This Application claims priority of Taiwan Patent Application No. 099112126, filed on Apr. 19, 2010, the entirety of which is incorporated by reference herein.
1. Field of the Invention
This application relates in general to a lamp assembly and in particular to an LED lamp assembly.
2. Description of the Related Art
As LEDs have low power dissipation and long endurance, they have been widely applied in various lamp apparatuses. Conventional LED lamps may comprise several metal fins for heat dissipation, so as to prevent failure due to overheating.
The metal fins are usually formed by die extrusion or die casting processes. However, the die extrusion process is expensive and forming complex structures therewith is difficult. As for the die casting process, manufacturing fin structures with fine pitches and durable strengths is difficult. Accordingly, it has been difficult to manufacture low cost lamp assemblies with fin structures having high cooling efficiency.
The application provides a lamp assembly including a light source, a thermal module, a connecting member, and an adapter electrically connected to the light source. The thermal module includes a first thermal member and a second thermal member. The first and second thermal members respectively have a plurality of first and second fins which are arranged in a staggered manner. The second thermal member forms a plurality of through holes for heat dissipation. The light source is disposed on the second thermal member, and the connecting member connects the thermal module with the adapter.
The invention can be more fully understood by reading the subsequent detailed description and examples with references made to the accompanying drawings, wherein:
Referring to
As shown in
During the die casting process, since a fine pitch between adjacent fin structures is hard to achieve, the number of fin structures is adversely limited. To overcome the drawbacks of the die casting process, the present application provides a thermal module 30 including a first thermal member 31 and a second thermal member 32 engaged with each other, wherein the first and second fins 311 and 321 are arranged in a staggered manner to multiply the number of fins used; thus, increasing the surface area thereof and improving cooling efficiency.
Referring to
Referring to
Referring to
The present application provides a lamp assembly including a thermal module, a light source disposed on the thermal module, an adapter, and a connecting member. The thermal module includes a first thermal member and a second thermal member respectively having a plurality of first and second fins which are arranged in a staggered manner to multiply the number of fins used; thus, increasing the surface area thereof and improving cooling efficiency. Specifically, the second thermal member forms a plurality of through holes to rapidly dissipate heat generated from the light source by air convection; thus, preventing overheating and failure of the light source.
While the invention has been described by way of example and in terms of preferred embodiment, it is to be understood that the invention is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
---|---|---|---|
99112126 A | Apr 2010 | TW | national |
Number | Name | Date | Kind |
---|---|---|---|
6511209 | Chiang | Jan 2003 | B1 |
6787999 | Stimac et al. | Sep 2004 | B2 |
6864513 | Lin et al. | Mar 2005 | B2 |
7144140 | Sun et al. | Dec 2006 | B2 |
7458706 | Liu et al. | Dec 2008 | B1 |
7513653 | Liu et al. | Apr 2009 | B1 |
7549772 | Wang | Jun 2009 | B2 |
7549774 | Tsai | Jun 2009 | B2 |
7568817 | Lee et al. | Aug 2009 | B2 |
7575346 | Horng et al. | Aug 2009 | B1 |
7581856 | Kang et al. | Sep 2009 | B2 |
7623348 | Otsuki et al. | Nov 2009 | B2 |
7637635 | Xiao et al. | Dec 2009 | B2 |
7637636 | Zheng et al. | Dec 2009 | B2 |
7670028 | Liu et al. | Mar 2010 | B2 |
7824077 | Chen et al. | Nov 2010 | B2 |
7959332 | Tickner et al. | Jun 2011 | B2 |
7993034 | Wegner | Aug 2011 | B2 |
20040108102 | Otsuki et al. | Jun 2004 | A1 |
20050174780 | Park | Aug 2005 | A1 |
20070236935 | Wang | Oct 2007 | A1 |
20070253202 | Wu et al. | Nov 2007 | A1 |
20080007954 | Li | Jan 2008 | A1 |
20090129102 | Xiao et al. | May 2009 | A1 |
20090135613 | Peng | May 2009 | A1 |
20090141500 | Peng | Jun 2009 | A1 |
20090147520 | Liu et al. | Jun 2009 | A1 |
20090296402 | Chang et al. | Dec 2009 | A1 |
20110254425 | Huang et al. | Oct 2011 | A1 |
Number | Date | Country |
---|---|---|
201096292 | Aug 2008 | CN |
201133635 | Oct 2008 | CN |
101338887 | Jan 2009 | CN |
101566285 | Oct 2009 | CN |
201416782 | Mar 2010 | CN |
3135391 | Feb 2001 | JP |
3148247 | Mar 2001 | JP |
2007-193960 | Aug 2007 | JP |
3135391 | Aug 2007 | JP |
3148247 | Jan 2009 | JP |
2009-163955 | Jul 2009 | JP |
2010086713 | Apr 2010 | JP |
M278059 | Oct 2005 | TW |
M330426 | Apr 2008 | TW |
M344428 | Nov 2008 | TW |
M353309 | Mar 2009 | TW |
200933079 | Aug 2009 | TW |
M364818 | Sep 2009 | TW |
M366884 | Oct 2009 | TW |
M368757 | Nov 2009 | TW |
Entry |
---|
Taiwan Patent Office, Office Action, Patent Application Serial No. 099112125, Jun. 15, 2012, Taiwan. |
Japan Patent Office, Office Action, Patent Application Serial No. 2010-211677, Jul. 3, 2012, Japan. |
Japan Patent Office, Office Action, Patent Application Serial No. 2010-211678, Jul. 3, 2012, Japan. |
China Patent Office, Office Action, Patent Application Serial No. 201010178032.2, Sep. 26, 2012, China. |
China Patent Office, Office Action, Patent Application Serial No. 201010178033.7, Sep. 24, 2012, China. |
Taiwan Patent Office, Office Action, Patent Application Serial No. 099112126, Jan. 14, 2013, Taiwan. |
Number | Date | Country | |
---|---|---|---|
20110253358 A1 | Oct 2011 | US |