PURPOSE OF THE INVENTION
To provide a system for changing heat dissipation dependent light sources that must have direct and substantial contact with heat sink configuration within a luminaire or luminaire system without removing and/or discarding the heat sink configuration.
To provide a cost effective lamp change system without discarding expensive materials in the lamp change process.
To provide multiple and varied types of light distribution from a “bulb-like” change out module.
To provide a uniform and constant system that can be used in a variety of luminaire products and their associated applications.
To provide efficient illumination through the use of bulbs that project precise illumination to multiple specific target areas.
BRIEF DESCRIPTION OF DRAWINGS
FIG. 1 is a plan view of a lighting component system.
FIG. 2 is a three dimensional diagram of the lighting component system illustrated in FIG. 1.
FIG. 3 is a three dimensional diagram of a lighting component system similar to that shown in FIGS. 1 and 2.
FIG. 4 is a three dimensional diagram of a lighting component system similar to that shown in FIG. 3.
FIG. 5 is a three dimensional diagram of a lighting component system similar to that shown in FIG. 3 further comprising a bulb-like envelope.
FIG. 6 is a three dimensional diagram of a lighting component system similar to that shown in FIG. 5 further comprising spring like compressive heat sinks.
FIG. 7 is a three dimensional diagram of a lighting component system applied to a luminaire.
FIG. 8 is a diagram of a light bulb comprising a lighting component system.
FIG. 9 is a three dimensional diagram of a lighting arrangement.
FIG. 9A is a plan view of the arrangement.
PREFERRED EMBODIMENTS
FIGS. 1 and 2 are a plan view diagram and a 3-dimensional view of a lighting component system LS1 to be used for changing out lighting modules within a luminaire without removal of heat sinks and related hardware from the luminaire itself. This instant invention can be used in many types of luminaires and luminaire systems that are inclusive of such optical systems that are incorporated herein by reference in U.S. Pat. Nos. 5,676,457; 5,897,201; 7,118,253; 7,600,894; 7,677,760; 7,597,453; 6,616,305; 6,536,921; 6,851,833, and PCT/US/06/49369. In addition this instant invention can be applied to various types of light bulbs such as PAR and R lamps, T lamps, and decorative lamps such as candelabra bulbs, as well as indoor and outdoor luminaire systems.
The components which form the component lighting system LS1 are (as illustrated in FIG. 2) as follows:
A light module LM comprising a light emitting diode LED disposed substantially on an optical axis OA, the light emitting diode LED mounted to a heat transfer component HT (for removing heat from the LED); the heat transfer component HT having contact surfaces CS that are designed to interface with heat sink assembly HS in such a manner that attaching and detaching the heat transfer HT subcomponent TC from the heat sink HS is accomplished by manually moving the light module(s) LM in a direction along the optical axis OA.
The heat sink assembly component HS comprises a series of heat sink fins HF which are radially disposed outwardly from the optical axis OA and connected to a common portion of the heat sink assembly component HS which can be a ring HR, plate HP, or other shapes having structural and enhanced heat dissipating functions and that holds the fins HF together. At least one of the surfaces of at least one of the fins has a heat transfer function and an attachment function to the contact surfaces CS of the light modules LM.
The lighting component system LS1 further comprises an electrical system ES for providing current from an appropriate power source to the light module(s) LM. In the embodiment illustrated in FIGS. 1 and 2, male electrical contact pins EM that are disposed on the light module component LM are substantially parallel to the optical axis OA so that the light module LM can be manually guided along the optical axis OA to attach the light module LM to the heat sink component HS. The male pins EM which are disposed in alignment to the heat fins HF, (illustrated by dotted lines DL) are pressed into and make contact with the female pin connectors EF. The female pin connectors EF are positioned within an electrical connector EC which are substantially disposed about optical axis OA. The electrical connector EC may or may not be attached to heat sink assembly HS.
FIG. 3 is a three-dimensional exploded diagram of lighting component system LS2 similar to lighting component system LS1 shown in FIGS. 1 and 2, further illustrating and containing:
At least two light modules LM1 and LM2 each light module containing a multibeam projector MB1 and MB2 (respectively), each further containing heat transfer elements (HT as in FIG. 2) which in this embodiment are in the form of “clips” EC. The orientation of clips EC of each of the light modules is radially offset from another of the light modules in correspondence to how the multibeam collimators MB1 and MB2 are offset from each other and to the light distribution functions (including the direction of beam projections IB) that at least partially surround the light module LM2 illustrated in this figure. The heat sink fins HF are so disposed as to not interfere with or obstruct said individual beams IB projected by the multiple beam projectors.
As in all the embodiments discussed, the number of light modules (and their associated optics) are not limited to two as shown in FIG. 3.
Also illustrated are electrical continuity rods ER that connect light modules LM which are disposed between the individual projecting optical elements PO of the multibeam projectors MB1 and MB2, and are positioned so as not to obstruct their associated individual beams IB. In other embodiments the electrical connecting rods ER may end as male contact pins EM. One or more light modules may include male contact pins EM that connect directly into sequentially disposed light modules that contain female pin connectors EF which would allow for the change out or replacement for each light module individually.
The distance MD between light modules LM1 and LM2 corresponds directly to the distance HD between heat sink assemblies HS1 and HS2. These distances are determined by the heat dissipation and optical/light function requirements and or the lighting functions of the component systems as used in conjunction with its corresponding luminaire. In such co-functional situations the luminaire can provide support between heat sink assemblies and or comprise heat sink assemblies as structural parts of the luminaire. In other embodiments wherein the component system LS co-functions with a luminaire, the luminaire can comprise optics such as reflectors, refractors and light guides to reshape and or redirect light emanating and or projecting from the light modules comprising the component system. In still other embodiments, the light modules, heat sink assemblies, and electrical systems may substantially comprise the entire luminaire but may still require structural, electronic, or environment related connecting hardware for complete functioning of the luminaire.
FIG. 4 is a three dimensional diagram of a lighting component system LS3 similar to the lighting component system illustrated in FIG. 3 differing in that (for graphic purposes of simplification) the individual light modules LM1 and LM2 (in this embodiment) are not shown to comprise light controlling optics, although any type of light controlling optics such as those shown in the enclosed embodiments herein may be employed. Also shown, there is no direct electrical connection (continuity) between light modules LM, allowing each of the light modules to be changed or replaced individually so as not to disconnect continuity between connected (installed) light modules when another light module is removed.
At least one of the heat transfer surfaces HT of at least one of the light modules LM1 and LM2 is shown to comprise an electrical contact pad EP which makes contact with an associated electrical contact pad EP mounted to heat sink fin HF. Contact pad EP is insulated from heat sink fin HF by an insulating material disposed between electrical contact pad EP and heat transfer surface HT of heat sink fin HF on the heat sink assemblies HS1 and HS2.
FIG. 5 is a three dimensional diagram of a lighting component system LS4 similar to the lighting component system illustrated in FIG. 3 differing in that and further including:
A light bulb-like enclosure BE of light transmissive material such as glass or plastic that is at least partially surrounding at least one of light modules LM1 and LM2, and in other embodiments surrounding and connecting at least two of light modules. The bulb-like enclosure BE has a cylindrical (T lamp) shape, or may have other cross-sectional geometric or configurations and light bulb shapes. The shape and surface of the enclosure may contain various types of lenses for differing light projecting configurations and applications. Such various types of lenses OC can be employed to project radial beam(s) RB, and radially collimated beam(s) RC. Multiple beam collimating optics MB1 and MB2 (shown in FIG. 3), Fresnel optics, prismatic optics and diffusing optics can also be employed.
Also illustrated is electrical contact base EB that plugs into an electrical socket ES, the base EB (which is shown in this embodiment is connected to light module LM2) is shown to comprise spring-type contact pads EP that compress onto electrical contact pads ES located within socket SE. In other embodiments at least one or either of the electrical contacts can be disposed on the top of the base and on the bottom of the socket as in single and or double contact bases. In other embodiments the spring type contact pads EP may be disposed with socket SE.
FIG. 5 further illustrates two types of electrical continuity between light modules LM1 and LM2, and their connecting component(s). The electrical continuity between light module LM1 and its connecting component (as shown and described in connection with FIG. 4) are such that the electrical connection and thermal connections are made within the same subcomponents. In this embodiment electrical continuity and thermal transfer from light module LM2 is achieved at different locations and by different subcomponents.
FIG. 6 is a three dimensional diagram of a lighting component system LS5 designed for lamp changing that comprises alternate type modules LM1 and LM2 and respective alternate type heat sink assemblies HS1 and HS2 (as described in FIGS. 2 through 5), differing in that and further including: heat sink assemblies HS1 and HS2 that contain spring-like subcomponents that provide a compressive force from the heat transfer element of the heat sink assembly HS1 and HS2 to and on the heat transfer elements HT on the lighting modules LM1 and LM2.
The compressive force provided by the heat transfer element HT (subcomponent of heat sink assembly HS1) is created by a spring-like configuration of the heat sink fins HF of heat sink assembly HS1. The compressive force provided by the heat transfer element HT (subcomponent of heat sink assembly HS2) is created by a split S and an expansion in the ring shaped heat transfer element HT. Both heat sink assemblies HS1 and HS2 include a spring-type metal alloy within the heat sink material. In another embodiment a spring in the form of a compressive band can be integrated into the heat sink assembly so disposed as to surround and create a compressive force around heat transfer element HT of light module LM. In other embodiments a circular clamp (configured similarly to a hose clamp) can be so disposed as to surround and create a compressive force around the heat transfer element HT. In such an embodiment the clamp could be manually loosened to remove and replace the typical light modules LM1 and LM2.
In some embodiments bulbs (illustrated by bulb enclosure BE) may include internal heat sinks. In other embodiments the bulb like enclosure BE may include non-detachable heat sinks. Also illustrated are male connector pins EM and female connectors EF that are located in electrical socket ES.
FIG. 7 is a three dimensional diagram of a luminaire LU containing components similar to the components contained within the lighting component systems illustrated in FIGS. 1 through 6. In this embodiment luminaires LU having a specific function which is down lighting. This is achieved by applying optical principles and configurations formerly described and that are incorporated herein by reference to the patents listed above and in connection with the description of FIGS. 1 and 2. Light module LM1 within heat sink assembly HS1 includes a linear light collector such as a parabolic or ellipsoidal reflector that at least partially surrounds the light emitting diode LED, and which projects beam LB forward, surrounding optical axis OA and away from luminaire LU. Light module LM2 includes a side emitting lens SO at least partially surrounding its associated light emitting diode LED which projects a radial beam SB onto ring reflector RR which in turn reflects and directs beam RB which surrounds (but is not obstructed by) heat sink assembly HS1 in substantially the same direction as linear beam LB.
In another embodiment, each of the modules can project different types of illumination, e.g., one module (such as LM2) projecting a radial beam onto a reflector for down lighting application. One module such as LM1 (the light emitting diode LED surrounded by a side emitting lens) can simultaneously project an indirect beam onto a ceiling plane for indirect lighting applications.
FIG. 8 is a side view/sectional diagram of a multifunctional light bulb BU disposed within a luminaire LL (such as a table lamp). Multifunction light bulb BU includes a combination of at least one of the light modules (as described in FIGS. 1 through), which are further surrounded by a bulb enclosure BE. Bulb enclose BE having at least one of the light interface aspects (that are described in FIG. 5) between light modules and the space surrounding bulb enclosure BE. The specific lighting functions of the three light modules illustrated are as follows: Light module LM1 includes a configuration of optics that collects and projects light from its associated light emitting diode as a beam RB which surrounds and is projected in the direction of the optical axis OA, beam RB having a cross-section so shaped so as not to be obstructed by either the bulb base EB or the luminaire socket LS. Light module LM2 (sharing the same optical axis OA with light module LM1) includes a configuration of optics that project a radial beam SB outward and away from the optical axis OA, and as illustrated in this embodiment onto the shade SH of lamp style luminaire LL. Light module LM3 including at least one light emitting diode LED that is disposed to emit and direct light LB substantially in the opposite direction as light projected by light module LM1. Light module LM3 can include optics directly surrounding light emitting diode LED and disposed between the light emitting diode LED and the bulb enclosure BE, or bulb enclosure EB can include optical light control elements such as those described in FIGS. 3, 5, 7, and 8. In some embodiments, each of the light modules can be dimmed or switched independently from each other. The application of the multi-function bulb BU within a luminaire as described provides a high level of efficiency, utility and precision of required illumination by projecting light directly to where it is required. In other embodiments at least two of the light modules can provide the same type of illumination. In other embodiments only one can be utilized. One light module can simultaneously provide more than one type of illumination.
FIG. 9 is a three dimensional diagram of a lighting component system LS6 which includes a light module LM further including a light emitting diode mounted to a thermal transfer board HT (previously referred to as a heat transfer component) which is thermally connected to heat sink assembly HS. Heat sink assembly HS includes at least two heat sink fins HE that radiate outwardly from, and at least partially surround, light module LM. At least one of the edges of at least one of heat sink fins HF includes a reflective surface IS that is positioned in relationship to the light module LM so as to reflect a portion of the light emanating from the light emitting diode LED away from the light module LM as reflected rays PR, while allowing a portion of the light emanating from the light emitting diode LED to pass by and between the heat sink fins HF as rays RP. Rays RP, as well as forward projecting rays RR can be reflected or refracted by optical components such as those in FIGS. 5, 7, and 8. The reflective surface(s) IS may include parabolic, ellipsoidal, and circular (among other) curvatures or can be flat.
FIG. 9A is a plan view facing the light component system LS shown in FIG. 9, further illustrating and describing that the thickness TH of each of the reflective surface IS of the heat sink fins HF can vary from fin to fin and therefore increase or decrease the percentage of light as well as the cross-sectional symmetry of the beam(s) projected from the light component system. Also illustrated in FIG. 9A is that the number of radial heat sink fins HF can vary. At least one single beam projecting optic BP of a multiple beam projector is shown to project at least a partially collimated beam onto at least one of the heat sink reflectors IS. The types of thermal connection between the thermal transfer board HT and the heat sink fins HF are explained in connection with FIGS. 1 thru 7.
FIGS. 9B, 9C and 9D are cross-sectional diagrams taken through section SS in FIG. 9 illustrating three of the possible types of cross-sections of the reflective surfaces of heat sink fins HF and the section thru their corresponding reflected beam. The reflective surface of heat sinks in FIGS. 9B, 9C, and 9D, respectively, are: convex surface CX reflecting light emanating from the light emitting diode LED as diverging beam DB; flat surface SF reflecting light emanating from the light emitting diode LED as beam SB having substantially the same angular ray pattern as the rays emanating from the light emitting diode LED; concave surface CV reflects light emanating from the light emitting diode LED as a focused beam or a collimated beam FB.
In some embodiments the heat sink assembly HS may be not be removable from their associated light module and be contained within and or surrounding the bulb envelope, or light modules can be detachable from their associated heat sink so that the bulb may be removed and replaced from a luminaire without having to remove and or replace the heat sinks.
Patent Grant
8858033
