The invention relates to a transition from a transmission line to a waveguide and more particularly a transition between a printed transmission line on a substrate and a rectangular waveguide.
Several types of transitions are known between a printed transmission line on a substrate and a rectangular waveguide.
A first type rests on setups based on a perpendicular configuration between the plane containing the substrate and the longitudinal axis of the waveguide. In this case, the substrate supporting the transmission line completely blocks off the end of the waveguide and the electromagnetic coupling between this line and this guide is then provided either by:
One problem with this first type of transition is that the perpendicular geometry between the substrate and the guide, and the various coupling means used lead to serious problems with regard to the ease of assembly of such a structure, in particular regarding the fine control of the positioning between the various elements constituting the transition.
A second type of transition consists of configurations where:
In all cases, the coupling of the printed transmission line to the waveguide is produced from patterns inscribed together on the substrate and the lateral face of the guide and positioned opposite each other. These patterns may be equivalent to slots or to electrodes, as, for example, in documents U.S. Pat. No. 6,977,560, U.S. Pat. No. 8,368,482, WO 2010/130293 and U.S. Pat. No. 7,132,905. All these solutions therefore need to directly etch the coupling patterns on the waveguide and align them or space them very precisely with the patterns inscribed on the printed circuit, hence leading to real difficulties in production and assembly.
A third type of transition corresponds to solutions where the coupling between the transmission line and the waveguide is obtained by a probe or antenna system connected to the end of the line and plunging inside the guide. This probe or antenna is then combined with other elements produced within the guide, such as cavities or ridges. Documents U.S. Pat. No. 3,146,410, U.S. Pat. No. 6,002,305 and U.S. Pat. No. 7,746,191 are some examples of this. The main drawback to this type of solution is based on the need to physically insert a plunger in the guide, with all the associated difficulties of production, assembly and positioning.
A fourth type is also based on a principle of insertion inside the waveguide of a substrate on which the transmission line is printed. The substrate is then either partially inserted into the guide from its open end, or is completely inserted into the plane E of this guide. The printed patterns on the substrate are either of the antenna type or of the taper type (transition produced on the substrate between, for example, a microstrip line and a slot line). Documents U.S. Pat. No. 3,732,508, U.S. Pat. No. 4,260,964 and U.S. Pat. No. 8,305,280 describe examples of such a transition. As for the third type, the major difficulty with this family of solutions is the insertion of all or part of the substrate supporting the printed patterns into the waveguide.
Finally, a fifth and final type is based on the use of a narrow ridge or “tapered” structure, most often produced inside an air waveguide, in electrical contact with the end of a transmission line etched on a substrate. Documents U.S. Pat. No. 6,265,950 and JP 2002344212 illustrate two examples. For this type of ridge transition, an alternative solution, where the guide and the substrate are then produced collectively in the same dielectric material, is described in document U.S. Pat. No. 7,382,212. In documents U.S. Pat. No. 6,265,950 and JP 2002344212, the transition requires a precise overlapping of the ridge and the end of the line and the ridge is produced in the form of an excrescence extending into the internal volume of the air waveguide. In document U.S. Pat. No. 7,382,212, the uniqueness of the dielectric material for the joint production of the guide and the substrate does not allow combining such a transition with a printed circuit produced on any other dielectric substrate.
Taking into account the various known types of transitions there is a real need to simplify the production of a transition and to facilitate its surface transfer onto any type of printed circuit.
The invention meets the above-mentioned need and provides a transition device between a printed transmission line on a dielectric substrate and a rectangular waveguide including a front face forming an inlet of the waveguide, a rear face parallel to the front face and forming an outlet of the waveguide, a lower face, an upper face parallel to the lower face, the upper and lower faces extending between the front and rear faces, the waveguide being a block of dielectric material whereof the faces are fully metalized except for the front face and the rear face, the transition device including:
a three-dimensional cavity formed in the volume of the waveguide between the inlet of the waveguide, further forming the inlet of the cavity, and the rear face while widening, the cavity being at an inlet height of the lower face of the waveguide and ending at a distance from the inlet of the cavity at an outlet height greater than the inlet height;
an electrical connection extending from the transmission line along the front face of the waveguide up to the inlet of the three-dimensional cavity.
The invention is advantageously completed by the following features, taken singly or in any one of their technically possible combinations:
Compared to the known transition devices, the transition device of the invention facilitates both the production of the device and the surface transfer thereof onto any type of printed circuit.
In particular, the coupling between the transmission line and the waveguide, by a simple direct electrical connection between the two elements, makes this solution particularly robust and not very sensitive to technological and assembly dispersions.
Other advantages provided by the device of the invention are as follows:
In addition, the invention also leads to good electrical performance, notably regarding the bandwidth of the device, while having a structure of a relatively compact size.
Other features, purposes and advantages of the invention will emerge from the following purely illustrative and non-restrictive description, which must be read with reference to the accompanying drawings in which:
In all the figures similar elements bear identical references.
The dielectric substrate 20 includes a front face 21 including a conductive deposit 210 forming a ground plane, and a rear face 22 parallel to the front face on which the transmission line 10 is printed.
The dielectric waveguide 30 is rectangular and includes a front face 31 forming an inlet of the waveguide, a rear face 32 parallel to the front face and forming an outlet of the waveguide, a lower face 33, an upper face 34 parallel to the lower face, the lower 33 and upper 34 faces extending between the front 31 and rear 32 faces.
In addition, the rectangular waveguide includes two lateral faces 35, 36 parallel to each other respectively extending between the upper 34 and lower 33 faces.
The waveguide is made of dielectric material and is a solid parallelepiped block. The material of the waveguide is preferably plastic or plastic foam with electrical characteristics such that the relative permittivity εr is as close as possible to 1 and the dielectric losses tg δ very close to zero.
The waveguide is further metalized on all its faces except the front face and the rear face thereof. Thus the following are metalized: the lower 33 and upper 34 faces and the two lateral faces 35, 36. The transition device further includes a three-dimensional cavity or “tape” 40 formed in the volume of the waveguide 30 between the inlet 31 of the waveguide, further forming an inlet of the cavity, and the rear face 32 widening along a longitudinal axis (not represented) of the waveguide 30.
The three-dimensional cavity 40 may be produced in the volume of the waveguide 30, either by machining or by molding.
Advantageously, in order to couple the transmission line 10 and the waveguide 30, the device includes an electrical connection 50 which extends from the transmission line 10 along the front face of the waveguide up to the inlet 31 of the three-dimensional cavity 40.
In addition, the dielectric substrate includes a recess 23 configured for bringing the electrical connection 50 to the inlet of the cavity 40.
As will be understood the junction device is of the SMC (Surface Mounted Component) type so that it can be easily transferred onto a dielectric substrate (i.e. an integrated circuit) or onto a metal support.
In the front view, the three-dimensional cavity presents an inlet profile φ (with vertical linear edges in
The cavity is at an inlet height H1 of the lower face 33 of the waveguide 30 and ends at a distance L from the inlet of the cavity at an outlet height H2 greater than the inlet height H1.
The width W1 and height H1 values are chosen to match the geometric characteristics of a microstrip transmission line with a characteristic impedance Zc (typically 50Ω), which would be produced on a dielectric substrate of the same dielectric material as that used for the waveguide and of a thickness H1, whereof the microstrip width would be equal to W1. This choice of characteristic impedance, and consequently the choice of the dimensions W1 and H1, is used to ensure the conditions for a good match with the printed transmission line, itself with a characteristic impedance Zc.
Subsequently the cavity expands over a length L along the longitudinal axis of the waveguide along a widening profile φ′ (sinuous in
In a preferred way, the cavity 40 ends at a distance L from the inlet with a transverse section, the dimensions W2 and H2 of which match those of the rectangular waveguide in which the latter is formed.
Advantageously the length L of the cavity and the appearance of the inlet φ, lateral φ″ and widening φ′ profiles progressively match the inlet dimensions of the cavity W1, H1 to its outlet dimensions W2, H2.
Thus, the cavity presents a height/width pair that increases along the length L of the waveguide 30.
In addition, in order to avoid any electrical contact between the electrical connection 50 and the lower face of the metalized waveguide, a local area 37, around the electrical connection, is devoid of metalization.
Similarly the height H1 at the inlet is less than the height H taken in an intermediate sectional plane along the section BB′ and even less than the height H2 taken at the outlet of the cavity 40. Thus as mentioned, the cavity presents a height/width pair that increases along the length L of the waveguide 30.
The inlet, widening and lateral profiles may take several forms.
The inlet profile may have vertical linear edges (
The widening profile may be linear (
The lateral profile may be linear (
A description will now be given of several embodiments of a transition device in conformity with the invention.
According to this first embodiment the dielectric substrate 20 includes a front face 21 including a conductive deposit 210 forming a ground plane, and a rear face 22 parallel to the front face on which the transmission line 10 is printed. In addition, the waveguide 30 is disposed on the ground plane 210 and the dielectric substrate includes a recess 23 configured for bringing the electrical connection 50 to the inlet of the cavity 40. In addition, the waveguide includes on its lower face a local area 37 at the level of the electrical connection 50 devoid of metalization in order to prevent any electrical contact between the electrical connection and the lower face of the waveguide.
According to this second embodiment, the dielectric substrate 20 includes a front face 21 including a conductive deposit 210 forming a ground plane, and a rear face 22 parallel to the front face on which the transmission line 10 is printed. In addition, the waveguide 30 is disposed on the rear face of the dielectric substrate. In order to connect the lower face of the waveguide to the ground plane of the dielectric substrate, the device includes a plurality of metalized vias 70 traversing the dielectric substrate and electrically connecting the ground plane to the lower face of the waveguide. In addition, the waveguide includes on its lower face a local area 37 at the level of the electrical connection 50 devoid of metalization in order to prevent any electrical contact between the electrical connection and the lower face of the waveguide.
According to this third embodiment, the dielectric substrate 20 includes a front face on which the transmission line 10 and a conductive deposit 210 forming a ground plane in contact with the lower face of the waveguide 30 are coplanarly printed. In addition, the waveguide is disposed on the ground plane and the lower face of the waveguide includes a local area 37 at the level of the electrical connection 50 devoid of conductive deposit in order to prevent any electrical contact between the electrical connection 50 and the lower face of the waveguide.
According to this fourth embodiment, the device includes a metal support 60 on which the waveguide is disposed. In addition, the lower face of the waveguide is connected to the metal support, a metal support on which the dielectric substrate is also disposed. In this configuration, the dielectric substrate 20 is in the extension of the waveguide 30.
In each of the embodiments described above, the electrical connection 50 produced in the form of a metal conductor ensures the electrical connection between the end of the transmission line 10 and the inlet of the cavity 40 and is chosen for being the most transparent possible on the electrical plane. It may be, for example, a wire or a very short metal strip or even, if the configuration allows it, a simple solder point.
A prototype of a transition device according to the first embodiment has been developed and characterized in the X band [8-12 GHz]. In particular, performances obtained by digital simulation were compared with the developed device.
In order to be able to measure the device experimentally, it is composed of two transitions according to the first embodiment, mounted “head-to-tail” and separated by a waveguide section of given length.
The waveguide is here in a polyurethane foam material of relative permittivity εr=1.17 and dielectric losses tg δ=0.003. For a single transition, the length L of the cavity is slightly less than 0.6 λg, where λg is the guided wavelength of the signal in a waveguide operating in the X band, filled with foam. This length L preserves a relatively compact character for this type of transition.
Number | Date | Country | Kind |
---|---|---|---|
1359045 | Sep 2013 | FR | national |
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/EP2014/070055 | 9/19/2014 | WO | 00 |