The art of inkjet printing is relatively well developed. Commercial products such as computer printers, graphics plotters, and facsimile machines have been implemented with ink jet technology for producing printed media. Generally, an ink jet image is formed pursuant to precise placement on a print medium of ink drops emitted by an ink drop generating device known as an ink jet printhead. Some known printers make use of an ink container that is separably replaceable from the printhead. When the ink container is exhausted it is removed and replaced with a new ink container. The use of replaceable ink containers that are separate from the printhead allow users to replace the ink container without replacing the printhead. The printhead is then replaced at or near the end of printhead life, and not when the ink container is replaced.
A consideration with ink jet printing systems that employ ink containers that are separate from the printheads is to predict an out of ink condition for an ink container. In such ink jet printing systems, it is important that printing cease when an ink container is nearly empty with a small amount of stranded ink. Otherwise, printhead damage may occur as a result of firing without ink, and/or time is wasted in operating a printer without achieving a complete printed image.
Inkjet cartridges with integrated pressure sensing elements are known in the art, such as described in U.S. Pat. No. 6,435,638, INK BAG FITMENT WITH AN INTEGRATED PRESSURE SENSOR FOR LOW INK DETECTION. A purpose of the pressure sensing element is to measure changes in the pressure of the ink or fluid being delivered to the printhead over the ink cartridge lifetime, to provide data for indicating ink level and out-of-ink information.
A challenge for ink cartridges with integrated pressure sensors is protecting the sensor from pressure spikes, which commonly occur during manufacturing, shipping or handling, and can occur due to dropping the cartridge.
Features and advantages of the disclosure will readily be appreciated by persons skilled in the art from the following detailed description when read in conjunction with the drawing wherein:
In the following detailed description and in the several figures of the drawing, like elements are identified with like reference numerals. The figures are not to scale, and relative feature sizes may be exaggerated for illustrative purposes.
Referring now to
The ink supply station 100 contains receptacles or bays for accepting ink containers 110-116 which are respectively associated with and fluidically connected to respective print cartridges 60-66. Each of the ink containers 110-114 includes a collapsible ink reservoir, such as collapsible ink reservoir 110A that is surrounded by an air pressure chamber 110B. An air pressure source or pump 70 is in communication with the air pressure chamber for pressurizing the collapsible ink reservoir. For example, one pressure pump supplies pressurized air for all ink containers in the system. Pressurized ink is delivered to the print cartridges by an ink flow path that includes for example respective flexible plastic tubes connected between the ink containers 110-116 and respectively associated print cartridges 60-66.
Each of the ink containers includes a collapsible ink reservoir and an optional integral ink cartridge memory. Schematically depicted in
Continuing to refer to
A host processor 82, which includes a CPU 82A and a software printer driver 82B, is connected to the printer controller 82. For example, the host processor 82 comprises a personal computer that is external to the printer 50. A monitor 84 is connected to the host processor 82 and is used to display various messages that are indicative of the state of the ink jet printer. Alternatively, the printer can be configured for stand-alone or networked operation wherein messages are displayed on a front panel of the printer.
Referring now to
As shown in
As more particularly shown in
The chassis 1120 is secured to the opening of the neck region 1102A of the pressure vessel 1102, for example by an annular crimp ring 1280 that engages a top flange of the pressure vessel and an abutting flange of the chassis member. A pressure sealing O-ring 1152 suitably captured in a circumferential groove on the chassis 1120 engages the inside surface of the neck region 1102A of the pressure vessel 1102.
The collapsible ink reservoir 114 more particularly comprises a pleated bag having opposing walls or sides 1114, 1116. In an exemplary construction, an elongated sheet of bag material is folded such that opposed lateral edges of the sheet overlap or are brought together, forming an elongated cylinder. The lateral edges are sealed together, and pleats are in the resulting structure generally in alignment with the seal of the lateral edges. The bottom or non-feed end of the bag is formed by heat sealing the pleated structure along a seam transverse to the seal of the lateral edges. The top or feed end of the ink reservoir is formed similarly while leaving an opening for the bag to be sealingly attached to the keel portion 1292 of the chassis 1120. By way of specific example, the ink reservoir bag is sealingly attached to keel portion 1292 by heat staking.
The collapsible ink reservoir 114 thus defines an occupied portion 1103a of the interior chamber 1103, such that an unoccupied portion 1103b of the interior chamber 1103 is formed between the pressure vessel 1102 and the collapsible ink reservoir 114. The air inlet 1108 is the only flow path into or out of the unoccupied portion 1103b which functions as an air pressure chamber, and more particularly comprises a fluid conveying conduit that is in communication with the unoccupied portion 1103b of the interior chamber 1103. The ink outlet port 1110 is the only flow path into or out of the occupied portion 1103a and comprises a fluid conveying conduit that is in communication with the occupied portion 1103a of the interior chamber 1103, namely the interior of the collapsible ink reservoir 114. The ink outlet port 1110 is conveniently integrated with the keel portion 1292 of the chassis 1120.
As more specifically shown in
The electrical output of the pressure transducer 71 is provided to externally accessible contact pads 81 disposed on the top of the chassis 1120 via conductive leads 83 of a flexible printed circuit substrate 85 that extends between the ceramic substrate and the top of the chassis 1120, passing on the outside surface of the chassis 1120 between the O-ring 1152 and such outside surface. The conductive leads 83 are electrically connected to the externally accessible contact pads 81 disposed on the top of the chassis which can be formed on one end of the flexible printed circuit substrate 85 that would be attached to the top of the chassis 1120. The output of the pressure transducer 71 can be sampled while printing which avoids the need to interrupt printing to take a reading.
Optionally, a memory chip package 87 can be conveniently mounted on the ceramic substrate 87 and interconnected to associated externally accessible contact pads by associated conductive leads 83 of the flexible printed circuit substrate 85.
The pressure of the ink supply (for example as detected via the ink supply line) remains approximately equal to the pressure of the pressurizing gas (for example in the pressure line) for much of the ink supply life, and thus the differential pressure is approximately zero for much of the ink supply life. As the ink supply approaches an empty condition, the pressure of the ink supply decreases with decreasing remaining ink, whereby the differential pressure increases with decreasing ink. The relationship between differential pressure and the amount of ink remaining is reasonably consistent for any given system and can be reliably characterized.
A low ink level warning can optionally provided when the supply pressure decreases below a selected supply pressure threshold that is indicative of a low ink level threshold.
In an exemplary embodiment, the pressure sensor 71 is fabricated on a silicon die, which is positioned over the opening 73A formed in the substrate 73. In this exemplary embodiment, the sensor is a commercially available part, e.g. a Silicon Microstructure SM5102-005 pressure sensor, having a die size of about 2 mm by 2 mm by 0.9 mm high. In accordance with this invention, means are provided for improving the robustness of the pressure sensor 71 to high frequency pressure waves or pressure shocks, i.e. sudden spikes or increases in the pressure differential being monitored by the pressure sensor. Such pressure shocks can be the result of, for example, a full ink supply being dropped or roughly handled during manufacture, shipping or other handling.
Embodiments of the invention include mechanical filters, serving as protection structures, configured to prevent high-frequency pressure shocks from damaging the pressure sensor, while not substantially affecting static and low frequency measurements.
In a first embodiment, a mechanism for dampening the high frequency pressure waves comprises a mass of low-stiffness material 300 such as a low stiffness adhesive deposited over the exterior of the sensor die, as illustrated in
In another embodiment of a means for improving the robustness of the pressure sensor to pressure spikes, a porous plug 310 is fitted between the fluid path 1110A leading to the pressure sensor, i.e. between the main body of the fluid and the pressure sensor. In an exemplary embodiment, the plug 310 is a porous metal plug, e.g. a sintered stainless steel plug having a pore size on the order of 10 micrometers, although other pore sizes can alternatively be employed. For example, pore sizes in the range of 0.5 micrometer to 20 micrometers can provide protection against pressure spikes. The plug acts as a low-pass filter and passes gradual changes in pressure to the pressure sensor, but not pressure spikes. In an exemplary embodiment, the plug has respective diameter and length dimensions on the order of 1.3 mm and 2 mm. Other plug embodiments could alternatively be employed, e.g. plugs fabricated of porous ceramic or plastic materials.
Tests of these techniques for improving shock robustness indicate that, for the disclosed exemplary embodiments, both techniques significantly improve the robustness of the pressure sensors to pressure spikes. These tests indicate moderate improvement to shock robustness with little loss of sensor sensitivity for the mass of low-stiffness material 300. The porous pressure dampener 310 virtually eliminated failures due to shock.
A third exemplary embodiment of a means for improving the robustness of the pressure sensor to pressure spikes is illustrated in
The structure 320 includes a diaphragm portion 321 (
The labyrinth o-ring structure 320 operates in the following manner. Ink in the chassis passage 1110A entering from the reservoir at the center 328A of the inner gland 326 is forced to flow along flow path 332A through the opening 326A into the channel 330A, around either side of the inner gland to the through hole 322. Ink flowing through the hole 322 from the reservoir side to the sensor side then passes along path 332B in channel 330B to the opening 326B in the inner gland to the center 328B, and then to the center 328B, from which ink flows to the sensor 71. When a pressure impulse occurs, the outer gland 324 provides compliance, and the narrow flow path defined by path portions 332A, 332B and the hole 322 provides dampening. The result is an attenuated pressure spike on the sensor side.
The labyrinth o-ring structure is a unitary part, typically an injection molded structure, fabricated of an elastomeric material. Exemplary materials suitable for the purpose include Butadiene Acrylonitrile (Nitrile) and EPDM. Nitrile elastomers can provide improved barrier properties with respect to air diffusion.
Improved performance of the o-ring structure 320 may be obtained for some applications by employing a relatively thin outer gland 324. This gland assists in shock suppression as a complaint member of the structure; unduly increasing its thickness can substantially reduce its compliance.
Exemplary dimensions of the o-ring structure 320 for a particular application are as follows: outer diameter, 3.6 mm; diaphragm thickness, 0.2 mm; outer gland thickness, 0.4 mm; inner gland thickness, 0.3 mm; through hole diameter, 0.3 mm.
Various modifications can be made to the gasket structure. The structure need not have a circular periphery, for example. Also, instead of providing dual flow paths on each side of the o-ring, a configuration can be employed with a single flow path, with the inner gland having one end which ends at the outer gland. Such an alternate configuration is shown in
Through holes 382A, 382B are formed through the web portion 381 of the gasket structure 380 between the outer gland 384 and the inner gland 386, and permit fluid flow between the reservoir side and sensor side of the gasket structure 380. In an exemplary embodiment, the holes may be spaced apart by 90 degrees, although this may vary depending on the particular application.
The labyrinth gasket structure 380 operates in the following manner. Ink in the chassis passage 1110A entering from the reservoir at the center 388A of the inner gland 386 is forced to flow along flow paths 392A-1, 392A-1 through the opening 386A into the channels 390A-1, 390A-2, around either side of the inner gland 386 to the through holes 382A, 382B. Ink flowing through the holes 382A, 382B from the reservoir side to the sensor side then passes along paths 392B-1, 392B-2 in channels 390B-1, 390B-2 to the opening 386B in the inner gland to the center 388B, from which ink flows to the sensor 71. When a pressure impulse occurs, the outer gland 384 provides compliance, and the narrow flow paths defined by path portions 392A-1, 392A-2, 392B-1, 392B-2 and the holes 382A, 382B provides dampening. The result is an attenuated pressure spike on the sensor side.
The gasket structure 380 with a redundant flow path structure through multiple through holes allows redundant fluid communication in the through-hole region at spaced intervals. The external rib 396 adds structure to reduce the sheer of the outer wall which can lead to through-hole blockage. The rib 389 adds structure to reduce the sheer of the outer gland 384, which can lead to through hole blockage. The redundant architecture of the gasket structure may reduce blockage caused by variation in the assembly process, such as shearing of the gasket due to non-vertical assembly motion, variation in material sizes, presence of foreign bodies, or swelling of the gasket material due to exposure to solvents which may be included in the fluid. Fluid movement and pressure is communicated through the redundant flow path structure which may serve, in an exemplary embodiment, both a resistive function and a compliant function. The labyrinth seal structure in an exemplary embodiment attenuates high-frequency signals and passes low frequency signals in fluid movement and pressure. In an exemplary embodiment, the redundant flow path structure attenuates fluid pressure spikes with periods less than two seconds.
The gasket structure 380 in an exemplary embodiment is an integral one-piece structure, molded from an elastomer, such as, for example, Nitrile rubber or EPDM. The through hole diameters may be in a range of 0.01 mm to 5 mm.
The gasket structure 400 includes a web portion 401 which covers most of the inner area of the structure. The structure has opposed reservoir and sensor sides, which are mirror images of each other. The outer circumferential gland 404 extends about the periphery of the structure 400, with a rib 416 protruding from the outer side of the gland 404. The inner horse shoe shaped gland 406 is spaced between the central surface region 408A and the outer gland 404, and has an opening in the wall defining the gland 406. As noted above, wall 418 protrudes from the outer gland into the horse-shoe opening, forming channels 406A1 and 406A-2. A wall or rib 409 is positioned 180 degrees around the horse shoe-shaped gland 406 from the opening 406A, connected between the gland 406 and the outer gland 404. Channels 410A-1 and 410A-2 (reservoir side) and 410B-1 and 410B-2 (sensor side) are formed between the glands 404, 406 on opposite sides of the wall 389.
Through holes 402A, 4022B are formed through the web portion 401 of the gasket structure 400 between the outer gland 404 and the inner gland 406, and permit fluid flow between the reservoir side and sensor side of the gasket structure 406. In an exemplary embodiment, the holes may be spaced apart by 90 degrees, although this may vary depending on the particular application.
The labyrinth gasket structure 400 operates in the following manner. Ink in the chassis passage 1110A entering from the reservoir at the center 408A of the inner gland 406 is forced to flow along flow paths 412A-1, 412A-2 through the openings 406A-1, 406A-2 into the channels 410A-1, 410A-2, around either side of the inner gland 406 to the through holes 402A, 402B. Ink flowing through the holes 402A, 402B from the reservoir side to the sensor side then passes along paths 412B-1, 412B-2 in channels 410B-1, 410B-2 to the openings 406B-1, 406B-2 in the inner gland to the center 408B, from which ink flows to the sensor 71. When a pressure impulse occurs, the outer gland 404 provides compliance, and the narrow flow paths defined by path portions 412A-1, 412A-2, 412B-1, 412B-2 and the holes 412A, 412B provides dampening. The result is an attenuated pressure spike on the sensor side.
The gasket structure 400 with multiple through holes allows redundant fluid communication in the through-hole region at exemplary 90 degree intervals. The external rib 416 adds structure to reduce the sheer of the outer wall which can lead to through-hole blockage. The wall 418 provides parallel double flow channels into the center region 408A, which are more robust against closing when the outer gland 404 is pushed in the direction of arrow 420. The redundant architecture of the gasket structure may reduce blockage caused by variation in the assembly process, such as shearing of the gasket due to non-vertical assembly motion, variation in material sizes, presence of foreign bodies, or swelling of the gasket material due to exposure to solvents which may be included in the fluid.
The gasket structure 400 in an exemplary embodiment is an integral one-piece structure, molded from an elastomer, such as, for example, Nitrile rubber or EPDM. The through hole diameters may be in a range of 0.01 mm to 5 mm.
The gasket structures provide a seal function integrated with a pressure shock dampening function, and thus provide the advantage of accomplishing both functions with a single part.
While the foregoing fluid supply implementation applies greater than ambient pressure to the ink supply, the techniques for protecting the sensor against pressure spikes can be employed in systems wherein the ink supply is subjected only to ambient or atmospheric pressure instead of a pressure that is greater than atmospheric pressure, for example in a system wherein a non-pressurized ink supply is elevated so that ink flows out of the ink container by gravity. Also, the disclosed techniques can be employed in other printing or marking systems that employ liquid ink such as liquid electrophotographic printing systems.
Although the foregoing has been a description and illustration of specific embodiments of the invention, various modifications and changes thereto can be made by persons skilled in the art without departing from the scope and spirit of the invention as defined by the following claims.
This application is a continuation-in-part of application Ser. No. 11/041,047, filed Jan. 21, 2005, in turn a continuation of application Ser. No. 10/280,441, filed Oct. 25, 2002, now U.S. Pat. No. 6,886,929.
Number | Date | Country | |
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Parent | 10280441 | Oct 2002 | US |
Child | 11041047 | Jan 2005 | US |
Number | Date | Country | |
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Parent | 11041047 | Jan 2005 | US |
Child | 11188480 | Jul 2005 | US |