Claims
- 1. A process for the formation of a coating on a heat resistant wire substrate which comprises coating said substrate with a solvent-containing coating composition containing a binder comprising
- a) a polyvinyl acetal and
- b) about 1 to 300 parts by weight, based on 100 parts of component (a), of an organic compound containing (i) carbodiimide and/or uretone imine groups and (ii) blocked isocyanate groups,
- and curing the coating at a temperature above about 80.degree. C.
- 2. The process of claim 1 wherein component (b) contains 0 to about 25% by weight of carbodiimide groups (calculated as --N.dbd.C.dbd.N--) and 0 to about 30% by weight of uretone imine groups (calculated as C.sub.2 N.sub.3 O), the sum of carbodiimide groups and uretone imine groups (calculated as --N.dbd.C.dbd.N--) being about 0.5 to 25% by weight, and about 1 to 25% by weight of blocked isocyanate groups (calculated as NCO).
- 3. The process of claim 1 wherein component (a) comprises a polyvinyl formal.
- 4. The process of claim 2 wherein component (a) comprises a polyvinyl formal.
Priority Claims (1)
Number |
Date |
Country |
Kind |
3718238 |
May 1987 |
DEX |
|
Parent Case Info
This application is a division of application Ser. No. 07/196,178 filed May 19, 1988.
US Referenced Citations (5)
Divisions (1)
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Number |
Date |
Country |
Parent |
196178 |
May 1988 |
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