Patent Application
20170097195
1. Field of the Invention
The present invention relates generally to a knockdown heat dissipation unit, and more particularly to a knockdown heat dissipation unit, in which the number of the heat pipes can be adjusted according to the heat dissipation requirement of a user to enhance the heat dissipation effect.
2. Description of the Related Art
Along with the advance of technologies, the number of transistors per unit area of electronic component has become more and more. This leads to increase of heat generated by the electronic component in working. On the other hand, the working frequency of the electronic component has become higher and higher. In working, the heat generated by the transistors when switched on/off is the main cause of increase of the heat generated by the electronic component. In case the heat is not properly dissipated, the heat will lead to slowdown of the operation speed of the chip or even shorten the lifetime of the chip in some more serious cases. In order to enhance the heat dissipation effect of the electronic component, a passive heat dissipation unit such as a heat sink and/or heat pipe and/or vapor chamber is used to conductive heat. Under such circumstance, the heat generated by a heat source can be dissipated to the environment by the radiating fins of the heat sink by way of natural convection or forced convection.
The heat pipe can transfer a great amount of heat to a remote place to dissipate the heat by a very small cross-sectional area under very small temperature difference without any additional power supply. Therefore, in consideration of economical factors including power-freeness and space utility, various heat pipes have been widely applied to electronic products as one of the most often used heat transfer components.
The most often employed means for dissipating heat is to mount a heat dissipation unit (such as a heat sink) on the heat source, especially a heat sink equipped with heat pipe structures. The heat sink is made of a material with high heat conductivity. A working fluid and capillary textures are disposed in the heat pipe, whereby the heat sink has the property of high heat conduction. Moreover, the heat sink has the advantage of lightweight in structure. Therefore, the heat sink is free from the shortcoming of heavy weight of the conventional heat dissipation device. Also, the heat sink solves the problems of the conventional heat dissipation device that the cost is high and the system is complicated.
Conventionally, the heat sink equipped with the heat pipe structures and mounted on the heat source has a fixed configuration. That is, both the number and size of the heat pipes of the heat sink cannot be changed. Therefore, it is impossible for a user to flexibly adjust the number of the heat pipes according to the size of the heat source. In addition, the heat pipe cannot be solely used. It is necessary to connect the heat pipe with a heat sink or a base seat for practical use. Therefore, the heat generated by the heat source is first conducted to the base seat or the heat sink and then transferred to the heat pipe for remote-end heat dissipation. As a result, the heat pipe cannot directly contact the heat source to transfer the heat so as to enhance the heat transfer efficiency. Also, the assembly of the heat pipe and the heat sink cannot be adjusted according to the heat dissipation requirement so that the application of the assembly is limited.
In conclusion, the conventional heat dissipation unit has the following advantages:
1. The number of the heat pipes cannot be adjusted according to the heat dissipation requirement of a user.
2. The number of the heat pipes cannot be flexibly adjusted according to the size of the heat source.
It is therefore a primary object of the present invention to provide a knockdown heat dissipation unit, which can enhance the heat dissipation effect.
It is a further object of the present invention to provide the above knockdown heat dissipation unit, in which the number of the heat pipes can be flexibly adjusted according to the size of the heat source.
To achieve the above and other objects, the knockdown heat dissipation unit of the present invention includes at least one combination body and multiple heat pipes. The combination body has two opposite connection sections. The heat pipes are respectively connected with the connection sections of the combination body by means of press fit, welding or adhesion to form a large area of thermal contact face.
According to the structural design of the knockdown heat dissipation unit of the present invention, the number of the heat pipes can be adjusted according to the thermal wattage to be dissipated as required by a user. Also, the number of the heat pipes can be adjusted according to the size or number of the heat sources. In addition, the number of the heat pipes can be adjusted according to the distance between the arrangement positions of the heat sources. In the case that the heat source has a relatively large size or the distance between multiple heat sources is relatively long, multiple combination bodies and heat pipes can be alternately arranged and assembled to form the knockdown heat dissipation unit. In the case that the heat source has a relatively small size or the distance between multiple heat sources is relatively short, the numbers of the heat pipes and the combination bodies can be reduced. Therefore, thanks to the structure of the combination body, the size of the knockdown heat dissipation unit can be freely flexibly changed to enhance the heat dissipation effect.
The structure and the technical means adopted by the present invention to achieve the above and other objects can be best understood by referring to the following detailed description of the preferred embodiments and the accompanying drawings, wherein:
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In addition, in this embodiment, the two heat pipes 11 can be assembled with the combination body 10 in such a form that the ends of the two heat pipes 11 are flush with each other or the two heat pipes 11 are respectively positioned in a front position and a rear position.
Besides, in this embodiment, the cross section of the heat pipe 11 has, but not limited to, a circular shape. Alternatively, the cross section of the heat pipe 11 can have a semicircular shape (as shown in
Furthermore, in this embodiment, the configuration (volume and length) of the combination body 10 can be freely modified according to the requirement of a user. The combination body 10 can be made of a heat-conductive material or non-heat-conductive material. For example, the combination body 10 can be made of metal material or nonmetal material. The connection sections 101 can be designed with, but not limited to, the form of channels. Alternatively, the connection sections 101 can have the form of raised sections (as shown in
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In addition, the connection sections 101 of the combination bodies 10 can be formed with rough surfaces or recessed/raised sections (not shown) for more tightly connecting with the heat pipes 11.
In conclusion, in comparison with the conventional heat dissipation unit, the present invention has the following advantages:
The present invention has been described with the above embodiments thereof and it is understood that many changes and modifications in the above embodiments can be carried out without departing from the scope and the spirit of the invention that is intended to be limited only by the appended claims.
