Claims
- 1. A circuit connecting a pair of communication lines respectively to a pair of input leads of an electronic device, comprising:
- (a) a pair of sockets for connecting respectively to said pair of communication lines;
- (b) a pair of sockets for connecting respectively to said pair of the input leads of the electronic device;
- (c) one or more low melting point wires;
- (d) one or more surge absorbing elements, the number of which correspond to the number of said one or more low melting point wires;
- (e) a grounding lead wherein each of said surge absorbing elements is arranged in parallel with said communication line and said electronic device, and is positioned respectively between said pair of the communication lines, and between one of said input leads for the electronic device and the grounding lead, and between another one of said input leads for the electronic device and the grounding leads, and each of said low melting point metal wires is arranged respectively in series with each of said communication lines, said electronic device and each of said surge absorbing elements; and further each of said low melting metal wires is positioned in direct thermal contact respectively with a surface of each of said surge absorbing elements.
- 2. A circuit in accordance with claim 1, wherein said combination of surge absorbing elements and low melting point metal wires are mounted respectively through each of connecting pins onto a resinous molded base.
- 3. A circuit in accordance with claim 1, wherein each of said low melting point metal wire has a melting point from 65.degree. C. to 165.degree. C.
- 4. An in-line electrical load protection circuit comprising:
- (a) a pair of input sockets;
- (b) a pair of output sockets for connecting respectively to said pair of the input leads for the electronic device;
- (c) one or more low melting point wires; and
- (d) one or more surge absorbing elements, the number of which correspond to the number of said one or more low melting point wires;
- (e) a grounding lead wherein each of said surge absorbing elements is arranged in parallel with said communication line and said electronic device, and is positioned respectively between said pair of the communication lines, and between one of said input leads for the electronic device and the grounding lead, and between another one of said input leads for the electronic device and the grounding leads and each of said low melting point metal wires is arranged respectively in series with each of said communication lines, said electronic device and each of said surge absorbing elements; and further each of said low melting metal wires is positioned in direct thermal contact respectively with a surface of each of said surge absorbing elements.
- 5. The in-line electrical load protection circuit in accordance with claim 4 wherein each of said combination of said surge absorbing elements and said low melting point metal wires are mounted respectively through each of connecting pins onto said resin molded base.
- 6. The in-line electrical load protection circuit in accordance with claim 4 wherein each of said low melting point metal wire has a melting point from 65.degree. C. to 165.degree. C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2-246309 |
Sep 1990 |
JPX |
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Parent Case Info
This is a continuation of copending application Ser. No. 07/760,901 filed on Sep. 17, 1991 now abandoned.
US Referenced Citations (4)
Continuations (1)
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Number |
Date |
Country |
Parent |
760901 |
Sep 1991 |
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