The present invention relates to the field of input devices, and in particular, to a keyboard device and an assembly method thereof.
With the progress of science and technology, the development of electronic apparatuses has brought great convenience to human life. Therefore, it is an important subject to provide electronic apparatuses with more user-friendly operations. Common input devices of an electronic apparatus include a mouse device, a keyboard device and a trackball device. Among them, the keyboard device allows a user to directly input text and symbols into a computer, and has gained much attention.
First, the structure and functions of a conventional keyboard device are described.
When the keycap 104 of any one of the key structure 10 is pressed and moves downward relative to the bottom plate 101, the first frame 1051 and the second frame 1052 of the scissors-type connection element 105 change from an extended state to a retracted state, and the keycap 104 that moves downward may be pressed against the elastic element 106 and enable an urging portion of the elastic element 106 to urge and trigger the corresponding thin-film switch 1021, so that the keyboard device 1 generates a corresponding key signal. When the keycap 104 of the key structure 10 is released, the keycap 104 moves upward relative to the bottom plate 101 in response to an elastic recovery force of the elastic element 106. At this time, the first frame 1051 and the second frame 1052 change from the retracted state to the extended state, and the keycap 104 returns to the original position.
However, in the conventional keyboard device 1, the thin-film circuit board 102, the keycap 104, the scissors-type connection element 105, and the elastic element 106 are carried on a carrier including the bottom plate 101 and the key frame 103. Therefore, to produce the bottom plate 101 and the key frame 103, it is necessary to fabricate separate molds for the two components, which greatly increases the production cost. In addition, the assembly process of the conventional keyboard device 1 is to first assemble the thin-film circuit board 102, the elastic element 106, the scissors-type connection element 105 and the keycap 104 onto the bottom plate 101 in sequence, and then to assemble the bottom plate 101 carrying the thin-film circuit board 102, the elastic element 106, the scissors-type connection element 105, and the keycap 104 with the key frame 103 by means of hot melting, buckling or locking. However, moisture can easily enter the keyboard device 1 assembled with the above process through an assembly joint of the bottom plate 101 and the key frame 103, thereby causing damage to the thin-film circuit board 102. Therefore, it is a focus of persons skilled in the art to solve the above problem.
An objective of the present invention is to provide a keyboard device and an assembly method thereof. The keyboard device has a key frame and a bottom plate that are of an integrally formed structure, and the assembly method is easy to implement, thereby effectively reducing the production cost.
Other objectives and advantages of the present invention may be further understood from technical features disclosed in the present invention.
To achieve one of, a part of or all of the above objectives, or other objectives, the present invention provides a keyboard device, including a plurality of key structures, where each key structure includes a thin-film circuit board, a key frame, an elastic element, and a press assembly. The key frame is arranged on the thin-film circuit board, and includes a frame body and a bottom plate that are of an integrally formed structure. The bottom plate is located between the frame body and the thin-film circuit board and has a through hole, and the thin-film circuit board covers the through hole. The elastic element is arranged on the thin-film circuit board, and a part of the elastic element is located in the through hole in the bottom plate. The press assembly is arranged in the key frame, and the elastic element is located between the press assembly and the thin-film circuit board.
In an embodiment of the present invention, the elastic element has a bottom surface facing the thin-film circuit board, where the bottom surface of the elastic element is connected to the thin-film circuit board, and an area of the bottom surface is smaller than an area of the through hole.
In an embodiment of the present invention, the elastic element has a bottom surface facing the thin-film circuit board, where the bottom surface of the elastic element is connected to the thin-film circuit board, and an area of the bottom surface is larger than an area of the through hole, so that the elastic element and the through hole are in a tight fit state.
In an embodiment of the present invention, the press assembly includes a keycap and a scissors-type connection element, where the scissors-type connection element is located between the bottom plate of the key frame and the keycap.
In an embodiment of the present invention, the bottom plate of the key frame has a first surface and a second surface opposite to each other, where a key is connected to the first surface of the bottom plate, and the thin-film circuit board is attached on the second surface of the bottom plate.
In an embodiment of the present invention, a material of the key frame includes plastics.
The present invention further provides a keyboard device assembly method, which is applicable to the keyboard device above. The keyboard device assembly method include the following steps: assembling the key onto the first surface of the bottom plate in a direction from above the key frame towards the key frame; assembling the elastic element onto the thin-film circuit board; and assembling the thin-film circuit board onto the second surface of the bottom plate in a direction from below the key frame towards the key frame, and passing the elastic element through the through hole in the bottom plate, so that a part of the elastic element is located in the through hole, where the second surface is opposite to the first surface.
In an embodiment of the present invention, the key includes a keycap and a scissors-type connection element, and the step of assembling the key onto the first surface of the bottom plate includes: assembling the scissors-type connection element onto the first surface of the bottom plate in the direction from above the key frame towards the key frame; and assembling the keycap to the scissors-type connection element, so that the scissors-type connection element is located between the keycap and the bottom plate.
Each key structure of the keyboard device of this embodiment of the present invention has the key frame composed of the frame body and the bottom plate that are of an integrally formed structure, so that the key frame needs only one mold and can be produced in one step or by means of multi-shot injection molding, thereby effectively reducing the production cost of the keyboard. Moreover, because the key frame is of an integrally formed structure, no assembly joint exists between the bottom plate and the frame body, so that it is not easy for moisture to enter the keyboard device to cause damage to the thin-film circuit board, thereby effectively prolonging the service life of the keyboard device. In addition, on the condition that the key frame is of an integrally formed structure, in the keyboard device assembly process, the keycap and the scissors-type connection element are assembled from above the key frame, and the thin-film circuit board and the elastic element are assembled from below the key frame. In this way, the assembly process is simplified and requires fewer holes in the structure, thereby greatly improving waterproof and weather-resistant effects.
In order to make the above and other objectives, features, and advantages of the present invention more obvious and easier to understand, preferred embodiments are described in detail below with reference to the accompanying drawings.
Other detailed structures of the keyboard device 2 of this embodiment of the present invention are further described below.
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In this embodiment, a material of the key frame 202 is, for example, plastics, that is, the frame body 2021 and the bottom plate 2022 use a plastics material and are of an integrally formed structure. However, the present invention does not limit the material of the key frame 202, and the material of the key frame 202 may be changed according to requirements of actual situations. An advantage of the key frame 202 made of the plastics material is that, the weight of each key structure 20 may be reduced, so that the overall weight of the keyboard device 2 is greatly reduced. In addition, the key frame 202 of this embodiment, for example, uses the frame body 2021 and the bottom plate 2022 that are integrally formed in one step or by means of multi-shot injection molding, but the present invention does not limit the production process of the key frame 202.
In this embodiment, the elastic element 203 has a bottom surface 2031 facing the thin-film circuit board 201, where the bottom surface 2031 of the elastic element 203 is connected to the thin-film circuit board 201, and an area A1 of the bottom surface 2031 of the elastic element 203 is smaller than an area A2 of the through hole H, so that the elastic element 203 can pass through the through hole H in the key frame 202 when the thin-film circuit board 201 is attached on the second surface S2 of the bottom plate 2022. It should be noted in particular that, the area A1 of the bottom surface 2031 of the elastic element 203 is larger than an area of any horizontal cross-section of the elastic element 203.
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In conclusion, each key structure of the keyboard device of the embodiments of the present invention has the key frame composed of the frame body and the bottom plate that are of an integrally formed structure, so that the key frame needs only one mold and can be produced in one step or by means of multi-shot injection molding, thereby effectively reducing the production cost of the keyboard. Moreover, because the key frame is of an integrally formed structure, no assembly joint exists between the bottom plate and the frame body, so that it is not easy for moisture to enter the keyboard device to cause damage to the thin-film circuit board, thereby effectively prolonging the service life of the keyboard device. In addition, on the condition that the key frame is of an integrally formed structure, in the keyboard device assembly process, the keycap and the scissors-type connection element are assembled from above the key frame, and the thin-film circuit board and the elastic element are assembled from below the key frame. In this way, the assembly process is simplified and requires fewer holes in the structure, thereby greatly improving waterproof and weather-resistant effects.
The above descriptions are only preferred embodiments of the present invention, and an implementation scope of the present invention shall not be limited by the embodiments. All simple equivalent changes and modifications made in accordance with the claims and the specification of the present invention are still within the protection scope of the present invention. In addition, any one of the embodiments or the claims of the present invention need not to achieve all the objectives or advantages or features disclosed in the present invention. Moreover, the abstract and the title are used only to assist in the search of patent documents, and are not used to limit the scope of the present invention. In addition, the terms “first”, “second” and the like mentioned in the specification or in the claims are only used to name elements or to distinguish between different embodiments or scopes, and are not used to limit the upper or lower limit of a quantity of the elements.
Number | Date | Country | Kind |
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108121779 | Jun 2019 | TW | national |