Claims
- 1. A joint assembly comprising:
a first member having a first surface at a first angle to an external surface of the first member and formed of a first material; a second member having a second surface at a second angle to an outer surface of the second member and formed of a second material which is different from the first material, each of the first and second materials being characterized by a shear modulus and the second angle being a function of the shear modulus of the first and second materials and of the first angle; a bonding material which bonds the first and second members together, the bonding material being characterized by a bonding stress; the first angle being determined according to the equation: 20sin φ=σaσcwhere σα is the bonding stress and σc is a shear stress of the first material; and the second angle being determined according to the equation: 21tan β=GyzcGy′zs·tan φwhere Gyzc is a shear modulus of the first material in the y-z direction and Gy′zs is the shear modulus of the second material in the y′-z direction where y′ is parallel to the outer surface and z is perpendicular thereto.
- 2. The joint assembly of claim 1, wherein the first material is a thermal insulator and the second material is a metal.
- 3. The joint assembly of claim 2, wherein the first material is a composite.
- 4. The joint assembly of claim 1, wherein the bonding material is adhesive.
- 5. A singularity-free adhesively bonded joint assembly adapted to rotate about a central axis through the joint assembly comprising:
a first member having a first surface at a first angle to an external surface of the first member and formed of composite; a second member having a second surface at a second angle to an outer surface of the second member and formed of metal, each of the first and second materials being characterized by a shear modulus and the second angle being a function of the shear modulus of the composite and metal and of the first angle; an adhesive which bonds the first and second members together, the adhesive being characterized by an adhesion stress and the composite is characterized by a composite stress; the first angle being determined according to the equation: 22sin φ=σaσcwhere σα is the adhesion stress and σc is the composite stress; and the second angle being determined according to the equation: 23tan β=GyzcGy′zs·tan φwhere Gyzc is a shear modulus of the composite in the y-z direction and Gy′zs is the shear modulus of the metal in the y′-z direction where y′ is parallel to the outer surface and z is perpendicular thereto.
- 6. A method for forming a singularity-free bonded joint comprising the steps of:
providing a first member having a first surface at a first angle to an external surface of the first member and formed of a first material; providing a second member having a second surface at a second angle to an outer surface of the second member and formed of a second material which is different from the first material, each of the first and second materials being characterized by a shear modulus and the second angle being a function of the shear modulus of the first and second materials and of the first angle; connecting the first and second members together with a bonding material, the bonding material being characterized by a bonding stress; the first angle being determined according to the equation: 24sin φ=σaσcwhere σα is the bonding stress and σc is a shear stress of the first material; and the second angle being determined according to the equation: 25tan β=GyzcGy′zs·tan φwhere Gyzc is a shear modulus of the first material in the y-z direction and Gy′zs is the shear modulus of the second material in the y′-z direction where y′ is parallel to the outer surface and z is perpendicular thereto.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This is a continuation-in-part of pending U.S. patent application Ser. No. 08/895,653 filed on Jul. 17, 1997.
Continuations (1)
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Number |
Date |
Country |
Parent |
09625095 |
Jul 2000 |
US |
Child |
10761716 |
Jan 2004 |
US |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
08895653 |
Jul 1997 |
US |
Child |
09625095 |
Jul 2000 |
US |