1. Field of the Invention
The present invention relates to a lamp device and, more particularly, to a lamp device allowing smooth flow of air currents into an interior thereof for heat dissipating purposes.
2. Description of the Related Art
To reduce interference with the flow of the air currents, Taiwan Utility Model Publication No. M339780 entitled “Improved Circuit Board Structure for LED Lamp Device” discloses a circuit board including at least one aperture in an area free of electronic elements and circuits. The aperture extends from a side through the other side of the circuit board, such that the air currents entering the housing can flow smoothly into an interior of the housing via the aperture, enhancing the heat dissipating effect. However, formation of the aperture results in complicated and troublesome procedures for manufacturing the circuit board. Furthermore, the resultant heat dissipating effect is still unsatisfactory, for the circuit board still causes certain interference with the flow of the air currents entering the housing.
The primary objective of the present invention is to provide a lamp device including a circuit board that does not interfere with the flow of the air currents entering the lamp device.
A lamp device according to the preferred teachings of the present invention includes a housing having first and second ends spaced in an axial direction. The first end includes an electrical connection portion, and the second end includes a light transmitting portion. The housing further includes an air inlet portion and an air outlet portion. Each of the air inlet portion and the air outlet portion extends from an inner periphery through an outer periphery of the housing. A circuit board is mounted in the housing and electrically connected to the electrical connection portion. The circuit board includes a substrate having first and second sides spaced in the axial direction. The first side of the substrate faces the second end of the housing, and the second side of the substrate faces the first end of the housing. The circuit board further includes a plurality of electronic elements mounted on at least one of the first and second sides of the substrate. Each electronic element has a height in the axial direction. One of the electronic elements having the largest height in the axial direction is mounted on the first side and extends toward the second end of the housing. A heat dissipating module is mounted in the housing and between the air inlet portion and the air outlet portion. A lighting element is coupled to the heat dissipating module and electrically connected to the circuit board. Thus, the substrate can be in a position closer to the first end of the housing, so that the flow of air currents entering the housing via the air inlet portion will not be interfered by the substrate, providing enhanced heat dissipating effect and prolonging the life of the lamp device.
In a preferred form, the electronic elements are mounted on the first side of the substrate. In another preferred form, the electronic elements are mounted on the first and second sides of the substrate.
In a preferred form, the housing includes an inner wall having a positioning portion at the first end of the housing, and the second side of the substrate is coupled to the positioning portion. Furthermore, the positioning portion includes a plurality of pegs formed on the inner wall. A plurality of fasteners is extended through the substrate into the plurality of pegs.
The present invention will become clearer in light of the following detailed description of illustrative embodiments of this invention described in connection with the drawings.
The illustrative embodiments may best be described by reference to the accompanying drawings where:
All figures are drawn for ease of explanation of the basic teachings of the present invention only; the extensions of the figures with respect to number, position, relationship, and dimensions of the parts to form the preferred embodiment will be explained or will be within the skill of the art after the following teachings of the present invention have been read and understood. Further, the exact dimensions and dimensional proportions to conform to specific force, weight, strength, and similar requirements will likewise be within the skill of the art after the following teachings of the present invention have been read and understood.
Where used in the various figures of the drawings, the same numerals designate the same or similar parts. Furthermore, when the terms “first”, “second”, “end”, “portion”, “axial”, “spacing”, “height”, and similar terms are used herein, it should be understood that these terms have reference only to the structure shown in the drawings as it would appear to a person viewing the drawings and are utilized only to facilitate describing the invention.
A lamp device according to the preferred teachings of the present invention is shown in
The housing 10 can be a single housing or have two or more housing parts assembled together to provide a compartment receiving the circuit board 20, the heat dissipating module 30, and the lighting element 40. In the preferred form shown in
In the preferred forms shown in
In the preferred forms shown in
In the preferred forms shown in
In the preferred form shown in
In the preferred forms shown in
The lighting element 40 can be a light-emitting diode (LED), a bulb, or any element that can emit light beams when supplied with electricity. The lighting element 40 is coupled with the other side of the fin 31 of the heat dissipating module 30 and electrically connects with the circuit board 20.
In use, the electrical connection portion 13 can be coupled to a socket on a wall, a ceiling or a table to supply electricity to the lighting element 40. The light beams emitted from the lighting element 40 pass through the light transmitting portion 14 to the environment. The heat generated by the lighting element 40 is absorbed by the fin 31 and dissipated by the heat dissipating module 30. Specifically, air currents are drawn by the impeller 32 into the housing 10 via the air inlet portion 15 and then exit the housing 10 via the air outlet portion 16. Thus, the heat can be transferred to the environment, providing the desired heat dissipating effect and, thus, prolonging the life of the lighting element 40.
Since the electronic element 20 having the largest height h is mounted on the first side 211 of the substrate 21 and extends towards the second end 12 of the housing 10, the substrate 21 can be in a position closer to the first end 11 of the housing 10, so that the substrate 21 will not cover a large portion of the air inlet portion 15 of the housing 10. Air currents outside the housing 10 can be drawn into the housing 10 more easily, avoiding the flow of the air currents entering the housing 10 from being interfered by the substrate 21 of the circuit board 20. Thus, the airflow can flow smoothly in the housing 10, providing enhanced heat dissipating effect and prolonging the life of the lamp device according to the preferred teachings of the present invention.
Thus since the invention disclosed herein may be embodied in other specific forms without departing from the spirit or general characteristics thereof, some of which forms have been indicated, the embodiments described herein are to be considered in all respects illustrative and not restrictive. The scope of the invention is to be indicated by the appended claims, rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are intended to be embraced therein.
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7524089 | Park | Apr 2009 | B2 |
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7874710 | Tsai et al. | Jan 2011 | B2 |
Number | Date | Country |
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M339780 | Sep 2008 | TW |
Number | Date | Country | |
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20100232168 A1 | Sep 2010 | US |