths of the slits were made uniform, so that a honeycomb structure having a high quality could be formed. Furthermore, in the resultant honeycomb structure forming die, the lattice-like groove portions functioned as buffer portions, and hence the forming material introduced from the back holes could smoothly be moved without any trouble. In consequence, sophisticated forming properties were realized, and the honeycomb structure was precisely formed.
A honeycomb structure forming die was manufactured by using materials similar to those of the above example in the same manner as in the example except that as shown in
In the manufacturing method of the honeycomb structure forming die of the present comparative example, after completing the heating, the solder remained in back holes and groove portions of one platy member. Therefore, a large resistance was generated during the processing of slits, and the slits having an equal width could not be formed. Moreover, in the resultant honeycomb structure forming die, the groove portions connecting the back holes to the slits, the flow paths of the back holes or the like had portions narrowed by the solder, and defects or the like were sometimes generated in a formed article.
It is to be noted that the removal of the solder which had entered the back holes and the groove portions of the one platy member was confirmed by an ultrasonic flaw detection test.
The manufacturing method of the bonded body of different members of the present invention can preferably be used as a method for manufacturing a bonded body of different members in which two platy members made of heterogeneous materials were joined to each other, especially as a bonded body of different members manufacturing method capable of precisely obtaining an accurate bonded body of different members from an only part of which an excellent wear resistance is demanded and in which an unjoined region and a joined region in a joined face are intricately intertwined.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2008-064349 | Mar 2008 | JP | national |
